Is Dual Gate Device Is Dual Gate Device Structure Better Structure Better From a Thermal From a Thermal Perspective? Perspective? D. Vasileska, K. Raleva D. Vasileska, K. Raleva and and S. M. Goodnick S. M. Goodnick Arizona State University Arizona State University Tempe, AZ USA Tempe, AZ USA
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Is Dual Gate Device Structure Better From a Thermal Perspective? D. Vasileska, K. Raleva and S. M. Goodnick Arizona State University Tempe, AZ USA.
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Is Dual Gate Device Is Dual Gate Device Structure Better From a Structure Better From a Thermal Perspective?Thermal Perspective?D. Vasileska, K. Raleva and D. Vasileska, K. Raleva and
S. M. GoodnickS. M. GoodnickArizona State UniversityArizona State University
Tempe, AZ USATempe, AZ USA
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
Technology Trends and Device Technology Trends and Device Miniaturization SolutionsMiniaturization Solutions
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
Why Heating Effects in Alternative Why Heating Effects in Alternative Device Geometries?Device Geometries?
dS
~ 300nm
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
Complexity of the Problem: Complexity of the Problem: Treatment of PhononsTreatment of Phonons
10-9
10-8
10-7
10-6
0
0.2
0.4
0.6
0.8
1
Silicon layer thickness (m)
MolecularDynamics
Phonon Boltzmann Transport Equation
Fourier Law
Classical SOI StructuresSuperlattice
Nanotubes
10-9
10-8
10-7
10-6
0
0.2
0.4
0.6
0.8
1
Silicon layer thickness (m)
MolecularDynamics
Phonon Boltzmann Transport Equation
Fourier Law
Classical SOI StructuresSuperlattice
Nanotubes
-Phonon mean free path(=300nm)
-phonon mean freelength (=1-2nm)
High Electric Field
Optical Phonon Emission
Acoustic Phonon Emission
Heat Conduction in Semiconductor
~ 0.1ps ~ 0.1ps
~ 10ps
~ 10ps
Hot Electron Transport
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
ASU SolutionASU Solution
J. Lai and A. Majumdar, “Concurent thermal and electrical modeling of submicrometer silicon devices”, J. Appl. Phys. , Vol. 79, 7353 (1996).
Average acoustic and optical phonon temperature profile in the silicon layer
25nm single-gateFD SOI nMOSFET
25nm dual-gateFD SOI nMOSFET
lattice temperature profile
optical phonon temperature profile
channelsource drain Higher Numberof Carriers
Higher LatticeTemperature
More VelocityDegradation
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
A Closer Look …A Closer Look …
0 25 50 7575-2
0
2
4
6
8
10
12
14
16
18x 10
4
along the channel (nm)
Vel
oci
ty (
m/s
)
0 25 50 75750
0.1
0.2
0.3
0.4
0.5
0.6
0.7
along the channel (nm)
En
erg
y (e
V)
dual-gatesingle-gate
Average electron velocity and energy for 25nm single-gate and dual-gate FD SOI nMOSFET
10 20 30 40 50 60 70
10
20
30
40
50
60
X= 68Y= 6Level= 560.9467
x (nm)
y (n
m)
Lattice temperature profile for 25nm DG SOI MOSFET
X= 15Y= 9
Level= 416.422
300
350
400
450
500
550
bottom gateregion
set to 300K
10 20 30 40 50 60 70
10
20
30
40
50
60
Lattice temperature profile for undoped, single-gate 25nm FD SOI MOSFET
300
320
340
360
380
400
420
440
460
480
500
Single gate lattice temperature profile
Dual gate lattice temperature profile
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
Where Does the Where Does the Benefit of the DG Benefit of the DG Structure Comes Structure Comes From?From?
25nm DG SOI nMOSFET(Vgate-top=Vgate-bottom=1.2V; Vdrain=1.2V; Vsource=0V; Vsubstrate=0V)
Type of simulation
Top gate temperature
Bottom gate temperature
Bottom of the BOX
temperature
Current(mA/um)
Current decrease
(%)
isothermal 300K 300K 300K 3.0682 \
thermal 300K 300K 300K 2.7882 9.13
thermal 400K 400K 300K 2.6274 14.37
thermal 600K 600K 300K 2.3153 24.54
Type of simulation
Gate temperatur
e
Bottom of the BOX
temperature
Current(mA/um)
Current decrease
(%)
isothermal 300K 300K 1.9428 \
thermal 300K 300K 1.7644 9.18
thermal 400K 300K 1.6641 14.35
thermal 600K 300K 1.4995 22.82
ND=1019 cm-3; NA= 1018 cm-3
tox=2nm; tsi=10nm; tBOX=50nm
25nm FD SOI nMOSFET
25nm DG SOI nMOSFET
For almost the sameCurrent degradationDG devices offer1.5-1.7 times morecurrent
Ira A. Fulton School of Engineering
AINE – Arizona Institute for Nanoelectronics
What Needs to be Done in Terms What Needs to be Done in Terms of Modeling Thermal Effects?of Modeling Thermal Effects?
When the heat conduction is nonlocal, the transport is highly When the heat conduction is nonlocal, the transport is highly nonequilibrium, the temperature used to represent the nonequilibrium, the temperature used to represent the modeling results is at best a measure of the local energy modeling results is at best a measure of the local energy density, rather than their typical thermodynamic meaning. density, rather than their typical thermodynamic meaning. On the other hand, in microelectronics, the device reliability On the other hand, in microelectronics, the device reliability
is often associated with the temperature through the is often associated with the temperature through the Arrehnius law, which is a manifestation of the Boltzmann Arrehnius law, which is a manifestation of the Boltzmann distribution and is a result obtained under the assumption distribution and is a result obtained under the assumption of local equilibrium.of local equilibrium.
The simulations so far are based on either Monte Carlo The simulations so far are based on either Monte Carlo methods or the Boltzmann equation and take the various methods or the Boltzmann equation and take the various relaxation times as input parameters. These parameters are relaxation times as input parameters. These parameters are subject to a wide range of uncertainties. subject to a wide range of uncertainties. There is a clear need for more accurate information on the There is a clear need for more accurate information on the
relaxation times. Molecular dynamics simulation may be relaxation times. Molecular dynamics simulation may be one way to obtain them.one way to obtain them.
Similarly, electron-phonon scattering processes also need Similarly, electron-phonon scattering processes also need further consideration, particularly when electrons have very further consideration, particularly when electrons have very different temperatures from that of phonons.different temperatures from that of phonons.