Flip Chip Flip Chip Technology Technology M DCL DCL EE SNU EE SNU Flip Chip Technology Flip Chip Technology 2005/6/16 Kim Dong Hwan School of Electrical Engineering and School of Electrical Engineering and Computer Science Computer Science Seoul National University, Korea Seoul National University, Korea Microwave Device Term Microwave Device Term Project Project
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Flip Chip Technology MDCL EE SNU Flip Chip Technology 2005/6/16 Kim Dong Hwan School of Electrical Engineering and Computer Science Seoul National University,
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Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
Flip Chip TechnologyFlip Chip Technology
2005/6/16
Kim Dong Hwan
School of Electrical Engineering and School of Electrical Engineering and Computer ScienceComputer Science
Seoul National University, KoreaSeoul National University, Korea
Microwave Device Term Microwave Device Term ProjectProject
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
ContentsContents
• Introduction
• Wire Bonding vs. Flip Chip interconnect
• Flip Chip Process (SSB & MSB)
• Conclusion
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
IntroductionIntroduction• Advancements in the packaging of semiconductor devicesAdvancements in the packaging of semiconductor devices
traditionally use wire bondswire bonds to provide the interconnect from device to substrate or to other devices
• Along with the rapid advances in microwave and millimeter Along with the rapid advances in microwave and millimeter wave subsystem developmentwave subsystem development
a growing interest concerning chip interconnection techniques has developed.
• The importance of quality of these interconnectsThe importance of quality of these interconnects
a large impact on the performance of the entire subsystem, especially at high frequencies.
• Flip chip offers advantages over traditional interconnect Flip chip offers advantages over traditional interconnect schemes.schemes.
A smaller overall footprints, better thermal heat transfer
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
• Introduction
• Wire Bonding vs. Flip Chip interconnect
• Flip Chip Process (SSB & MSB)
• Conclusion
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
Wire BondingWire Bonding
Bond ribbon
Wire Wire length length
lossloss
[Coplanar Waveguide Model]
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
[Cross-sectional SEM photograph of the bonding portion by MBB]
-To cure the resin
☞ Further requirements for miniaturization and higher frequency operation
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
ConclusionConclusion• The need for smaller packagingThe need for smaller packaging
– Flip chip interconnect process → more compact fashion
• Improved electrical performanceImproved electrical performance– Reduced interconnect length → lower inductance and reduced signal loss
→ lower power requirements
• The demands of high frequency applications– Limitation of the wire interconnect → flip-chip bump connection
[Flip Chip Bump Connection][Wire connection]
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU
References[1] Mark S. Hauhe, “Flip Chip Technology Vendor Overview,”[2] R. Sturdivant, “Reducing the effects of the mounting substrate on the perform
ance of GaAs MMIC flip chips,” in Proc. 1995 Int. Microwave Theory Tech. Symp. Dig., Orlando, FL, May 1995, pp. 1591-1594.
[3] Hideki Kusamitsu, et al., “The Flip-Chip Bump Interconnection for Millimeter Wave GaAs MMIC,” IEEE Transactions on Electronics Packaging Manufact- uring, VOL. 22, NO .1, January 1999.
[4] T. Krems, et al., “Millimeter-Wave Performance of Chip Interconnections Using Wire Bonding and Flip Chip,” IEEE MTT-S Digest. pp. 247-250.
[5] Hiroyuki Sakai., “High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-wave ICs,” IEICE TRANS. Electron., VOL. E81-C, NO. 6 June 1998.
[6] Kiyomitsu Onodera, et al., “Novel Flip-Chip Bonding Technology for W-Band Interconnections Using Alternate Lead-Free Solder Bumps,” IEEE Microwave and Wireless Components Letters, VOL.12, NO. 10, October 2002.
[7] Sangsub Song, “The Flip-Chip Mounted MMIC Technology using the Modified MCM-D Substrate for Compact and Low-Cost W-band Transceivers” IEEE IMS 2005. Microwave Application Seminars.
Flip Chip TechnologyFlip Chip Technology MMDCLDCL EE SNUEE SNU