HP1050

1050 Series of HPLC Modules Service Handbook

Copyright Agilent Technologies 2001 All rights reserved. Reproduction, adaption, or translation without prior written permission is prohibited, except as allowed under the copyright laws. Part No. NONE 09/2001 Printed in Germany

WarrantyThe information contained in this document is subject to change without notice. Agilent Technologies makes no warranty of any kind with regard to this material, including, but not limited to, the implied warranties or merchantability and fitness for a particular purpose. Agilent Technologies shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.

IMPORTANT NOTE This version of the 1050 service manual includes all sections from the 01050-90102 edition 4 (1995). The series I opticals information (79854A MWD and G1306A DAD) and the 79853A VWD information has been removed (products went out of support during 2000). Part numbers have been updated as of 09/2001. Contact your local Agilent support office in case of part number issues or upgrades. The latest version of this manual is available as Adobe Acrobat Reader (PDF) version only and can be downloaded from the Agilent Technolgies web page www.agilent.com.

Agilent Technologies Hewlett-Packard-Strasse 8 76337 Waldbronn Germany

Contents

1 Common: General Information This chapter provides general information about the 1050 Series of HPLC Modules 29 Safety Information 30General 30 Operation 30 Safety Symbols 32

Radio Interference Sound Emission 33

3333 33

Manufacturers Declaration Manufacturers Declaration

UV-Radiation 34 Solvent InformationFlow Cell 35 Solvents 35

35 36

1050 Introduction

The Modules Overview 36 1050 Identification 38 Repair Policy 38

2 Common: Electronic Information This chapter provides common electronic information about the 1050 Series of HPLC Modules 39 Overview 41 Common Main Processor Board (CMP) 42Common 1050 Functions CMP Details 44 Remote Control 47 42

Service Handbook for 1050 Series of HPLC Modules - 09/2001

3

Contents

Firmware Board (FIM)Firmware Description 53

53 55

Fluorescent Indicator Module (FIP) External Contacts 56 Power Supply (DPS-B / DPS-A) 57General Description 57 Base Supply (DPS-B) 58 Lamp Supply (DPS-A) 60

Communication Interface (CIB / CRB)

64

3 Common: Cable Information This chapter provides information on cables for the 1050 Modules 67 Overview 68 Analog Cables 70 Remote Cables 72 BCD Cables 77

4 Pumps: General Information This chapter provides general information about the 1050 Pumps 83 Introduction 84 About this Manual 84 About the Pumps 85 Repair Policy 85 Product Structure 86

4


Contents

Capillaries 87 Specifications 88

5 Pumps: Hardware Information This chapter provides hardware information about the 1050 Pumps 91 Overview 93 How does the Pump Work? 95Isocratic Operation Gradient Operation 95 96

Overview of the Electronics 96 Overview of the Flow Path 98 Solvent Cabinet 99Helium Degassing 99 Manual Injection Valve Column Heater 100 100

Multi Channel Gradient Valve (MCGV) Metering Drive Assembly 103 Pump Head Assembly 104 Continuous Seal Wash 105 Active Inlet Valve 107 Outlet Ball Valve 108 Frit Adapter Assembly 109 Purge Valve 110 High Pressure Damper 111 Column Holder 112

102


5

Contents

6 Pumps: Electronic Information This chapter provides electronic information about the 1050 Pumps 113 Overview 115 Pump Drive Control Board (PDC2) 118 Relative A/D Converter Board (RAD) 123 Firmware Board (SFW) 127 HRI Board - Heater Isocratic Board 128 Heater Quaternary Board (HRQ) 131 High Pressure Transducer Board (HPT) 134 Connector Board (CON) 136 Pump Motherboard (HPS) 138

7 Pumps: Diagnostic Information This chapter provides information on error messages and diagnostic features of the 1050 Pumps 143 How to use the Diagnostic Test Functions Pump Pressure Ripple 146 Flow (Pressure) Tests 147Prerequisites for the Pressure Tests 148 Normal Pressure Test 149 The Modified Pressure Test 150 Flow Test Method 151 Flow Test Method - Firmware Rev. 1.0 152 Flow Test Method - Firmware Rev. 3.0 and above

145

157

Gradient Test Method

159159

Prerequisites for the Gradient Test Method Running the Gradient Test Method 159

6


Contents

Error Messages Selftest 163ROM/RAM Test 163

162

Panic Error / Bus Error Address Error 164 Common 1050 Error Messages 165 Pump Initialization Error Messages 167 Normal Operation Error Messages 171 Column Heater Error Messages 175 Online Monitor Messages 177 Troubleshooting Hints 180 Standard Pressure Tests with different Solvents 181Modified Pressure Tests 181 Pressure Tests - Firmware Revision 1.0 182 Pressure Tests - Firmware Revision 3.0 and above Pressure Tests - Leak at Piston Seal 1 186 Pressure Tests - Leak at Piston Seal 2 189 Pressure Tests - Defective Piston 1 192 Pressure Tests - Defective Piston 2 196 Pressure Tests - Defective Active Inlet Valve 184

Pressure Tests when the Pump is broken 185

200

8 Pumps: Maintenance Information This chapter provides provide procedures for service and maintenance of the 1050 Pumps 203 Solvent Cabinet and Column HeaterReplacing the Heat Exchanger 205 Replacing the Cable Assembly 206

205

Replacing the Active Inlet Valve

207


7

Contents

Replacing the Outlet Ball Valve 209 Maintaining the Frit Adapter Assembly Maintaining the Purge Valve 211

210

Maintaining the Pump Head Assembly 212 Procedure 1: Pump Head with old Plunger HousingStage 1: Removing the Pump Head Assembly 213 Stage 2: Disassembling the Pump Head assembly 213 Stage 3: Replacing the Seals 214 Stage 4: Disassembling the Plunger Housing 215 Stage 5: Reassembling the Plunger Housing 216 Stage 6: Reassembling the Pump Head Assembly 217 Stage 7: Mounting the Pump Head Assembly 217

213

Procedure 2: Pump Head with new Plunger HousingStage 1: Removing the Pump Head Assembly 218 Stage 2: Disassembling the Pump Head Assembly 218 Stage 3: Replacing the Seals 219 Stage 4: Reassembling the Pump Head Assembly 220 Stage 5: Mounting the Pump Head Assembly 220

218

Continuous Seal Wash Option 221 Replacing the Fan 222 Removing the Metering Drive Assembly

223

9 Pumps: Parts Information This chapter provides information on parts of the 1050 Pumps 225 Electronic Boards 227 Complete List of Ti-Parts 229 Solvent Cabinet 230

8


Contents

Solvent Cabinet with Helium Degassing 232 Solvent Cabinet with Column Heater and Manual Injection Valve 234 Overall Diagram 236 Hydraulic Flow Path 240 Metering Drive Assembly 243 Pump Head Assembly (old version) 244 Pump Head Assembly (new version) 245 Pump Head Assembly with Seal Wash 246 Active Inlet Valve 248 Outlet Ball Valve 249 Frit Adapter Assembly 250 Purge Valve Assembly 251 Column Holder Assembly 252 Special Tools 253

10Pumps: Additional Information This chapter provides additional information about the 1050 Pumps 255 Product History 257 Firmware History 259Revision 1.0 Revision 3.0 Revision 3.1 Revision 3.2 259 259 260 260

How does the On-line Monitor work 261Normal Operation 262 M2 Gas Bubble 263 M4 Leak at first Piston 265


9

Contents

M6 Valve Backflow 266 M8 Outlet Valve Problem

267

If You Need Operational Hints 268Helium Degassing Principle 269 Helium Regulators 269 Bottle Head Assembly 270 Isocratic Pumps 270 Pump Head Assembly 271 PDC Board 271 PDC2 Board 271 HRQ Board 272 GVD Board 272 Wear Retainer 272 Outlet Ball Valve 273 Flow Test Method 273 Method loading 273 Flow Gradients 273 Manual Injection Valve 273 Metering Drive Repairs 274 Troubleshooting E27 Errors (Max Motor Drive Power Exceeded) Piston with Conical Holder 276 Ghost Leak messages 276 PANIC Errors 276

275

11Sampler: General Information This chapter provides general information about the 1050 Autosampler 281 About this Manual 282 About the Autosampler 282 Repair Policy 283

10


Contents

Product Structure 283 Capillaries 284 Specifications 285

12Sampler: Hardware Information This chapter provides hardware information about the 1050 Autosampler 287 Overview 289 Solvent Flow Path 290 How Does The Autosampler Work? 291 The Injection Sequence 293 What happens when the 18596L/M Sample Tray is connected? 294 Overview of the Electronics 295 Sampling Unit 297 Metering Drive 299 Analytical Head Assembly 300 High Pressure Switching Valve 301 Pneumatic Assembly 302Actuator Air Solenoids 303

Additional 100 Sample Capacity

304

13Sampler: Electronic Information This chapter provides electronic information about the 1050 Autosampler 307 Overview 309


11

Contents

Max Tray Drive Board (MTD) 312 Needle Mini Tray Drive Board (NMD) 316 Valve Metering Drive Board (VMD) 320 Firmware Board (FIM) 324 Autosampler Motherboard (ALM) 325 Extender Test Board (ET) 330

14Sampler: Diagnostic Information This chapter provides information on error messages and diagnostic features of the 1050 Autosampler 333 Single Steps 335335

Entering the Test Functions

Single Steps For The 21 Sample Tray 336 Single Steps for the 100 Sample Tray 338Entering the Additional Single Steps Entering Diagnostic Mode 340 Z Test (Gripper Assembly) 340 R Test (radial arm movement) 341 Theta Test (angular movement) 341 338

18596L/M Sample Tray Diagnostic Mode

340

Error Messages 342Selftest 343 Panic Error 343

Common 1050 Error Messages 344 Error Messages for Firmware Revision 4.0 and greater 346 Injector Program Error Messages 350 Normal Operation Messages for Firmware Revision 3.1 and below 351 Events Messages 354

12


Contents

18596L/M Vial Tray

355

15Sampler: Maintenance Information This chapter provides provide procedures for service and maintenance of the 1050 Autosampler 357 Sampling Unit 359Stage 1: Removing the Sampling Unit 359 Stage 2: Removing the Needle 360 Stage 3: Installation of the Needle 361 Stage 4: Removing the Seat Capillary 361 Stage 5: Disassembling the Needle Arm 362 Stage 6: Reassembling the Needle Arm 362 Stage 7: Disassembling the Tray Mechanic 363

Metering Device

365

Removing the Metering Device 365 Removing the Gear Belt 365 Analytical Head Assembly 366 Procedure 1: Analytical Head Assembly with old Adapter Housing Procedure 2: Analytical Head with new Adapter Housing 369 Reassembling the Metering Device 371

366

High Pressure Switching ValveStage 1: Removing 372 Stage 2: Disassembling 372

372

Adjust the Sensors 374Service Only Level 374 Sensors of the Sampling Unit 376 Sensor of the High Pressure Switching Valve Metering Device Home Sensor 380 379


13

Contents

16Sampler: Parts Information This chapter provides information on parts of the 1050 Autosampler 381 Electronic Boards and Fuses 383Electronic Boards Fuses 383 383

Complete List of Ti-Parts 384 Overall Diagram 79855A/B 385 Hydraulic Flow Path 389 Sampling Unit 391Arm Assembly Spare Parts 395

Metering Drive and Analytical HeadMetering Drive 396 Analytical Head (Old Version) 396

396

High Pressure Switching Valve 399 Pneumatic Valve Assembly 401

17Sampler: Additional Information This chapter provides additional information about the 1050 Autosampler 403 Product History 405 Firmware Revisions 406Firmware Revision 1.0 Firmware Revision 2.0 Firmware Revision 2.1 Firmware Revision 3.0 Firmware Revision 3.1 Firmware Revision 4.0 406 406 407 408 409 410

14


Contents

Firmware Revision 4.1 411 Firmware Revision 4.2 411 If you update the firmware to revision 4.0 and greater 412 If you add a 100 vial tray to the autosampler 412 If you have Intermittant E17: Needle cannot move out of vial If you have to update the autosampler with a fan 413 If the fan in the autosampler does not work properly 413 If the needle lifts the vial out of the tray 414 If the injections are not reproducible (grooved needle) 414

413

18DAD/MWD: General Information This chapter provides general information about the 1050 Diode Array and Multiple Wavelength Detectors 419 About the Detector 420General 420 Repair Policy 420 Identification 421 Compatibility 421

DAD Differences 422Added features 422 Removed features from local keyboard Restrictions of user interface 423 Compatibility 423 Local User Interface 424 Workstation Interface 426 Test Functions 428 Options 428 422

Specifications DAD/MWD 429


15

Contents

19DAD/MWD: Hardware Information This chapter provides hardware information about the 050 Diode Array and Multiple Wavelength Detectors 433 Overview: Optical System 435 Overview: Electronics 436 Optical Unit 438Flow Cell Assemblies 439 Slit Assembly 441 Deuterium Lamp Assembly 442 Heat Exchanger Assembly 444 Shutter Assembly 445 Leak Sensor Assembly 446

Fans 447

20DAD/MWD: Electronic Information This chapter provides electronic information about the 1050 Diode Array and Multiple Wavelength Detectors 449 Overview 451 Array Signal Conversion Board (ASC) 454 Data Acquisition Board (AQB) 459 Firmware Board (FIM) 463 Common Main Processor Board (CMP) 464Remote Control 466

Communication Interface (CRB) 467 Digital to Analog Conversion Board (DAC) Fluorescent Indicator Module (FIP) 472 Motherboard (LUM) 473 LPC Board 477

468

16


Contents

Power Supply (DPS-A)

478

21DAD/MWD: Diagnostic & Troubleshooting Information This chapter provides information on error messages and diagnostic features of the 1050 Diode Array and Multiple Wavelength Detectors 483 STATUS InformationStatus Modes 485 Status LEDs 486 Warnings 486

485

Error Messages 487Selftest 487

Common 1050 Error Messages 488 1050 DAD/WMD Error Messages 490 Diagnostic Features 493Entering the Test Functions 493

Measure Intensity Profile 494 Lamp Intensity Test 496 Measure Holmium Spectrum 498 D/A Converter Test 500 Electronic Noise Test 502 Check of Wavelength Calibration 504 ASC Test 505 Shutter Position 506 ROM/RAM/DISPLAY Tests 507 Using the Built-in Test Chromatogram 508How to print the DAD Profiles 510


17

Contents

22DAD/MWD: Maintenance Information This chapter provides provide procedures for service and maintenance of the 1050 Diode Array and Multiple Wavelength Detectors 513Tools Needed 514 Warnings and Notes

515

Removing the Optical Unit 516 Flow Cell Maintenance 517Flushing Procedure 517 Replacements on Standard Flow Cells 518 Replacements on High Pressure Flow Cells 520

Lamp House Window MaintenanceRemoving the Quartz Window 522

522

Replacing the Achromat 524 Replacing Fans 525 Replacement of Shutter or LPC Board 526 Replacement of Leak Sensor 527 Upgrade to from 79854A MWD to G1306A DAD 528 Upgrade MWD with Series II Optical 529 Verifying the Performance 530Specifications 530 What You Need 530 Preparations 530 Scaling Factors 532

23DAD/MWD: Parts Information This chapter provides information on parts of the 1050 Diode Array and Multiple Wavelength Detectors 533

18


Contents

Overall Diagram 535 Optical Unit 538 Heat Exchanger and Flow Cell 540 Flow Cell Parts (STD-SST) 541 High Pressure Flow Cell Parts (HP-STD-SST) 542 High Pressure Flow Cell Parts (HP-Micro-SST) 543 Cell Repair Kits 544 Lamp Housing 545 Upgrade Parts MWD to DAD 546 Upgrade Parts MWD to Series II Optical 547 List of Accessories 548

24DAD/MWD: Additional Information This chapter provides additional information about the 1050 Diode Array and Multiple Wavelength Detectors 549 Product HistoryHardware Changes

551551

Firmware Changes 552 Known Problems 553Panic Errors 553

25VWD: General Information This chapter provides general information about the 1050 Variable Wavelength Detectors 559 About the Detector 561 Versions vs. Support Periods (EOS) 561


19

Contents

79853A 79853C

561 561

Repair Policy 562 Specifications 563

26VWD: Hardware Information This chapter provides hardware information about the 1050 Variable Wavelength Detectors 565 Overview 566 Optical System Overview 568 Leak Interface Assembly 569 Leak Sensor Assembly 570 Fan Assemblies 571 Optical Unit 572Flow Cells 573 Deuterium Lamp 576 Photodiodes Assemblies 579 Filter Assembly 580 Grating Assembly and Motor 581 Mirrors 582 Slit Assemblies 582 Beam Splitter 582

Enhanced Optical Unit (D) 583

27VWD: Electronic Information This chapter provides electronic information about the 1050 Variable Wavelength Detectors 585

20


Contents

Location of Electronic Assemblies 587 Interconnection Diagram 589 Detector Controller Board (DCB) 590Digital Section 592 Analog Sections 594

Power Supply (DPS-A) Keyboard 602

601603

Keyboard Electronics (KDI / VFD)

Pre-Amplifier Boards 605 Power Supply Connection Board (PSC) 606 GPIB Communication Interface 607GPIB Firmware Revisions 608

28VWD: Diagnostic & Troubleshooting Information This chapter provides information on error messages and diagnostic features of the 1050 Variable Wavelength Detectors 609 Self Diagnosis 611During Power On 611 During Normal Operation At Power ON 612 611

Error Messages Before Lamp Ignition

612

Error Messages After Lamp Ignition 616 Error Messages During Normal Operation 617 Error Messages During Use of Control Functions 619 User Control Functions 620 Service Control Functions 622Entering the Service Mode 622 Zero Order Calibration 624


21

Contents

Wavelength Calibration 626 Wavelength Calibration Check 628 SET WL Parameter 629 Fix Signal 631 Leak Sensor Voltage 634 Voltage Test 635 ADC Noise 636 Grating Photo Sensor 637 Filter Photo Sensor 638 Remote Test 639 Filter Check 640 Zero Order Test 641 DAC Test 642 Pre-amplifier Gain 644 EEROM Test 645 DAC Calibration 646 Wavelength Compensation 647

29VWD: Maintenance Information This chapter provides provide procedures for service and maintenance of the 1050 Variable Wavelength Detectors 649 Warnings 650 Securing for Transport 651 Replacement of Deuterium LampStep 1: Replacement 652 Step 2: 0th Order Calibration 653 Step 3: WL CALIBRATION 654

652

Flow Cell MaintenanceFlow Cell Maintenance Kits Replacing Cell Parts 655

655655

22


Contents

Flushing Procedure Leak Test 657

656

Using the Cuvette Holder 658 Replacing DCB Board and FirmwareDCB Board 661 DCB Firmware 661

661

Replacing Display Boards 662 Replacing the Leak Interface 663Leak Sensor Assembly Leak Interface 664 663

Replacements in the Optical Unit

665

Removing the Optical Unit 666 Replacing the PSC Board 667 Replacing Pre-amplifiers or Photodiodes 667 Replacing Grating Assembly Parts 668 Replacing Filter Assembly Parts 670 Replacing Mirrors, Beamsplitter and Slits 670

Optical Alignment Procedures 671Procedure 1: Simple Alignment 671 Procedure 2: Sample Beam Alignment 672 Procedure 3: Reference Beam Alignment 674

Cleaning of Optical Unit Parts 675 Upgrade to GPIB 676 Performance Verification 677What you need 677 Preparations 677 Starting a run 678 Scaling Factors 679

30VWD: Parts Information This chapter provides information on parts of the 1050 Vari-


23

Contents

able Wavelength Detectors Overall Diagram 683 Front Panel Parts 686Leak Interface 686 Font Panel 687

681

Optical Unit C

688

Optical Unit C Inner Parts Top 689 Optical Unit C Inner Parts Bottom 690

Grating Assembly 691 Filter Assembly 692 Standard Flow Cell C (SST/Ti) 693 Semi-Micro Flow Cell (SST) 695 High Pressure Flow Cell (SST) 696 Ultra High Pressure Flow Cell (SST) 697 Preparative Flow Cell (Ti) 698 Cuvette Holder 700 Accessories 701 Screws 702

31VWD: Enhanced Optical Unit Information This chapter provides information about the enhanced optical unit D 705 Compatibility 706 Support of Previous Optical Units Introduction 707 Support Considerations 708Prefix Change 708 Identification 708

706

24


Contents

Compatibility Matrix

708

Part Numbers for Enhanced D Optical Unit 709 Standard Flow Cell D Repair Parts 710 Repair and Mainenance 711Tools required: 711 Pre-requisites: 711

Additional Information 712 Replacements and Calibrations 712 Installing the Test Slit 713 Replacing Mirror #1 Assembly 715 Replacing Mirror #3 or #4 Assembly 716 Replacing the Grating or Grating Motor 718 Replacing the Beam Splitter 720 Cleaning or Replacing the Lens 721 Unlocking the Reference Aperture 723 Optimizing the Reference Readings 725 Installing the Standard Slit 726

32VWD: Additional Information This chapter provides additional information about the 1050 Variable Wavelength Detectors 727 Product HistoryPrefix Changes

729729

DCB ROM Firmware Revisions 731 GPIB ROM Firmware Revisions 733 Hardware Changes and Service Notes 734Modified Pre-Amplifier Gain 734 Important Service Note 734


25

Contents

26


1050 Series of HPLC Modules Service Handbook Common Information



IMPORTANT NOTE This version of the 1050 service manual includes all sections from the 01050-90102 edition 4 (1995) and G1306-90102 edition 2 (May 1994). It merges both sections, the MWD and the DAD. The series I opticals information (79854A MWD) information has been removed (product went out of support during 2000). Part numbers have been updated as of 11/2001. Contact your local Agilent support office in case of part number issues or upgrades. The latest version of this manual is available as Adobe Acrobat Reader (PDF) version only and can be downloaded from the Agilent Technolgies web page www.agilent.com.


1

1

Common: General InformationThis chapter provides general information about the 1050 Series of HPLC Modules

Common: General Information Safety Information

Safety InformationThe following general safety precautions must be observed during all phases of operation, service, and repair of this instrument. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the instrument. Agilent Technologies assumes no liability for the customers failure to comply with these requirements.

GeneralThis is a Safety Class I instrument (provided with terminal for protective earthing) and has been manufactured and tested according to international safety standards.

OperationBefore applying power, comply with the installation section. Additionally the following must be observed. Do not remove instrument covers when operating. Before the instrument is switched on, all protective earth terminals, extension cords, auto-transformers, and devices connected to it must be connected to a protective earth via a ground socket. Any interruption of the protective earth grounding will cause a potential shock hazard that could result in serious personal injury. Whenever it is likely that the protection has been impaired, the instrument must be made inoperative and be secured against any intended operation. Make sure that only fuses with the required rated current and of the specified type (normal blow, time delay, and so on.) are used for replacement. The use of repaired fuses and the short-circuiting of fuseholders must be avoided. Some adjustments described in the manual, are made with power supplied to the instrument, and protective covers removed. Energy available at many points may, if contacted, result in personal injury. Any adjustment, maintenance, and repair of the opened instrument under voltage should be avoided as much as possible. When inevitable, this should be carried out by a skilled person who is aware of the hazard involved. Do not attempt internal service or adjustment unless another person, capable of

30



rendering first aid and resuscitation, is present. Do not replace components with power cable connected. Do not operate the instrument in the presence of flammable gases or fumes. Operation of any electrical instrument in such an environment constitutes a definite safety hazard. Do not install substitute parts or make any unauthorized modification to the instrument. Capacitors inside the instrument may still be charged, even though the instrument has been disconnected from its source of supply. Dangerous voltages, capable of causing serious personal injury, are present in this instrument. Use extreme caution when handling, testing and adjusting. When working with solvents please observe appropriate safety procedures (for example, goggles, safety gloves and protective clothing) as described in the material handling and safety data sheet by the solvent vendor, especially when toxic or hazardous solvents are used.


31


Safety SymbolsTable 1 shows safety symbols that are used on the instrument and in the manuals.

Table 1

Safety Symbols Symbol Description The apparatus is marked with this symbol when the user should refer to the instruction manual in order to prevent risk of harm to the operator and protect the apparatus against damage. Indicates dangerous voltages.

Indicates a protected ground terminal.

Eye damage may result from directly viewing the light produced by the deuterium lamp used in this product. Always turn off the deuterium lamp before opening the metal lamp door on the side of the instrument. WA R N I N G A warning alerts you to situations that could cause physical injury or damage to the equipment. Do not proceed beyond a warning until you have fully understood and met the indicated conditions.

C A UT I O N

A caution alerts you to situations that could cause a possible loss of data. Do not proceed beyond a caution until you have fully understood and met the indicated conditions.

32


Common: General Information Radio Interference

Radio InterferenceManufacturers DeclarationThis is to certify that this equipment is in accordance with the Radio Interference Requirements of Directive FTZ 1046/1984. The German Bundespost was notified that this equipment was put into circulation, the right to check the series for compliance with the requirements was granted. Test and Measurement If test and measurement equipment is operated with equipment unscreened cables and/or used for measurements on open set-ups, the user has to assure that under operating conditions the radio interference limits are still met within the premises.

Sound EmissionManufacturers DeclarationThis statement is provided to comply with the requirements of the German Sound Emission Directive of 18 January 1991. This product has a sound pressure emission (at the operator position) < 70 dB. Sound Pressure Lp < 70 dB (A) At Operator Position Normal Operation According to ISO 7779:1988/EN 27779/1991 (Type Test)


33

Common: General Information UV-Radiation

UV-RadiationEmissions of ultraviolet radiation (200-315 nm) from this product is limited such that radiant exposure incident upon the unprotected skin or eye of operator or service personnel is limited to the following TLVs (Threshold Limit Values) according to the American Conference of Governmental Industrial Hygienists:

Table 2

UV-Radiation Limits Exposure/day 8 hours 10 minutes Effective Irradiance 0.1 W/cm2 5.0 W/cm2

Typically the radiation values are much smaller than these limits:

Table 3

UV-Radiation Typical Values Position Lamp installed, 50-cm distance Lamp installed, 50-cm distance Effective Irradiance average 0.016 W/cm2 maximum 0.14 W/cm2

34


Common: General Information Solvent Information

Solvent InformationObserve the following recommendations on the use of solvents.

Flow CellLong term operation at pH > 11 should be avoided. Never leave strongly alkaline solutions in the flow cell without flow.

SolventsAlways filter solvents through 0.4 m filters, small particles can permanently block the capillaries. Avoid the use of the following steel-corrosive solvents: Solutions of alkali halides and their respective acids (for example, lithium iodide, potassium chloride, and so on). High concentrations of inorganic acids like sulfuric acid, especially at higher temperatures (replace, if your chromatography method allows, by phosphoric acid or phosphate buffer which are less corrosive against stainless steel). Halogenated solvents or mixtures which form radicals and/or acids, for example: 2CHCl3 + O2 2COCl2 + 2HCl This reaction, in which stainless steel probably acts as a catalyst, occurs quickly with dried chloroform if the drying process removes the stabilizing alcohol. Chromatographic grade ethers, which can contain peroxides (for example, THF, dioxane, di-isopropylether) such ethers should be filtered through dry aluminium oxide which adsorbs the peroxides. Solutions of organic acids (acetic acid, formic acid, and so on) in organic solvents. For example, a 1-% solution of acetic acid in methanol may attack steel. Mixtures of carbon tetrachloride with 2-propanol or THF dissolve stainless steel.


35

Common: General Information 1050 Introduction

1050 IntroductionThe Modules Overview1050 is a series of HPLC products based on a modular concept. The necessary functions are broken down into independent stand-alone modules with standardized external design hydraulic- and external interfaces. Following modules will be available at introduction:

Table 4

1050 Modules Module 1050 Isocratic Pump 1050 Quaternary Pump 1050 Quaternary Pump (bio compatible) 1050 Variable Wavelength Detector 1050 Multiple Wavelength Detector 1050 Diode Array Detector 1050 Autosampler 1050 Autosampler (bio compatible) Product Number 79851A 79852A 79852B 79853C 79854A G1306A 79855A 79855B

36



Figure 1

1050 Modules


37


1050 IdentificationEach module is identified by a 5 digit product number and a 10 unit serial number on a label attached to the wall inside the module. The first four digits of the serial number are the serial prefix. The letter identifies the country of origin. The last five digits are an identification number unique to each module. Any changes to the modules will be covered initially by Service Notes. They will be sent out to all Service personnel prior to implementation of the change to the instrument. With every reprint these changes will be incorporated into the documentation.

Repair PolicyMajor mechanical and electrical assemblies inside the 1050 modules will be repaired on an assembly-exchange level. All other items have to be repaired on board/component level. Repair procedures are given in the respective sections of this manual (refer to Table of Contents). Assemblies can be set up to the Blue Stripe Exchange system or can be removed. If in doubt contact Waldbronn Product Support (Europe/ICON) or Little Falls Product Support (USA/Canada).

38


2

2

Common: Electronic InformationThis chapter provides common electronic information about the 1050 Series of HPLC Modules

Common: Electronic Information

This chapter gives information about the common electronics used in more than one of the 1050 Series of modules: Overview Common Main Processor (CMP) Remote Control Firmware Boards (FIM, SFW) Fluorescent Indicator Module (FIP) External Contacts Poweer Supplies (DPS-B, DPS-A) Communication Interfaces (CIB, CRB)

40


Common: Electronic Information Overview

OverviewSome of the electronic boards are used in more than one 1050 module. The following table shows common electronic assemblies:

Table 5

Common Electronic BoardsDescription Power Supply (DPS-B) Power Supply (DPS-A) Common Main Processor (CMP) Display Interface Board (FIP) Communication Interface (CIB) Communication Interface (CRB) Modules pump, sampler MWD, DAD, VWD pump, sampler, MWD, DAD pump, sampler, MWD, DAD pump, sampler MWD, DAD Part Number 5061-3374 5061-3375 5061-3380 5061-3376 5061-3382 5062-2482 Exchange 01050-69374 01050-69375 01050-69580 no no no


41

Common: Electronic Information Common Main Processor Board (CMP)

Common Main Processor Board (CMP)Repair Level: Board

Table 6

Part Numbers for CMP Board Item CMP Board (Exchange) CMP Board (NEW) Part Number 01050-69580 5061-3380

Common 1050 Functions display handling keyboard polling remote control input and output leak sensing option interfacing time programming method storage module configuration memory switching 32 kbyte RAM with battery back-up for parameter storage.

42



Figure 2

Blockdiagram CMP


43


According to the above functions the main processor board contains some basic hardware which is common to all 1050 modules: 68008 main processor running at 8 MHz; 64 kByte RAM (32 kbyte RAM with battery back-up for parameter storage. The data will be lost when CMP is removed from the slot); interrupt logic for system communication; 3 channel software controlled timer; interface to keyboard/display module; remote I/O hardware; leak sensor electronics; interface to backplane bus; watchdog hardware. Firmware is not part of this board, because parts of the main processors software are module specific. The main processor firmware will be located on the personality module (AQB-, RAD, VMD-Board) or on an optional board.

CMP DetailsInterrupt system There are one non-maskable interrupt six high priority hardware interrupt lines and seven low priority mail interrupt lines. The non-maskable interrupt is connected to the powerfail line of the power supplies (DPS-A/B). The high priority interrupt lines are: One from timer 6840 for hardware synchronization and five from remaining slots (these lines are disabled by SOK- = HIGH (system not ok). The low priority interrupt lines are: Five lines from all slots except power supply used for communication with local processors via dual port RAMs and two lines for CMP controlled software interrupts. Watchdog timer (Test for CPU hang-up) This circuitry is software retriggerable and is disabled during CPU initialization. In case of CPU hang-up SOK line is set the CPU is halted and the remote line shutdown is set.

44



LED on board There is a RED LED on the board which is the output of the watchdog circuit. It is ON during initialization and when the processor has a hang-up (LD 101). Programmable timer It includes 3 independent timers: Timer 1 is connected to the backplane bus its free for module special use. Timer 2 is used as software timer for the CMP. Timer 3 is used to generate the BUS ERROR signal. Reset system A harware reset is performed at power manually by on-board switch Hardware reset will reset all devices connected to the bus but main processor can reset these devices by software too. Reset for display unit The latch for the status LEDs and the brigthness control will not be reseted by power on or by software reset. The alphanumeric display is reseted at power on. I/O Two remote connectors are at the rear panel. They provide start, stop, not ready, shutdown, prepare-run and power on signals. The remote lines are input and output and are decoupled for EMC. The shutdown line is set by hardware in the case of leak or CPU hang-up. System control The POK (peripheral OK) is driven from all devices. The SOK- (system OK) is outputted from main processor to all devices; is hardware and software controlled disables/enables all devices by main software; disables all devices if main processor watchdog becomes active (main processor hang-up); Service Handbook for 1050 Series of HPLC Modules - 11/2001 45


All devices are enabled after initialization. Bus control After bus request the main processor will pass bus control to the requesting external controller. The local main processor areas including I/O are accessible too. This may be a feature for diagnostics or if data rate is increasing to much with later options. For this second case an external fast transfer hardware (for example DMA device) could do the transfers after set-up by the main processor. Leak sensing The leak detection circuit is located on the CMP board and checks continuously for presence and leak conditions. If the sensor is missing (defect) or in leak condition the PTC is cooled down the error message appears. When the module is turned on the leak message is disabled for some time to allow the sensor to reach its working range. Working condition of the PTC Normal: Error: Actions: Check for leak. Check connector of the sensor. Check resistance of leak sensor. Change leak sensor. Change CMP board. Change FIM board. about 75C below 55C 400...500 Ohm about 150 Ohm

46



Remote ControlThe CMP board provides two remote connectors. Remote control allows easy connection between single instruments or systems to ensure coordinated analysis with simple coupling requirements. When 1050 System is started from the autosampler the following signals can be measured at the remote lines. The START REQUEST signal is only available when the autosampler was started from any other module (remote configuration set to HPSystem). Figure 3 Remote Control Analysis


47


For the 1050 Series of HPLC Modules the subminiatur D connector is used. Each module provides two remote connectors which are both parallel and inputs/outputs (wired-or technique). To provide maximum safety within a distributed analysis system one line is dedicated to SHUT DOWN the systems critical parts in case any module detects a serious problem. To detect whether all participating modules are switched on or properly powered one line is defined to summarize the POWER ON state of all connected modules. Control of analysis is maintained by signal readiness READY for next analysis followed by START of run and optional STOP of run triggered on the respective lines. In addition PREPARE and START REQUEST may be issued. Signal descriptionSHUT DOWN POWER ON READY PREPARE START REQUEST START STOP (L) System has serious problem (e.g. leak: stops pump). Receiver is any module capable to reduce safety risk. (H) All modules connected tosystem are switched on. Receiver is any module relying on operation of others. (H) System is ready for next analysis. Receiver is any sequence controller. (L) Request to prepare for analysis (e.g. calibration detector lamp on). Receiver is any module performing preanalysis activities. (L) Request to start injection cycle (e.g. by start key on any module). Receiver is the autosampler. (L) Request to start run / timetable. Receiver is any module performing runtime controlled activities. (L) Request to reach system ready state as soon as possible (e.g. stop run abort or finish and stop injection). Receiver is any module performing runtime controlled activities.

The signal level are defined as standard TTL levels (0 V is logic true, + 5 V is logic false). The remote lines can be input or output (wired or technique). Fan-out is 10 Input Load 2 kOhm against + 5 V Outputs are open collector type

48



The REMOTE Connector To help you make the correct connections the signals carried on each pin are listed in the table below (the colors refer to wires of remote cable 01046-60201). Figure 4 APG Remote Connector

Table 7

Remote SignalsPin 1 2 3 4 5 6 7 8 9 Signal Digital ground Prepare run Start Shut down Reserved Power ON Ready Stop Start request HIGH HIGH LOW LOW LOW LOW LOW Active Color white brown gray blue pink yellow red green black

Remote Configuration The 1050 Series provides three remote configurations: HPsystem GLOBAL LOCAL Start of automatic operation from any modules start key. Start request is outputted. Synchronized start of several modules for a single run. Start / Stop is outputted. Single modules start. No pulses outputted.


49


Figure 5

Table of line definition

Notes Y1 is done by balance key of MWD only. Y2 BALANCE on detectors is performed. Y3 is not used in the module. The remote line SHUT DOWN will always be active. The remote line POWER ON will not be processed.

50



Figure 6

Schematic of Remote Control

N OT E

Above schematic is for Pump, Autosampler, MWD and DAD. The signal level are defined as standard TTL levels (0 V is logic true, +5 V is logic false). The remote lines can be input or output (wired or technique). Fan-out is 10 Input Load >=2.2 kOhm against + 5 V Outputs are open collector type


51


Figure 7

Board Layout CMP

52


Common: Electronic Information Firmware Board (FIM)

Firmware Board (FIM)Repair Level: Exchange Board

Table 8

Part Numbers for Firmware Boards Item for Pumps (79851/2A/B) on RAD Board for Autosamplers (79855A/B) on VMD Board for Multiple Wavelength Detectors (79854A) on AQB Board for Diode ArrayDetectors (G1306A) on AQB Board Part Number Exchange 01018-66518 no 01078-66504 no 01048-66504 no G1306-66524 no

Firmware DescriptionFigure 3-7 shows the firmware structure for the 1050 Series of modules (pump, autosampler, multiple wavelength detector and diode array detector). As many as possible tasks use the same core firmware and only special routines for each module are developed seperate (control of the hardware sensors motors and so on). This common structure gives maximum flexibility for later development of similar products. It is obvious that also in the common firmware different commands display contents method parameters and so on. appear (Dialog, Method Handler, Parameter Handler). But nevertheless the structure is the same. In each part of the firmware there exist tables which hold the module specific commands parameters and so on, which are all handled under the same conditions. The firmware works with a foreground background mode. All time critical tasks (timetable execution, sensor and motor information) are working in the foreground mode and have highest priority. All other tasks share the remaining time in the background. If there are no tasks running the processor goes into the idle state. The firmware per module has approxmiately 300 kByte, where 170 kByte is Common and 130 kByte module specific).


53

Common: Electronic Information Firmware Board (FIM)

The firmware is located on the module specific firmware board which is piggy back on the personality board of each module (AQB-, RAD- or VMD-board) and can be exchanged easily. Figure 8 Firmware Structure

54


Common: Electronic Information Fluorescent Indicator Module (FIP)

Fluorescent Indicator Module (FIP)Repair Level: Board or Fuse ICP1

Table 9

Part Numbers for FIP Board Item FIP Board Fuse 1 A Part Number 5061-3376 2110-0099 used for pumps, autosampler, MWD amd DAD

The FIP module is located behind the keyboard module of pump, autosampler and multiple wavelength detector. The function of the FIP module is to provide an interface between a host system and the user. Messages can be displayed with up to 32 characters (2 lines x 16 characters/line). A matrix keyboard is scanned for numeric or special function input and status information is displayed through 4 LEDs. The characters are displayed in a 5 x 7 dot matrix. In case of a dark display, check the on board fuse ICP1 (1 A) which is soldered in close to the connector P1/P2. Figure 9 Board Layout FIP


55

Common: Electronic Information External Contacts

External ContactsThe personality boards of the 1050 modules (MWD/DAD: AQB, Pumps: RAD and Autosampler: VMD) have two external conacts at the rear. 1 contact without supply (contact closure) max. 30 V/250 mA (fused with 250 mA) 1 contact with internal 24 V supply (max. 250 mA output with fuse) The schematic for all three boards (AQB, NMD and RAD) is in general the same. Only the values of the components vary from board to board due to internal specifications. Figure 10 External Contacts

Table 10

Components of External ContactsComponents L1, L2, L3, L4 C1, C2, C6, C7 C3, C4, C8, C9 C5, C10 Fuse F250 mA (2110-0004) AQB 4.7 H 100 nF 10 nF 1 nF RAD 10 H 1 nF 10 nF 10 nF VMD 1 H

56


Common: Electronic Information Power Supply (DPS-B / DPS-A)

Power Supply (DPS-B / DPS-A)Repair Level: Fuses and DPS-B / DPS-A

Table 11

Part Numbers for LUC/LPC Board Item DPS-B (Exchange) DPS-B (New) DPS-A (Exchange) DPS-A (New) Fuse for 110 V operation 3 A Fuse for 220 V operation 2 A Part Number 01050-69374 5061-3374 01050-69375 5061-3375 2110-0003 2110-0002 used for Pumps and Autosamplers Pumps and Autosamplers MWD, DAD, VWD MWD, DAD, VWD

General DescriptionThe power supply is a primary switching regulated type. It consists of two parts. the Base Supply and the Lamp Supply. The Base Supply provides outputs of +5 V, 19 V, +24 V and +36 V. In addition the Lamp Supply provides all circuits necessary for the operation of a deuterium lamp.


57


Base Supply (DPS-B)Figure 11 on page 59 shows the base part of the DPS-A. The line voltage is rectified filtered and switched with about 50 kHz by a power MOS-FET. The complete control of frequency and pulsewidth is made by the control board #1 containing the logic needed and the FET driver. The isolation between the primary and the secondary part is made by opto-couplers and the switching transformer. The DC-output voltages are generated by single-phase rectifiers and LC-filtering with the additional features: The +36 V output has an separate over-voltage protection to limit the voltage to +45 V maximum. The +5 V output contains an additional analog series regulator to provide a stable output for all load conditions under different applications. The synchronization input is used in the 1050 MWD/DAD only to synchronize the switching frequency to a value of three times (54 kHz) of the diode array readout frequency. This output is not used in the other modules. The power supply status is monitored by the processor system to detect a powerfail condition and to save all important data. The Power Supply STATUS LED (GREEN) at the rear panel shows the OK condition of the power supply. N OT E OK means that the pulsewidth of the switching FET is inside the allowed limits. OK does not means that all voltages at the output are present (for example a broken inductor is not detected).

58



Figure 11

Block Diagram DPS-B (Base Supply)


59


Lamp Supply (DPS-A)Figure 12 on page 61 and Figure 13 on page 62 show the additional circuits necessary for the deuterium lamp: a DC output of 5.5 V for the regulated heater output (located on the primary board); a regulated constant current source with selectable current of 320 mA, 360 mA or 400 mA; a 600 V lamp ignition circuit; a 12 V regulated output for future use. WA R N I N G Hazardous voltage present at the output connector with instrument power cord connected to AC line. The main feature of this power supply is a low noise current source for the deuterium lamp. For realization a pulse-width modulated DC-DC converter (36 V input, 170 V no load output) is built-up with a switching FET and high voltage transformer. The pulse-width is regulated so that the DC-output is about 12V above the actual anode voltage of the deuterium lamp. This design allows minimum power loss if the anode voltage varies from lamp to lamp and by aging between 65 V and 100 V. The final regulation to the selected current is made by an analog power regulator. Again the switching frequency is synchronized to 54 kHz in the 1050 MWD/DAD.

60



Figure 12

Block Diagram DPS-A (Lamp Supply I)


61


Figure 13

Block Diagram DPS-A (Lamp Supply II)

62



Lamp Ignition To ignite the deuterium lamp a 0.5 F capacitor loaded with 600 V is discharged via a 10 kOhm resistor to the anode. These 600 V are generated by a separate winding. The lamp status output signal shows "OK" if the lamp current has the selected value. Otherwise an error message is generated. The heater output made by a series regulator is in the pre-heating status 2.5 V always. After ignition a different output voltage is selected depending on the lamp type used: In the 79853C VWD, 79854A MWD and the G1306A DAD, the heater is switched off after ignition. The 12 V low noise output is made by a series regulator connected to the +19 V output.


63

Common: Electronic Information Communication Interface (CIB / CRB)

Communication Interface (CIB / CRB)Repair Level: Exchange Board

Table 12

Part Numbers for CRB Board Item CIB Board (NEW) CRB Board (NEW) Part Number 5061-3382 5062-2482 used for Pumps and Autosampler 79854A MWD / G1306A DAD

N OT E

This section describes the communication interface for the 1050 Pumps (79851/2A/B), Autosamplers (79855A/B), Multiple Wavelength Detectors (79854A) and Diode Array Detector (G1306A) only. The communication interface for the 1050 Variable Wavelength Detector (79853C) is described in the chapter of the 1050 VW Detector. The communication interface board is necessary for the control by a Personal Computer and to connect printer or plotter devices. The communication interface board provides one GPIB and one RS-232 interface. The CRB for the 1050 MWD/DAD has a 96 kbyte runbuffer for the data/spectrum operation with the Multiple Wavelength Detector. The interface is located in Slot #2 of the module.

64



Compatibilities

Table 13

CIB/CRB Compatibility Instrument 1050 Pump 1050 Sampler 1050 MWD 1050 DAD R P C CIB R R C C CRB P P R R Firmware REV 3.1 REV 3.1 REV 3.1 REV 1.0

recommended configuration possible but not neccessary only for instrument control

Firmware To use the communication interface board it is mendatory to have the 1050 Modules equipped with the latest firmware revisions (see Table 13). Baud rate The board contains a baudrate generator. The baudrate is setable up to 19200 baud from the keyboard. The transmitter and receiver baudrate are independent adjustable. RS-232 Interface The implemented serial interface is a subset of the RS-232 standard only. It contains at PIN 2 PIN 3 PIN 4 RxD receive data (data input) TxD transmit data (data output) GND (Ground)

The 1050 modules are designed as DCE (data communication equipment) without hardware handshake.


65


66


3

3

Common: Cable InformationThis chapter provides information on cables for the 1050 Modules

Common: Cable Information

Overview

The 1050 Modules provide Analog Signal Output (Pumps, Detectors) Remote Control Connector (all) BCD Connector (Autosampler) WA R N I N G Never use cables other than the ones supplied by Agilent Technologies to ensure proper functionality and compliance with safety or EMC regulations.

68


Common: Cable Information Overview

Table 14

Cables Overview Type Analog cables Description 3390/2/3 integrators 3394/6 integrators, 35900A A/D converter General purpose (spade lugs) Remote cables 3390 integrator 3392/3 integrators 3394 integrator 3396A (Series I) integrator 3396 Series II / 3395A integrator, see page 74 3396 Series III / 3395B/96C/97A integrator 1100 / 1050 modules / 1046A FLD / 35900A A/D converter 1040 DAD / 1090 liquid chromatographs / SDM BCD cables 3392/3 integrators 3396 integrator General purpose (spade lugs) GP-IB cable 1100 module to ChemStation, 1 m 1100 module to ChemStation, 2 m 1100 module to ChemStation, 5 m 03396-61010 5061-3378 01046-60202 obsolete 03396-60560 18594-60520 10833A 10833B 10833D Part Number 01040-60101 35900-60750 01046-60105 01046-60203 01046-60206 01046-60210 03394-60600


69

Common: Cable Information Analog Cables

Analog CablesOne end of these cables provides a BNC connector to be connected to 1050 Series modules. The other end depends on the instrument to which connection is being made. 1050 to 3390/2/3 IntegratorsConnector 01040-60101 Pin 3390/2/3 1 2 3 4 5 6 7 8 Shield Center Pin 1050 Shield

Signal Name Ground Not connected Signal + Connected to pin 6 Analog Connected to pin 4 Key Not connected

1050 to 3394/6 IntegratorsConnector 35900-60750 Pin 3394/6 1 2 3 Shield Center Pin 1050

Signal Name Not connected Analog Analog +

70


Common: Cable Information Analog Cables

1050 to BNC ConnectorConnector 8120-1840 Pin BNC Shield Center Pin 1050 Shield Center

Signal Name Analog Analog +

1050 to General PurposeConnector 01046-60105 Pin 3394/6 1 2 3 Black Red Pin 1050

Signal Name Not connected Analog Analog +


71

Common: Cable Information Remote Cables

Remote CablesOne end of these cables provides a Agilent Technologies APG (Analytical Products Group) remote connector to be connected to 1050 Series modules. The other end depends on the instrument to be connected to. 1050 to 3390 IntegratorsConnector 01046-60203 Pin 3390 2 NC 7 NC NC NC NC NC NC Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)

Signal Name Digital ground Prepare run Start Shut down Not connected Power on Ready Stop Start request

Low Low Low

High High Low Low

72



1050 to 3392/3 IntegratorsConnector 01046-60206 Pin 3392/3 3 NC 11 NC NC NC 9 1 4 - Key NC Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)


Low Low Low

High High Low Low

1050 to 3394 IntegratorsConnector 01046-60210 Pin 3394 9 NC 3 NC NC NC 5,14 6 1 13, 15 Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)

Signal Name Digital ground Prepare run Start Shut down Not connected Power on Ready Stop Start request Not connected

Low Low Low

High High Low Low

N OT E

START and STOP are connected via diodes to pin 3 of the the 3394 connector.


73


1050 to 3396A IntegratorsConnector 03394-60600 Pin 3394 9 NC 3 NC NC NC 5,14 1 NC 13, 15 Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)


Low Low Low

High High Low Low

1050 to 3396 Series II / 3395A Integrators Use the cable 03394-60600 and cut pin #5 on the integrator side. Otherwise the integrator prints START; not ready.

74



1050 to 3396 Series III / 3395B IntegratorsConnector 03396-61010 Pin 33XX 9 NC 3 NC NC NC 14 4 NC 13, 15 Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)


Low Low Low

High High Low Low

1050 to 1050, 1046A or 35900 A/D ConvertersConnector 5061-3378 Pin 1050 / 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)


Low Low Low

High High Low Low


75


1050 to 1090 LC, 1040 DAD or Signal Distribution Module Connector 01046-60202 Pin 10901 NC 4 7 8 NC 3 6 5 - Key NC

Pin 10501 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black

Active Signal Name (TTL)Digital ground Prepare run Start Shut down Not connected Power on Ready Stop Start request High High Low Low Low Low Low

1050 to General PurposeConnector 01046-60201 Pin Universal Pin 1050 1 - White 2 - Brown 3 - Gray 4 - Blue 5 - Pink 6 - Yellow 7 - Red 8 - Green 9 - Black Active (TTL)


Low Low Low

High High Low Low

76


Common: Cable Information BCD Cables

BCD CablesOne end of these cables provides a 15-pin BCD connector to be connected to the 1050 Series modules. The other end depends on the instrument to be connected to. 1050 to 3392/3 Integrators (Obsolete)Connector 18584-60510 Pin 3392/3 10 11 3 9 7 5 12 4 6 - Key 1 2 Pin 1050 1 2 3 4 5 6 7 8 9 15

Signal Name BCD 5 BCD 7 BCD 6 BCD 4 BCD 0 BCD 3 BCD 2 BCD 1 Digital ground +5V

BCD Digit 20 80 40 10 1 8 4 2

Low


77

Common: Cable Information BCD Cables

1050 to 3396 IntegratorsConnector 03396-60560 Pin 3392/3 1 2 3 4 5 6 7 8 9 NC Pin 1050 1 2 3 4 5 6 7 8 9 15

Signal Name BCD 5 BCD 7 BCD 6 BCD 4 BCD 0 BCD 3 BCD 2 BCD 1 Digital ground +5V

BCD Digit 20 80 40 10 1 8 4 2

Low

1050 to General PurposeConnector 18594-60520 Pin 1050 1 2 3 4 5 6 7 8 9 15

Wire Color Green Violet Blue Yellow Black Orange Red Brown Gray White

Signal Name BCD 5 BCD 7 BCD 6 BCD 4 BCD 0 BCD 3 BCD 2 BCD 1 Digital ground +5 Vt

BCD Digit 20 80 40 10 1 8 4 2

Low

78


In This Book This manual contains technical information about the Agilent 1050 liquid chromatographs. This manual is available as electronic version (Adobe Acrobat Reader file) only.

1050 Series of HPLC Modules Service Handbook Pumps (79851A/79852A/B)



IMPORTANT NOTE This version of the 1050 service manual includes all sections from the 01050-90102 edition 4 (1995) and G1306-90102 edition 2 (May 1994). It merges both sections, the MWD and the DAD. The series I opticals information (79854A MWD) information has been removed (product went out of support during 2000). Part numbers have been updated as of 11/2001. Contact your local Agilent support office in case of part number issues or upgrades. The latest version of this manual is available as Adobe Acrobat Reader (PDF) version only and can be downloaded from the Agilent Technolgies web page www.agilent.com.


4

4

Pumps: General InformationThis chapter provides general information about the 1050 Pumps

Pumps: General Information

Introduction

This chapter gives general information on about this pump repair policy product structure capillaries specifications

About this ManualThis manual provides service information about the 1050 Pumps (isocratic and quaternary). The following sections give the detailed descriptions of all electronic and mechanical assemblies. You will find illustrated part-breakdowns interconnection tables connector configurations as well as all necessary replacement procedures in this manual. Detailed diagnostic procedures using firmware resident test methods and error messages are also given in this manual.

84


Pumps: General Information About the Pumps

About the PumpsThe 1050 Pump modules houses the mechanical devices and the electronic circuitry for either the isocratic or quaternary module which control the various functions of the flow system. The module is controlled via the user interface through which the operator defines his requirements (flow-composition and so on) and which provides the required analytical information.

Repair PolicyThe 1050 Pumps are designed that all components are easy accessible Customers are able to repair certain parts of the 1050 Pumps see Operators Handbook. For details on repair policy refer to Repair Policy on page 38.


85

Pumps: General Information Product Structure

Product StructureThe 1050 Series of HPLC modules are available in two versions. In the standard version most of the parts used are stainless steel. In the 1050 Ti Series the flow path of the quaternary pump consists solely of corrosion resistant materials such as titanium, tantalum, quartz, sapphire, ruby, ceramic and fluorocarbon polymers. It is recommended for use with mobile phases containing high salt concentrations, extreme pH solutions and other aggressive mobile phases. Isocratic Pump Quaternary Pump Ti - Quaternary Pump N OT E 79851A 79852A 79852B

The isocratic pump was also introduced as Ti - version (79851B) but due to the insufficient orders it became obsolete end of FY 91.

86


Pumps: General Information Capillaries

CapillariesIn the 1050 Pumps the capillary shipped with the module will have a plastic color coating for identification in terms of material and internal diameter. All capillaries before the injector have a internal diameter of 0.25 mm. From the injector the internal diameter is reduced to 0.17 mm.

Table 15

Capillary Color Code color blue green red white Internal Diameter 0.25 mm 0.17 mm 0.12 mm tantalum Material

N OT E

For the Ti pumps the fittings are always titanium with a titanium nitrite coating and the front and back ferrules are gold plated. The Ti capillaries have two color coatings. One for identifying the material covering the main part of the capillary and a small one for the internal diameter.


87

Pumps: General Information Specifications

Specifications

Table 16

Specifications of 1050 Pumps Hydraulic System Dual-pistons in-series with proprietary servo-controlled variable stroke drive floating pistons and active inlet valve. Setpoint from 0.001 to 9.999 ml/min in 0.001 ml/min increments. 20 to 100 l, automatic matched to flow rate or user-selectable.

HP1050

Documents

general information

flow pressure tests

diagnostic information

modified pressure tests

pressure tests leak

standard pressure tests

safety information

hardware information