EP&Dee no 8 - September, 2013

EP&DeeDESIGN & MANUFACTURING SEPTEMBER, 2013 ISSUE NO. 8, VOL. 11

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

THE EAST EUROPEAN RESOURCEFOR EMBEDDED APPLICATIONS

EP&Dee | September, 2013 | www.epd-ee.eu2

Table of Contents

SEPTEMBER 2013

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EP&Dee is offering you the chance to win an MPLABStarter Kit for Digital Power (#DM330017). This starterkit allows the user to easily explore the capabilities andfeatures of the dsPIC33F GS Digital Power Conversionfamily. It is a digitally controlled power supply boardthat consists of one independent DC/DC synchronousBuck converter and one independent DC/DC Boost converter. Each power stage includes a MOSFET controlled 5W resistive load. The kit features an On-Board In-Circuit Debugger /Programmer via USB,LCD display for voltage, current, temperature and faultconditions and an on-board temperature sensor.

The Digital Power Starter Kit provides closed-loopProportional-Integral-Derivative (PID) control in thesoftware to maintain the desired output voltage level.The dsPIC® DSC device provides the necessary memoryand peripherals for A/D conversion, PWM generation,analog comparison and general purpose I/O, preventingthe need to perform these functions in external circuitry.

Win an MPLABStarter Kit for

Digital Power fromMicrochip

For the chance to win an MPLAB Starter Kit for DigitalPower, please visit:

http://www.microchip-comps.com/epdee-digpow and enter your details in the entry form.

DESIGN FEATURES

4 Why choose when you can have both?The latest mixed-signal controllers combine the best of both the analogue and digitalpower-conversion worlds, explains Stephen Stella, of Microchip Technology Inc.

6 Analog and Digital IntegrationThe Moore’s Law scaling phenomenon observes ever-increasing integration in the digital landscape. Constantly shrinking transistor geometries (node sizes) means more functionality can be integrated into the same die area. Die size reductions are accompanied by less power dissipation, making further integration feasible from an energy and thermal perspective.

8 Development Kits – The Evolution of Electronic CircuitsAs part of the design process when developing a new product, engineers must build prototypes to test out their concepts and develop a final product. One of the main development tools an engineer uses to speed up the process is a development kit.

10 MikroElektronika development kits dedicated to PIC 32 MCUsIn order to help a future user acquaint with the properties of a given microcontroller’s family, their manufacturers offer demonstrative and development kits. They should be made in such a manner as to give designers a tool whose universality will allow quick and effective command of at least basic designing principles with the use of possibilities offered by a given circuit.

12 Capacitive Touch-Sensing an implementation with minimal external componentsIn this article we will describe how a CVD (Capacitance Voltage Divider) technique and a microcontroller peripheral called a Charge Time Measurement Unit (CTMU) can be used to implement low-cost capacitive touch sensing with minimal external components.

16 Hybrid Distribution from Rebound Electronics leads to higher quality in the electronic component industry supply chainRebound Electronics is the pioneer of ‘Hybrid Distribution’ of electronic components, offering global market purchasing, shortage and obsolescence management, excess stock and asset disposal and value engineering services.

34 Built-in Sensor

PRODUCT NEWS

Embedded Systems(p 7, 15, 18, 19, 20, 22)(p 24 - 28)

LEDs (p 32, 33)

Sensors (p 29)

Active Components(p 35 - 40)

37

29

26

20


Since the introduction of digital power con-version designers have had a clear choicebetween using analogue or digital for theirdesigns. Each approach has its own distinctbenefits as well as drawbacks, but the devel-opment of mixed-signal or hybrid controllersis making it possible for designers to combinethe best of both power-conversion worlds.

Analogue for performanceThe advantage of analogue power conversionis that it offers very efficient control, whilst thedown-side is that it gives designers very littleflexibility. Once the performance tradeoffshave been evaluated for each design, the cho-sen optimisation path is applied across thewhole load profile and across the full power-

conversion operating range.Using this single level of optimisation across adesign’s full power-conversion spectrum hasbeen the industry standard for many yearsbecause, whilst it is inherently inflexible, it doesdeliver efficient control. However, recent gov-ernment regulations, and the increasing expec-tations of end-users, are driving designers to

The latest mixed-signal controllers combine the best of both the analogue and digitalpower-conversion worlds, explains Stephen Stella, of Microchip Technology Inc.

Why choose when you can have both?

DESIGN DIGITAL POWER CONVERSION

www.epd-ee.eu | September, 2013 | EP&Dee 5

achieve greater efficiency. This is pushing ana-logue power conversion to the limit of its effi-ciency and persuading many designers to makethe change to digital power conversion.

Digital for flexibilityThe main benefit of digital power conversionis that it offers the flexibility that analogue con-version lacks. It replaces one level of power-conversion optimisation with multi-point opti-misation. It also provides the ability to commu-nicate with the system, enabling power con-version to become part of the overall optimi-sation of the system’s long-term performance.The disadvantage of digital power conversionis that this flexibility comes at the price. Thedigital approach increases system complexitybecause the analogue feedback from the sys-tem needs to be digitised before it can beused for power management. This meansadding an analogue-to-digital converter, andalso a high-speed microcontroller or digitalsignal processor to provide the processingpower to achieve digital control.The speed of the A/D conversion and thecomputational speed of the MCU/DSP deter-mines the bandwidth of the digital controlloop. So, if a design needs more bandwidth, it

needs faster and more costly ADCs and MCUs.Another factor is that digital-control tech-niques are very different to the techniquesneeded for analogue control. Making theswitch from analogue to digital requires signif-icant investment in the skills, resources, toolsand processes required for digital design andsoftware engineering. This investment can be asignificant barrier to some companies.

The combined strength of hybrid controllersComponent manufacturers have addressedthis dilemma by eliminating the choicebetween analogue and digital design withmixed-signal, or hybrid, controllers. Combiningthe strengths of both analogue and digitalpower conversion, hybrid controllers offset theweaknesses which are inherent in eachapproach. This enables designers to achievethe flexibility of a digital solution with the effi-ciency, load regulation and transient responseof analogue power conversion. It also elimi-nates the need for designers to learn spe-cialised skills or invest in new design resourcesand processes. Figure 1 shows the block dia-gram of Microchip’s MCP19111. This hybridcontroller integrates a peak current-mode ana-

logue controller with a small, 8-bit microcon-troller. By performing power regulation in theanalogue domain, the MCP19111’s integrated8-bit microcontroller provides enough pro-cessing power to monitor and adjust the per-formance of the analogue controller.Also on-board the MCP19111 are on-chippower MOSFET drivers and a mid-voltageLDO. This high level of integration enables theMCP19111 to significantly reduce the numberof external components that are needed forpower conversion whilst introducing a degreeof flexibility that is not possible with analogue-only power conversion. A very wide operatingvoltage range of 4.5 to 32V operating rangeprovides even more flexibility for the designer.The introduction of hybrid or mixed-signalpower conversion controllers offers designersthe combination of the performance of ana-logue conversion, with the flexibility of digitalcontrol, at a cost that makes it accessible to avery wide range of applications. Whilst somedesigners will continue to make the choice andaccept the limitations of analogue-only or digi-tal-only power conversion, others will combinethe best of both worlds by choosing the per-formance and flexibility of hybrid controllers.www.microchip.com

Figure 1: Block diagram of the MCP19111 hybrid controller.

DESIGN DIGITAL POWER CONVERSION


There are numerous benefits integration pro-vides; the opportunity for footprint (boardspace) reduction, reduced power dissipation,higher performance, and potential cost sav-

ings. These are the type of advantages that,thanks to Moore’s Law, digital designers haveenjoyed and exploited. Analog integration into a typically all digital IC

can also help reduce the amount of uncertain-ty inherent in analog design. Silicon vendorsprovide well characterised and boundedbuilding blocks that perform within specified

The Moore’s Law scaling phenomenon observes ever-increasing integration in thedigital landscape. Constantly shrinking transistor geometries (node sizes) means morefunctionality can be integrated into the same die area. Die size reductions are accompa-nied by less power dissipation, making further integration feasible from an energy andthermal perspective. The results are faster and more powerful microprocessors, densermemory devices, and more capable system-on-a-chip (SoC) IC’s that integrate whatwas, not too long ago, one or more circuit card’s worth of IC’s onto a single IC today.More recently, this integration has included analog functions along-side digital on acommon die, from basic comparators to ADCs, DACs, sensors, mixers, analog muxes andmore. This perspective explores the benefits of integration to analog.

Analog and Digital Integration

DESIGN ANALOG & DIGITAL

by Chris SullivanGlobal Head of Solutions Marketing


parameters. Often the integrated build-ing blocks allow for customisation andon-the-fly modifications - something dif-ficult, if not impossible, to achieve in tra-ditional discrete level analog circuits.The silicon manufacturer solves many ofthe typical analog design concerns, withworst-case scenarios typically alreadytested, characterised, and specified.Integration allows designers to work on amore granular level. The ease-of-use benefits and pre-veri-fied aspects of integration result in lessdesign time, less time selecting individ-ual discrete components and less timecalculating and checking componentparameters. This all improves time-to-market, which will likely result in mone-tary benefit. While analog integration has beenaround for many years in the form ofmixed signal ASIC’s and standard cell IC’s,more recently this integration has beenadopted and made available in moremain-stream ASSP style devices. Thereare an increasing number of silicon ven-dors that offer various levels of analogfunctionality integrated into what werepreviously all digital IC’s. Nearly all micro-controllers and microprocessors includesome level of analog integration.Additionally, there are devices that inte-grate various forms of programmableanalog logic including FPGAs, and PSoCs.Premier Farnell carries a broad rangeanalog enabled products from a numberof leading manufacturers. However, it is important to understandthe challenges inherent in combininganalog and digital circuits:For the digital functions, there is a continu-ing drive to smaller geometries to supporthigher density and lower power. However,the smaller feature of a digital process mayresult in worse analog properties. Let’s think about a chip where a mix ofhigh-speed analog functions and high-density digital circuitry is required. Technology requirements are differentfor the two parts of this mix, with the bestprocess for low-power, high-density dig-ital circuits not necessarily suitable forhigh-speed analog circuits. With processnodes hitting 28nm and below, analogproperties are not optimal anymore. This may slow down future levels ofmixed signal integration, or even reversethe trend.Sometimes, even where it is technicallyfeasible to implement an analog functionon a digital optimized IC, it may not beconvenient from an economic point ofview. Analog functions may perform per-fectly well on 130nm processes andabove at a considerable lower cost with

respect to how they perform if pushedonto 45nm nodes and below simply forthe sake of increased integration.For systems with a generic microcon-troller with the analog functions in sepa-rate devices, the components are mucheasier to replace or second source. If themicrocontroller does not incorporate theanalog functions, it can be substituted byany microcontroller of equivalent capa-bility that is able to communicate withand control the slave analog devices inthe system. In the same way, if some or allof the analog devices are separate, theycan be replaced with equivalent compo-nents if better ICs become available. Instead, if the microcontroller is special-purpose with integrated analog com-ponents, it may not be possible to findanother microcontroller from a differ-ent manufacturer that does exactly thesame thing.Similarly, spreading the functions out, thedesigner is in control of exactly what thesystem is capable of and what it is not.Moving to an integrated “all-in-one”microcontroller means limiting thedesigner to the combinations of featuresavailable for that device. If three ADCsare needed and the microcontroller onlyallows two, the designer will have to addanother external ADC to the design orchange to a different microcontroller.And if the microcontroller supportscapabilities or interfaces that the designdoes not actually use, then those capabil-ities (and the additional cost and com-plexity in the microcontroller that theyrepresent) are wasted.Finally, there is the matter of sourcingflexibility: analog design has always beena specialized art. Often also highly densedigital ICs derive from specializedexpertise. Companies that invest in spe-cific competencies in one area often findit challenging to do it in the other areatoo. This is why it is rare to see compa-nies that compete in both areas with thesame strength.In summary, for an increasing range of cir-cuitry and function, analog integrationcan and should be considered. The ben-efits are too great to ignore. However,combining analog circuits on a digital ICsubstrate can be very difficult. There willbe performance trade-offs, and some-times the analog side will not be as goodas the application demands. At PremierFarnell it is easy to connect with theworld-leaders in signal processing, anddesigners have at their disposal anincredible, best-in-class range of prod-ucts and solutions for data conversion,amplifiers and power management.www.farnell.com

DESIGN ANALOG & DIGITAL

Key Facts:• Microchip’s UCS100X family offers

programmable charging emulation• Integrated current sensor supports wider

charging compatibility at higher currents• Enables systems to be updated as new

products are introduced• Ensures compatibility with a wider range of

existing productsMicrochip announces the expansion of its pro-grammable USB port power controller portfoliowith the three-member UCS100X family. Thesenew power controllers offer advanced USB-based charging capabilities for designing hostdevices, such as laptops, tablets, monitors, dock-ing stations and printers; as well as dedicatedAC-DC power-supply and charging products,such as wall adapters.

Microchip’s new USB port power controllers - theUCS1001-3, UCS1001-4 and UCS1002-2 - are anexpansion of its popular UCS1001 and UCS1002series. These new controllers offer higher currentand priority charging for smartphones andtablets. The UCS100X have also added supportfor active cables, such as the Apple® Lightning™connector, in addition to 12W charging. The UCS1002-2 features a built-in current sensorthat can report on the amount of charging cur-rent. This allows a system to optimise its chargingcurrent and allocate power appropriately.Additionally, the UCS100X can support futureUSB product designs via a flexible method fordetecting and creating charging emulation pro-files. This allows designers to update their sys-tems as new products are introduced to the mar-ket, while providing compatibility with a widerrange of existing products.

The UCS100X family is supported by Microchip’snew UCS1001-3/4 Evaluation Board (ADM00540)priced at $24.99, and UCS1002-2 EvaluationBoard (ADM00497) priced at $90.00, both ofwhich are available today.

The UCS1001-3, UCS1001-4 and UCS1002-2are available now for sampling in a 20-pin QFNpackage.

MICROCHIP TECHNOLOGYwww.microchip.com/get/TKTE

World’s first programmable USBport power controllers for activeconnectors and 12W charging


In the old days, electronic compo-nents had long lead wires that lentthemselves to being connectedtogether with other componentsto make an electronic circuit.Nowadays, with the miniaturiza-tion of components, along with thecomplexity of electronic circuitfunctionality, most circuits are com-

prised of a high number of leadlessor surface mount components.Because of this, it is often necessaryto mount a component along withits supporting components on acircuit board to test its functionali-ty. The resulting circuit board iswhat is often called a developmentkit (dev kit), demo board, or evalu-

ation board. The fascinating trendthat has been evolving is the typesand usages of these dev kits out-side of the professional engineer’sworkspace.Manufacturers of electronic com-ponents have long used develop-ment kits to showcase their prod-ucts’ functionality. There are tradi-

tionally two main types of kits –embedded and analog kits.Embedded kits are those thatallow users to program and testmicroprocessors, microcontrollers,and other programmable compo-nents. Analog kits, on the otherhand, usually do not need pro-gramming, but instead need many

As part of the design process when developing a new product, engineers must buildprototypes to test out their concepts and develop a final product. One of the maindevelopment tools an engineer uses to speed up the process is a development kit.

Development Kits –The Evolution of Electronic Circuits

by Chris SullivanGlobal Head of Solutions Marketing

INDUSTRY NEWS EMBEDDED SYSTEMS


additional components to high-light their functionality. These types of kits include a widerange of functions including sens-ing, power management, amplifi-cation and more.More recently, development kitshave expanded in terms of theirfunction and range of application,as well as their price point.Manufacturers have realized thatmany users simply want to try outa product, but do not want toinvest a lot of money for a full-fea-tured development kit. The LPCXpresso from NXP andthe Discovery series fromSTMicroelectronics are examplesof low cost kits that allow users toevaluate their microcontrollers for

little cost. Likewise, many manu-facturers are now developinglower cost base boards and allow-ing users to choose which type ofproduct or additional functionalitythey need by adding on accessoryboards that are designed to“plug” into the baseboard. Examples include Freescale’sTower platform, Texas Instruments’LaunchPads and BoosterPacks,Atmel’s STK600 and Microchip’sPICtail add-on boards.Another type of development kitthat has been gaining popularityis the Single Board Computer(SBC). An SBC features a proces-sor that has the ability to run anoperating system and has inputsand outputs that allow it to func-

tion as a stand-alone computer.The rise of a few SBCs in particu-lar, the Raspberry Pi andBeagleBone, have driven dramaticinterest in this type of dev kit.Both of these kits have the abilityto work as a true stand-alonecomputer.

And while they may not be com-parable to most desk or laptopcomputers on the market in termsof performance or processingpower, they are far more reason-ably priced and offer supportfrom their manufacturers andonline communities.These types of kits are used in amultitude of ways, an educationaltool being one of them. The costof these boards allow engineers,hobbyists, students and childrenalike to experiment with comput-er programming without the riskassociated with a $400 homecomputer. Another popular usageis as a product in itself. Becausethese products come as fully test-ed and complete devices, entre-preneurs and businesses havebegun incorporating them intotheir end products to reduce

development time and cost, aswell as add additional functionalityto existing designs.Finding the right development kitto fit your needs, whether for pro-fessional design or personaldevelopment, has never beeneasier.

Many companies like Newark.comin the US, Farnell.com in Europe,and element14 in Asia carry thelatest selection of developmentkits for every type of application.Users can also learn about the lat-est advances, get development kitproject examples and get helpfrom other users or experts ononline communities. The element14 Community (ele-ment14.com) is one such resourcethat focuses on professional, hob-byist and educational users.With development kits’ continual-ly increasing performance-to-costratio, we can look forward tofuture kits that will bring us anever expanding amount of tech-nology for a broader base ofusers who can leverage theseunique tools for years to come.www.farnell.com




The 32-bit microcontrollers belonging to thePIC32MX family, manufactured by Microchipare the most developed circuits available in thismanufacturer’s offer (presently, the offer com-prises of 69 different types). Depending on theversion, they provide their users with the Flashmemory from 16 up to 512KB and from 8 to128KB of RAM memory. Their maximum clockfrequency is 80MHz, which means performing80 million operations per second (MIPS). Theyare available in 28 to 100 pin enclosures, mak-ing accessible up to 85 I/O lines. Depending onthe version, they offer a wide range of periph-erals kit. The biggest difference, in comparisonto ARM architecture-based microcontrollersavailable in the market, is the fact that PIC32 ismade with the use of a different architecture,i.e. MIPS. It causes that designing engineerswhile making a decision which unit to use, havea choice. In many applications, PIC32 micro-controllers performance exceeds ARM per-formance. The fact that needs to be empha-sized is hardware unification maintained bothwithin the very PIC32 family, as well as among 8and 16-bit Microchip controllers. When we add to this universal, free MPLAB Xprogramming environment that supports allcircuits of this manufacturer, designing engi-neer obtains easiness of migration to more andmore developed units.In order to help a future user acquaint with theproperties of a given microcontroller’s family,their manufacturers offer demonstrative anddevelopment kits. They should be made insuch a manner as to give designers a toolwhose universality will allow quick and effec-tive command of at least basic designing prin-ciples with the use of possibilities offered by agiven circuit. Of course, Microchip is not anexception here, since it makes considerable

number of such kits, whereas, the subject ofthis article is an overview of development kitsfor MikroElektronika PIC32 kits. This Serbiancompany has been present in the market forover 10 years. It is an official designing partnerof Microchip (and additionally of severalother, renown manufacturers).

MikroElektronika developmentkits dedicated to PIC 32 MCUs


MikroE development kits are characterizedwith considerable universality and incrediblywell thought workmanship. The simplest one is“MINI-32” (MIKROE-763). It has beendesigned with the use of PIC32MX534F064Hmicrocontroller (64KB Flash, 16KB RAM, USBOTG, CAN). On the PCB board dimensionallycorresponding to the DIP40 (51×18mm)enclosure, apart from the processor, there aretwo quartz generators (for MCU clocking andRTCC circuit), the set of 3 LED’s, RESET buttonand USB port. thanks to the embedded USBHID bootloader, the kit can be connecteddirectly to a PC. The board can also be sup-plied by means of the USB port or from theexternal source 3,3VDC. Of course, we haveaccess to 40 lines of a microcontroller enteredin the form of pads. The kit constitutes somekind of a PIM (Plug-In-Module) module allow-ing to extend user’s application with aPIC32MX family microcontroller.The other one is the “mikromedia kit forPIC32” (MIKROE-597) designed by means ofthe most extended PIC32MX460F512L micro-controller. On a single PCB board (with thedimensions of 81 × 60mm), we obtain a com-pact, multimedia development kit with a con-siderable number of peripherals. So, let’s startenlisting – well, we will find there, among oth-ers, a colourful LCD display (320 × 240) withresistive touch screen, stereo mp3 codec, 3-axial acceleration sensor, USB Slave connector(connection to a PC / kit power supply, audioconnector, MMC/SD memory card slot, addi-tional retentive Flash memory 8Mbit to storethe data and easy access to 52 microcon-troller’s pins as lead pads. The board is direct-ly connected by means of the USB port to a PC(thanks to the embedded, pre-programmableHID bootloader), but, there is still a possibilityto program the PIC32 microcontroller bymeans of the external programmer (mikroProgor ICD2/3). Additionally, kit’s functionality, canbe extended by means of using a considerablenumber of expansion boards offered byMikroElektronika (among others, Battery Boostshield, Proto shield or mikroBus shield).With all offered benefits, the PIC32MX460microcontroller is not equipped with theEthernet interface. Presently, a slogan “Internetof Things” moves from the concept phase to theexecution phase that is why, the possibility ofconnecting application/hardware to the globalnetwork is becoming a desired feature.Embedded Ethernet interface can be found inthe PIC32MX795F512L microcontroller. TheMikroElektronika’s kit designed with its help, ismultimedia for PIC32MX7 (MIKROE-596). Thisis also a compact, multimedia PCB board(dimensions: 125 × 89mm). Apart from the pre-viously described peripherals (TFT display andothers:-)) it offers additional integrated temper-ature sensor, additional EEPROM memory, ajoystick, RS-232 connector, USB Host/Slave con-nectors and obviously, Ethernet slot.

Thanks to the lead pads, we have access to thetotal of 60 pins of the microcontroller..The best universal design (and biggest dimen-sions 266 × 220mm :-)) are offered by the“EasyPic Fusion v7” (MIKROE-1205) kit that hasbeen nominated in the “Best Tool” categoryduring the Embedded World 2013 trade fairin Nuremberg. Listing all its features wouldcertainly exceed the volume of this article, it isjust worth mentioning that thanks to the uni-versal PIM pad, it supports 65 differentMicrochip microcontrollers from the PIC24,dsPIC33 (both 16-bit) and PIC32 families. The functionality of the kit can be extended bymeans of “Click” – type boards attached bymeans of the MikroBus connection (on the base board, there two con-nections of this type). The manu facturer, atthe moment,offersover50 differ-ent “clicks”.In many otherMikro Elektronika kits,apart from the boards, thecustomer receives a DVD withexamples and documentation,user’s manual in a beautifully preparedand printed book, printed connectionsdiagram and USB cable to connect with PC.

MikroElektronika also manufactures program-mers and C language compilers, Pascal andBasic to a wide range of microcontrollers(including PIC32). To find out more details ofthe offer, please visit TME’s site (www.tme.eu),which is the official distributor in Poland.

Paweł Sióda

www.tme.eu



DESIGN CAPACITIVE TOUCH-SENSING

Capacitive Touch-Sensing - TechnologyThe capacitive sensor scroll wheel is increasinglyprevalent in electronic devices in comparison toother touch-sense technologies.

Capacitive Touch Sensing - PrinciplesIf a finger – or any object with capacitive char-acteristics - comes close to a capacitive touchsensor, it acts as another capacitor. This iscaused by the dielectric nature of the sensorwhich varies the effective capacitance of thesystem used to detect the touch. Figure 1 shows how the parallel plate is con-nected to the sensor input of the chip, whilethe finger acts as one of the parallel plates.Strings of capacitors aligned to the surface ofthe body are created from the iron content ofblood. When these strings come in proximitywith a conductor they create a capacitancecoupled to ground, and this results in a changeto the measured voltage determining touch. Three main functional blocks comprise a stan-dard capacitive touch-sense system: • An analog block for capacitive sensing• A controller for processing the data

• An interface block for communicating with a host processor

The capacitive touch-sense solutions basedupon Voltage variation can be effectivelyimplemented by making use of the followingtechniques:

- A microcontroller’s on-chip Charge Time Measurement Unit (CTMU) peripheral.

- The Capacitive Voltage Divider (CVD) technique, using the Analog-to-Digital Converter (ADC) which does not require a dedicated capacitive-sensing peripheral.

Figure 1: Capacitive Touch Sensing Principles.

Capacitive Touch-SensingAn Implementation With MinimalExternal Components

by Nithin Kumar Mada, Senior Applications Engineer, Microchip Technology Inc.and Harsha Jagadish, Applications Engineer - Advanced Microcontroller Architecture Division, Microchip Technology Inc.

The addition of touch screen functionality is becoming increasing popular inelectronic and mobile technology because it is easy-to-use and aestheticallyappealing. For manufacturers, it has the added benefit that it does not involvemechanical movement since capacitive touch sensing can also be implementedusing a copper pad as part of the standard PCB design. In this article we will describe how a CVD (Capacitance Voltage Divider) tech-nique and a microcontroller peripheral called a Charge Time Measurement Unit(CTMU) can be used to implement low-cost capacitive touch sensing with minimalexternal components. Lastly a reference design will also show how to replacemechanical switches with capacitive touch-sense keys.



* Effective Implementation ofCapacitive Touch Sensing Using theCTMU PeripheralA CTMU peripheral works in conjunction withan ADC as a flexible analog module for precisemeasurement of capacitance. As figure 2demonstrates, it contains a constant currentsource connected to the ADC channel.Capacitance changes and the time differencebetween events is calculated by the CTMUusing a constant current source.A faster response will be delivered by theCTMU in comparison to the CVD because ithas different ranges of current source. Theresponse time of the capacitive touch sensesystem is therefore improved by the fastercharging of the analog channels.The following equation sums up the use of aCTMU peripheral for capacitive touch sensing:

I × T = C × V

Where:• I is the constant current source of the

CTMU• T is the fixed period that the CTMU

charges the capacitive-touch sensor• C is the capacitance of the capacitive-

touch sensor• V is the capacitive touch-sensor voltage, as

read by the ADC

A relative shift in capacitance can be sensed byobserving a change in voltage if this equationis rearranged:

C = (I × T) / V

This equation highlights the different stepsinvolved in detecting the touch as follows:

n The Capacitive touch sensor acts a capaci-tor and is connected to a channel multiplexedwith the CTMU peripheral and ADC.n The touch sensor is initially charged from aconstant current source for a fixed time period(T). Voltage (V) across the sensor is measuredusing the ADC (Figure 3).

n As long as there is no change in the capac-itance due to the touch on the sensor pad, thisvoltage remains relatively constant in the suc-cessive iterations of charge measurement.

Legend:1. CTMU Current Source OFF2. ADC Conversion takes place3. Discharge the Capacitive Sense Circuit4. CTMU Current Source ON

In conjunction with a multi-channel ADC, theavailability of a constant current source in theCTMU peripheral provides an effective plat-form for interfacing to the capacitive touchsensor. The CTMU peripheral is connecteddirectly to the ADC’s input so that it can con-nect to any pin through the analog multiplexer.

A single CTMU peripheral can measure a num-ber of sensors equal to the number of ADCchannels with this configuration.

The calibration to counter the external interfer-ence and transmission losses is facilitated by thetrim bits associated with the current source.

*Note: For more information on the on-chipCTMU peripheral, refer to MicrochipApplication Note # AN1250, “CTMU forCapacitive-Touch Applications.”

**The CVD for Capacitive Touch SensingBy comparing the known, fixed internal sam-ple-and-hold capacitor with the unknown,variable capacitive sensor, the CapacitiveVoltage Divider (CVD) method uses the ADCalone to take a voltage-based measurement.CVD is constructed in the same way as a typi-cal sensor; an area of copper on a PCB or sim-ilar conductive pad for sensing, tied directly toan ADC channel. The rest of the process iscompleted in the precise configuration of theADC and I/O in a specific manner.

The basic principles for employing the CVD are:n One ADC channel charges the internalsample-and-hold cap for the ADC to VDD.n The sensor channel is then grounded, tobring it to a known state. (Figure 4).n After grounding, the sensor must be madean input again.n After it is made an input, the ADC channelis immediately switched to the sensor. A voltage divider is created as the sensorcapacitor is in parallel with the sample andhold cap, CHOLD. As a result, the voltages onthe sensor capacitor are the same on the sam-ple and hold capacitor. The ADC should besampled, and the reading represents a ratiobetween caps. When a finger touches the sen-sor, the capacitance of the sensor will increase;the voltage on the sensor will be lower and theADC readings will increase.Figure 2: CTMU Module.

Figure 3: Charging and Discharging Waveform of CTMU.



An absolute capacitance reading is not requiredfor capacitive touch sensing because all decod-ing decisions are related to baseline readings.**Note: For more information on the CVD tech-nique, refer to Microchip Application Note #AN1298, “Capacitive Touch Using Only ADC(CVD).”

Developing the Firmware to Eliminatethe External InterferenceDynamic fluctuations in capacitance arecaused by factors such as humidity, heat,extent of touch, contaminants on sensors, andEMI/EMC interferences which impact the sys-

tem’s capacitive touch-sensing capabilities.Firmware that can implement dynamic averagedetection, debouncing, and trip-level dynamicvariation can be used to counter these factorsand make the system more robust.To resist any residual noise on the sensor pad,software filtering concepts must be incorpo-

rated; this enables the firmware to distinguishbetween a touched and an untouched condi-tion. The algorithm can be designed to detectmultiple touch conditions, in order to distin-guish between intended and unintendedtouch. The software can then be calibrated to

sense a touch even when there is a thick over-lay on the capacitive-touch pad.

Reference Design for Capacitive Touch-Sense ApplicationsFigure 5 will help the users to immediately kickstart the implementation of a capacitive touchsense system. The approach offers extensiveflexibility in interfacing the other peripheralslike the USB and the LCD in their design. Thiscan also help to reduce the turnaround time inmaking the touch sense system up and running.The microcontroller used in the referencedesign has 13 ADC channels to connect to amaximum of 13 touch sensors. Four capacitivetouch sensors are connected to Ports A0 - A3.The CTMU module has a programmable cur-rent source that is used to charge the capaci-tive touch sensors. The USB receptacle is usedfor application power as a bus-powereddevice, which uses on-chip USB engine. Thefirmware can provide a feedback by display-ing the appropriate status of the touch sensorin the LCD module driven by the pins in Port Dwhen the sensor is pressed. A six-pin header isprovided to connect the reference board to ahardware programmer.

Figure 4: Block Diagram of CVD.

Figure 5: Capacitive Touch-SensingApplication Reference Design.

DESIGN

Factors Contributing To Effective Capacitive Touch-Sensing Designs*Real-time applications present a range of challenges from capacitive touchsensing. Design can help to reduce parasitic capacitance and increase fin-ger capacitance, ultimately ensuring better sensor design as follows: • Sensor pad size. The shape of the sensor pad is not important fora capacitive sensor, but the area of the pad determines sensitivity andtherefore warrants consideration. The larger the pad, better the sensi-tivity; the area should be about the size of an average user’s finger press(15 × 15 mm) but if the size of the sensor pad is larger than the optimal,the parasitic capacitance can increase because of the proximity to theground.• Separation between sensors. When a sensor is touched, the fingerintroduces additional capacitance not only to the current sensor, butalso to the nearby sensors. Therefore, to insulate the finger’s capaci-tance, a space between adjacent sensors must be maintained. Ideallyseparation should be 2-3 times the thickness of the covering material ofthe capacitive touch-sense system. As an example, if the thickness of thecovering material is 3 mm, the distance between the sensors should be6 mm to 9 mm, for an effective capacitive touch-sense design.• Length of the trace. The trace length between the sensor and themicrocontroller can create a higher susceptibility to parasitic capaci-tance if it is too long. This could change the trace resistance and willaffect the sensitivity. Ideally, the length of the trace should not exceed12” (300 mm).• Composition and thickness of the covering material. The capaci-tance of a finger transmitted to the capacitive touch sensor is determinedby the covering material used and its thickness. The covering materialmust have a large dielectric constant to increase the sensitivity and be asthin as possible. If the thickness of the covering material increases, thenthe crosstalk effect between the sensors increases.• Grounding techniques. The sensing method is affected by the para-sitic capacitance of a sensor to ground; it can be countered by placingground very close to the sensor. This increases the parasitic capacitanceand reduces its effect on the sensor. • Selecting an adhesive. The adhesive secures the covering material tothe PCB and should be kept thin in order to keep the sensitivity high.There should be no air bubbles when applying the adhesive and all bond-ing instructions should be studied prior to application.

* Note: For more information on the various factors that affect the hard-ware and software designs, refer to Microchip Application Note #AN1334, “Techniques for Robust Touch-Sensing Design.”

SummaryWith the cost of touch-sensing technology lowering, it is now an idealchoice for consumer and industrial products. The main advantage overthe traditional mechanical switches is that the capacitive touch sensors donot wear out over a long period of time. By using a microcontroller’s on-chip CTMU peripheral or the CVD technique, designers can implementcapacitive touch-sensing user interfaces at a low cost and with minimalcomponents. For more information, visit www.microchip.com/mtouch n

References1. PIC24F Family Reference Manual, Sect. 11 Charge Time MeasurementUnit (CTMU), DS39724B, © 2010 Microchip Technology Inc.2. Microchip application notes:• AN1101, “Introduction to Capacitive Sensing,” by Tom Perme. © 2007

Microchip Technology Inc.:• AN1334, “Techniques for Robust Touch Sensing Design,” by Burke

Davison © 2010 Microchip Technology Inc.• AN1250, “Microchip CTMU for Capacitive-Touch Applications,”

by Bruce Bohn. © 2009 Microchip Technology Inc.• AN1298, “Capacitive Touch Using Only an ADC (CVD),”

by Tom Perme. © 2009 Microchip Technology Inc.www.microchip.com

Microchip announces a new fam-ily of microcontrollers (MCUs),the PIC24FJ128GC010. This family is an analog systemon a chip that integrates a fullanalog signal chain, includingMicrochip’s first ever on-chipprecision 16-bit ADC and 10Msps 12-bit ADC, plus a DACand dual operational amplifiers(Op Amps), alongwith eXtreme LowPower (XLP) technol-ogy for extended bat-tery life in portablemedical and industrialapplications.This combination ofanalog integrationand low power con-sumption reduces sys-tem cost and noise, andimproves the signal throughputin applications which includeportable medical monitoringdevices such as blood glucosemeters and blood pressure mon-itors; as well as industrial applica-tions and portable monitoringdevices, such as voltage and cur-

rent monitors, gas sensors andhigh-speed sensor arrays, amongothers. The PIC24FJ128GC010family includes an integratedLCD display driver that providesthe ability to drive up to 472segments with information-richuser displays that include scroll-ing alphanumeric banners.Integrated USB supports the

uploading of clinical data formedical equipment and can actas a service/data port for indus-trial equipment. Capacitivetouch sensing is supported withan on-chip mTouch™ peripheral.

MICROCHIP TECHNOLOGY www.microchip.com/get/6T4J

Microchip announces its third-generation USB3 ControllerHubs (UCH3s): the four-mem-ber USB553XB-5000 family isSuperSpeed Logo Certified bythe USB Implementers Forumand is the world’s first to inte-grate OTP Flash configurationmemory. This UCH3 fami-ly is also the industry’smost flexible, as it includesa seven-port hybrid ver-sion with a certified four-port USB3 hub and threeadditional USB2 lanes.The remaining three fami-ly members feature two-,three- and four-port USB3hubs, respectively, providing abroad migration path for thedesigners of PCs, peripherals,computing platforms, storagesolutions, networking and con-sumer devices, set-top boxes,docking stations and monitors.The designers of computing andperipheral platforms are rapidlyadopting the USB3 standard forits increased bandwidth of 5

Gbps and higher-power charg-ing ports. To address marketpricing, delivery and differentia-tion pressures, designers needUSB3 controller hubs with a highdegree of flexibility and integra-tion. Microchip’s new UCH3 fam-ily lowers system costs and

speeds development by inte-grating programmable memorythat allows OEMs to quickly cus-tomise their products andensure operating-system com-patibility, without the addedcost, complexity and boardspace of off-chip memory.

MICROCHIP TECHNOLOGY www.microchip.com/get/CQ0H

Microchip’s third-generation USB3 Controller HubFamily - SuperSpeed certified USB3

Microchip Introduces First PIC® MCU integrating16-bit ADC, 10 Msps ADC, DAC, USB and LCD

PRODUCT NEWS



Rebound Electronics opened its first Europeanoffice outside of the UK in Gdynia, Poland, in2006, followed by a second in Cracow in 2007.These offices have proved very successful,growing rapidly to today when they supportseveral hundred customers throughoutPoland, as well as Romania, Czech Republic,Slovakia and Hungary. Additional local officesin Brno, Miskolc, Timisoara, Bistrita andBucharest have helped to develop and sup-port Rebound’s growing customer basethroughout Central and Eastern Europe.Further expansion into the Baltic States,Ukraine and Russia is also in progress.

These Central and Eastern European officesprovide support for a wide range of customers,both local OEMs and major multi-nationalsalike, predominantly in the following sectors:• Power industry & engineering• Telecommunications• Military• Automotive• Mining• Security• Medical• EMS providers• Railway • Lighting

In pioneering the Hybrid Distribution model,Rebound has utilised its experience to blendtogether the expertise of a professional brokerwith the key service and reliability standardsexpected from franchised distribution; theresult is Hybrid Distribution. Currently there are four main methods of elec-tronic component procurement used in theelectronics industry: OEM direct; cataloguehouses; franchised distribution; and brokers.While there are benefits to each of thesemethods, there are also distinct disadvantagesmeaning that the buyer has to compromise insome way.

Rebound Electronics is the pioneer of ‘Hybrid Distribution’ of electronic components,offering global market purchasing, shortage and obsolescence management, excess stockand asset disposal and value engineering services. Its commitment to quality and developingprocesses and systems to support and enhance the supply chain has seen the companydevelop and grow into one of the industry’s leading independent distributors.Rebound Electronics is part of the Rebound Group, with offices in 15 countries, which providesglobal sourcing and supply capabilities for blue chip OEMs and EMS providers throughoutEurope, the Americas and Asia.

Hybrid Distribution from ReboundElectronics leads to higher quality in theelectronic component industry supply chain

DISTRIBUTION COMPANY PROFILE


Rebound introduced Hybrid Distribution tothe market as a fully integrated business model,taking all the advantages of the existing meth-ods and combining these into one hybridmethod of distribution that means the customerdoes not have to compromise in any way. Through its Hybrid Distribution model,Rebound is able to offer value-added services,a reliable supply of original manufacturersproducts, good local support, and is able to buyin the manufacturer’s base currency and fromthe most cost-effective area worldwide.Because of its local and regional offices andglobal procurement abilities, customers canbenefit from working with Rebound whereverthey are based in the world. Other distributors in the industry are adopt-ing Hybrid Distribution as a model, and this isencouraging as it means that the customer andsupply chain will benefit from a consistentapproach. However, Rebound has set strict cri-teria for Hybrid Distribution in order to main-tain this high standard:

• Deliver quality product inside lead-time• Reliable supply of obsolete product• Total global view of pricing and availability• Secure source of OEM product• A global company with local values• Disciplined approach to purchase orders• Utilisation of approved test facilities• Focus on long-term business relationships• After-sales support• Worldwide recognised quality standards• Professional company and people to deal with• Financially strong company

Since its inception in 2010, hundreds of cus-tomers around the world have adoptedHybrid Distribution, as they increasinglyrecognise the benefits it brings, such as the thecost-effective supply of an extensive range ofcomponents including microcontrollers,processors and memories as well as passiveparts, such as military connectors, relays and

switches, capacitors, inductors, potentiome-ters, and resistors plus PCBs.As part of the Hybrid Distribution philosophy,Rebound is totally focused on quality, and hasstrict procedures in place to ensure consistent-ly high quality products and services.Reboundcontinually improves its working processes tounderstand, meet and ultimately exceed cus-tomer requirements. The company has received recognition for itscommitment to quality by achieving severallevels of accreditation including AS9120 (Rev. A),ISO 13485: 2003, SC21 Silver (2012 & 2013),and ISO9001:2008. Through working on theseexcellence and quality programmes, Reboundhas seen significant improvements in its work-place and operations, which have lead to araised performance in its supply chains.Rebound also has dedicated purchasing teamsin Europe, Asia and USA, and this local sup-port enables it to arrange supplier audits inmost countries within 24 hours, which areessential and are carried out routinely toensure consistency in the chain. As part ofRebound’s commitment to customers, it has avery straightforward approach to sourcingproduct. If available, Rebound only offer fullytraceable parts to their customers unlessspecifically requested to do otherwise. Wedefine fully traceable parts as from a compo-nent manufacturer, from our franchised linesor from another franchised distributorRebound recognises that through obsoles-cence or extreme shortage there may be noviable option other than to offer untraceableparts. If the only options are to either stop acustomer’s production line or utilise untrace-able parts, Rebound always obtains the con-sent of customers and insists upon a mutuallyagreed independent test regiment. Reboundonly utilises ‘best in class’ independent andcertified test houses to avoid any potential forconflict of interest. In Asia this includes aWestern owned and operated, ISO9001:2008approved, test house which provides addi-tional support and security. The Reboundteam also works closely with manufacturers to

validate the authenticity of parts.Rebound continually strives to develop andstrengthen its quality management system inorder to remain responsive to customers're-quirements and to the dynamics of the ever-changing market. In addition to external sup-ply chain activities, Rebound also has in placestringent warehouse inspection procedures.All products, without exception, are pho-tographed and are fully traceable from POreceipt through to sales order dispatch.

With extensive experience across a plethora ofvertical markets, including military, aerospace,automotive and medical, Rebound has estab-lished itself by offering a truly integratedapproach across the world that is not tied tospecific manufacturers or pricing structures. Hybrid distribution, coupled with Rebound’squality accreditations, strict supplier approvalsand internal management processes, plus thecommitment of its staff to provide customerswith a quality product, has been the key toRebound’s success, and will continue to do so.

For further information about ReboundElectronics and the Rebound Group visit:www.reboundeu.comwww.freeway-lighting.comwww.easby.comRebound Electronics contact:Mihaela ButiuBusiness Development ManagerT:+40 72 88 44 050 E: [email protected]

DISTRIBUTION COMPANY PROFILE

Microchip and element14Announce Raspberry Pi®

chipKIT™ Expansion Board;World’s First With Prototyping-

Friendly 32-bit MCU PackageMicrochip Technology Inc., a leading providerof microcontroller, mixed-signal, analog andFlash-IP solutions, announced the expansion ofits Arduino™ compatible chipKIT™ platformecosystem, including a new Raspberry Pi® toolthat it co-developed with partner element14 -the chipKIT Pi Expansion Board. On the soft-ware side, volunteers from the chipKIT andArduino communities collaborated withMicrochip’s engineers to expand the freechipKIT Multi-Platform IDE (MPIDE), to allowusers to create, compile and program Arduinosketch-based chipKIT applications within theRaspberry Pi operating system. The chipKITMPIDE is open source and compatible with theArduino programming language and develop-ment environment. Both of these tools arebased on Microchip’s 32-bit PIC32 microcon-trollers (MCUs) in prototyping-friendly, low pincount SPDIP packages, which was previouslyonly available with 8-bit MCUs for the Arduino

community. This enables all users - includinghobbyists, academics, makers and professionals- to benefit from the PIC32’s high performance,memory and integrated peripherals while using

the basic hobbyistprototyping equip-ment that is found

in most home workshops.The Raspberry Pi is widely viewed as one of theeasiest and most affordable computers on whichto program, and recently shipped more than onemillion units in less than a year on the market. ele-ment14’s chipKIT Pi Expansion Board is theworld’s first to enable the development of 3.3VArduino compatible applications for theRaspberry Pi using a 32-bit, high-performanceMCU in a prototyping-friendly package. Becausethe Raspberry Pi’s processor is a 3.3V chip, itsdigital I/O and communications (I2C™, UART, SPI)pins require 3.3V. The chipKIT Pi can interfacedirectly to the Raspberry Pi I/O Expansion head-er without any additional components, reducingboth cost and design complexity.

MICROCHIP TECHNOLOGYwww.microchip.com/get/NHAC



ACROSSER Technology, a world-leadingembedded system manufacturer, is proud tointroduce its 2 Mini-ITX mainboards, AMB-D255T1 and AMB-QM77T1. Both productsfeature low-power consumption and out-standing system stability, making them suit-able for system integration for multipleindustrial uses. ACROSSER Technology hasseen many successful business stories withinthe embedded computing industry; such asworking closely with clients, and from systemintegrators to solution suppliers.With a total board height less than 20mm,the slim fit feature of AMB-D255T1 makes ita perfect application almost everywhere.With single layer I/O ports and external+12V DC power input, AMB-D255T1 caneasily be equipped even in limited spaceslike digital signage, POS or thin client sys-tems. Also, the supporting video sourceincludes both VGA and HDMI outputs tocater to a variety of needs. Many digital sig-nage partners have showed great intereststoward AMB-D255T1 for their business sec-tor. AMB-D255T1 has one DDR3 SO-DIMMwhich supports up to 4GB DDR3 memory,mSATA socket with USB signals and SIM slot,and a DC jack for easy power in. For cus-tomers that are taking their entire system tothe next level, AMB-D255T1 provides onePCI slot and one Mini PCIe expansion slot

with a SIM card socket for further improve-ment. The mini PCIe expansion allowsmSATA to function together with the systemor multi module choices for USB signalsmodule installation.( mSATA storage, Wi-Fimodule, or 3G/4G telecommunication). AMB-QM77T1 is dedicated to multiple

Acrosser introduces 2 Mini-ITX industrial mainboard for diverse ap

Expanding the two companies' successfulrelationship, Kontron today is named as thepreferred provider of Airborne Servers andCabin Wireless Access Points (CWAPs) forRockwell Collins' new wireless in-flight enter-tainment (IFE) systems. RockwellCollins is a premier innovator ofintegrated electronic solutions forcommercial aircraft, and Kontronhas been supplying computing, IFEand connectivity system solutions toRockwell Collins for almost fiveyears. The Kontron ACE Flight 600general purpose airborne serverand the company's Cab-n-Connect™ CWAP are currentlydesigned into the PAVES™ family ofin-flight entertainment systems and theSkybox™ wireless cabin solutions fromRockwell Collins. Kontron's airborne serversand CWAPs are scheduled for multipleRockwell Collins deployments in businessjets, VIP and air transport installations.Kontron brings a unique understanding fromits more than 20 years of experience inbuilding mission-critical computing systems.

This knowledge aligns and complements theintegrated technology requirementsRockwell Collins has set for its new wirelessIFE systems, said Andy Mason, Business UnitManager, Commercial Avionics Products

Group at Kontron. We are committed tohelping innovators such as Rockwell Collinsimprove the passenger experience and fur-ther expand and enhance in-flight broad-band services for the commercial airline andbusiness jet market.

KONTRONwww.kontron.com

Kontron is named preferred provider of Airborne Serversand CWAPs for Rockwell Collins' Wireless IFE systems

Watch a brief video:www.microchip.com/get/598S

The key features of the AMB-D255T1 include:• Intel Atom D2550 1.86GHz • 1 × DDR3 SO-DIMM up to 4GB• 1 × VGA• 1 × HDMI• 1 × 24-bit LVDS• 6 × USB2.0• 4 × COM• 1 × GbE (Realtek RTL8105E)• 1 × PS/2 KB/MS• 1 × PCI slot• 1 × MiniPCIe slot for mSATA and USB device• 1 × SATA with power connector• 8-bit GPIO



IAR Systems® launches its newExperiment! starter kits. The kitsare aimed at creative evaluationfor a low price. Developers canuse the Experiment! kits to eval-uate the embedded develop-ment toolchain IAR EmbeddedWorkbench® and the includedmicrocontroller, as well asdesign, start develop, integrateand test their applications.First to be introduced are agame controller kit and a magne-tometer kit. The game controllerkit includes a game controller, a1.8x1.6" color LCD and exampleprojects such as a snake game.The kit is priced at 89 EUR/119USD. The magnetometer kit canbe used to identify magneticfields using the included magne-tometer module and to outputinformation on a 1.53x1.38" LCD.This kit is available for 69EUR/94 USD. The kits include asize-limited license of the pow-erful toolchain IAR EmbeddedWorkbench and can be usedwith IAR Systems’ in-circuitdebugging probe I-jet™ as wellas other JTAG probes, and arealso available in versions includ-ing an IAR J-Link Lite USB-JTAG/SWD debug probe. Both kits are based on the ARMCortex-M3 STM32L152VBmicrocontroller fromSTMicroelectronics and featureseveral connectors: JTAG 20 pin,

a small 19 pin trace connector,two UEXT/UXT connectors anda USB connector. Power is sup-plied through the JTAG, trace orUSB connector. The board alsohas a prototyping area, user andreset buttons and power anduser LEDs, as well as designatedpower/current measuring pointsthat can be used with IARSystems’ I-scope™ probe toenable detailed current andpower measurements correlatedwith the source code in IAREmbedded Workbench.“We have developed a newtype of kits for creative, easyand low-cost evaluation,” com-mented Sara Skrtic, ProductManager for Kits, IAR Systems.“We are developers ourselves,so when deciding what modulesand project examples to include,we thought of what we like towork with, and we believe wecame up with something that willbe useful and fun at the sametime. The two first kits will befollowed by others, with differ-ent modules as well as a range ofdifferent microcontrollers.”More information about theExperiment! kits is available atwww.iar.com/experiment, whereusers can also send in and sharetheir applications with others.

IAR SYSTEMSwww.iar.com

IAR Systems introduces line-up of Experiment!kits for creative, easy and low-cost evaluation

Kontron has presented a new10/40 Gigabit Ethernet switch thatis designed to significantly enhanceand standardize data throughput innetwork-centric OpenVPX applica-tions. The outstanding feature ofthe fully managed Layer 2/Layer 3Switch Kontron VX3920 is its 24high-throughput 10 Gbit/s ports tothe data plane. These can bescaled through channel bundlingeven up to 40 Gbit/s bandwidth.By using this newrugged switch forinter- and intra-sys-tem communica-tion, OEMs canachieve an enor-mous performanceboost for theirapplications. Also,other highly indi-vidual data busescan now be

replaced. Rugged COTS systemsprofit from the application ofEthernet - the standard high band-width network protocol of the ITbusiness - by reduced costs, com-prehensive enterprise class switch-ing functionalities and a stabletechnology roadmap, which canalso increase long-term systemavailability.KONTRONwww.kontron.com

applications, such as industrialautomations, kiosks, digital sig-nages, and ATM machines.Supporting 3rd generation Intelcore i processor, AMB-QM77T1features an integrated GPU tosupport the following graphiclibraries: DirectX11, OpenGL4.0and OpenCL1.1. As for numbersof output, a maximum of 3 inde-pendent displays are supplied,which is a perfect solution forgaming/multimedia business.

In addition, 4 USB3.0 and 2 SATAIII connectors result in high datatransmission.ACROSSER Technology has pro-vided outstanding embeddedsystems for over 26 years. We pride ourselves in offeringnot just products, but solutions.Please contact us for further con-sultations, volume quotes, or anyother questions.ACROSSER TECHNOLOGY www.acrosser.com

New 10/40 Gigabit Ethernet switch from Kontronenhances data throughput in network-centricOpenVPX applications

pplication

The key features of the AMB-QM77T1 include:• Intel QM77 chipset• FCPGA988 socket supports 3rd Generation

Intel® Core (TM) i7/i5/i3 processors and Celeron

• 2* DDR3-1600/1333/1066 SO-DIMM up to 16GB

• Supports VGA/DVI-D/HDMI/LVDS displays• Support 3 independent display• Dual Intel PCI-E Gigabit LAN• 8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II,

2* SATA III• 1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket• iAMT 8.0, TPM 1.2, Watchdog timer, 8-bit

Digital I/O


Industry’s Simplify IsolatedDigital Inputs to an Industrial

PLC While Reducing Power,System Cost, and Size

Designers now have a way to reduce power,system cost, and size for programmable logiccontroller (PLC) digital-input subsystems, withthe Corona (MAXREFDES12#) reference designby Maxim Integrated Products, Inc. This designreduces isolated channels and leverages analogintegration for industrial control and automa-tion applications.

One method of reducing the size of I/O solutionsin PLCs is to reduce the number of digital chan-nels that need to be isolated. Integrating threeMaxim products including a transformer driver,the Corona design reduces isolated channels andeliminates the need for power-hungry optocou-plers and discrete parts. These savings reducepower by 16%, solution size by 38%, and cost by23%. Maxim’s devices used in Corona aredesigned specifically for harsh industrial environ-ments with operating temperature ranges from -40°C to +125°C, so they are ideal for use in PLCsand other automation applications. Key Advantages• Analog integration: reduces isolation chan-nels to four while Maxim’s digital isolator elimi-nates the need for optoisolators; optimized for16, 24, and 32 input channel designs, the digi-tal input serializer’s SPI busses can be daisy-chained to further reduce isolation channelcount, leading to increased savings• Lower power: best-in-class power consump-tion; uses 16% less power than the traditionaldesign approach • Lower cost: uses 38 fewer parts than a tradi-tional design to create a less expensive inte-grated solution• Smaller size: provides 51% fewer compo-nents than a traditional designMAXIM INTEGRATED www.maximintegrated.com


With the launch of SymTA/S 3.4, Symtavisionhas announced a comprehensive, new timingdesign and analysis capability for LIN (LocalInterconnect Network), the low-cost, distrib-uted networking protocol used primarily inautomotive and industrial applica-tions. SymTA/S 3.4 also featuresFlexRay dynamic segment analysisimprovements, AUTOSAR XML 4.ximport with Ethernet support,improved Gantt loading, individuallicense check out and scripting effi-ciency improvements. At the sametime, Symtavision has announcedversion 3.4 of TraceAnalyzer, itspowerful solution for visualizing andanalyzing timing data from bothmeasurements and simulations which seam-lessly integrates with SymTA/S.The new LIN capability in SymTA/S 3.4 sup-ports System Distribution and Worst Caseanalysis with multiple scheduling tables andmultiple frame mapping as well as definingstandard parameters such as individual busspeeds, time bases and jitter, enabling engi-neers to parameterize multiple LIN networks

and analyze respective frame responsetimes. An LDF (LIN Description File) interfacealso facilitates the importation of LIN com-munication matrices. Seamless integrationwith the well-established SymTA/S analyses

for CAN, Ethernet, FlexRay and OSEK /AUTOSAR-based ECUs facilitates end-to-end timing analysis for distributed functionsvia LIN, as well as the connection of LIN toCAN, Ethernet and FlexRay networks viagateways.

SYMTAVISIONwww.symtavision.com

Launch of SymTA/S 3.4 features new LIN bus analysis capability

Acrosser Technology Co. Ltd, a global pro-fessional industrial and embedded comput-er provider, announces the new Mini-ITXmainboard, AMB-D255T3, which carries theIntel dual- core 1.86GHz Atom Processor

D2550. AMB-D255T3 fea-tures onboardgraphics viaVGA andHDMI, DDR3SO-DIMMsupport, PCIslot, mSATAsocket withSATA & USB

signals, and ATX connector for easy powerin. AMB-D255T3 also provides completeI/O such as 6×COM ports, 6×USB2.0 ports,2×GbE RJ-45 ports, and 2×SATA port.AMB-D255T3 can support dual displays viaVGA, HDMI or 18-bit LVDS. AMB-D255T3has one MiniPCIe type slot and one PCI forcustomer’s expansion. The MiniPCIe slotworks with SATA and USB signals that can beequipped with mSATA storage module.

ACROSSER TECHNOLOGYwww.acrosser.com

Fanless Mini-ITX mainboardwith Intel Atom Processor“Cedar Trial” D2550 DSM Computer sponsored the Team Fast

Forest e.V. from the Deggendorf TechnologyInstitute that at the Formula Student 2013competition achieved fourth place in theFSE (Formula Student Electric) group andeighth place in the overall placing.

As its contribution to the success of the FastForest Team, DSM Computer provided theNanoServer® N1-GM45 embedded systemand the D1 industrial display with a 38 cm(15 inch) diagonal screen. The robust indus-trial computer used for the fast acquisition,evaluation and read-out of relevant vehicledata is installed in the support car thataccompanies the “Jenny 5” racing car.A base cover allows direct access to the MiniPCI Express™ slot, the Compact Flash socketand the hard disk.

DSM COMPUTER www.dsm-computer.com

DSM Computer sponsors aFormula Student Team



MSC Vertriebs GmbH, manufac-turer of highly integrated stan-dard board level products andcustomer-specific boards andsystems, now offers its high-endMSC C6B-8S COM Express™Type 6 module family with thejust introduced dual-core vari-ants of the fourth generationIntel® Core™ processors (codename “Haswell”). Thepowerful modules arecharacterized by high-est computing andgraphics performancewith simultaneouslylow power dissipation.Besides the first mod-ule with Intel® Core™i7-4700EQ (2.4GHz,3.4GHz in turbo boostmode) quad-core processor, fourmore economical Intel® Core™ i3and i5 variants with two proces-sor cores are now available. TheCOM Express™ products areoffered with Intel® Core™ i5-4400E (2.7/3.3GHz), i5-4402E(1.6/2.7GHz), i3-4100E (2.4GHz)or i3-4102E (1.6GHz) processor.The thermal design power (TDP)is 37W or 25W. Depending onthe type, the processors supportthe Intel® AMT 9.0 Technology,Intel® 64, the Intel® VirtualizationTechnology, VT-d Virtualized

I/O, Intel‘s Trusted ExecutionTechnology, the Intel® AdvancedEncryption Standard and theIntel® Turbo Boost Technology.The Intel® Advanced VectorExtensions (AVX) 2.0 Technologyallows for high-end imagingapplications. The powerful 4600(GT2) Intel® HD graphics inte-grated into the processor die

offers a significantly improvedvideo and graphics performanceover the third generation ofIntel® Core™ processors.Accelerated coding and decod-ing functions for high resolutionvideos, DirectX 11.1 andOpenGL 3.2 are supported.OpenCL™ 1.2 allows for theadditional use of the graphicsengines for applications withextensive use of floating-pointcomputations.MSC VERTRIEBSwww.mscembedded.com

Newest Intel Dual-Core Processors on COM Express Modules

AMD announced a new low-power Accelerated ProcessingUnit (APU) in the award-winningAMD G-Series SOC family withthe GX-210JA, further reducingx86 power requirements forembedded designs. The newGX-210JA APU, a full System-on-Chip (SoC) design, uses one-third less energy than the previ-ous low-power Embedded G-Series SOC product while pro-viding industry-leading graphicscapabilities. At only 6 watts max-imum thermal design power

(TDP), and approximately 3watts expected average power,this new member of the G-SeriesSOC family will enable addition-al fanless designs for a variety ofapplications ranging from indus-trial controls and automation,digital gaming, communicationsinfrastructure and visual embed-

ded products including thinclient, digital signage and med-ical imaging.The GX-210JA is part of theAMD Embedded G-Series SOCprocessor family that offerssuperior performance per wattin the low-power x86-compati-ble product category with 6W -25W TDP options.

The family includes:• Enterprise-class Error-

Correction Code (ECC) memory support;

• Industrial temperature range of -40°C to +85°C and available with dual- or quad-core CPUs;

• Discrete-class AMD Radeon™ GPU;

• Integrated I/O controller.

The AMD Embedded G-SeriesSOC platform, including the GX-210JA, is currently shipping.AMD supports a comprehensiveecosystem of industry-leadingembedded solution providerssupporting and/or announcingmarket-ready products poweredby the AMD Embedded G-Series SOC.

AMDwww.amd.com

AMD Extends Embedded SoC Leadership by Lowering G-Series Energy Consumption

Mouser Electronics, Inc. is stocking 4thGeneration Intel® Core™ Processors, for-merly known as Haswell, featuring 22nmarchitecture and Tri-Gate technology formaximum performance per watt.Processors are available in Desktop,Mobile, or Embedded varieties for designflexibility. Idle state power consumptionhas been lowered, creating a 20ximprovement from the previous genera-tion; with a 3-second wakeup time, madepossible using Intel® Rapid Start.Intel® Wireless Display is available tostream content from portable productsto a compatible HDTV. Processors areavailable as low as 35W Thermal DesignPower for embedded applications.Desktop performance processors areavailable with a clock speed up to3.9GHz when utilizing Intel® Turbo BoostTechnology. Sockets supported are LGA2001 for desktop and rPGA947 &BGA1364 for mobile. 4th GenerationIntel® Core™ processor’s new instructions

include Intel® Advanced VectorExtensions 2, gather, BMI1, BMI2, andFMA3 support.With its broad product line and unsur-passed customer service, Mouser catersto design engineers and buyers by deliv-ering What’s Next in advanced technolo-gies. Mouser offers customers 20 globalsupport locations and stocks the world’swidest selection of the latest semicon-ductors and electronic components forthe newest design projects. MouserElectronics’ website is updated daily andsearches more than 10 million productsto locate over 4 million orderable partnumbers available for easy online pur-chase. Mouser.com also houses an indus-try-first interactive catalog, data sheets,supplier-specific reference designs,application notes, technical design infor-mation, and engineering tools.

MOUSER ELECTRONICSwww.mouser.com

Mouser Stocks 4th Generation Intel® Core™ Processors

To learn more, visit:www.mouser.com/new/Intel/intel-haswell-processors


Silicon Labs introduced a newfamily of silicon TV tuners offeringthe industry’s highest perform-ance, integration and lowest sys-tem cost while supporting allworldwide terrestrial and cableTV standards. The new Si21x7tuner family provides TV and set-

top box (STB) makers with anunsurpassed level of field-proven,global performance based on fivegenerations of patented architec-tural enhancements and a produc-tion history of more than 200 mil-lion silicon tuner units shippedinto TVs to date. The Si21x7 fami-

The Amplicon Impact-E 200 is acompact, yet powerful embed-ded industrial PC, housed in alightweight chassis and designedto increase heat dissipation. TheImpact-E 200 is an exciting newaddition to the renownedembedded series by Amplicon.The Amplicon Impact-E 200builds upon the strong founda-tions of the Amplicon Impact-Eseries to deliv-er the powerof the Ivybridge mobileiCore proces-sor and theamazing fea-ture set of theIntel QM77, allpackaged in afanless com-pact chassis.The QM77chipset introduces high band-width SATA III allowing for datatransfer speeds of up to 6Gb/s,this ensures that the data busbottleneck, which previously hin-dered data transfer speeds isnow a thing of the past. Withhigh speed data transfer, RAIDfunctionality and options for twomechanical/solid-state drives, youcan be assured that your data isprotected and secure in theImpact-E 200 embedded PC.

The new Impact-E 200 uses theIntel HD Graphics 4000, thisallows for high-resolution on allthree-display outputs and offerssupport for both DirectX andOpenGL graphics renderingoptions. The new Impact-E 200also utilises “SuperSpeed” USB3.0, this provides for USB transferspeeds up to 5Gb/s on four rearmounted ports these ports also

give backwards compatibility toUSB 2.0 and 1.1 for legacyperipherals. The Impact-E 200can house up to 16GB DDRIIImemory from 1066MHz up to1600MHz; this enables the unitto handle a range of memoryintensive applications that someof the larger form factor PCs onthe market may struggle with.

AMPLICONwww.amplicon.com

Amplicon introduces powerful fanless embeddedindustrial PC, the Impact-E 200

Silicon Labs Solidifies Market Lead with Industry’s Most

Silicon Labs introduced the indus-try’s lowest jitter, lowest powerand most frequency-flexible tim-ing solution for high-speed net-working equipment based on theSynchronous Ethernet (SyncE)standard. Offering an unmatchedcombination of any-frequencysynthesis and industry-leading jit-ter performance (as low as 263femtoseconds RMS),the new Si5328 preci-sion clock multiplierand jitter attenuatoraddresses the needfor ultra-low jitterphysical layer refer-ence clocks in CarrierEthernet switches androuters. Eighty percent smallerand also 80 percent more powerefficient than competing SyncEclocks, the Si5328 provides abest-in-class SyncE-compliant tim-ing solution for edge routers,multi-service switches, wirelessbackhaul systems, DSLAMs andGPON/GEPON optical line termi-nation (OLT) equipment. Thetelecom infrastructure market israpidly transitioning from legacySONET/SDH networks to higher-

speed, more cost-effectiveEthernet networks. A key enablingtechnology behind this networktransition is Synchronous Ethernet,which is used to distribute accu-rate timing in Gigabit Ethernet(GbE), 10 GbE, 40 GbE, and 100GbE Carrier Ethernet switches androuters. Every Carrier Ethernetswitch and router requires a high-

performance SyncE clock to pro-vide wander filtering, distributetiming and provide a low-jitterEthernet PHY reference clock.Silicon Labs has addressed thisapplication need with the indus-try’s lowest jitter, most frequency-flexible SyncE timing solutionoptimized for Ethernet PHYs rang-ing from GbE to 100 GbE.

SILICON LABS www.silabs.com/timing

Murata today announced theLBCA series of ultra compactand ultra low power consump-tion Bluetooth Smart modules.Measuring only 5.4 x 4.4 mm(LBCA2BZZFZ without antenna),these surface mount devices area quarter of the size ofprevious models and areaimed at the increasinglywide range of wearabledevices, especially wrist-band-type applications,such as fitness monitoring,smart watches and remotecontrollers. Conforming tothe Bluetooth 4.0 lowenergy protocol, the mod-ules are available both with(LBCA2HNZYZ) or without abuilt-in antenna (LBCA2BZZFZ)).With a 0dBm output power, themodules typically have a rangeof 30 metres. Interfaces includeUART, SPI, I2C and GPIO. Peak

current consumption is up to 4.5mA, dropping down to a deepsleep current of 0.6 uA or less.Average current consumptionduring communications is 6 uAwhen 20 bytes of data are trans-mitted once per second. It is

anticipated that with this usecase up to 4 years operation ispossible when using CR2032-type coin cells.

MURATAwww.murata.eu

Murata introduces world’s smallest Bluetooth Smart wireless module

Silicon Labs Launches Industry’s LowestJitter, Fully SyncE-Compliant Clock

PRODUCT NEWS EMBEDDED SYSTEMS


Advanced TV Tuners

Modular 4-U 19-inchindustrial PCs withindustrial mainboard or slot CPUThe 19-inch Infinity® I4 systems with 4-U height areavailable from DSM Computer in three differentmodels with Industrial ATX Mainboard, PICMG 1.0or PICMG 1.3, the latter two as slot CPU. For flexi-ble applications, the high-performance computerscan be equipped with various microprocessortypes and chipsets of the latest generations. Therobust IPCs have a housing depth of 408 mm or508 mm, respectively.

Thanks to the industrial-strength of the central sys-tem module, the 19-inch I4 system with ATXMainboard offers high reliability and robustness,and so is also suitable for applications that run inharsh environments, e.g. in automation. A total ofseven slots are available for accepting expansioncards: three PCI Express™ slots and four PCI slots.

In comparison, the 19-inch slot CPU-based 4-Usystems can be configured more flexibly and pro-vide as many as fourteen slots. The I4 with PICMG1.3 slot CPU includes three PCI Express™ slots andeight PCI slots. The PICMG 1.0 slot CPU-based sys-

tem has among other four PCI slots and providesspace for the installation of as many as eight ISAcards. Other configuration variants can be imple-mented easily on customer request.

Like all Infinity® computers, the industrial-strength4-U I4 series models are installed in a functionalgray housing with anthracite-colored front. Fordusty environments, a metal flap protects theoperating elements, the drives and the air filterthat can be replaced from the front. The housingcan be given a customer-specific company logo.The IPCs are designed for installation in 19-inchcabinets or can be provided as stand-alone unit fordeployment in harsh environments.

DSM COMPUTER www.dsm-computer.com

Laird, a global technology company,announced the release of the high per-formance Class 1 Bluetooth 700 Seriesmodules, which includes both the BT730and BT740 variant modules. Mass pro-duction quantities of modules and theassociated development kits are availablenow from all Laird global distributors. Key application areas for the BT700Series include medical devices, ePOS ter-minals, automotive diagnostic equipment,barcode scanners, and industrial cablereplacement. Every BT700 Seriesmodule is designed to add robust,long-range Bluetooth data connectivi-ty to any device. Based on the market-leadingCambridge Silicon (CSR) BC04chipset, the modules provide excep-tionally low power consumption withoutstanding Class 1 range via 18 dBmof transmit power. All BT700 seriesmodules support either on boardantenna or u.FL for external antenna con-nection plus a broad range of Bluetoothprofiles including Serial Port Profile (SPP)and a robust AT command interfaceensures customers the fastest time to mar-ket. The BT730 variant modules arebased on the Bluetooth v2.0 specification,providing OEMs with a time servedfirmware implementation, used acrosssimilar Laird Bluetooth modules. Therange of the BT730 variant modules areproven in the Laird application note,Laird BT730 Range Testing. The applica-tion note describes the setup, procedureand results of reaching almost 1,000meters with two Laird BT730 radios. The

BT740 variant modules support theBluetooth v 2.1 specification, includingSecure Simple Pairing, which enhancessecurity and ease of use for end cus-tomers. The innovative embeddedfirmware provides programming supportfor multi-point applications that use up toseven simultaneous data connections toand from the BT740 modules. The BT700 Series modules are all fullyqualified as Bluetooth End products,enabling designers to integrate the mod-

ules in devices without the need for fur-ther Bluetooth Qualification. A low-costdeveloper’s kit makes it easy for an OEMto integrate the module and guaranteesthe fastest route to prototype and thenmass production. Embedded wireless solutions from Lairdinclude Summit Wi-Fi radio modules, afull line of Bluetooth® radio modules andinnovative RAMP radio modules. Theseunique product solutions are ideal forapplications in the industrial, medicaland M2M communications industries.

LAIRD TECHNOLOGIESwww.lairdtech.com

Laird Announces New Class 1 Bluetooth® Series

ly includes five products optimized forhybrid analog/digital iDTVs, analog-onlyTVs, portable TVs, DVD and Blu-rayrecorders, and terrestrial and cable STBs.The Si21x7 TV tuner family offers thesame best-in-class sensitivity and selec-tivity, reduced bill of materials (BOM)cost and low power consumption thatTV and STB makers have come to expectfrom Silicon Labs, while enhancing per-formance in several key areas. The Si21x7tuners improve noise figure (NF) acrossall bands, return loss for a given NF, chan-nel selectivity in the presence of terrestri-al blockers and in a fully loaded and/ortilted cable spectrum, and linearity overan extended RF input power range.Improvements in these key areas deliverenhanced reception of terrestrial orcable broadcasts across a broad variety

of real-world field conditions, and theyextend Silicon Labs’ lead in TV tuner per-formance over competing solutions.The highly integrated Si21x7 tuners aredesigned to enable the lowest BOM costof any silicon TV tuner solution in massproduction. Unlike competing silicon TVtuners, the Si21x7 tuners require noexternal balanced-to-unbalanced trans-former (balun) on the RF input, whichsignificantly reduces system cost andcomplexity without performance degra-dation. In addition, the Si21x7 TV tunersintegrate all tracking filter inductors, andthey eliminate the need for inductivepower supply filtering, thanks to built-inhigh supply ripple tolerance, a key con-sideration for on-board designs.

SILICON LABS www.silabs.com/pr/tv-tuner



Renesas Electronics, a premierprovider of advanced semicon-ductor solutions, todayannounced a new UniversalSerial Bus 3.0 (USB 3.0) hubcontroller (part numberμPD720211) with dual down-stream ports, extending moreflexibility to implement USB 3.0connections of digital devicessuch as PCs, tablets, and digitalTVs to other USB 3.0-compati-ble peripheral devices. Adding a new two-port hubcontroller to the lineup along-side Renesas’ world’s-first certi-fied USB 3.0 four-port hubcontroller (part numberμPD720210) increases systemdesigners’ options for USB 3.0

hub expansion with productssuch as PCs, tablets, displaymonitors, docking stations (func-tion expansion units that con-nect to notebook PCs), and digi-tal TVs. The addition of thetwo-port hub controller(uPD720211) supports designswith tighter space and costbudgets, while expanding theUSB 3.0 connectivity to utilizethe increasing number and per-formance of USB 3.0 peripheralsdevices available in the market.The two-port hub controlleremploys a quad flat no-lead(QFN) package, which ispresently the industry-leadingsmall package for USB 3.0 hubcontroller chips, and integrates a

Renesas Electronics announcedthe availability of the newRL78/F13 and RL78/F14 16-bitmicrocontrollers (MCUs) thatcontribute to enhanced devel-opment efficiency, reduced sys-tem costs, lower system powerconsumption and improvedfunctional safety features forautomotive control systems. The new MCUs consist of total of91 products includ-ing 60 products inthe RL78/F13 Groupand 31 products inthe FL78/F14 Group.The RL78/F13 MCUsare designed for usein an extensive rangeof automotive appli-cations; from bodycontrol systems such as powerwindow and side mirror control,to automotive motor control sys-tems such as electric waterpumps and cooling fans. TheRL78/F14 MCUs support thebody control system applications,such as BCM (body control mod-ule) and HVAC (heating, ventila-tion, and air conditioning) controlthat require especially largememory capacities. In recent

years, automobiles have seen anincreasing use of electronics forfunctions such as real-time recog-nition and cloud connection IT toachieve automobiles that, in addi-tion to the existing automotivefunctions of running, turning, andstopping, also provide a safe,secure, and pleasant drivingexperience. While there contin-ues to be demand for diversifica-

tion of specifications by automak-ers and by model, there is, alongwith this trend, also a demand foran extensive MCU lineup that cancover all ECU (electronic controlunit) systems as a common plat-form solution. Furthermore, asthe use of electronics in carsincreases, the number of ECUs ina single car is also increasing.RENESAS ELECTRONICS www.renesas.eu

Renesas Electronics Introduces New 16-BitMicrocontrollers that Realize Reduced SystemPower Consumption, More Compact Size andEnhanced Development Efficiency for AutomotiveControl Systems

Renesas Electronics Strengthens Its Lineup of USB 3.0 Hub

Murata announces theMVAD040 and MVAD065 openframe, convection cooled AC-DCpower supplies.Packaged in the industry stan-dard 2 x 4 inch format with a lowprofile, 1U compatible 1.3 inchheight (50.8 x 101.6 x 33.02mm), the low powerMVAD series is suitablefor use in a wide rangeof high volume applica-tions including medicaland healthcare appli-ances, data storage andnetworking, and indus-trial factory automationsystems. Up to 90% effi-cient, the MVAD040 andMVAD065 do not require addi-tional heatsinking or forced aircooling to operate at full outputpower. No load power con-sumption is less than 0.3 W,which meets ErP and Energy Starrequirements. Accepting the uni-versal input voltage range from90 to 264 VAC, each model isavailable with a + 12, + 24, or+48 VDC output. Operating

temperature startup is as low as– 20 degrees C. MVAD065 fea-tures remote sense, which com-pensates for lead losses up to0.4 VDC at the load point.The supplies comply with thestringent demands of the inter-nationally recognized 3rd edi-

tion medical safety standardIEC/EN 60601-1: 2006. They alsomeet the IEC/EN60950-1 safetystandard for IT equipment. TheMVAD series has an MTBF ofone million hours, this being atleast 2x the MTBF of similar com-peting devices available on themarket today.MURATAwww.murata.eu

XP Power announced the SDL400series of 400 Watt single anddual output AC-DC power sup-plies. These compact units, suit-able for 1U applications, areavailable in four mechanical for-mats: U channel, U channel withcover (-C option), top fan cover(-F option) and end fan cover (-Eoption). All of the formats apartfrom the top fan mounted ver-sion are less than 39.9 mm (1.6inches) high. A variable speed fanis used to reduce audible noise atlower load conditions and extendfan life in the –E and –F models.For applications without a fan orforced air flow, the units canoperate with convection coolingup to 220 W for the single out-put models. With a peak poweroutput of up to 700 Watts for up0.5 s, the SDL400 is ideal forapplications that might have ahigher power demand for shortduration loads such as starting upa motor. This capability savesdesigners from having to specify

a larger, more expensive powersupply to satisfy this requirement.Single output models are avail-able with the popular nominaloutputs between +12 and +48VDC, as well as both a +54 and+60VDC output variant. Dualoutput models have a +5 VDCoutput in combination with a+12, +24 or +48VDC or a +12 /+24VDC model.

XP POWER www.xppower.com

Compact 400 Watt power supply capable of 700 Watt peak

40 W and 65 W convection cooled AC-DC power suppliescomply with 3rd edition medical safety standard



Silicon Labs DeliversHigh-Performance,Cost-Effective 8-BitMCUs Optimized forMotor ControlSilicon Labs introduced highly integrated, feature-rich8-bit microcontrollers (MCUs) optimized for cost-sensitive motor control applications. The newC8051F85x/6x MCUs combine best-in-class analogand communications peripherals, flash sizes rangingfrom 2 kB to 8 kB, high performance, small-footprintpackaging and cost-effective pricing, making themideal for brushless dc motor control applications usedin remote-control helicopters and cars, PC and elec-tric fans, electric tools and small appliances. TheF85/6x MCUs are a good fit for other consumer andindustrial applications such as power supplies, bat-tery chargers, set-top boxes, projectors, lightingequipment and optical transceiver modules. TheseAEC-Q100-qualified MCUs can also be used in auto-motive body electronics applications such as windowlifts and power seats.

Today’s embedded developers seek economicalmixed-signal MCU solutions that provide high levelsof integration and processing performance for ana-log-intensive and computationally demanding appli-cations such as motor control. Designed to meet theperformance requirements of motor control, theF85x/6x MCUs feature a high-speed 8051 core that is50 percent faster than the closest in-class competi-tors. This high performance enables finer pulse-widthmodulation (PWM), enhanced motor control efficien-cy and the ability to execute more complex algo-rithms for a broad range of motor speeds. TheF85x/6x MCUs also support three independent high-resolution PWM channels with a built-in overcurrentprotection/fault detection capability specifically tar-geting motor control and power supply applications.The F85x/6x MCUs take functional density to the nextlevel by integrating advanced analog and digitalperipherals into a small package. The MCUs include a12-bit multi-channel analog-to-digital converter(ADC), two analog comparators with programmablehysteresis and response time, and a precise internalvoltage reference. SILICON LABSwww.silabs.com/8bit-mcu

Fujitsu offers its new family D322x-B ofμATX mainboards with LGQA1150 sock-ets. The mainboards support the 4thgeneration Intel® Core(TM) processorfamily. They are available at distributorRutronik as of now. The new mainboards D3220-B with IntelB85 Chipset, D3221-B with Intel Q83Chipset and D3222-B with Intel Q87Chipset are now mass-produced usingthe latest versions ofthe respectivechipsets. All boardsof the D322x-B fam-ily share the samelayout and drivers,which facilitates thedesign-in of themainboards andoffers flexibility withregard to customers'requirements andpricing. Their volt-age supply is opti-mized for the lowestpossible level ofenergy consump-tion. Additionally,the Fujistu SilentFan technology ensuresvery quiet, but safe operation thanks totemperature-based control of ventilation.All models use a high-quality Intel®Gigabit Ethernet Network Connectionand require no more than two solderingprocesses. Fujitsu's μATX mainboards ofthe D322x-B family are ideal for remotemanagement with various software solu-

tions. Fujitsu DeskView offers a compre-hensive solution for in-band manage-ment, i.e. the remote access to the main-board while the operating system is run-ning. Out-of-band management, i.e.remote access on the BIOS level whilethe operating system is switched off ordysfunctional, is particularly importantfor unstaffed embedded applications. Incooperation with American Megatrends,

Fujitsu caters to out-of-band manage-ment needs with the remote manage-ment solution AMI Megarac XMS, basedon iAMT or DASH. A free demo versionhereof comes with every item from thenew mainboard family.

RUTRONIKwww.rutronik.com

voltage step-down regulator equivalentto that of existing hub controllers aswell as peripheral components requiredfor rapid charging of tablets, smart-phones, etc. In addition, the two-porthub controller delivers industry-leading

small power consumption at approxi-mately 5 milliwatts (mW) in low-powermode and approximately 350 mW dur-ing USB 3.0 operation.The USB 3.0 standard, which delivers 10times the previous maximum transferrate of 480 megabits per second, wasintroduced in response to demand forhigher data interface speeds to accom-modate the large file sizes of video con-tent and recording media with increasedstorage capacity. More recently, chipsetswith integrated USB 3.0 host controllerfunctionality have appeared, spurringadoption of USB 3.0 on devices otherthan PCs, such as tablets and digitalhome electronics products.

RENESAS ELECTRONICSwww.renesas.eu


b Controllers to Meet Demand for More USB Ports on Electronic Devices

Rutronik presents mainboard family with latest 4th Gen Intel® Corechipsets from Fujitsu


Microchip announces a new six-member family of temperaturesensor ICs called the EMC118X.This is the world’s first family oftemperature sensors with 1.8VSMBus and I2C™ communication,which is required forinterfacing to the latestgeneration of smart-phone, tablet and PCchipsets. Additionally,this integrated low-volt-age I/O support reducescost and board spacebecause it is accom-plished without anexternal voltage levelshifter. These are also the firsttemperature sensors to use anadvanced sample-frequency-hopping filter, which enablesaccurate readings using tempera-ture-monitoring traces of up to 8inches in noisy environments.The EMC118X family serves abroad range of applications inthe mobile, commercial andembedded computing marketsby combining the above features

with options for dual, triple andquad temperature monitoring, inaddition to hardwired system-shutdown settings that cannotbe overridden by software.The latest generation of smart-

phone, tablet and PC chipsetsutilise advanced process geome-tries, which have a 1.8V uppervoltage limit for I/O signals.There are few temperature sen-sors with 1.8V I2C/SMBus inter-faces, and the EMC118X is thefirst family to provide this capa-bility, in addition to a flexible setof integrated feature options.MICROCHIP TECHNOLOGY www.microchip.com/get/7TEL

The new version of WeatherProfor Android 3.0 now also sup-ports sensors integrated in thecell phone, such as the humidityand temperature sensor fromSensirion. Thesensor data is dis-played in thedaily forecast.This enablesusers to comparethe data fromtheir current loca-tion with theforecast values,making them bet-ter prepared forany weather.The use of such asensor is onlypossible thanks to innovativetechnology in both the hardwareand software. The hardware isthe smallest humidity and tem-perature sensor currently avail-able. It was specially designedfor mobile end-devices by the

Swiss high-tech companySensirion and optimized to fulfillthe industry's unique require-ments. The company not onlyprovides the sensor, but also the

corresponding soft-ware. Without it, theheat generated bythe smartphoneitself would makeany measurement ofthe ambient temper-ature impossible.Sensirion is currentlythe only company tooffer an all-in-onesolution for ambientsensing of humidityand temperature forsmartphones.

From today, WeatherPro forAndroid 3.0 is available fordownload at:https://play.google.com/store/apps/details?id=com.mg.androidSENSIRIONwww.smart.sensirion.com

WeatherPro with Sensor Support from Sensirion

Microchip introduces world’s first temperaturesensor family with 1.8V SMBus and I2C™ interfacefor latest smartphone, tablet and PC chipsets Mouser Electronics, Inc.

announces the launch of its newRFID & NFC Technologies site.This Mouser technology siteexplores the rapidly expandingRadio-Frequency Identification(RFID) market and includesfeatured products, technicalarticles, videos, white papers,testing resources, and more.RFID technology has wide-ranging uses but generallyinvolves bi-directional com-munication between an RFIDtag and RFID reader. NFC(Near Field Communications)is a sub-set of RFID technolo-gy that is used for transferringinformation securely betweenelectronic devices within a shortrange. Inventory and point-of-sale activities make up the lion’sshare of the RFID market, but itsapplications have expanded toretail loyalty-rewards programs,dynamic pricing, keyless entry,and much more. RFID is even

being combined with biometricsin ePassports and health records.A featured article on the RFIDtechnology site by Mouser dis-cusses the growing number ofdesign opportunities that are

becoming available as RFID tech-nology becomes more widelyused. The site also offers technicalarticles from leading semiconduc-tor manufacturersSTMicroelectronics and Murata.MOUSER ELECTRONICSwww.mouser.com

CAN in Automation (CiA) hasreleased the version 3.0 of itsCANopen conformance test tool(CTT). The completelyredesigned tool is improved inmany aspects and complies withthe CiA 310 CANopen confor-mance test plan. The CTT is avail-

able free-of-charge for CiA mem-bers. Non-members may pur-chase it from CiA Headquartersin Germany. CiA uses this tool forthe conformance testing ofCANopen devices (CANopencertified by CiA). The tool runs

on PCs with Microsoft Windowsfrom Windows 95 to Windows 8and requires a CAN hardwareinterface plus COTI low-leveldriver program. COTI softwarefor different PC-to-CAN modules(esd, Ixxat, National Instruments,Port, and Vector) comes with the

CTT software. Recently, Peak-System announced that theyreleased COTI-DLLs for CiA’s testtool, which supports all of itsCAN-PC interface modules.CiAwww.can-cia.org

CANopen Conformance Test Tool

New Technology Site from Mouser ElectronicsFocuses on RFID and NFC Technologies



n Optical sensorsn Sensors for logistic applicationsn Safety at work

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n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

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n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Heavy Duty Industrial Connectorsn Power and Data Transmission Connectorsn Aluminium Junction Boxes

AUTOMATION

Honeywell announced that it has launchednew customizable pressure and thermal sen-sor solutions – including modules with multi-ple sensors and technologies integratedinside. Heaters, magnetic, Magneto-resistive,infrared, optical, pressure, thermal, andhumidity options are all available for cus-tomization. Additional value add optionsinclude custom interfaces, I/O, size and shape,environmental packaging, and total thermalmanagement solutions to make it much easier,faster and more affordable for design engi-neers to find a Honeywell sensor solution thatmeets their design parameters. With Honeywell’s upfront and ongoing tech-nical support, this customization processenhances the developer design process,ensuring that new and updated designs canbe brought to the market quicker. The ability

to design in a customized version of analready approved sensor design often meansthat device developers do not have to re-cer-tify their upgraded products, saving bothtime and money. “It is important to provide customers with exact-ly what they want, all from a single vendor,” saidValerie Rothermel-Nelson, Honeywell seniorglobal product marketing manager. “This is partof Honeywell’s new systematic method of pro-viding integrated and differentiated value addedsolutions. Our new approach means that we arenow providing higher level assemblies, not justcomponents. A higher level assembly is a pack-age that provides differentiated and integratedsolutions that ultimately give our customers acompetitive advantage. It could be combiningmore than one sensor into higher level packag-ing, providing custom termination or even pro-

viding total thermal management solutions.”Honeywell’s value-added capabilities build onhighly reliable, proven and accurate sensingplatforms, while responsive quoting and rapidprototyping processes meet demandingdeadlines.

HONEYWELLwww.honeywell.com

Honeywell Sensing and Control Launches New Value Added Sensor Assembly Solutions


DESIGN SENSORS


DESIGN SENSORS

AUTOMATIONTel. +40 256-201346Mail [email protected] www.oboyle.ro


DER-350 achieves excellentdimming performance for allTRIAC dimmer types Power Integrations, the leader inhigh-efficiency, high-reliabilityLED driver ICs, announced a ref-erence design for a dimmablePAR38 spotlight,developed in col-laboration withCree, Inc.(Nasdaq: CREE),a leading LEDlighting company.The new refer-ence design,described inDER-350, usesPowerIntegrations’ new LYT4317E, amember of the company’sLYTSwitchTM-4 family of single-stage drivers, along with Cree’sMT-G2 EasyWhite® LEDs.DER-350 includes an isolated,high-power-factor, TRIAC-dim-mable LED driver optimized todeliver an LED current of 550mA at 36 V (nominal) from aninput voltage range of 90 VACto 132 VAC. The combined PFC

and CC single-stage, isolatedtopology of the LYTSwitchTM-4IC delivers excellent efficiency,power factor of 0.98, and lowcomponent count. Over-voltage, overcurrent andover-temperature protection

features are built-in.DER-350 also showcases theLYTSwitchTM-4 IC’s excellentTRIAC dimming with very fastsub-200 ms start-up, reducedpop-on and no dead-travel, easi-ly satisfying NEMA dimmingcurve requirements, for bothleading-edge and trailing-edgedimmers.POWER INTEGRATIONS www.powerint.com

Power Integrations Announces New ReferenceDesign for Efficient PAR38 LED Spotlight

Osram Opto Semiconductorspresents the new multi-chip-LEDs with a broad bright bluecolor range. This gives lightingdesigners a free choice of colorsfor the interior lighting invehicles. Color design nowcovers cluster lighting to anincreasing extent, notably incombined instruments suchas speedometers and revcounters, in displays, as back-lighting for switches and forambient lighting. Rutronikdistributes the MultiLED asof now. The main feature ofthe new MultiLED in the stan-dard 3.3 x 3.0 x 1.8mm SMTpackage is a very broad bluecolor range with a wavelength ofup to 447nm and high bright-ness, which allows the produc-tion of deep saturated bluetones. This is thanks to the use ofthree LED chips in red, greenand blue (RGB). At 370mcd the

blue is very bright. This brightness is a huge advan-tage as the human eye perceivesthe color blue darker than itreally is and the new MultiLED

can offset this darker percep-tion. Other properties of theMultiLED are an integrated ESDprotective diode (electrostaticdischarge), an improved corro-sion resistance and a long marketavailability, which makes themideal for use in automobiles. RUTRONIKwww.rutronik.com

More options for automobile designers: Osram'snew MultiLED at Rutronik

Osram Opto Semiconductorsextends its Duris "S" LED seriesby the Duris S 8. The new multi-chip, high-power LED offers lotsof light from a small surface. It isprimarily used in directional andomnidirectional retrofits, as wellas in LED spots in indoor lighting.It is particularly suitable fordirectional lighting in office andbusiness premises, as well as inthe home. Rutronik distributesthe new Duris S 8 in two versionsas of now. The very good colorconsistency (color binning) in thedirectional retrofits is achievedthrough the close grouping ofthe LEDs, which corresponds tothe coverage of a 5-stepMacAdam ellipse. 3-stepMacAdam grouping is addition-ally available for applicationsrequiring very good color homo-geneity. The Duris S 8 isgrouped by color coordinates at

the junction temperature of100°C instead of at room tem-perature. In terms of color ren-dering, it has a CRI of more than80. The new Duris S 8 measuresonly 5.8 × 5.2mm and is availablein two versions: with six or eight

chips. Version 1 (six chips) comeswith a grouping current of200mA, forward voltage of 18.6up to 22.2V and a luminous fluxof 390lm at typical 25°C and3,000K. RUTRONIKwww.rutronik.com

Osram Opto Semiconductorspresents the new MicroSideled3806 for stable light conditionson the display. The brightness ofthis LED remains constantthroughout its lifetime of typically15.000 hours and can withstandhigh temperatures as well as highcurrents. Thanks to an impressiveefficiency, it is ideal for portabledevices such as tablets and smartphones. The MicroSideled 3806is available in white andblue at distributorRutronik as of now. Thewhite model is a classicLED with chip and con-verter, achieving a highefficiency of 150lm/W. Itoffers very fine binningfor there is always a uni-form color over theentire backlit surface. The effi-ciency of the blue MicroSideled is55%, measured as the externalquantum efficiency (EQE), inother words the ratio of the elec-trical power used to the emittedoptical power. This LED isdesigned for special display tech-nology that uses quantum dots(special nano particles) as conver-

sion material. That conversiontechnology features a thin sheetwith quantum dots (the quantumdot sheet) in the backlighting, inwhich the sheet is illuminated bythe blue LEDs. This in turn, leadsto an extremely narrow-bandemission spectrum which accu-rately hits the color filters of thebacklighting unit. Thereby, lightlosses are kept to a minimum andthe colors are more vibrant.

System efficiency is 10 to 15%greater than with white LED solu-tions, the coverage of the colorspace is also 33% better. Osram'sMicroSideled 3806 have a beamangle of 120°, an operating cur-rent of 20mA and a forward volt-age of < 3,0V. RUTRONIKwww.rutronik.com

Rutronik: 15.000 hours of constant output withMicroSideled 3806 from Osram

Rutronik: compact multi-chip LED for interiorlighting from Osram

PRODUCT NEWS DISPLAY


EVERLIGHT ELECTRONICS CO.,LTD., a leading player in the glob-al LED industry, has expanded itshigh performance JU series ofchip-on-board (COB) LEDs toinclude 7, 10 and 15 W types inaddition to the existing 4W ver-sion. COB LEDs are especiallysuited for directional applicationsthat require a powerful singlelight source for effective illumina-tion such as GU, MR and PARretrofits, downlights and cande-labras. The JU series now consistsof four JU1215 (15×12×1.6mm)and one JU2024 (20×24×1.6mm)type/s with powers ranging from4 watts to 15 watts. All types pro-vide an efficacy of 110lm/W ormore at 3000K CCT, a CRI of>80Ra and 25°C substrate tem-perature, and are available in ver-sions ranging from ANSI bin2,700 K to 6,500 K. The JU seriesalso offers 3 step (McAdam)options for advanced utilization.JU COB LEDs are multi-chip solu-tions that are directly applied tothe board without housing, for

efficient thermal dissipation.Their ceramic substrate baseallows for thermal resistances ofbelow 2°C/W, with the largestwattage COB measuring around0.8C°/W. Low thermal resistance

and superior heat dissipationensure high reliability andincrease the LEDs’ service life.EVERLIGHT ELECTRONICSwww.everlight.com

Advanced Power ElectronicsCorp. (USA), a leading Taiwanesemanufacturer of MOS powersemiconductors for DC-DCpower conversion applications,has launched a newstep-up convertercapable of efficientlydriving up to eightwhite LEDs in seriesfor backlighting appli-cations. The APE1612-3 uses current mode,1.2MHz fixed frequen-cy architecture to reg-ulate the LED current,which is set using an external cur-rent sense resistor. The APE1612-3 features a low300mV feedback voltage thatreduces power loss andimproves efficiency. The OV pinmonitors the output voltage andturns off the converter if anover-voltage condition is presentdue to an open circuit condition.The APE1612-3 includes under-voltage lockout, current limiting

and thermal shutdown protec-tion preventing damage from anoutput overload. Comments Ralph Waggitt,President/CEO, Advanced Power

Electronics Corp. (USA): “Smallsize and high efficiency make theAPE1612-3 ideally suited forbacklighting applications. A wide200Hz to 200kHz range enablesthe device to be used in PWMdimming.”The APE1612TY-HF-3 is shippedin a small RoHS/REACH-compli-ant TSOT-26 package.ADVANCED POWER ELECTRONICSwww.a-powerusa.com

New, efficient LED driver from Advanced PowerElectronics Corp. suits backlighting applications

Everlight extends JU series of COB LEDs

MIPI DSI and CSI Tx/RxReference Designs HelpDesigners Overcome theChallenges of IntegratingCamera and DisplayCapabilities to their Systems Lattice SemiconductorCorporation announced threenew complete reference designsthat will make it easier for elec-tronic OEMs to deliver media-rich experiences to their endusers by taking advantage of

low-cost, industry-standard MIPI(Mobile Industry ProcessorInterface) camera, applicationprocessor, and display technolo-gies. These latest FPGA-basedreference designs from Latticeenable OEMs to quickly buildand roll out next-generationproducts that are low cost, highlyreliable, and consume low poweras they deliver the latest in dis-play, image and motion features. Using these new referencedesigns, designers can use imagesensors that are not designed forthe mobile market. As an exam-ple, a high end smartphonecould incorporate a DSLR typecamera. In this case, the imagesensor is bridged to a MIPI-based applications processor viaa Lattice FPGA. The inverse isalso true where MIPI-based com-ponents can be linked to non-MIPI based processors or SoCs. “Increasingly, for OEMs to becompetitive they need to provideend-users with a media-rich expe-rience across all their electronicdevices. To deliver on this, manu-facturers would like to leveragemobile display, applicationsprocessor, or camera components,but the interfaces for these lowcost system components oftenpresent a challenge,” said Ted

Marena, Director of SolutionsMarketing at Lattice. “The fact is,until MIPI becomes the dominantinterface for the broad market, cus-tomers are going to need a bridgebetween different interface tech-nologies. Not only does Latticeprovide the perfect FPGA technol-ogy to adapt to different interfaces,now we provide complete refer-ence designs that make addingMIPI to any system an easy toachieve reality.”

Available TodayGiven that every customer’s sys-tem architecture is unique, eachof the three new referencedesigns, as well as the previouslyannounced CSI-2 receive bridge,includes a configuration formavailable on the Lattice web sitethat allows designers to specifythe interfaces they need andreceive an HDL netlist targeting aMachXO2™ or LatticeECP3™FPGA. For more information, clickon the links below:

• MIPI DSI Transmit Bridge:Enables a Lattice FPGA to drive aDSI-receiving device such as a DSIdisplay.• MIPI DSI Receive Bridge:Allows an application processorto interface to a screen that is notdesigned for mobile applications.• MIPI CSI-2 Transmit Bridge:Provides the conversion bridgelogic required to enable an appli-cations processor to interface to anon-CSI-2 image sensor.• MIPI CSI-2 Receive Bridge(previously announced): Allows amobile CSI-2 image sensor tointerface to an embedded imagesignal processor.

LATTICE SEMICONDUCTORwww.latticesemi.com

Lattice Just Made it Easier for OEMs to Introduce theLatest in MIPI Camera and Display Capabilities

PRODUCT NEWS DISPLAY

XP Power announced additionsto its GCS series of single outputhigh efficiency “green” AC-DCpower supplies with both ITEand Medical safety approvals.Complementing the GCS150150 Watt models, the GCS180range extends the power out-put capability up to 180Watts. All models in the rangehave a no load input power ofless than 0.5W and a typicalefficiency of 93%. TheGCS180 series is available inmultiple mechanical formatsgiving the designer severalmounting configurations tochoose from to suit the endapplication. Convectioncooled formats, providing upto 150 Watt output, are in anindustry standard 3 x 5 inch(127 x 76.2 mm) open framepackage, an optional enclosedcover option is also available. Thefull 180 W output is availablewhen a forced air flow of only 7CFM is provided by the user orby using the optional top or endmounted fan formats.Across the range, 5 single output

models are available covering thepopular nominal outputs of +12,+15, +24, +28 or +48 VDC. Anadditional 12 V / 0.6 A fan outputis standard. Designers also have

the choice of using an input earthconnection or not due to theClass I and Class II input construc-tion used. A remote on/off fea-ture is available across the rangeby specifying the –R option.XP POWERwww.xppower.com

CUI Inc announced significantupgrades to its VYB and VYCproduct lines, with the release ofthe new high efficiency PYB dc-dc converter family.Housed in board mount pack-ages with six-sided shield-ing, the new family offersan output power range of10 W~30 W across fourseries and features anultra-wide, 4:1 inputrange. Efficiencies are alsoincreased significantlyover previous generationsreaching 91%, up 3 per-centage points.Input ranges of 9~36 Vdcor 18~75 Vdc make the units ide-ally suited to battery-drivenapplications, where charging anddischarging conditions require awide input range. The devices’ -40° to + 85°C operating tempera-ture range also allows the seriesto work reliably in harsh environ-

ments.The 10 W, 15 W, and 20 W fami-lies are packaged in an industrystandard 2” × 1” (50.8 mm × 25.4mm) footprint while the 30 Wmodel features a footprint of 2” ×

1.6” (50.8 mm × 40.6 mm). ThePYB family is available in singleoutput (3.3, 5, 12, 15, or 24 Vdc),dual output (±5, ±12, or ±15 Vdc)and triple output (3.3/±12,3.3/±15, 5/±12, or 5/±15) models. CUI www.cui.com

CUI’s Next Generation 10 W~30 W Dc-DcConverters Boost Efficiency by 3 Points

Multi format 180 Watt 93% efficient power sup-ply from XP Power

Ericsson has introduced a new3E* DC-DC regulator, theBMR461, that is the first 12 × 12× 8mm 12A digital point-of-load(POL) module to combineDynamic Loop Compensation(DLC), low-bias currenttechnology, advancedenergy-optimization algo-rithms to reduce energyconsumption, and a land-grid-array (LGA) footprintthat guarantees excellentthermal, mechanical andelectrical performance.The new BMR461 DynamicLoop Compensation isbased on ‘state-space’ or ‘model-predictive’ control, which guaran-tees stability while also achievingthe optimum dynamic perform-ance without requiring any exter-nal components. The new prod-uct performs an automatic com-pensation routine that is basedon measured parameters, whichenables the construction of aninternal mathematical model ofthe power supply including exter-

nal components such as filteringand parasitic resistors. Based onthe ‘state-space’ mathematicalmodel rather than traditional pro-portional-integral-derivative (PID)regulation, the BMR461 uses

closed-loop pole placement anda model based on the resonantfrequency of the output filter,thereby reducing the number ofoutput capacitors required for fil-tering and stability. This technolo-gy is highly suitable for FPGA andprocessor applications wherelow-ESR decoupling capacitorsare currently being used.ERICSSON POWER MODULESwww.ericsson.com/powermodules

Mouser Electronics, Inc. nowstocks International Rectifier’s(IR) family of AEC-Q101Automotive qualified 40V N-channel MOSFETs, featuring IR’sproven Gen12.7 trench technol-ogy with ultra-low Rds(on).International Rectifier'sAutomotive COOLiRFET™ PowerMOSFETs from MouserElectronics targetrugged automotiveapplications. TheseHEXFET® PowerMOSFETs utilize lead-ing-edge manufacturingtechniques to achievevery low on-resistance,resulting in highly efficient switch-ing of high current signals withvery little power loss. Additionalfeatures include a high 175°Cjunction temperature, fast switch-ing speeds for better power effi-ciency, and a high repetitive ava-lanche rating for harsh signal envi-ronments. These new devicesoffer low conduction losses and

robust avalanche performance todeliver higher efficiency, powerdensity and reliability.Applications using these new IRCOOLiRFET™ devices fromMouser Electronics can run signifi-cantly cooler than comparableMOSFETs. These features com-bine to make this an extremely

efficient and reliable MOSFET foruse in automotive systems as wellas a wide variety of other applica-tions. To learn more, visit:www.mouser.com/new/interna-tionalrectifier/ir-autocoolirfet-mosfet/MOUSER ELECTRONICSwww.mouser.com

International Rectifier’s Automotive COOLiRFET™Power MOSFETs are Now Available at Mouser

New voltage regulator from Ericsson delivers digitaldynamic-loop-compensation


PRODUCT NEWS ACTIVE COMPONENTS


Laird announced the release ofits BTM46x Series Bluetooth®modules. Mass production quan-tities of modules and the associ-ated development kits are nowavailable directly from Laird. Based on the market-leadingCambridge Silicon Radio (CSR)BC04 chipset, the innovativefirmware on the BTM46x seriesallows OEMs to seamlessly sup-port Bluetooth data connectivityfor all PCs, smartphones andtablets including Apple iOSdevices. The BTM46x firmwareenables Apple licensees to leverage Bluetooth data con-nectivity, via the iAP protocol,into their MFI accessories,enabling rapid time to market for

their products. “With Laird’s BTM46x modulesand associated development kit,OEMs can provide cross platformBluetooth data support in a simpleand easy to use module,” saidJonathan Kaye, Laird productmanager. “Laird’s embeddedfirmware provides a seamless dataconnectivity engine regardless ofwhether connecting to, or from,Bluetooth enabled Android,Windows, Linux or iOS devices.” Key application areas for theBTM46x Series include medicaldevices, ePOS terminals, barcodescanners, industrial cable replace-ment, and smartphone/tablet‘Appcessories’. Every BTM46xSeries module is designed to add

SuVolta, Inc., a developer of scal-able semiconductor technolo-gies for low-power, high-per-formance IC chips, todayannounced that it has realizedsignificant processor speed gainswith associated power reductionin an ARM Cortex-M0 processorbuilt using transistor technologyfrom SuVolta. The ARMCortex-M series proces-sor was manufacturedwith SuVolta’s DeeplyDepleted Channel™(DDC) technology on a65nm bulk planarCMOS DDC process.With SuVolta’s transistortechnology, designersare able to significantlyreduce power or dra-matically improve performance,depending upon design require-ments. When compared to anidentical ARM Cortex-M0processor manufactured in theconventional 65nm process, witha 1.2V supply voltage, the DDCtransistor-based ARM implemen-tation operating at 0.9V demon-strates the following benefits:• 50 percent lower total powerconsumption at matched350MHz operating speed.• 35 percent increased operatingspeed (performance) at matchedpower.

• 55 percent increased operatingspeed when operated atmatched supply voltage.“ARM’s heritage is based on lowpower, so technologies that canfurther improve power consump-tion, such as DDC technology fromSuVolta, will always be welcomedby ARM and our Partners,” said

Noel Hurley, vice president,Strategy and Marketing,Processor Division, ARM. “SuVoltahas shown that the DDC technolo-gy, when incorporated into anARM processor, can provide addi-tional power reductions or a signif-icant performance boost. As theInternet of Things continues toexpand, innovative ultra-lowpower technology for sensors andother devices will be vital toensure that ARM remains at theforefront of this opportunity.”SuVolta, INC.www.suvolta.com

SuVolta Announces Speed-Power Benefits ofTransistor Technology Validated in ARM Processor

Laird Announces Bluetooth Module for Apple iOS Device

Laird, announced the release ofthe new RWC5353 SeriesWireless Charging Coil Modules.The RWC5353 Series improvesefficiency and performance whileminimizing electromagnetic inter-ference (EMI) in wireless chargingdevices. The newRWC5353 series are trans-mitter coil modules thatmeet the Wireless PowerConsortium’s WPC) Qistandard, the global stan-dard for wireless charging.With more than 20 millionpeople using Qi-phones,the market for wirelesscharging devices is poised forexplosive growth. “Laird is a leader in ferrite prod-ucts and offers an extensive lineof signal integrity and EMI filter-ing solutions,” said Jill Tsai, prod-uct specialist at Laird. “We havetaken our expertise one step fur-ther and developed a solution forthe emerging wireless chargingmarket that reduces EMI andimproves performance while stillkeeping costs down.” These RWC5353 Series use fer-rite material 28, which is not onlyWPC recommended but alsoimproves reliability. The powertransmitter in the new modules is

A1 compliant and can support upto 5 Watts of ower transfer. Thiscomplete solution features a highQ factor for maximum wirelesspower charging efficiency and isdesigned for extended operatingtemperatures of -40° to 85°C.

Wireless charging technologyrequires two coils, a transmitterand a receiver. An alternating cur-rent is passed through the trans-mitter coil in the charging device,generating a magnetic field. Thisresults in a voltage in the receivercoil which can be used to powera mobile device or charge a bat-tery by simply placing it closeenough to the charging device. There are over 200 Qi certifiedproducts available on the WPC’s website, ranging fromsmart phones and tablets tocomponents. LAIRD TECHNOLOGIESwww.lairdtech.com

Advanced Power ElectronicsCorp. (USA) has launched anasymmetric-dual N-channelenhancement mode powerMOSFET targeting synchronousbuck dc/dc converter powerdesigns. Packaged in a small 3mm squarePMPAK®3x3, the AP6950GYTcomprises a “high-side” controlMOSFET (CH-1) and a “low-side”synchronous MOSFET (CH-2),providing a compact solutionoptimised for synchronous buckapplications. Drain-Source break-down voltage (BVDSS) for bothchannels is 30V, while on-resistance is low at 18mΩ (CH-1)and 10.5mΩ (CH-2)Comments Ralph Waggitt,President/CEO, Advanced PowerElectronics Corp. (USA):

“Our MOSFETs provide thedesigner with cost-effective per-formance whilst retaining the bestcombination of fast switching,ruggedized device design, andlow on resistance.”

Devices are RoHS-compliant andhalogen-free; more data is avail-able at www.a-powerusa.com/docs/AP6950GYT-3.pdfADVANCED POWER ELECTRONICSwww.a-powerusa.com

Dual channel MOSFETs from Advanced PowerElectronics Corp. simplify synchronous buck design

Laird Announces Release of Wireless ChargingCoil Modules



Microsemi Answers Data StorageSecurity Threats with World’s OnlySelf-encrypted, Half-terabyte 2.5”SATA SLC Solid State DriveMicrosemi Corporation, a leading provider of semi-conductor solutions differentiated by power, securi-ty, reliability and performance, announced theworld’s only secure, half-terabyte (TB) solid statedrive (SSD) for mobile video surveillance operations,storage area networks (SANs) and other high capaci-ty storage applications requiring superior real-timedata protection. The ruggedized TRRUST-Stor™Series 200 2.5” SATA SSD operates at sustained 200megabytes per second (MB/s) and delivers the indus-try’s fastest full-hardware-based erase time of lessthan 10 seconds. The self-encrypting, half-terabyteSSD is available now and currently shipping to multi-ple customers to support applications requiring mas-sive secure storage capacity.

The half-terabyte TRRUST-Stor SSD provides mili-tary-grade ruggedization as well as unparalleled safe-guards and processes for physical data storage withmultiple layers of security features. The suite ofindustry-leading features prevents corruption andunauthorized access with hardware- and software-based barriers. The drive features a built-in compactin-line encryptor with hardware-implemented, NIST-certified AES 256 encryption using the XTS blockcipher mode.Ruggedization features include superior error correc-tion, 9 petabytes write endurance, power loss protec-tion and more than 2 million hours mean timebetween failure (MTBF). Enhanced mechanical con-struction ensures operation in extreme temperatures,humidity, shock and vibration.The TRRUST-Stor Series 200 is powered byMicrosemi’s second generation Armor™ processor,enabling robust performance. The Series 200 SSDsalso offer the ability to load encryption keys.Customers can input their own AES-256 keys, purgethem and reload as needed. Microsemi’s TRRUST-Purge™ technology destroys keys in less than 30 mil-liseconds when activated.

MICROSEMIwww.microsemi.com

Power Integrations introduced CHY100,the first AC-DC wall-charger interface ICthat enables designers of mobile devicesto implement the Quick Charge 2.0 pro-tocol from Qualcomm. Launched earlierthis year, Quick Charge 2.0 enables usersto charge mobile devices up to 75%faster than when using conventionaltechnology. Used in combination withPower Integrations’ AC-DC switcher ICs,the CHY100 incor-porates all the nec-essary elementsrequired to addQuick Charge 2.0functionality toAC-DC wall charg-ers. The CHY100detects commandsfrom a QuickCharge 2.0-enabled device,such as a cellphonehandset, and adjusts the output of theAC-DC wall charger to enable increasedpower delivery to the device’s battery.When plugged into a powered devicewithout Quick Charge 2.0 capability, theCHY100 automatically disables the high-er-voltage/higher-power capability toensure safe operation. Tests confirm thatsmartphones with high-capacity batteriescan be fully charged in as little as onehour using Quick Charge 2.0 – an impres-sive improvement from the four-hourcharging cycles characteristic of conven-tional fixed-voltage chargers.

Comments Abid Hussain, director ofproduct management at Qualcomm:“We chose Power Integrations as the leadstrategic partner for our Quick Charge 2.0program which was launched earlier thisyear. We are delighted that they wereable to deliver a spec-compliant, produc-tion-ready IC for AC-DC wall adapters inless than six months, enabling OEMs andadapter makers to implement Quick

Charge 2.0 immediately. Qualcomm'sQuick Charge 2.0 allows mobile devicesto be charged up to 75% faster and it israpidly becoming the industry-wide stan-dard for cell phones and tablets."The CHY100 is suitable for batterychargers for smartphones, tablets, net-books, digital cameras and Bluetooth®accessories as well as USB power outputports. Devices are available in SOIC-8packaging and cost $0.22 each in 10Kquantities. POWER INTEGRATIONS www.powerint.com

Power Integrations Teams with Qualcomm on Rapid-ChargingTechnology for Mobile Devices

robust, short-range Bluetooth data con-nectivity to any device. With a compactfootprint of 12.5 × 22 mm, the modulesdeliver maximum range with minimumsize. The modules are designed to sup-port a separate power supply for I/O, inaddition to including a completeBluetooth v2.1 protocol stack forincreased ease of integration.

The BTM46x Series provides supportfor multi-point connections andincludes the following Bluetooth pro-files: Serial Port Profile (SPP), HID(Human Interface Device) and Apple’siAP protocol. BTM46x modules are fullyqualified as a Bluetooth End Product,whilst also holding FCC Modular, IC, CEand MIC ( Japan) regulatory approvals,enabling designers to quickly integratethe modules into devices without theneed for additional qualificationresources. The available low-cost devel-oper’s kit makes it easy for an OEM tointegrate the module and guaranteesthe fastest route to prototype and thenmass production.

LAIRD TECHNOLOGIESwww.lairdtech.com




New external microphoneavailable from AvnetAbacus reduces noise forenhanced in-car voicecommunicationAvnet Abacus, one of Europe’s leading interconnect,passive, electro-mechanical and power distributorsand a business unit of Avnet Electronics MarketingEMEA, a business region of Avnet, Inc., has announcedavailability of a new high-performance external carmicrophone developed by Kingstate, a leading manu-facturer of electro-acoustic components.

This new unidirectional microphone is optimised todeliver the very highest quality acoustics and noisereduction capability essential for the safe use of in-car

multimedia, communications and satellite navigationsystems. It features high (-37dBV) supercardioid sensi-tivity to enhance the definition of reception at thefront of the vehicle while reducing sound pick-up fromthe side and rear, and a high signal-to-noise ratio (SNR)of 69dBA, to provide optimal communication per-formance for speech recognition, voice speed dial andGPS navigation.

With overall dimensions of just 11.7mm (diameter) ×25.5mm, the compact microphone is encased in light-weight and durable aluminium alloy. High frequencynoise is effectively filtered out, thanks to the deploy-ment of a high-performance junction gate field-effecttransistor ( JFET) at the core of the electret condensermicrophone (ECM), plus a low pass filter (LPF) outputcircuit that detects and passes low frequency signals.

Kingstate has more than 30 years’ experience in thedevelopment of advanced electro-acoustic products,including piezo buzzers, magnetic buzzers, microspeakers, dynamic receivers, electret condenser micro-phones and earphones. These products, including thenew external car microphone, are fully supportedacross Europe by the applications and sales teams ofAvnet Abacus.

AVNET ABACUSwww.avnet-abacus.eu

AVX Corporation announced its newlow-profile 0603 diplexer today. Basedon the company’s patented multilayerorganic high density interconnect tech-nology, the new 0603 MLO™ diplexeremploys high dielectric constant and lowloss materials to realize high Q passiveprinted elements, such as inductors andcapacitors in a multilayer stack up.Capable of supporting multiple wirelessstandards, including: WCDMA, CDMA,WLAN, GSM, and BT, the 0603 diplex-ers are ideally suited for band switchingin dual- and multiband applications, suchas WiFi, WiMax, GPS, and cellular bands.Utilizing land grid array packaging tech-nology, AVX’s new 0603 diplexers havean inherently low profile (<0.5mm) andexhibit excellent solderability, low para-sitics, and high heat dissipation.Expansion matched to PCBs, the diplex-ers also provide improved reliabilitywith regards to comparable ceramic or

silicon components. AVX’s new 0603MLO™ diplexer features a maximumpower capacity of 4.5W, measures1.65mm × 0.88mm × 0.42mm (0.065” ×0.035” × 0.017”), is rated for use in tem-peratures ranging from -40°C to +85°C,and is available in Ni Au, Ni Sn, and OSPfinishes, all of which are compatible with

automatic soldering technologies.Finished parts are 100% tested for elec-trical parameters and visual characteris-tics and are packaged on tape and reel.AVXwww.avx.com

AVX releases new low-profile 0603 MLO™ diplexer formultiband applications

A new series of low input currentoptocouplers with phototransis-tor output from Vishay can nowbe ordered from TTI, Inc., theworld’s leading specialist distrib-utor of passive, connector,electromechanical and dis-crete components. TheVOS627A and VOS628Aseries optocouplers broadenVishay’s optoelectronicsportfolio and feature thecompact SSOP-4 mini-flatpackage and the flexibility tochoose from variable transferratio (CTR) ranges.The new optocouplers offerextensive CTR (current transferratio) ranges from 40% to 600%,low power dissipation, and a lowinput drive current down to1mA. Available in several pack-age sizes including DIP-4, LSOP-4, SOP-4 and SSOP-4, the com-ponents in the SOP-4, SSOP-4and LSOP-4 package are only2mm high, making them ideal for

applications with height con-straints. Compared with the stan-dard DIP-4 package, the devicesin the smaller package sizes offerconsiderable board space sav-

ings, saving 60% board space inthe SSOP-4 package and 30% inthe SOP-4 package.Certified to UL, CSA, VDE,Fimko, and CQC safety stan-dards and fully RoHS-compliant,as well as lead (Pb)-free, Vishay’s new optocouplers benefit from an eco-friendly“green” compound. TTI www.ttieurope.com

SuVolta, Inc. and FujitsuSemiconductor Limited todayannounced volume productionof the first Deeply DepletedChannel™ (DDC) transistor-basedchip, MB86S22AA Milbeaut®image processor integrated cir-cuit (IC). Manufactured on“CS250S” technology, which com-bines Fujitsu Semiconductor’s55nm process with DDC technol-ogy, the IC has 30 percent lowerpower consumption and roughlytwice the processing perform-ance compared to the existingproducts, despite the new prod-uct having considerably morecircuits with enhanced processingperformance. MB86S22AA rep-resents the culmination of a suc-cessful joint development pro-gram between the companies.Together, the companies areadvancing the capabilities ofultra-low-power, high-perform-ance products.Fujitsu Semiconductor is SuVolta’sfirst licensee of the DDC technol-

ogy. Since the collaboration wasannounced in June 2011, thecompanies have successfullybrought up the DDC technologyat the 65nm and 55nm nodes,meeting all production, yield andreliability requirements.

MB86S22AA is the latest of theMilbeaut line of image processorswhich has established a wide-ranging track record in a host ofapplications from digital SLR cam-eras to smartphones. FUJITSU SEMICONDUCTOR http://jp.fujitsu.com/fsl/enSuVoltawww.suvolta.com

First DDC™ Transistor-Based Chip EntersVolume Production

New series of low input current optocouplersfrom Vishay offering multiple CTR ranges nowavailable from TTI, Inc

Alliance Memory today intro-duced a new line of high-speedCMOS double data rate syn-chronous DRAMs (DDR1SDRAM) with densities of 64 Mb(AS4C4M16D1), 128 Mb(AS4C8M16D1), 256 Mb(AS4C16M16D1), and 512 Mb(AS4C32M16D1). The devices released today pro-vide reliable drop-in, pin-for-pin-compatible replacements fora number of similar solutions inmedical, communications, indus-trial, and consumer productsrequiring high memory band-width, and they are particularlywell-suited to high-performancePC applications. Internally con-figured as four banks of 1M, 2M,4M, or 8M word x 16 bits with asynchronous interface, the DDR1

SDRAMs operate from a single+2.5-V (± 0.2 V) power supplyand are lead (Pb)- and halogen-free. The AS4C4M16D1,

AS4C8M16D1, AS4C16M16D1,and AS4C32M16D1 feature afast clock rate of 200 MHz, acommercial temperature rangeof 0°C to 70°C, and are offeredin the 66-pin TSOP II packagewith a 0.65-mm pin pitch. ALLIANCE MEMORYwww.alliancememory.com

A new series of unidirectionalTVS diodes from Lilttelfuse isnow available from TTI, Inc., theworld’s leading specialist distri -butor of passive, connector,electromechanical and discretecomponents. The SD05 Series450W of discrete unidirectionalTVS diodes is designed toreplace multilayer varistors(MLVs) in electronic equipmentfor low speed and DCapplications and protectssensitive equipment fromdamage due to ESD andother transient events.Littelfuse SD05 Series TVSdiodes safely cope withrepetitive ESD events at±30kV (contact discharge,IEC 61000-4-2) withoutperformance degradationand dissipate 30A of8/20μs induced surge cur-rent (IEC61000-4-5) with verylow clamping voltages. Suchrobust surge and enhanced ESDprotection guards against theeffects of events such as lightningstrikes, helping extend equip-ment life and system up time.Low dynamic resistance of 0.5Ω

(SD05) and 0.6Ω (SD05C) pro-tects sensitive electronics byreducing clamping voltage by upto 50% compared to competi-tive technologies. Leakagecurrent is a maximum of 1μA, adecrease of up to 97% com-pared to older technologies,which helps extend battery life.In SOD-323 packages, theLittelfuse SD05 Series fits the

same PCB footprint as exisiting0805 MLVs without requiring aPCB or solder pad change, socan be used without any prod-uct design adjustments beingnecessary. TTIwww.ttieurope.com

Littelfuse SD05 Series discrete unidirectionalTVS diodes - now from TTI Inc

Alliance Memory Introduces New High-Speed CMOSDouble Data Rate (DDR1) Synchronous DRAMs With64-Mb, 128-Mb, 256-Mb, and 512-Mb Densities in66-Pin TSOP II Packages




The converters of the new non-insulating 08D series from YDS(Distributor: MSC) handle inputvoltages up to 72V and reachedeven at output voltages of 3.3,5.0 and 6.5V an efficiencygreater than 80% and morethan 90%. The minimuminput voltage at these outputvoltages is 9V. This results inthe extremely wide inputvoltage range of 8:1. The08D series also includes mod-els with output voltages of 9,12, 15 and 24V and evenhigher efficiency. Continuousshort circuit protection withautomatic recovery after thefault is removed and a MTBF rat-ing of 1,242 × 103 hours (at71°C using MIL-HDBK217F)make the 08D series DC/DC con-verters the perfect solution evenfor critical applications. All series08D models feature an outputvoltage tolerance of ±2%, a loadregulation of ±0.4% (from 10%

to 100% load), output rippleand noise of 60mVss maximumand a switching frequency of500kHz. With dimensions of just11.8 mm × 8.5 mm × 17.5 mm

the new 08D series is pin-com-patible with the popular 78XXlinear regulators. The 08D seriesDC/DC converters deliver anoutput current of 0.5A with nat-ural convection cooling at ambi-ent temperatures up to +71°C.

MSC VERTRIEBS www.msc-ge.com

CUI Inc launched their smallestac-dc power supplies yet withthe release of the PBK ultra-com-pact SIP series. Available in 1 W, 3W, and 5 W families, the modulesmeasure as small as 1.38 × 0.43 ×0.94 in. (35 × 11 × 24 mm), occu-pying less pcb real-estate thanother conventional ac-dc powersupplies, thus allowing designersto fully maximize space whereon-board ac-dc power conver-sion is required.The high density PBK series isoffered in single output voltagesof 3.3, 5, 9, 12, 15, and 24 Vdcand can operate at ac input volt-ages between 85~264 Vac. Forhigh voltage dc-dc applications,the modules also provide a dcinput range spanning 100~400Vdc. All models are designed for3,000 Vac/1 Min input to outputisolation, have over current andcontinuous short circuit protec-tion, and can function at a wideoperating range from -40 to+85°C (1W and 3W) and -25 to

+85°C (5W) for use in challeng-ing environments. The SIP pack-aged PBK series meets interna-tionally recognized UL 60950-1/EN 60950-1 standards andcomplies with EN55022 Class Blimits for conducted and radiated

EMC with few additional externalcomponents. They are ideallysuited for a range of applicationsincluding automation systems,industrial systems, and telecom-munication equipment. The PBKSeries is available through distri-bution starting at $9.00 for 100pieces. Please contact CUI forOEM pricing.CUIwww.cui.com

Miniature SIP Ac-Dc Power SuppliesMaximize Board Space

Pin-compatible with the popular 78XX linearregulators08D Series - DC/DC converters from YDS Murata announced the DMR20-

1-ACV “nanometer” self-pow-ered four-digit bright LED volt-meter. This line powered ACvoltmeter can measure the trueRMS value of its input from 85 to264 VAC to within 0.1 V resolu-tion. Designed to becompletely self-con-tained, the low costtwo-wire voltmeterrequires no addi-tional componentsor connections apartfrom the AC voltageit is measuring. It iscapable of accurate-ly measuring quasi-sine AC source suchas modified, modified 2-stepand modified 3-step sine wave inaddition to conventional sine, tri-angle and square wave inputs.The voltmeter fits an industrystandard “oiltight” 30 and 30.5

mm / 1.2 inch round panelcutout. The 7.6 mm / 0.3 inchfour-digit LED display is housedin a rugged round polycarbon-ate case that provides protectionagainst dust, moisture, vibrationand shock. It is supplied with an

EPDM rubber gasket and plastichex nut that aid protection toIP67 / NEMA6 specification forwater ingress.MURATAwww.murata.eu

Murata announced the NCS12series of compact, encapsulated,metal-cased 12 Watt DC-DCconverters developed by MurataPower Solutions.Accommodating a 4:1 wideinput voltage range, these singleand dual output isolated con-verters are available in 9 – 36VDC or 18 – 75 VDC input volt-age models. Single output mod-els cater for thepopular nominaloutput voltagesfrom 3.3 to 15VDC. Duals areavailable witheither ±5, ±12 or±15 VDC outputs.An undervoltagelockout featureensures that theconverter onlyoperates with avalid input voltage. Load regula-tion is typically within the rangeof 0.05 to 1% and is modeldependent. Line regulation istypically 0.1% and the converterhas a fast start-up time of 9 ms.Other protection and safety fea-tures of the NCS12 include cur-

rent fold back in overload condi-tions and thermal shutdownshould the case temperatureexceed 120°C. The normal oper-ating temperature range is from -40 to +85°C.The NCS12 converter measuresjust 20 × 32 × 10.75 mm anduses an industry standard pin-out that is also compatible withearlier DC/DC converter devices

available from Murata PowerSolutions. Certification to theindustry safety standardIEC/UL60950 for commercialand IT equipment, is pending.

MURATAwww.murata.eu

12 Watt DC-DC converter offers 4:1 wide inputrange and tight line regulation

True RMS self-powered AC voltmeter fits30.5 mm / 1.20 inch panel cutout


EP&Dee no 8 - September, 2013

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