江阴长电先进封装有限公司 JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD. JCAP Confidential Jan 2015 20 th April, 2004 JCAP Confidential
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP Confidential Jan 2015 20th April, 2004JCAP Confidential
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Company OverviewEstablishment : 2003, August
Shareholder: JCET 75%, APS & others, 25%Shareholder: JCET 75%, APS & others, 25%
Business focus: Wafer Bumping
Wafer Level CSP
Wafer Level Sensor
Si/Glass Level Packaging
Pl t 9 000 2 (F b 1)Plant area : 9,000 m2 (Fab-1)
28,000 m2 (Fab-2)
JCAP Confidential Jan 2015 2
Employees : 725 (Fab-1)/ 115 (Fab-2)
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Company Milestones
Formation of JCAP Cu pillar and RDL production
300mm bumping production
2003 2005 2008 2010 2012
2004 2006 2009 2011
2014
Double RDL production
J-WLP (C2W) developed
2015
Encapsulated chip package developed
Completed building. Reach 80kk /month Set up TSV line for Set up FC & RFID line New 12” production linep gSet up bumping line in WLCSP Sensors (Ready by end of 2014)
JCAP Confidential Jan 2015 3
Passed ISO9001
Passed 14001
Passed TS16949
Passed QC080000
Passed SONY GP 2009 TI SEA award 2011 TI SEA award
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Organization Structure
JCAP Confidential Jan 2015 4
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Our Focus- Advanced Packaging ( Middle End )
Wafer Wafer BumpingBumping( ( AuBAuB, , SnBSnB, , CuPCuP, , CuBCuB, , uCuPuCuP…)…)
Flip Chip/ TSVFlip Chip/ TSV// InterposerInterposerWafer Level PackagingWafer Level Packaging
FI WLP FO WLPFC BGA
FC ICsFC ICsBOPBOP Optic WLP J-WLP
2D/2.5D/3D ICsIntegration
2D/2.5D/3D ICsIntegration
2D/2.5D/3D SiIntegration
2D/2.5D/3D SiIntegration
FI WLP Embedded
2P1M2P1M MEMS WLP FC LDF
FC FilmIPD IPD
EmbeddedEmbedded
WLFO
FO -SiP
uCuP Bump
TemporaryBond/ Debond
FC SiP
Embedded
RDL RDL -- FI WLPFI WLP33P3MP3M
FC Film
Stacked/CC2W2W/C2C Assembly2P2M2P2M
EmbeddedEmbedded
FO -3D
Si-CSM(2D)
M2M, SiO/SiO etc. Bonding
SiSi/Glass Interposer
3P2M3P2M 4P3MW2W AssemblyCOF/COG
JCAP Confidential Jan 2015
Mass ProductionMass Production In development Development 1.Key 1.Key technology, 2.Integrationtechnology, 2.Integration, , 3. Patent3. Patent
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Wafer Bumping ServicesPad RedistributionP l i id /PBO C TPolyimide/PBO, Cu TraceThin Film with Passive ComponentIPD Min W/S:9x7umApplication: IPD/RDL
Solder Plating
Solder Ball DropSAC material
Gold Bumping
Std height: 5um – 18um
Pitch:>30um
Electroplating Sn/SnAgPitch: >160umApplication: FCOS/FCOL
Application: COF/COG/RFID
Pillar PlatingStd structure :65um Cu + 25um Sn/SnAg
before reflowENIG PlatingStd structure: Ni/Au on Al or Cu
JCAP Confidential Jan 2015 6
Pitch: >160um (>40um for fine pitch)Application: High density interconnect for FCOS/FCOL
Std structure: Ni/Au on Al or CuApplication: UBM, RDL for flip chip connection or wire bonding
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP CuP / CuB Various Structure
2P2M Pillar Bump
Standard Pillar Bump1P2M Pillar Bump
Any Shape Pillar BumpCu on Via Pillar Bump
JCAP Confidential Jan 2015 7
Note : (X)P(Y)M denotes X layers of Polyimide and Y layers of Metal.
Micro Pitch Pillar BumpAny Shape Pillar Bump
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Flip Chip on Lead frame
Silicon Die
Cu Pillar
L/F
FCOL with copper pillar bump offers:L i d d i iLower inductance and resistance propertiesHigher efficiency, dissipate less powerHigh current density carrying capacityLow cost ( replacing gold wire)
JCAP Confidential Jan 2015 8
Exposed die possible for high current as high to 50A
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Flip Chip on Substrate
Solder Bumps Micro Cu Pillar 54um Pitch
COS i i ff
p‐ 200um Pitch
Micro Cu Pillar ‐ 54um Pitch
FCOS with copper pillar bump offers:High power High frequencyHigh frequencyLow parasitic resistance, capacitance, inductanceFine pitch available down to 54um bump pitch
JCAP Confidential Jan 2015 9
p p p
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Bumping & Packaging Fully Turnkey Wafers from
customers or fabShip to customers or their end users
JCAP internal process
UBM **Backside CoatBy JCAP/customer
ForwarderBy JCAP/customer
Forwarder
Electroplating
Back grinding
**Laser Marking
Dicing / Laser Grooving
Flip Chip Assembly & Test
Ball PlacementSorting(TnR)
Probing
JCAP Confidential Jan 2015 10
Packing
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Wafer Level CSP Structure
**
**
**
CSP - 3P3M
CSP - 2P1M
CSP - 2P2MStandard design:
CSP 3P3MStandard design:
1st PI: 5/10um
2nd PI:5/10um
CSP - 1P1MStandard design:
P.I: 5um/10um
CSP 2P1MStandard design:
1st PI: 5um
2nd PI:10um
g
1st PI: 5um
2nd PI:10um
Cu trace:3~7.5um
3rd PI:5/10um
1st Cu trace:3~7.5um
2nd Cu trace:3~7.5umCSP - 1M
Standard design:
JCAP Confidential Jan 2015 11
UBM:7.5um Cu trace:7.5um UBM:7.5um UBM:7.5umUBM:7.5um
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP WLCSP Process CapabilityFor Do ble RDL ProcessFor Double RDL Process
8.60um 8.40um 8.53um6.81um
8.36um8.33um8.40um 7 14um7.14um
Two layers RDL 9um line width/7um line space
JCAP Confidential Jan 2015
Two layers RDL 9um line width/7um line space
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
2005 2007 2008
For Ball Drop Capability 2005Ball pitch: 500umBall size: 300umStatus: Mass Production
2007Ball pitch: 400umBall size: 250umStatus: Mass Production
2008Ball pitch: 350umBall size: 150umStatus: Mass production
2009Ball pitch: 300umBall size: 150um
2010Ball pitch: 250umBall size: 120um
2013~2014Ball pitch: 150umBall size: 80um
Status: Mass Production
Status: Ready for production
Status: Finish development
99.2um
400um pitch WLCSP 300um pitch WLCSP250 it h WLCSP 400um pitch WLCSP 300um pitch WLCSP250um pitch WLCSP
JCAP Confidential Jan 2015 13
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
For Thin Wafer Process capability
Ball Placement Taping Back grinding De-tapingUBMThin wafer process: ball placement followed by back grinding. Wafer thickness can be thinned to ~180um for 12” wafer.
Taping Back grinding De-taping Ball PlacementUBMNormal thickness wafer process: back grinding followed by ball placement. Wafer thickness can be thinned to ~250um.
167um 356um
JCAP Confidential Jan 2015
42.3um
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
For Laser Grooving Capability
After Laser Groove After Blade Cut Front side After Blade Cut Backside
Laser Grooving + Blade Cut
Reliability test
Dry Bake + MSL3 + 255℃ 3x reflow HTS T1008 THS T1008 TC T1000
(0/231) (0/77) (0/77) (0/77)Note: Electrical function test with die level socket was applied to define
JCAP Confidential Jan 2015
Note: Electrical function test with die level socket was applied to define the test vehicle pass or fail the reliability test.
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP WLCSP Production Device StructureBall Ball Die Size Ball Ball Ball Height/Size Package Structure StatusArray Pitch Count Size after reflow Thickness
1x2 240um 0.21x0.41mm 2(bump) NA 11um bump height(No reflow)
185um 1P1M Qualification
1 2 400 0 3X0 6 2(b ) NA 11 b 290 1P1M M P d i1x2 400um 0.3X0.6mm 2(bump) NA 11um bump height(No reflow)
290um 1P1M Mass Production
2x2 350um 0.65x0.65mm 4 150um 105um/180um 295um 1P1M Mass Production
2 2 400 0 77 0 77 4 100 50 /150 280 2P2M M P d ti2x2 400um 0.77x0.77mm 4 100um 50um/150um 280um 2P2M Mass Production
3x3 500um 1.42x1.42mm 9 300um 230um/320um 610um 2P1M Mass Production
3x4 500um 1.32x1.82mm 12 225um 170um/235um 590um 1P1M Mass Production
4x5 500um 1.85x1.85mm 20 225um 170um/235um 440um 1P1M Mass Production
5x5 400um 1.92x1.92mm 24 250um 170um/235um 480um 1P1M Mass Production
5x5 500um 2.42X2.42mm 9 300um 195um/270um 490um 2P1M Mass Production
6x6 350um 2.13x2.13mm 36 200um 150um/220um 370um 2P2M Mass Production
JCAP Confidential Jan 2015 16
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP WLCSP Production Device StructureBall Ball Die Size Ball Ball Ball Height/Size Package Structure StatusBall Array
Ball Pitch
Die Size Ball Count
Ball Size
Ball Height/Size after reflow
PackageThickness
Structure Status
7x7 530um 3.49x3.49um 49 200um 160um/210um 460um 2P2M Mass Production
7x8 480um 3 89x3 89mm 56 250um 202um/257um 580um 2P1M Mass Production7x8 480um 3.89x3.89mm 56 250um 202um/257um 580um 2P1M Mass Production
8x8 400um 3.18x3.18mm 64 250um 185um/275um NA 1P1M Mass Production
8x8 500um 3.92x3.92mm 64 300um 235um/320um 560um 1P1M Mass Production
9 11 400 3 74 4 44 99 250 210 /260 530 1P1M M P d ti9x11 400um 3.74x4.44mm 99 250um 210um/260um 530um 1P1M Mass Production
10x10 500um 5.06x5.06mm 100 300um 235um/320um NA 2P2M Mass Production
10x13 400um 4.14x5.34mm 130 250um 150um/220um 370um 2P2M Mass Production
JCAP Confidential Jan 2015 17
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Wafer Level CSP for SensorsV-A Structure
V-B StructureReady by end of 2014
V-A: Laser drill process with side contact
V-B: Dry etching with PECVD, full PAD contact
JCAP Confidential Jan 2015 18
y g ,
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Fingerprint Packaging
TSV Structure
Trench + WB
JCAP Confidential Jan 2015 19
Trench + WB
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
J-WLP (Chip to Wafer)
Micro bump interconnection C2W Flip Chip Technology
Solder ballDaughter chip
Multi-RDL&IPD integration
JCAP Confidential Jan 2015
J-WLP Package
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP Testing ServiceJCAP i t l bilit t d i d k b■ JCAP internal capability to design and make probe cards, eliminating the inconvenience of maintenance and repairing outside and shortening the cycle timeand repairing outside and shortening the cycle time
■ JCAP internal capability of programming
■ Tester ListEagle ETS300/364, Credence ASL1000, AST 2000, Juno DTS1000, FET3600
Agilent V50, Nextest ST64, micro/ultra Flex, T2K…
Laser Trimming Capable: ESI9820
Prober: UF3000,UF200A,UF200SA/190B>150sets
JCAP Confidential Jan 2015 21
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Proportional Revenue by Regions
81.01%75.36% 73.88%
2012 2013 2014
0.02% 2.99% 2.90%
2012 2013 2014
17.67% 16.99% 18.81%
2012 2013 2014
1.30%4.66% 4.42%
2012 2013 2014
JCAP Confidential Jan 2015
America Europe China Korea
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Volume Production Customers
JCAP Confidential Jan 2015 23
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
CSP & Flip Chip Coverage
JCAP Confidential Jan 2015 24
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
What’s more…
JCAP Confidential Jan 2015 25
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Shipment Record for Bumping
•Totally more than 2.2M wafers output till 2013
JCAP Confidential Jan 2015 26
•1M wafers bump in 2014
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Shipment Record for Assembly
•Totally more than 8.8B units output till 2013
JCAP Confidential Jan 2015 27
•Over 3B forecast in 2014
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
Manufacturing CapacityCu Pillar and Bumping:FAB 1
• 140,000 wafers/m for 8inch
5 000 f / f 12i h5,000 wafers/m for 12inch
FAB 2
• Ready for qual by Q2 2015, with 40,000Ready for qual by Q2 2015, with 40,000 wafers/month of Phase I plan
WLCSP Backend :420kk/m, expanded to 500kk/m by Q2, 2015
Wafer Level for TSV products (80~90 degree ):• 10,000pcs wafers/month for 8inch
FC for RFID:50M units/month
JCAP Confidential Jan 2015 28
50M units/month
江阴长电先进封装有限公司JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD.
JCAP New B2 Plant
•Located 10 km from current JCAP B1 plantLocated 10 km from current JCAP B1 plant•Three floors, totally 28,000 square meters•Total plan capacity, more than 300,000 pcs for 8” and 12” wafers•World class FAB with fully automatic operation system
JCAP Confidential Jan 2015
•World class FAB with fully automatic operation system