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ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes Shireesh Verma
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ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

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Page 1: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 1

ITRS Design + System Drivers

July, 2010

Design ITWG

Juan-Antonio CarballoTamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes Shireesh Verma

Page 2: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 22011 Roadmap Work in Progress – Do Not Publish!

2

2004

2005

2006

2007

ExploreDesign metrics

Design Technology metrics

Revised Design metrics

Revised Design Technology Metrics

ConsumerPortableDriver

Consumer Stationary, PortableDrivers

Consumer Stationary,Portable,Networking Drivers

More Than Moore (MTM)analysis + iNEMI

Driver study

System DriversChapter

DesignChapter

2008

Revised Design MetricsDFM extension

Updated Consumer Stationary,Portable,and Networking Drivers

MTM extension+ iNEMI+ SW !!

2009

AdditionalDesign MetricsDFM ExtensionSystem level extension

Updated Consumer Stationary,Portable architecture,and Networking Drivers

MTM extension+ iNEMI synch+ SW !!

Overview (2004-Today)

1. Increasingly quantitative roadmap2. Increasingly complete driver set

MTMRF+AMS Driver

UpdatedConsumer,MPU, and Networking Drivers

Power roadmap chartUpgraded RF+AMS section

2010

Page 3: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 3

Selected Messages 20101. Design productivity continues to be center focus of design

technology roadmap, as scaling depends on time to market• Accurate design productivity and cost models are key

2. Power consumption has become the key technical parameter that controls feasible semiconductor scaling• Power-driven device roadmap, frequency pushed to flat trend

3. More Than Moore has become a necessary component of semiconductor product scaling • Mixed SiP-SoC analog-digital drivers need to be roadmapped

Page 4: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 4

Design / System Drivers 2010*-2011* Plans1. Design chapter

• Improvement of design productivity and cost models *• Develop “Power Chart” based on STRJ & productivity chart *• Ensure 3D / TSV content consistent with other chapters *• Improve DFM section, including Design for reliability rows *• Overhaul of Verification *, L/C/P sections *

2. System Drivers chapter• Update MPU frequency roadmap (flat trend), evaluate impact *• Update of SOC-CP and SOC-CS models (driven from TWGs) *• Update AMS/RF Driver / fabric with Wireless TWG *• More-Than-Moore RF+AMS driver SiP-SoC (based on SoC-P) *

3. Other Cross-TWG and public activity• PIDS: increase design-driven requirements definition *• 3D/TSV: hold for ACTION *• Continue other key interactions: A&P, Interconnect, Test *• Incorporate input from 2nd EDA Roadmap Workshop (@DAC)*

Page 5: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 5

Design / System Drivers 2010*-2011* Plans1. Design chapter

• Improvement of design productivity and cost models *• Develop “Power Chart” based on STRJ & productivity chart *• Ensure 3D / TSV content consistent with other chapters *• Improve DFM section, including Design for reliability rows *• Overhaul of Verification *, L/C/P sections *

2. System Drivers chapter• Update MPU frequency roadmap (flat trend), evaluate impact *• Update of SOC-CP and SOC-CS models (driven from TWGs) *• Update AMS/RF Driver / fabric with Wireless TWG *• More-Than-Moore RF+AMS driver SiP-SoC (based on SoC-P) *

3. Other Cross-TWG and public activity• PIDS: increase design-driven requirements definition *• 3D/TSV: hold for ACTION *• Continue other key interactions: A&P, Interconnect, Test *• Incorporate input from 2nd EDA Roadmap Workshop (@DAC)*

Page 6: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 6

ITRS Design Productivity RoadmapModel for upcoming Power Management Roadmap

6

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Page 7: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 7

ITRS Design Productivity RoadmapModel for upcoming Power Management Roadmap

7

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Design ProductivityINNOVATIONS

Design Cost

Page 8: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 8

ITRS Design Productivity RoadmapExpected upcoming Power Management Roadmap

8

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Design for Power INNOVATIONS

Power Efficiency

Page 9: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 9

SOC Modeling by Japan STRJ-WG1

Page 10: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 10

Design / System Drivers 2010*-2011* Plans1. Design chapter

• Improvement of design productivity and cost models *• Develop “Power Chart” based on STRJ & productivity chart *• Ensure 3D / TSV content consistent with other chapters *• Improve DFM section, including Design for reliability rows *• Overhaul of Verification *, L/C/P sections *

2. System Drivers chapter• Update MPU frequency roadmap (flat trend), evaluate impact *• Update of SOC-CP and SOC-CS models (driven from TWGs) *• Update AMS/RF Driver / fabric with Wireless TWG *• More-Than-Moore RF+AMS driver SiP-SoC (based on SoC-P) *

3. Other Cross-TWG and public activity• PIDS: increase design-driven requirements definition *• 3D/TSV: hold for ACTION *• Continue other key interactions: A&P, Interconnect, Test *• Incorporate input from 2nd EDA Roadmap Workshop (@DAC)*

Page 11: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 112011 Roadmap Work in Progress – Do Not Publish!

11

Design and System DriversITRS-iNEMI Domain Space

Chip level System level

Techrequirements

Marketrequirements

iNEMI(emulators)

ITRS(Drivers)

*Source: ITRS Design/System Drivers TWG Chairman, Dr. Juan-Antonio Carballo

Page 12: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 12A&DNetwork ConsumerPortable

OfficeMedical Automotive ConsumerStationary

MPU

PE/DSP

AMS

Memory

Fabrics

Markets

20062007 2006 20062010?2010?

SIP

New System Drivers? At the right pace…

• Is SIP a new fabric ?• What application is the right driver for (leading edge) 3D/TSVs ?

2010?

?

Page 13: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 13

ITRS-iNEMI Domain SpaceSiP-SoC More-than-Moore Proposal

Chip level System level

Techrequirements

Marketrequirements

Portable emulator

RF/AMS Driver

Portable consumer

driver1 2 3

Update portable driver

Update portable emulator

PA Case Study(SoC v. SiP)

Page 14: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 14

h

An Alternative Driver Tuner / Demodulator

Inclusion of AMS/RF sub-driver from ITRS AMS driver

Equivalent cost = NRE + non-NRE per-board cost

14

Power (SiP)

Power (SoC)

Equivalent cost (SoC)

Equivalent cost (SiP)

Tuner-demod case Study

Requirement Description

Tuner Resolution, operating freqs, power

ADC/DAC #bits, order, power, etc.

Demodulator/FEC decoder

Gain-bandwidth, power

Additional “rows” for combined analog-digital model

Page 15: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 15

SOC Modeling by Japan STRJ-WG1

Page 16: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 16

Power-Constrained Frequency Scaling Intrinsic frequency scaling + activity scaling 13% per year

Still exceed 150W in 2015 2009:

– To meet market needs frequency growth limited 8% per year 2010 (expected):

– To meet market needs / additional constraints: flat YTY trend

8% frequency scaling

Power < 150W

Page 17: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 17

Cross-TWG Interaction: Design-PIDS Device speed scaling: HiPerf CV/I improves by 13%/year

– Use “headroom” for further power savings? Three devices in the ITRS roadmap

– High Performance (HP): Highest Ion and Ioff, lowest CV/I– Low Operating Power (LOP): Lowest VDD, medium Ion, Ioff and CV/I– Low Standby Power (LSTP): Lowest leakage, low Ion, high CV/I

Design providing guidance as to targeted ratio of device characteristics– Preferred order of dynamic power: LOP < LSTP << HP– Preferred order of leakage power: LSTP < LOP << HP

Ratio of HP : LOP : LSTP

R1

R2

R3

Parameters

Target design freq.(GHz)

Device CV/I

Device Ioff

INPUT

FEEDBACK

Application driven Technology driven

Design Group PIDS Group

Page 18: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 18

Design / System Drivers 2010*-2011* Plans1. Design chapter

• Improvement of design productivity and cost models *• Develop “Power Chart” based on STRJ & productivity chart *• Ensure 3D / TSV content consistent with other chapters *• Improve DFM section, including Design for reliability rows *• Overhaul of Verification *, L/C/P sections *

2. System Drivers chapter• Update MPU frequency roadmap (flat trend), evaluate impact *• Update of SOC-CP and SOC-CS models (driven from TWGs) *• Update AMS/RF Driver / fabric with Wireless TWG *• More-Than-Moore RF+AMS driver SiP-SoC (based on SoC-P) *

3. Other Cross-TWG and public activity• PIDS: increase design-driven requirements definition *• 3D/TSV: hold for ACTION *• Continue other key interactions: A&P, Interconnect, Test *• Incorporate input from 2nd EDA Roadmap Workshop (@DAC)*

Page 19: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 19

h

ITRS-iNEMI MTM SOC/SIP Design/IntegrationUpdate of ITRS and iNEMI Portable Drivers

Inclusion of AMS/RF sub-driver from ITRS AMS driver

Equivalent cost = NRE + non-NRE per-board cost19

Other AMS

PA (RF)

Power (SiP)

Power (SoC)

Equivalent cost (SoC)

Equivalent cost (SiP)

PA Case Study

Page 20: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 20

Gaps in EDA (IEEE DAC Roadmap Workshop 2010

20

Technology

EDA nature

Metrics

Page 21: ITRS Design ITWG 2010 1 ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.

ITRS Design ITWG 2010 21

Selected Messages 20101. Design productivity continues to be center focus of design

technology roadmap, as scaling depends on time to market• Accurate design productivity and cost models are key

2. Power consumption has become the key technical parameter that controls feasible semiconductor scaling• Power-driven device roadmap, frequency pushed to flat trend

3. More Than Moore has become a necessary component of semiconductor product scaling • Mixed SiP-SoC analog-digital drivers need to be roadmapped