2006 Executive Briefing Fujitsu Microelectronics America, Inc
209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Introduction Emi Igarashi
Corporate Overview Kazuyuki Kawauchi
Business Updates Keith Horn
Summary / Q&A Keith Horn
ProgramProgram
409/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu at a GlanceFujitsu at a GlanceHeadquarters: Tokyo, JapanPresident: Hiroaki KurokawaEstablished: June 1935Net Sales: 4,791.4 billion yen (US$40.6 billion)Net Income: 68.5 billion yen (US$581 million)R&D Expenditure: 241.5 billion yen (US$2.0 billion)Employees: 158,000 worldwidePrincipal Business Areas: Technology Solutions, Ubiquitous
Product Solutions, Device SolutionsStock Exchange Listings: Tokyo (Code: 6702), Osaka, Nagoya,
Frankfurt, London, Swiss
Note: Consolidated net sales, net income and R&D expenditure for fiscal year ended March 31, 2006. US$1 = ¥118. WW employees as of Mar. 31, 2006.
509/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Device Solutions
Technology Solutions
Ubiquitous Product Solutions
Principal Services and ProductsPrincipal Services and Products
IT ConsultingSystems Integration(System Construction, Application Management, Application Integration)IT Infrastructure Management(Outsourcing, Managed Services) Network Services
Personal ComputersMobile Phones* Hard Disk Drives and Other Storage Devices
Note: *Japan market only
Servers Enterprise Storage SystemsNetwork Systems (Optical, IP, Mobile, Submarine)Software(Middleware, Applications/ Packages, Network Management)Retail and Financial Systems
Document Imaging and Other PeripheralsOptical Modules
Semiconductors(ASICs, MPUs/MCUs, System Memory,
ASSPs)Media Devices
Foundry Services(front-end / back-end services)Electronic Components
609/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
FY 2005 Revenue by Business SegmentConsolidated Net Sales by Business Segment, Including Intersegment Sales
Technology Solutions
Ubiquitous Product Solutions
Device Solutions
Other Operations
Business CompositionBusiness Composition
¥2,983.9 billion(US$25.3 billion)
¥1,059.9 billion(US$9.0 billion)
¥707.5 billion(US$6.0 billion)
¥447.3 billion(US$3.8 billion)
• LSI Devices• Electronic Components• Others
• PCs/Mobile Phones• Hard Disk Drives• Others
• System Platforms• System Products• Network Products
• Services
8.6%13.6%
20.4%57.4%
Note: Percentage breakdown for each segment is calculated as segment’s net sales / ( total consolidated net sales + elimination). US$1 = ¥118. FY 2005 is fiscal year ended March 31, 2006.
709/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Global Presence / R&D and Design Centers
Regional HeadquartersRegional Headquarters
ccAmerica, Inc.America, Inc.
809/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu’s Successful IDM Business Strategy
Foundry Foundry
System Arch / DesignSystem Arch / Design
TechnologyTechnology
ASICASIC
SoCSoCLogic DesignLogic Design
System Arch / DesignSystem Arch / Design
ManufacturingManufacturing
New IDM Conventional Business
Logic DesignLogic Design
Physical DesignPhysical Design
As we move to 65nm process technology, design and manufacturing become more complex while time-to market schedules continue to compress. The solution for companies developing new ASICs, SoCs and ASSPs is to work very closely with their foundry and fab partners.
909/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
FujitsuFujitsu’’s 300mm (90nm/65nm) s 300mm (90nm/65nm) Wafer Plant in MieWafer Plant in Mie
Building 1Building 2
(under construction)
0
5,000
10,000
15,000
20,000
25,000
Capacity(300mm)
(wafers / month)
Sept 2006 March 2007 Sept 2007 March 2008
Building 1
Building 2
(8/25/06)
1009/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Technological InnovationsTechnological Innovations
Design for Manufacturing – Statistical Static Timing Analysis (SSTA)
The industry’s first comprehensive environment for Statistical Static Timing Analysis for submicron designs for COT and ASIC customersTiming optimization turn-around times will be reduced by up to 30 percent Available now
New FeRAM MaterialJoint development by Fujitsu and Tokyo Institute of Technology of new material for 256M FeRAM using 65-nanometer technology Provides very low power, high speeds for mobile electronic productsEngineering sample shipments are planned for 2009
1109/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Key Market Segments
NetworkingEnterprise / AccessStorageWireless
AutomotiveConsumerIndustrialSecurity
Key Product Groups and Services
Custom LSIIDM Services COT / ASICs / AccelArray™
Wireless SolutionsWiMAX SoCsGPS
Networking Solutions10Gbps Ethernet Switch ICs
Embedded SolutionsMCUsGraphic Display ControllersBiometric Sensor ICs
Other ASSPsFRAMMemory
Market Segment and Application FocusMarket Segment and Application Focus
1209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu is now accepting ASIC designs for production using its 65nm process for its North American customers 10 products under development High-performance Products
PC CPU Large scale FPGA Graphics
Low-power ProductsImage processorsDigital AV products
65nm Custom LSI Products (CS200/CS200A)65nm Custom LSI Products (CS200/CS200A)
SRAM Chip
Logic Chip
1309/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
WiMAX – Fujitsu’s End-to-End AdvantageWiMAX – Fujitsu’s End-to-End Advantage
1409/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Industry's Most Powerful 20-port 10Gigabit Ethernet Switch ICIndustry's Most Powerful 20-port 10Gigabit Ethernet Switch IC
MB8AA3020 Evaluation Board
Industry Firsts10GbE serial – direct XFP compatible interfaceCongestion management – BCN and priority pauseOn-chip micro-engine
Reduces S/W development timeVLAN virtualization
ApplicationsBlade-server switching bladeATCA carrier node blade
Mesh configurationCentralized switch
Micro-TCA hubEnterprise switchingHigh-performance computing
1509/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
MBF320 with USB2.0 Compatibility and PreBoot Authentication (PBA)MBF320 with USB2.0 Compatibility and PreBoot Authentication (PBA)
PC Security from Boot
Turnkey SolutionIntegrated PBA modulesEase of use and integration Convenience
Secure Fingerprint ID Logon Pre-boot (BIOS)Windows O/S client Network authentication
SecurityEndpoint securityHardened authenticationIdentity theftUnauthorized network access
1609/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Moving Forward – FMA VisionMoving Forward – FMA Vision
Successful business collaborations / partnerships with the IDM business modelFocus on major market areas
NetworkingAutomotiveConsumerIndustrialSecurity
Focus on major product linesCustom LSI (COT and ASIC)Wireless Solutions (WiMAX, GPS)Networking Solutions (10GbE switch)Embedded Solutions (MCUs, GDCs, biometrics)
1809/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Announcements and HighlightsAnnouncements and HighlightsASIC
Fujitsu is now accepting ASIC designs for production using its 65nm process for its North American customers New ASIC macros – PCI Express, 10G SerDes, Serial ATA
WiMAXFujitsu and Hopling Technologies bring Linux-based WiMAX board support packages to market – MOU signed
10GbEIndustry’s first 20-port, Ethernet switch IC with 10Gbps Ethernet serial interface for blade server, advanced TCA, micro TCA, and data center switching
EmbeddedNew high-speed 8-bit MCU for consumer electronics and appliance applicationsMBF320 Sweep Sensor™ IC featuring USB2.0 compatibility, pre-boot authentication for PCs, notebooks and tablets
New Technologies Design for Manufacturing – new Statistical Static Timing Analysis toolNew FeRAM material
1909/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Key Market Segments
NetworkingEnterprise / AccessStorageWireless
AutomotiveConsumerIndustrialSecurity
Key Product Groups and Services
Custom LSIIDM Services COT / ASICs / AccelArray™
Wireless SolutionsWiMAX SoCsGPS
Networking Solutions10Gbps Ethernet Switch ICs
Embedded SolutionsMCUsGraphic Display ControllersBiometric Sensor ICs
Other ASSPsFRAMMemory
Market Segment and Application FocusMarket Segment and Application Focus
2009/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Custom LSI Solutions
FoundryASIC
2109/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Full Turnkey – Foundry through ASICFull Turnkey – Foundry through ASIC
Customers can select service and business model
Turnkey Foundry ServiceTraditional Foundry Service
WaferProcess
MaskDesign
Assembly / Test
IPs
Design/Verification
Support
Total coordinationTotal coordination
WaferProcess
MaskDesign
Assembly / Test
IPs
Design/Verification
Support
2209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu CMOS Technology RoadmapFujitsu CMOS Technology Roadmap
1000
100
10
500
50
20
200
1998 2000 2002 2004 2006 2008 2010Year (Production Start)
Phys
ical
Gat
e Le
ngth
(nm
)
45-nm45-nm65-nm65-nm
90-nm90-nm130-nm130-nm180-nm180-nm
CS100A
CS200
CS100HP
CS80 / 80A
CS90A
CS200ACS90
CS100/CS100A (90nm)L actual = 40-80nmSiOC (k:2.9) low-kDual Damascene Cu
CS200/CS200A (65nm)L actual = 30-50nmNCS (NanoNano--Clustering Clustering Silica)Silica)
CS300/CS300A (45nm)CS300
CS300A
2309/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
90nm Products and Beyond90nm Products and Beyond
65nm products10 products under development
90nm productsMore than 80 products in production High-performance, low-power products
PC / server CPUs FPGA GraphicsMultimedia processorsDigital AV productsWireless (RFCMOS)Ethernet switches
2409/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
3.125Gbps SerDesPOS-PHY Level 3POS-PHY Level 410/100 MAC8b/10 Encdec10/100/1GMACXAUI PHY (90nm)HDLC3-port Ethernet Switch
Networking & Communication
ARM1176JZF-SARM926J-E ARM 946 E-SARM7TDMI-SARC Tangent-A4 (+DSP)ARC3 (+DSP extensions)
Fujitsu IP LibraryProcessors &
DSP
USB2.0 Host Controller USB2.0 Device ControllerUSB2.0 PHYUSB2.0 OTG PHY (90nm)USB1.1 Device ControllerUSB1.0 Host ControllerPCI (2.1) Controller – 33 MHZPCI-XPCI ExpressPCI Host ControllerSATA Host ControllerSATA PHYSATA Target Controller
Std. Bus Controllers
Memory Controllers
PCI-AHB BridgeARC-AHB Bridge ARM-AHB BridgePCMCIA-PCI
Bus Bridges Other Peripherals
Multimedia Access
VoiP Core (4-channel)JPEGNTSC/PALMJPEGVideo Encoder
IrDAUWB802.16 (MAC & PHY)
Wireless
ARM7 Cache ControllerARM7 EDRAM ControllerFCRAM ControllerSDR SDRAM ControllerDDR SDRAM controller Mobile DDRARM7 SRAM ControllerExternal Memory ControllerMemory Stick ControllerSD/SDIOSRAM ControllerFlash Controller
ADK ModulesAMBA Bus Macros
ARM Peripherals
DMA Controller (2,4,8-Ch)UARTI2CPCMCIAMemory Stick IFSD Card IFSPIRTCIDE66F_CAL
DES/3DESAES CAN2.0
* Partial listing
2509/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
High-Speed IO Macro RoadmapHigh-Speed IO Macro Roadmap
CY2003 20052004 2006 2007
UGPHY
0.5-3.125GbpsXAUI, S-RapidIO, FC,
SGMII, Backplane SONET
GPON0.155-2.488Gbps
OC-3/12/48
0.155-2.488Gbps
SATA1.5 & 3Gbps
Gen1/21.5 & 3Gbps
Gen1/2
6.4/10G
6.4G, 10GCEI6, XFI
1-10GCEI6, XFI, XAUI, GbE 3.125/5/6.4Gbps
PCIe Gen2, XAUI, Backplane
PCIe2.5Gbps-3.125G
PCIe Gen12.5Gbps-3.125G
PCIe Gen1 SATA
3-6.4G
PCIe
CS200HP
CS200A_LL
2.5Gbps-3.125GPCIe Gen1
CS200A_LL
CS100A_LL
SATA
PCIe
1-10G6.4/10G
130nm
1-10G
90nm 65nm
PCIe
CS100A_LL
CS100HP
1.5 & 3GbpsGen1/2
2609/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
WirelessSolutions
WiMAX
RangeCoverage
WiMAX Evolution
2709/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
WiMAX Forum EvolutionWiMAX Forum Evolution
CarriersSystems/Equipment
Makers
SemiconductorVendors
WiMAX Forum
+ More
+ More+ More
Currently more than 340 member companies
2809/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fixed WiMAX – A Solid Foundation for Fixed-to-Mobile Broadband
Subscriber Station Reference Board
Base Station Reference Board
Fujitsu Fixed WiMAX SoC
Point-Point Backhaul Point-Multipoint Access
Mesh Network Connectivity
Enterprise & Residential Terminals
Public Safety &Disaster Recovery
Next-GenerationGateway Plug-in Card
5.xGHz
2.xGHz
3.xGHz
2909/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Mobile WiMAX Applications
Target Product Roadmap
UbiquitousBroadband
MobileVoIP & Data
UbiquitousQuad Play
Feat
ures
+
+
3009/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu’s End-to-end Commitment
Integrated Services onHigh BW Dynamic Pipe Metro Fiber IP, ATM Core
Enterprise
ISP
PSTN
DNSDHCPTFTP
OAM&PT1 / AnalogVoice
Customer Premise Equipment (CPE) Cell SiteAccess ShelfPA, Antennas
Alarms
Service Provider Metro & Core Network Service Providers (NSP)NOC Management Servers
(DHCP, DNS, TFTP)
NOC
3109/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
NetworkingSolutions
10Gigabit Ethernet
3209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Next-Generation Switch Chip –MB8AA3020Next-Generation Switch Chip –MB8AA3020
Industry Firsts10GbE serial – direct XFP compatible interfaceCongestion management – BCN and priority pauseOn-chip micro-engine
Reduces S/W development timeVLAN virtualization
Key FeaturesSingle-chip, 10GbE switch Number of 10GbE ports: 20Throughput: 400+GbpsPHY interfaces
XAUI/CX4/KX4(3.125Gbps x 4)
Power and physical size15 to 20WFCBGA1156 (35mm x 35mm)
TechnologyCMOS 90nm process
BenefitsFewer interconnects Reduced chip count and costs in having direct XFP interfaceEnhanced QoSFast firmware developmentNon-blocking wire-speed operationLow latency (300 ns)Board area savingsLow power requirement
ApplicationsBlade-server switching bladeATCA carrier node blade
Mesh configurationCentralized switch
Micro-TCA hubEnterprise switchingHigh-performance computing
3309/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
The Fujitsu 20-port 10GbE Switch as a Managed SwitchThe Fujitsu 20-port 10GbE Switch as a Managed Switch
MB8AA302020-port Switch
PORT (0-9) PORT (10-19)
2 X GbE LinksCopper Cable Copper Cable
CX4
CX4
CX4
CX4
XAUI
XAUI
CX4
CX4
CX4
CX4
XFI XFI
XENPAK Optical Module
XFPModules
Control Plane Interface
Eliminates the need for XAUI to XFI conversion SerDesBenefits:Eliminates cost of conversion – $ 100 per chip x 20 portsBoard area savingsFewer connectionsReduced latency – otherwise introduced by conversion (130ns)Reduced power consumption
3409/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Embedded Solutions
BiometricsMicrocontrollerFlexRayIDB-1394GDC
3509/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fingerprint Sensor IC OfferingsFingerprint Sensor IC OfferingsSensor ICs Features / Benefits Applications
MBF320PBT-GE1: USB/SPI Sweep Sensor™ PC notebooks & tablets8x256 pixel array, 500 dpi, AFD Computers & networksLow cost, power, size USB embedded/mobile
MBF310PBT-GE1: MCU/SPI Sweep Sensor Cell phones, lock boxes8x256 pixel array, 500 dpi, AFD Access control2KB FIFO, low cost, power, size MCU/SPI embedded
MBF200PFW-LP-G: USB/MCU/SPI Touch Sensor PC peripherals300x256 pixel array, 500 dpi Passport/Visa, POSAuto Finger Detect (AFD) Computers & networksLow power, 8-bit gray-scale SecurityConvenience (single touch)
SPF200-USB-E1 USB PCB mounted assembly Access control, kiosksusing MBF200 for rapid Integrated fingerprintdeployment & prototyping solutions, mobile,
Lock boxes
Fingerprint Dev Kits Fingerprint SDKs and MCU ports Integrated FP solutions
3609/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
MBF320 PC Notebook Preboot Solution Using Phoenix TrustedCore BIOSMBF320 PC Notebook Preboot Solution Using Phoenix TrustedCore BIOS
x86 Hardware
TrustedCore Secure Firmware
PBA Biometric Agent
FingerprintSensorDriver
MatchingEngineDriver
BIOS Extensions for GINA Credential Transfer
WindowsGINA Interface
BioTrust ID Client
WindowsLog On
FileEncryption
PasswordManager
No Companion Chip• USB integrated controller• Cost saving ($3-$5)• Power saving
OS Level• Industry-leading matching algorithm (using Cogent Systems) • End-to-end turnkey solution• Provides secure fingerprint logon to Windows and network domains
PBA Biometric Agent• Matching engine and biometric sensor driver• No development time (turnkey)• Standardized pre-boot solution (not vendor specific)• Integrated with TC secure environment and platform initiatives
3709/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
MCU Roadmap – ExpansionMCU Roadmap – Expansion8-bit F2MC-8FX: Further expansion of low-end MCU family
High-performance 8-bit CISC CPU and low power consumptionImproves 10MHz single-cycle operation to 16MHz single-cycle operation
16-bit F2MC-16LX and -16FX: New products for mid-range MCUs Technology migration to 0.18µm16FX series provide more than 20MIPS, five times the performance of the predecessor 16LX, or one fifth of the power consumption for the same task
FR60: New family of high-end MCUsTechnology migration to 0.18µm, while supporting 5V power supplyUp to 4MB of Flash100MHz operation up to 105ºC, automotive environmentUp to 6 CAN I/F with support for 128-message buffer per channel
3809/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
1MIPS
10MIPS
100MIPS
F2MC-8L(8-bit CISC)
0.5µm 0.35µm 0.25µm 0.18µm 90nm
F2MC-16LX
(16-bit CISC)
F2MC-8FX(8-bit CISC)
FR30(32-bit RISC)
FR60(32-bit RISC)
FR60Lite(32-bit RISC)
Automotive
Companion ChipHome Appliances
Automotive
Digital AV
FA
Digital AV
FR70(32-bit RISC)
FR80(32-bit RISC)
Automotive
Digital AV
F2MC-16LX/FX
(16-bit CISC)
FR80x(32-bit RISC)200MIPS
MCU – Target MarketsMCU – Target Markets
AutomotiveEmbedded FlashHigh-end CAN / LIN FlexRay
Industrial / home appliances Embedded FlashSecurity featuresLow powerMotor controller
ConsumerEmbedded FlashHigh performance Low powerDisplay controller
3909/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
FlexRay™ ASSP – MB88121AFlexRay™ ASSP – MB88121A
FlexRay Evaluation Kit
Fujitsu FlexRay: a part of full support for automotive networksSupport FlexRay Protocol Spec 2.1
Deterministic time-trigger protocol, max 10Mbps x 2chRedundancy for safety, suitable for x-by-wire applicationsSupport for flexible topology – bus, star, hybridFlexible segment structure of the date – static and dynamic segment
Provides total support covering MCUs, software, transceivers, and analysis tools required for development
4009/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
IDB-1394™ ASSP – MB88387IDB-1394™ ASSP – MB88387Fujitsu IDB-1394: full support for automotive networks Provide automotive multimedia infrastructure at 400Mbps using 1394b standard
Scheduled to support direct BT.601 I/F at next-generation ASSP MB883xxNear loss-less compression technology SmartCODEC will provide full use of 1394 bandwidth for video applications
VGA [640 x 480 YUV(4:2:2) 30fps] ; 147.5Mbps/3 x 4
85%
4-camera data Transfer
with SmartCODEC
VGA [640 x 480 YUV(4:2:2) 30fps] ; 147.5Mbps
64%
1-camera Transfer
Bandwidth used@S400
Bandwidth used@S400
V
D RR
A
AV Head Unit
Rear Display Rear Display
Audio ReceiverAmplifier
DVD Video(Max. 36.09Mbps@MPEG2-TS)
DTV(Max. 23.23Mbps@MPEG2-TS)
DVD Audio([email protected] Linear Audio)
30%DVDVideo DTV DVD
Audio
Bandwidth used@S400
Rear-seat Entertainment System Example Efficiency of SmartCODEC
4109/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Product family continues to expandNew product announcement at ConvergenceSignificant announcements to follow
Fujitsu GDCs are high-powered 3D GPUs that include many special display-control capabilities Co-processor architecture completely off-loads graphic and display operations from the MCU
Fujitsu Graphic Controllers (GDC)
4209/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Fujitsu Solutions for Automotive EntertainmentFujitsu Solutions for Automotive Entertainment
GDC & MPEG GDC & MPEG DecoderDecoder
MPEG MPEG EncoderEncoder
GDC & MPEG GDC & MPEG DecoderDecoder
GDC & MPEG GDC & MPEG DecoderDecoder
MPEG MPEG EncoderEncoder
IDB 1394IDB 1394
Aaaaa
4309/12/2006, Executive Briefing © Fujitsu Microelectronics America, Inc. 2006
Summary: Moving ForwardSummary: Moving Forward
Commitment to the leading-edge process technology development and fabricationCommitment to IDM model for flexible customer partnershipsStreamlining business
Emphasis on customer-driven key market segments
Industry-leading product groupsCustom LSI solutions – Foundry and ASICWireless – WiMAX, GPSNetworking – Ethernet switchEmbedded solutions – MCU, GDC, biometric sensors