Jianliang Lin, Sterling Meyers, Brajendra Mishra, Sudipta Bhattacharyya, Peter Ried,, John J. Moore Advanced Coatings and Surface Engineering Laboratory (ACSEL) Colorado School of Mines Acknowledgements: NADCA/DOE •Premier Tool & Die Cast, SPX Contech, GM Powertrain, H-L, Leggett and Platt, St. Clair •Balzers, Hardchrome, Ion Bond, Phygen, Teer Coatings THE DEVELOPMENT OF A SURFACE THE DEVELOPMENT OF A SURFACE ENGINEERED COATING SYSTEM FOR ENGINEERED COATING SYSTEM FOR ALUMINUM PRESSURE DIE CASTING ALUMINUM PRESSURE DIE CASTING DIES: DIES: TOWARDS A ‘SMART’ DIE COATING TOWARDS A ‘SMART’ DIE COATING
THE DEVELOPMENT OF A SURFACE ENGINEERED COATING SYSTEM FOR ALUMINUM PRESSURE DIE CASTING DIES: TOWARDS A ‘SMART’ DIE COATING. Advanced Coatings and Surface Engineering Laboratory (ACSEL) Colorado School of Mines. Jianliang Lin, Sterling Meyers, Brajendra Mishra, Sudipta Bhattacharyya, - PowerPoint PPT Presentation
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Jianliang Lin, Sterling Meyers, Brajendra Mishra, Sudipta Bhattacharyya,Peter Ried,, John J. Moore
Advanced Coatings and Surface Engineering Laboratory (ACSEL)
Colorado School of Mines
Acknowledgements: NADCA/DOE
•Premier Tool & Die Cast, SPX Contech, GM Powertrain, H-L, Leggett and Platt, St. Clair•Balzers, Hardchrome, Ion Bond, Phygen, Teer Coatings
THE DEVELOPMENT OF A SURFACE THE DEVELOPMENT OF A SURFACE ENGINEERED COATING SYSTEM FOR ENGINEERED COATING SYSTEM FOR
ALUMINUM PRESSURE DIE CASTING DIES:ALUMINUM PRESSURE DIE CASTING DIES:TOWARDS A ‘SMART’ DIE COATINGTOWARDS A ‘SMART’ DIE COATING
Develop the optimized coating architecture by P-CFUBMS
Field and Service testing
Work done by K.Kearn, O. Salas, A. Kunrath, J.Lin
Work done by S.Carrera
- Multimode tester- Coating degradation- Soldering (DSC)- Ease of release
J. Lin & S. Myers is working on this
Optimized Coating SystemOptimized Coating System
Overall coating thickness is about 5-8 m
Deposition of CrN and AlN binary phase
Deposition of CrAlN
Deposition of (Al,Cr)2O3 working layer
Deopsition of CrN/CrAlN graded layer
Deposition of the overall optimized coating architecture
Steps to the goal:
H13 die substratePlasma nitro-
carburized
Cr (60-100nm)
CrN
CrxAl1-xN
Multilayer or Compositionally graded
(Al,Cr)2O3
Cr-Al-N film Deposition Using P-CFUBMSCr-Al-N film Deposition Using P-CFUBMS
• Optimize the substrate to chamber wall distance (fixed substrate position)
• Deposit CrAlN film with rotation system
• Optimize the working pressure and N2 partial pressure
• Optimize the Al concentration in CrAlN films
Cr-Al-N films deposited at different substrate to Cr-Al-N films deposited at different substrate to chamber wall distanceschamber wall distances
Cr
Al
The ion energy in the plasma is different at different substrate
positionsPulsed closed field unbalanced magnetron sputtering system
GIXRD resultsGIXRD results
20 40 60 80 100
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
400220
200
111
(8 inches)
(7 inches)
( 6 inches)
( 5 inches)
2mTorr, 1000W/1100W, 75:25, -50V bias, different substrate position
Inte
nsity
2 Theta (Degree)
All Cubic
1000W Cr-1100W Al 20 at% Al in film
Nano-hardness and Young’s ModulusNano-hardness and Young’s Modulus
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.00
5
10
15
20
25
30
35
40
45
50
Hardness
Har
dnes
s (G
Pa)
N2(N
2+Ar) (%)
50
100
150
200
250
300
350
400
You
ng's
Mod
ulus
(G
Pa)
Young's Modulus
Substrate to chamber wall distance (inches)
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.00
5
10
15
20
25
30
35
40
45
50
Hardness
Har
dnes
s (G
Pa)
N2(N
2+Ar) (%)
50
100
150
200
250
300
350
400
You
ng's
Mod
ulus
(G
Pa)
Young's Modulus
Substrate to chamber wall distance (inches)
Ball-on-disk test and coefficient of frictionBall-on-disk test and coefficient of friction
0 1000 2000 3000 4000 5000 60000.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
5 inches 6 inches 7 inches 8 inches 9 inches
Fric
tion
of C
oeffi
cien
t
Time (seconds)
Ball on disk wear test:• Micro-tribometer
• Counter part: 1mm WC ball
• Applied force: 3N
• Travel length: 100m
5 6 7 8 9
0.30
0.35
0.40
0.45
0.50
0.55
0.60
COF v.s STD
Coe
ffici
ent o
f Fric
tion
Substrate to chamber wall distance (inches)
Photomicrographs of wear tracks Photomicrographs of wear tracks after 100m travelafter 100m travel
5 inches 6 inches 7 inches
8 inches 9 inches
Wear volume and wear factor of Cr-Al-N filmsWear volume and wear factor of Cr-Al-N films
4 5 6 7 8 9 100
2
4
6
8
10
12
14
16
18
Wea
r V
olum
e (1
0-3 m
m3 )
Wea
r F
acto
r (1
0-7 m
m3 N
-1M
-1)
Substrate to Chamber Wall Disance (Inches)
Wear Factor Wear Volume
3D profile of the wear track
2D profile of the wear track
)()(
)()/(
33
mlengthTravelNLoad
mmvolumeWearNmmmfactorwear
Ion energy distribution (IED) of N(29) in plasmaIon energy distribution (IED) of N(29) in plasma
0 20 40 60 80 100 120 140 1600
200000
400000
600000
800000
1000000
1200000
1400000
1600000 1000W, pulsing both targets at 350Khz, 1.4us, 2mtorr, 75:25
8 inches 4 inches
SE
M C
/S
Energy (eV)
SEM photomicrographs at cross-section of Cr-Al-N filmsSEM photomicrographs at cross-section of Cr-Al-N films1000W Cr-1100W Al pulsing both 100kHz at 1 1000W Cr-1100W Al pulsing both 100kHz at 1 ss
5 inches 6 inches
7 inches8 inches
Cr-Al-N film Deposition Using P-CFUBMSCr-Al-N film Deposition Using P-CFUBMS
• Optimize the substrate to chamber wall distance (fixed substrate position)
• Deposit Cr-Al-N film with rotation system
• Optimize the working pressure and N2 partial pressure
• Optimize the Al concentration in CrAlN films
Cr-Al-N film deposited with rotation systemCr-Al-N film deposited with rotation system
• Deposition parameters:
• Total Pressure: 2mTorr; N2:Ar = 75:25
• 1000W to Cr target, 1100W to Al target
• -50V substrate bias
• Planetary rotation system with substrate
to chamber wall distance ~ 4.5 inches
• To avoid the formation of superlattice
structure, the minimum rotation linear
speed is 10 cm/sec, which was calculated
from the system geometry and deposition
rates
• Rotation linear speed used: ~ 12 cm/sec
20 30 40 50 60 70 80 90 100
0
50
100
150
200
250
300
350
400
400
220
200
111
Fixed @ 7"
With rotation
2mtorr, 1000W/1100W, -50V bias, 75:25
Inte
nsity
2-Theta
Cr
Al
Cr-Al-N film deposited with rotation Cr-Al-N film deposited with rotation systemsystem
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.00
5
10
15
20
25
30
35
40
45
50
Hardness
Har
dnes
s (G
Pa)
Substrate to chamber wall distance (inches)
50
100
150
200
250
300
350
400
With Rotation
Yo
un
g's
Mo
du
lus
(GP
a)
Young's Modulus
Ra=30.33nm
The mechanical properties and surface roughness of Cr-Al-N film deposited with rotation system can be compared with those films deposited at fixed far positions
Ra=28.67nm
Ra=7.01nm
Cr-Al-N film Deposition Using P-CFUBMSCr-Al-N film Deposition Using P-CFUBMS
• Optimize the substrate to chamber wall distance (fixed substrate position)
• Deposit CrAlN film with rotation system
• Optimize the working pressure and N2 partial pressure
• Optimize the Al concentration in CrAlN films
Optimized working pressure and NOptimized working pressure and N22 partial pressure partial pressure
50 55 60 65 70 75 8012
14
16
18
20
22
24
26
28
30
32
34
2mtorr, 1000/1100w, -50Vbias, at 7 inches 3mtorr, 1000/1100w, -50Vbias, at 7 inches
Har
dnes
s (G
Pa)
N2 ratio (%)
1.5 2.0 2.5 3.0 3.5 4.010
15
20
25
30
35
75:25, 1000/1100w, -50V bias, 1hr deposition
Har
dnes
s (G
Pa)
Working pressure (Mtorr)
The optimized working pressure is 2 mtorr and N2 partial pressure is 75%
Cr-Al-N Films Deposited at 2mTorr with –50V Substrate BiasCr-Al-N Films Deposited at 2mTorr with –50V Substrate Bias
pN2=1 mTorr, 50% N2
pN2=1.2 mTorr, 60% N2
P N2=1.5 mTorr, 75% N2
pN2=1.6 mTorr, 80% N2
2 m
Decreased deposition rates
Cr-Al-N film Deposition Using P-CFUBMSCr-Al-N film Deposition Using P-CFUBMS
• Optimize the substrate to chamber wall distance (fixed substrate position)
• Deposit CrAlN film with rotation system
• Optimize the working pressure and N2 partial pressure
Same Pin; Lubricant RemovedConclusion: Pin after 10k shots contains no visible defects
New Pins
¼ ins
Preliminary ResultsPreliminary Results
•Stereographic Results•CrN, CrC-TiAlN coatings show few signs of wear • TiN-TiAlN, Cr/TiN-TiAlN illustrate more signs of wear •FeNC surface treatment show most signs of wear and soldering
SEM Results•Data still not produced•Edge retention of coating lost during metallography
One can measure the adhesion/soldering strength of the pin by separating the pin and solidified Al using a tensile testing machine with
a calibrated load cell
The pin must be pulled perpendicular to the solidified Al axis to assure same stress levels
‘‘Ease of Release’ TestEase of Release’ Test
Load/time curves – ‘ease of release’ testLoad/time curves – ‘ease of release’ test