EP&Dee no 7

EP&DeeDESIGN & MANUFACTURING JULY, 2014 ISSUE NO. 7, VOL. 12

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

THE EAST EUROPEAN RESOURCEFOR EMBEDDED APPLICATIONS

EP&Dee | July, 2014 | www.epd-ee.eu2

Table of Contents

JULY 2014

EUROSTANDARD PRESS 2000

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EP&Dee is offering its readers the chance to win an LCDExplorer Development Board (#DM240314) fromMicrochip. The LCD Explorer Development Board sup-ports Microchip’s 100-pin Microcontrollers with x8 com-mon Segment LCD Drivers. This board provides an idealplatform for a customer to evaluate a MCU with a x8Common LCD Driver on a 38 segment × 8 common LCDdisplay. PICtail™ Plus connections allow a customer to eval-uate the selected MCU in a complex system by addingMicrochip’s PICtail Plus daughter boards.

The on-board potentiometer, temperature sensor, 4 buttons,mTouch key and PICtail Plus expansion connectors provide aversatile platform for low power system development.The kit contains the LCD Explorer Development Board, a100-pin PIC24FJ128GA310 LCD PIM and example soft-ware programmed on PIM

Features• 96 Segment 37 Segment × 8 Common LCD Glass• 4 Buttons and 1 mTouch Capacitive Button• Analogue potentiometer and temperature sensor• Power input from 9V power supply, battery or USB

power source• Separate Vbat battery supply• RJ11 and 6 pin PICkit™ 3 programming and debug

connectors

Win a Microchip LCD Explorer

Development Board!

For your chance to win an LCD Explorer DevelopmentBoard from Microchip, please visit:

http://www.microchip-comps.com/epdee-lcdexplorerand enter your details in the entry form.

DESIGN FEATURES

5 Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation KitFeature-rich, affordable platform enables OEMs to leverage SmartFusion2’s lowest power consumption in its class, high reliability capabilities and best-in-class security to build highly differentiated products with significant time to market advantage.

6 Microchip Extends Spotify® Connect Support in New JukeBlox® Platform Release

8 First 8Gb DDR3 components and 16GB unbuffered DIMMs & SO-DIMMs by I'M Intelligent Memory

10 The RZ/A as used in an application exampleThe key target market for the RZ/A device is the Human Machine Interface market, for driving medium to large TFT panels. The RZ/A family is an ARM cortex A9 based embedded MPU solution that brings many advantages to the HMI application space. The article will be a discussion of the requirements of such an application space as well as of how the RZ/A meets these requirements and offers system level advantages to the design engineering community.

16 Aurocon COMPEC always offers new products

20 EM Microelectronic Releases COiN, a Complete Bluetooth® Smart BeaconCOiN Offers Longest Lasting, Longest Range, Most Secure & Flexible Bluetooth® Beacon

26 Contrinex presents a world first: M12 size, full-metal sensors with an extremely long operating distance of 15 mmNo fewer than four new, full-metal versions (PNP, NPN, NO, NC) in size M12 offer the unique benefit of a 15 mm operating distance. In this way, Contrinex adds an innovative technology to its Full Inox Extremerange as a solution for customers who need robust sensors with maximum operating distances.

36 EcoCWave by Dürr Ecoclean:Superior quality, cost-efficiency and process reliability in aqueous parts cleaning

38 parts2clean 2014

PRODUCT NEWS

Embedded Systems(p 4 - 9)(p 14, 18, 19)(p 21 - 25)

Sensors(p 27, 29)

Lighting Solutions /Display(p 28)

Active Components(p 30 - 35)

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Save up to 91% Power and upto 50% Space with Industry’s

Fastest 20-Bit SAR ADCMaxim Integrated’s versatile SAR ADCintegrates internal reference buffers anddesigners now get a wider dynamicrange with no trade-off in precision,speed, or power.Engineers can achieve the industry’s highestresolution and fastest sampling rate at thelowest power with the MAX11905, a 20-bit,1.6Msps successive approximation register(SAR) analog-to-digital converter (ADC)from Maxim Integrated Products, Inc.

Typically, when engineers require high-preci-sion data conversion, they turn to a delta-sigma ADC. However, to produce high preci-sion and wide dynamic range, those ADCsmust consume at least 100mW of power. Incontrast, the MAX11905 SAR ADC consumesonly 9mW – a 91% power savings. With thispower savings comes very high (20-bit) preci-sion and the fastest sampling (1.6Msps) rateavailable. The MAX11905 also integratesinternal reference buffers, which reduces costand time to market, and saves up to 50% spacecompared to competitive discrete solutions.With this versatility, the MAX11905 is ideal fora wide range of applications, including processcontrol, automatic test equipment, medicalinstrumentation, and battery-powered devices.Key Advantages• High speed: the MAX11905 enables1.6Msps throughout with no latency and set-tling time limitation. • High performance: the ADC achieves98.3dB signal-to-noise ratio (SNR) and -123dBTHD*); improves static and dynamic perform-ance; guarantees monotonic function; andprovides best-in-class power consumption.• Versatility: the SAR ADC delivers high 20-bit resolution with no missing codes, at1.6Msps of speed, at 9mW of power, enablingflexibility in designs without compromises.• Simplified designs: the MAX11905 inte-grates internal reference buffers, reducingdesign time and cost.MAXIM INTEGRATED www.maximintegrated.com

Altera Corporation announced thedemonstration of its FPGA technologybased on Intel’s 14 nm Tri-Gate process.The 14 nm-based FPGA test chips incor-

porate key intellectual property (IP) com-ponents – transceivers, mixed-signal IPand digital logic – used in Stratix® 10FPGAs and SoCs. Altera and Intel collab-orated on the development of the indus-try’s first FPGA-based devices leveragingIntel’s world-class process technologyand Altera’s industry-leading program-mable logic technology.Altera leverages a comprehensive testchip program to de-risk the rollout of allits next-generation products by validat-ing how Altera IP performs using innova-tive process improvements and circuitdesign techniques prior to final producttape out. Through the use of multiple 14-nm devices, Altera continues to see verypositive results in the high-speed trans-ceiver circuitry, digital logic and hard-IPblocks that will be used in Stratix 10FPGAs and SoCs. Intel offers a true dieshrink with its second-generation 14 nmTri-Gate process, relative to alternativeFinFET technologies. As a result, Altera will

deliver unmatched performance, power,density and cost advantages with its next-generation FPGAs and SoCs.Leveraging Intel’s 14 nm Tri-Gate process

and an enhanced high-performancecore fabric architecture, Stratix 10FPGAs and SoCs are designed toenable the most advanced, highestperformance applications in thecommunications, military, broadcastand compute and storage markets,while slashing system power. Stratix10 FPGAs and SoCs deliver 2X thecore performance of current high-end FPGAs with industry’s firstGigahertz-class FPGA featuring coreoperating performance up to 1

GHz. For high-performance systems thathave the most strict power budgets, Stratix10 devices allow customers to achieve upto a 70 percent reduction in power con-sumption. Stratix 10 FPGAs and SoCs alsoprovide the industry’s highest levels of sys-tem integration, which include:• The highest density monolithic devicewith greater than four million logic ele-ments (LEs)• Over 10 TeraFLOPs of single-precision,hardened floating point DSP performance• More than 4X serial transceiver band-width compared to previous generationFPGAs, including 28-Gbps backplanecapable transceivers and a path to 56Gbps transceivers• A 3rd-generation high-performance,quad-core 64-bit ARM Cortex-A53processor system• Multi-die solutions capable of integratingDRAM, SRAM, ASICs, processors and ana-log components in a single package.ALTERA www.altera.com

INDUSTRY NEWS EMBEDDED SYSTEMS

Altera Achieves Industry Milestone: Demonstrates FPGATechnology Based on Intel 14 nm Tri-Gate Process14 nm FPGA Test Chips Confirms the Performance, Power andDensity Advantage Altera Receives Using Industry’s MostAdvanced Process Technology

Forward Looking StatementThis press release contains a forward-looking statement regarding Stratix 10 devicesthat is made pursuant to the safe harbor provisions of the Private Securities LitigationReform Act of 1995. Investors are cautioned that forward-looking statements involverisks and uncertainty that can cause actual results to differ from those currently antic-ipated, including without limitation statements regarding product development andavailability, the potential risk in introducing a new process node, anticipated per-formance of future products, Altera’s and third parties’ development technology andmanufacturing capabilities as well as other risks discussed in Altera’s Securities andExchange Commission filings, copies of which are posted on Altera’s website and areotherwise available from the company without charge.

www.epd-ee.eu | July, 2014 | EP&Dee 5

Microsemi Corporation, a lead-ing provider of semiconductorsolutions differentiated bypower, security, reliability andperformance, announced theavailability of the company’s newleading-edge SmartFusion®2SoC FPGA Evaluation Kit.

The new SmartFusion2Evaluation Kit is an easy-to-use,feature-rich, affordable platformdesigned to enable designers toquickly and easily accelerateevaluation or prototype theirapplication. Utilizing Microsemi’smainstream SmartFusion2 FPGAsenables original equipmentmanufacturers (OEMs) to lever-age the device’s lowest powerconsumption in its class, high reli-ability capabilities and best-in-class security technology tobuild highly differentiated prod-ucts that help them gain a signif-icant time to market advantage.A prime example is that theSmartFusion2 Evaluation Kit allows for simplified develop-ment of transceiver I/O-based

FPGA designs necessary in today’sPCI Express (PCIe) and GigabitEthernet-based systems. For fasterevaluation and prototyping,Microsemi’s leading-edge evalua-tion board is small form-factorPCIe compliant, which can beused on any desktop PC or laptop

with a PCIe slot. According tomarket research firm Infonetics,the carrier Ethernet market willgrow to approximately $39 billionin 2017.The kit offers a comprehensiveset of features that include PCIe,Gigabit Ethernet, full-duplexSERDES SMA pairs, DDR memo-ry, SPI Flash, USB On-The-Goand several expansion interfacesthat create the needed flexibilityfor a wide range of applicationdevelopment. With purchase ofthe evaluation kit, developersalso have access to Microsemi’sfull array of industry leadingdevelopment resources such asreference designs and the abilityto launch example applicationdemonstrations.

Microsemi Enables OEMs to ExpeditePrototyping and Application Development with its Comprehensive New SmartFusion2 SoCFPGA Evaluation Kit

Embedded Office, a specialist company for embedded sys-tems that specialises in safety-critical applications, hasextended the range of its Cert-Kits and is now offering forμC/OS-II a component pre-certified on the 16-bit microcon-troller C167 from Infineon, which supports manufacturers ofsafety-critical systems in the standard-compliant develop-ment according to DIN EN50128 SIL-4. The C167 is aproven microcontroller, which is used very frequently inindustry. The C167 is typically used in the automotive sec-tor, in medical engineering and in industry, for example inrailway applications. By using the real-time kernel μC/OS-II as a pre-certified com-ponent, this product facilitates the development of safety-critical applications and considerably reduces the certifica-tion process. The Cert-Kit comprises all the elementsrequired for creating an executable application. Theseinclude the certified source code, various software manualssuch as safety, target integration, user, reference and systemmanual. The Cert-Kit also contains validation software(including reference board support package) and the TÜVcertificate pertaining to the type approval of the pre-certi-fied software component. Upon request, the test environ-ment can also be made available to customers. The Cert-Kitprovides flexibility so Embedded Office can adapt the certi-fication of μC/OS-II with minimum effort to other CPUs anddevelopment environments. In addition to the standardEN50128, it is also suitable for the development of safety-critical devices according to the standards IEC62304 (medical sector) and IEC61508 (industrial applications).EMBEDDED OFFICE www.embedded-office.de

Cert-Kit from Embedded Officesimplifies development of safety-critical railway applications with

C167 microcontroller


MICROSEMI CORPORATION www.microsemi.com

Feature-rich, affordable platform enables OEMs toleverage SmartFusion2’s lowest power consumptionin its class, high reliability capabilities and best-in-class security to build highly differentiated productswith significant time to market advantage.


Renesas Electronics Europe:TES Electronic Solutions’Guiliani Graphical User

Interface Software NowSupports Renesas’ RZ/A1

Microprocessors (MPU)Renesas Electronics Europe, a premierprovider of advanced semiconductor solu-tions, announced the availability of Guilianigraphical user interface software from TESElectronic Solutions for the RZ/A1 “RenesasStarter Kit” (RSK) development suite.

Renesas’ RZ/A1 microprocessor (MPU) hasbeen designed to give an optimal cost / per-formance balance for Human MachineInterface (HMI) applications. In contrast to astandard microprocessor architecture, theRZ/A1 Group incorporates up to 10MB ofembedded SRAM, eliminating the need forexternal RAM. It can also give a significantperformance boost compared with devicesneeding to run code over an external businterface. This achieves a high performance -and with no external RAM required, systemcost and complexity can be reduced dramat-ically. Of course, hardware requires opti-mised software too. Supported by TESElectronic Solutions’ Guiliani HMI software,the RZ/A1 provides a complete and verycost-effective solution.

Guiliani is a platform independent HMIframework designed to meet todays’ userexpectations for smartphone-like HMIs onhighly cost-driven embedded systems. BeingOS- and CPU-agnostic and without requiringan expensive hardware GPU, it covers a widerange of cost efficient MCUs and MPUs and isan ideal complement to Renesas’ RZ/A series.

Guiliani is delivered with a customisable andextensible set of modern widgets and fea-tures like carousels, wheels, gauges, dropboxes, animations, transition effects, multi-language support and skinning. Applying itsmodern graphics processing features, includ-ing sub-pixel accurate rendering, anti-alias-ing, scaling, filtering and blending in combi-nation with smart redraw and caching mech-anisms, provides an eye-catching and high-performance visual experience. Guiliani’s PCdrag and drop editor and simulator supportrapid HMI design and prototyping, resultingin fast development cycles.

TES ELECTRONIC SOLUTIONS www.tes-dst.comRENESAS ELECTRONICS www.renesas.eu


Microchip Technology Inc., announced anew release of Spotify® Connect in thestandard Microchip JukeBlox® Platform.This release extends support to morethan 8 million audio products based onMicrochip’s network audio processorsand includes a number of key improve-ments on the initial release. Audio brandscan easily add Spotify Connect to existingproducts through firmware upgrades andnew designs based on all of Microchip’sCX870 Wi-Fi® modules and DM860Ethernet processor. To speed productand firmware availability to consumers,Microchip’s APT Lab is the first to offerpre-certification services to Microchipcustomers using Spotify Connect.Spotify Connect does not require themobile device to continuously stream con-tent to a wireless speaker or AV receiver.The key benefit of Spotify Connect is thatonce a track has been selected, the audiostream is delivered directly from Spotify’sservers to the wireless speaker using thelocal network. This frees the mobile devicefor use during music playback which greatly

reduces battery depletion and allows themobile device to move anywhere in thenetwork without interrupting music play-back. Audio devices powered byMicrochip’s JukeBlox platform, such as wire-less speakers, AV receivers, Internet radios,home heatre systems, wireless speakersand portable music player docking sta-tions, will be part of the Spotify Connectexperience. Spotify Connect is an award-winning digital music service that provideson-demand access to more than 20 million

tracks. Spotify makes it easier than ever todiscover, manage and share music. SpotifyPremium users can control and play theirmusic through their phone, tablet andaudio devices simply and effortlessly, at thetouch of a button. Spotify Connect is avail-able in 28 markets including USA, UK,Sweden, Finland, Norway, Denmark,France, Switzerland, Germany, Austria,Belgium, The Netherlands, Spain, Australia,New Zealand, Ireland, Luxembourg, Italy,Portugal, Singapore, Hong Kong, Malaysia,Poland, Estonia, Latvia, Lithuania, Icelandand Mexico, with more than 24 millionactive users, and over 6 million payingsubscribers.“We are very pleased to be working withSpotify and adding a leading music stream-ing service,” said Sumit Mitra, vice presi-dent of Microchip’s Wireless ProductsGroup. “Microchip’s latest JukeBlox plat-form release allows audio brands to addSpotify Connect into previously sold audioproducts with just a firmware upgrade or tonew designs based on the DM8xx family ofWi-Fi and Ethernet processors.”

“Spotify is committed to delivering the indus-try’s best home listening experience withSpotify Connect. Partnering with Microchip,one of the leading providers in the industry,allows us to grow our base of partners evenfurther,” said Sten Garmark, vice presidentof Spotify’s Platforms. “We’re especiallypleased to be able to deliver Connect todevices that are already in consumer’s homesusing firmware upgrades.” MICROCHIP TECHNOLOGYwww.microchip.com/get/NBWE

Microchip Extends Spotify® Connect Support in NewJukeBlox® Platform Release


Silicon Labs introduced a family ofdigital isolators offering the high-est channel count, performance,reliability and data rates for cost-sensitive consumer electronicsapplications requiring functionalisolation of up to 1 kV. Based onSilicon Labs’ patented CMOS-based digital isolation technology,the new Si80xx family provides asuperior alternative to optocou-plers for washers, dryers, foodmixers, vacuum cleaners and otherhousehold appliances, as well astest and measurement equipmentrequiring functional isolation.

Used for more than 40 years,optocouplers are inherently lim-ited by an antiquated LED-basedtechnology resulting in signifi-cant output variations over inputcurrent, temperature and age.These variations reduce theoperating performance of opto-couplers over their lifetime,causing increased design com-plexity and reduced productreliability. Silicon Labs’ Si80xxdigital isolators overcome theselimitations through capacitiveisolation based on mainstreamCMOS process technology.Higher reliability and longerdevice lifetimes enable manufac-turers to support longer prod-uct warranties and reduce costsassociated with repair or

replacement. Less variability,especially in the input turn-oncurrent, simplifies system design.Developers no longer need toanticipate aging effects whenthey switch from using optocou-plers to Si80xx digital isolators intheir product designs. The oper-ating parameters of the Si80xxdigital isolators remain stableacross wide temperature rangesand throughout their long serv-ice life for ease of system designand highly uniform performancein consumer applications. The Si80xx family offers a superi-

or functional isolation solutionthan other digital isolators forapplications that require multi-ple isolated signal channels.Available in a choice of 3- to 6-channel configurations, theSi80xx family is the industry’swidest channel count series ofunidirectional isolators support-ing up to 1 kV isolation ratings.The Si80xx family’s industry-leading isolation channel countalso helps simplify timing andisolation challenges in systemswith wide digital buses byenabling developers to minimizethe number of separate isolators,thereby reducing bill of materi-als (BOM) cost and board space.SILICON LABS www.silabs.com/isolation

Silicon Labs Delivers Best-in-Class DigitalIsolators for Consumer Electronics Market


Captec, manufacturers of ruggedised industrial computersand mobile devices, have developed a new Mobile PickingSolution targeted to optimise retailers’ order fulfilmentrequirements. Combining a customisable trolley and toteswith a mounted tablet, extended battery and 1D/2D barcodescanner, the MPS-761 is fully integrated and ready for deploy-ment in any order picking or internet fulfilment setting.

A 9.7” tablet with capacitive touchscreen simplifies andimproves the order picking process by not only providing alarge graphical and intuitive display for ease of use, but alsoby allowing virtually hands free operation. Enhancing orderfulfilment times and maintaining high levels of accuracyempowers businesses with greater cost-effectiveness andreduces wrong orders, thereby providing a better service totheir customers.Captec offer this solution fully integrated, taking the costlyand time consuming work of testing and assembling theunits away from retailers, while also simplifying supply chainmanagement.The trolley itself is fully customisable, ensuring that it is bestsuited to the unique requirements of where it will be used,allowing it to be designed according to aisle sizes, productrequirements and store layouts, as well as any other factorsthat allow the order fulfilment system to flow smoothly.Captec’s solution ensures that order fulfilment can not onlyflow effectively, but for prolonged periods of time. With anextended battery allowing up to 26 hours continuous use,the Mobile Picking Solution can be used for a full day andeven through the night before needing a charge, especiallyuseful in stores that operate on 24 hour days.Find out more about the MPS-761 Mobile Picking Solutiontoday. Please visit www.captec-group.com/product-category/mobile-picking-solutions/CAPTEC www.captec-group.com

Revealing a New and MoreEfficient Approach to

Mobile Picking

New Si80xx Isolators Outperform Optocouplers forHousehold Appliance Applications Requiring Multi-Channel 1 kV Functional Isolation



I'M Intelligent Memory, aHong Kong based fablessDRAM manufacturer,announces availability ofthe world's first 8 Gigabit(Gb) DDR3 componentswith a single chip-select,doubling the amount ofmemory per chip com-pared to other DDR3DRAM devices on the market. Based on thesenew 8Gb components,I'M is also in-troducingthe first 16 Gigabyte(GB) DDR3 UDIMM andSO-DIMM memorymodules with optionalECC error-correction.

The JEDEC specification JESD79-3 hasalways allowed an 8Gb density forDDR3 memory devices. While mostDRAM manufactures are waiting for a2x nm process to fit such high memory ca-pacity into a single DRAM IC pack-age, I'M has developed it's own a revo-lutionary way to manufacture 8GbDDR3 components with single chip-select utilizing existing 30nm manufacturingtechnologies.

The I'M 8Gb components are 100% com-patible with the JEDEC standard pinout,timing and row/column/bank addressing,providing the simplest path to higher den-sity DDR3 upgrades. These devices allowfor a new level of memory capacity withoutaltering existing board-layouts or designs.

Orderable devices include a x8 (1G×8) con-figuration in FBGA 78 ball package, a x16(512M×16) type in FBGA 96 ball package aswell as a x32 (256Mx32) configuration in

FBGA 136 ball package. In addition, I'Moffers DDR3L low-voltage (1.35V) versionsof these devices. The products are availablein commercial and industrial temperatureranges.

Based on their new 8Gb device, I'M releasesthe very first 16GB DDR3 240 Pinunbuffered DIMMs (UDIMMs) and 204 PinSO-DIMMs to the market. These new high-capacity memory modules are also availablewith a 72 Bit width for ECC error correction.

The 8Gb components and 16GB moduleshave been verified to be compatible withprocessors and microcontrollers from AMD,Cavium, Freescale, Tilera and many others.

Intel currently supports 8Gb componentsand 16GB modules only on their AtomC2000 series (Codename 'Avoton') andAtom E3800 (Baytrail-I) processor series.New BIOS versions for these plat-forms arerequired to use the memory and are avail-able now.

For most standard Intel processors that areused in desktop PC's, laptops or servers,Intel is not yet supporting the new highcapacity memories. According to Intel, “it isnot POR” (-> Plan Of Record) for them toanalyze the possibility to support them,unless they can see a demand from the

market for these new memory products.Notebook, PC and motherboard manufac-turers such as HP, Lenovo, Apple, Dell orothers may contact their Intel field repre-sentative to push and request a change ofIntel's POR to support the new memorythrough future BIOS/ MRC updates. End-Customer may contact their board-manu-facturers customer-support to ask for com-patibility of the memories. I'M is also work-ing with Intel to address this gap.

ASUS confirmed that it is now possible toupgrade their X79-DELUXE, RAMPAGE IVBLACK EDITION and other ASUS X79 plat-form motherboards with 8 pieces of IM16GB DDR3 modules to reach a total of

128GB memory utilizing their newestown BIOS/MRC. Most Intel LGA-2011-socket CPUs like Sandybridge E orIvybridge E can be used on these ASUSX79 motherboards.

By offering their own special BIOS andMemory Reference Code to supportthe new memory on Intel CPU's, ASUSshows their engi-neering-expertise forhigh-end products.

Motherboard manufacturers such asASRock, Supermicro, AIC, Portwell and others have verified and approved theIM 16GB DDR3 memory modules formany motherboards based on AMD,Tilera, Intel's C2000 'Avoton' series andother processors already.

The German company RauschNetzwerktechnik announced their

Intel Avoton-based 'Tormenta MegacoreBlade-System' to be up-gradable to animpressive 12,800 GB of RAM withIntelligent Memory 16GB ECC SO-DIMMs.

With the new I'M Intelligent Memory 8GbDDR3 chips and high density DDR3 mod-ules, I'M sees potential markets in embed-ded/industrial, networking and telecommu-nication applications, as well as PC, laptops,servers and microservers, allowing to reachpreviously unattainable memory capacities.

I'M INTELLIGENT MEMORYwww.intelligentmemory.com

First 8Gb DDR3 components and 16GB unbufferedDIMMs & SO-DIMMs by I'M Intelligent Memory

The new Ericsson 3E series BMR464-50A is a third-genera-tion digital point-of-load (POL) regulator that featuresDynamic Loop Compensation (DLC) and also extends out-put current up by 25% to 50A from the 40A offered by theBMR464-40A, yet it comes in a fully compatible footprint.The product also features a full set of PMBus commandsenabling systems architects to fully monitor and dynamicallycontrol the energy delivered to strategic components, suchas processors, FPGAs and ASICs, down to a very low andhighly economical level.

Embedding the latest Dynamic Loop Compensation tech-nology, the BMR464-50A runs the DLC algorithm as defaultfollowing the enabling of the output. However, three moresettings are also available via the PMBus for systems archi-tects to choose the most appropriate method for the appli-cation with the DLC algorithm run every second or everyminute or simply disabled. In addition to standard methods,designers can also use the Loop Compensation Tool fea-tured in the latest Ericsson Power Designer software to settheir own loop compensation profile to match the require-ments of specific applications.Patrick Le Fèvre, Marketing and Communication Director,Ericsson Power Modules, says: “This new module is an extensionto the third generation of Ericsson 3E POL regulators, which haverapidly became the reference digital point-of-load modules inthe market. Working closely with customers in its development,the BMR464-50A meets the demands of volume markets byoffering a higher current output and, very importantly, embed-ding Dynamic Loop Compensation. While this new moduleenables additional flexibility and simplicity, it also means that sys-tem architects retain the ability to control parameters to matchspecific applications.”

ERICSSON POWER MODULES www.ericsson.com/powermodules

Ericsson embeds dynamic loopcompensation and increasescurrent output to 50A in new

digital point-of-load regulator

Microchip announces the expan-sion of its eXtreme Low Power(XLP) PIC® microcontrollers(MCUs) with the PIC24F “GB2”family. This new family features anintegrated hardware crypto

engine, a Random NumberGenerator (RNG) and One-Time-Programmable (OTP) key storagefor protecting data in embeddedapplications. The PIC24F “GB2”devices offer up to 128 KB Flashand 8 KB RAM in small 28- or 44-pin packages, for battery-operat-ed or portable applications suchas “Internet of Things” (IoT) sen-sor nodes, access control systemsand door locks.Several security features areintegrated into the PIC24F “GB2”family, to protect embeddeddata. The fully featured hard-ware crypto engine, supportingthe AES, DES and 3DES stan-dards, reduces software over-head, lowers power consump-tion and enables faster through-

put. This is another example ofMicrochip’s Core IndependentPeripherals, which can run withno CPU supervision. Also, aRandom Number Generator cre-ates random keys for data

encryption, decryption andauthentication, to provide ahigher level of security. For addi-tional protection, the One-Time-Programmable (OTP) key stor-age prevents the encryption keyfrom being read or overwritten.These security features increasethe integrity of embedded datawithout sacrificing power con-sumption. With XLP technology,the “GB2” family achieves 180μA/MHz Run currents and 18 nASleep currents, for very long bat-tery life in portable applications.For connectivity, the “GB2” fami-ly integrates USB for device orhost connections, as well as aUART with ISO7816 support,which is helpful for smartcardapplications.

Microchip expands XLP low-power PIC® microcontroller portfolio with integrated hardware encryption engine

MICROCHIP TECHNOLOGYwww.microchip.com/get/GNUT

Key Facts:• New PIC24F “GB2” MCUs enable secure data transfer and storage

in portable embedded applications• On-chip hardware crypto engine, random number generator and

one-time-programmable key storage supports enhanced security• eXtreme Low Power (XLP) technology minimises power

consumption for longer battery life • Compatible with Microchip’s embedded wireless solutions to enable

low-power wireless connectivity for Internet of Things applications



Ericsson / Studio Phos


DESIGN EMBEDDED SYSTEMS

In June 2013, Renesas released its newest plat-form. The RZ/A family is aimed firmly at theHuman Machine Interface market, for drivingmedium to large TFT panels. This is a marketexpanding at an enormous pace. BeforeApple took the world by storm, there was theconstant dismissive discussion in technical cir-cles about “who would want to have a colour

screen on their telephone?” but we were allproved wrong. Apparently, we all do want acolour screen on our phones. It is not justphones either! The number of coffeemachines, refrigerators, vending machines andthe likes that are fitted with a TFT panel is setto rise significantly over the next few years. Inoticed with excitement that in a number of

shops recently the piece of plastic upon whicha receipt is normally placed such that you cansign it, has now been replaced by a 7-inchTFT display showing advertising for productsavailable in the store. The rise of “bathroomadvertising” from companies across Europeand the world shows that soon there willreally be no escape from the TFT panel.

The RZ/A as usedin an application exampleThe key target market for the RZ/A device is the Human Machine Interface market,for driving medium to large TFT panels. The RZ/A family is an ARM cortex A9 basedembedded MPU solution that brings many advantages to the HMI application space.The article will be a discussion of the requirements of such an application space as wellas of how the RZ/A meets these requirements and offers system level advantages to thedesign engineering community. The RZ/A features up to 10MB of embedded SRAMon chip, which makes it the largest embedded RAM in the market and the article willshow to make best use of this embedded RAM to optimise both system cost andperformance of your HMI system.

Author: Robert Kalman, Product Marketing Manager Industrial Communications Business GroupRenesas Electronics Europe GmbH



So what do you needfor your application?Let’s start by looking at the heart of theproblem. What do you actually need inorder to drive a TFT screen? Most TFT pan-

els today use a digital RGB interface,whether that be RGB888 or RGB565. TheRGB value is a standard whereby the coloursred, green and blue of each pixel are repre-sented by the corresponding number ofbits. So for 888 each is given a full 8 bits ofdata (giving 24 bits per pixel), whereas in565 the red and blue are represented by 5

bits and the green by 6 bits (giving 16 bitsper pixel). Alternatively, instead of a stan-dard digital interface a screen could beusing an LVDS connector, as is increasinglybecoming the standard with larger screens.

As such, the RGB signals are transferred overa differential signal, but the format of thedata is still the same. So to start with, youneed a device that supports the generationof an RGB signal and / or an LVDS interface.Second to that, the RGB data has to comefrom a frame buffer, which is typically storedin RAM. This frame buffer is a bitmap image

stored in the desired format. Thus, a screensize of WVGA for example (which is 480 ×800) will need for an RGB888 image justover 1MB of RAM to store the image (480 ×800 × 24 bits = 1.125MB).

In addition to this frame buffer containing thecurrent picture being displayed on thescreen, a typical application will have a “backbuffer” that contains the next picture to bedriven to the screen. This way, the CPU canmanipulate the next picture without the userseeing a half-manipulated picture flickeringon the screen before the CPU is finished.

Memory use for WVGA screen


This system of double buffering is very com-mon and gives an overall higher quality ofHMI, but also means that the WVGA screenneeds a further 1.125MB of RAM to storethe buffer.The RAM story is sadly not finished, howev-er. In a typical HMI application it is not alwaysnecessary to manipulate the whole screen.For example, if an icon or button is pressed, itmight animate, glow, rotate or somehow reactprior to the action being taken.

In this case, what an HMI designer would dowould be to define a different layer of thepicture. There would be a background layerthat would be unchanged and the icon orbutton would be a foreground layer, whichwould then be animated. However, this obviously also needs addi-tional RAM, not a full screen but “some”more. It depends on the size of the image,but with a 200 × 200 pixel button we wouldneed an additional 100k of RAM. What isalso required here is the ability to blend all

these different layers with one another, andperhaps apply a level of transparency tosome of those pictures. This can be done insoftware if the CPU is fast enough, or inhardware if it is available.So, to complete the RAM requirements story,a reasonable HMI application can use in theregion of 3MB as frame data for a WVGAscreen size. If the code is running on RAMtoo, as is the case with most processors, thena further 0.5MB of code is needed.

Thus the starting point for a WVGA screenshould be to look for a system with a mini-mum of 3.5MB of RAM.Of course, the speed of access to the RAMis also very important. As you will have like-ly just realised, the RAM here is being writ-ten to and read from by several differentsources concurrently. For example, the frontbuffer (the original image data) will be readby the IP block to drive the data to thescreen. At the same time, the back bufferwill be updated by the CPU or by a DMA

transfer of a different image. At the sametime as this, the CPU may be manipulatingthe aforementioned icon, and reading itsown code from the RAM. This puts a lot ofpressure on the bandwidth of the bus to theRAM. This bus is very often the bottleneckin the application, so a good system of busarchitecture is required to mitigate the riskof overloading the bus and of the user see-ing some half-finished images, or worse stilla non-functional GUI.

Special attention should also be paid to theperformance of the CPU. A system deliver-ing 24 frames per second to the screen willneed to manipulate and create data (in ourexample of a WVGA screen) of over 24MBper second. This can be done entirely insoftware, or in some parts in hardware, butwhatever happens the CPU must be fastenough to cover these requirements.As we are now clearly talking about aprocessor solution, which is likely not goingto have any flash memory on chip, the next


RZ/A System Block Diagram



requirement is that of a connection to exter-nal flash memory. The typical method fortoday is to use an external parallel NORflash to store the code and then during bootmode to transfer this code into the RAM tosupport fast execution. Newer devices, how-ever, support other memory technology toallow system architects to reduce systemcost without having the overhead of an“expensive” NOR flash on the PCB.

Most of these applications typically do morethan just drive a screen. They need to beconnected to the rest of the system too.Automotive applications are typically con-nected to the CAN or MOST bus. Industrialand consumer devices today generallyrequire Ethernet and USB connections.These connections also mean that the mostsuitable product will have to not only incor-porate the hardware IP, but also have suffi-cient performance to manage their opera-tion and sufficient code space to supporttheir stacks.

So how about the RZ/A?The RZ/A family is an ARM Cortex A9 basedembedded MPU solution that brings a greatmany advantages to the HMI applicationspace. The RZ/A features up to 10MB ofembedded SRAM on chip, which makes itthe largest embedded RAM in the market.There are 3 variations in the family. TheRZ/A1H which includes the full 10MB ofRAM, the RZ/A1M which has just 5MB ofRAM, and the RZ/A1L which includes thelowest 3MB of RAM.So from the discussion above, where we cal-culated that the HMI application wouldneed approximately 3.5MB of RAM, theRZ/A1M looks ideally suited to meet these

requirements. It is of course possible to findseveral other solutions on the market thatwill use external RAM, whether it be DDR orSDRAM, to cover this size of memory butthe RZ/A family is the only product that theauthor is aware of that can offer such a highlevel of internal RAM.

The RZ/A1H gives the system designerroom to increase the screen size and also todecrease the screen size depending onrequirements, and create a cost-optimisedversion for smaller resolution products.

The 400MHz CPU performance is morethan enough to run a simple HMI applica-tion and maintain communication throughwhichever protocol the system dictates,because all versions of the RZ/A familyinclude CAN (up to 5 channels) Ethernet,USB (up to 2 channels) and even supportMOST in the automotive qualified versions. In fact, the 400MHz CPU is more thanenough due to two unique features of theRZ/A. The first feature is the VDC.

The video display controller from Renesassupports in hardware many of the functionsrequired for creating the final screen image.The VDC will support up to 4 differentgraphics layers, two of which can be inputsfrom an external camera. It will also supportalpha blending hardware. Alpha blending isa process whereby each pixel is allocated anadditional 8-bit alpha value.

This alpha value determines the transparen-cy of the pixel, such that it can be overlaidon top of another pixel to create the result-ing image. The VDC also supports chroma-key operation, the most well-known use ofwhich is in “green screen” videography,where a particular colour is defined as trans-parent so that an object can be overlaidagain on another picture. In some systems allof this would be done in software, but theRZ/A does it in hardware, thus the 400MHzin reality equates to a much higher equiva-lent performance. The VDC also supportsthe RGB digital connection to a TFT screenas well as the LVDS.

The second performance factor of the RZ/Afamily that boosts the CPU performance isthe removal of the bus bandwidth problemwe saw earlier. A quad-core terahertzprocessor is only as fast as it can get the data.When that data is all stored in a single RAMblock to be accessed over a single bus, this is

bound to slow down the core. The RZ/A, incontrast, has 5 separate RAM banks. Eachbank is connected to its own dedicated 128-bit wide bus, such that it is actually possibleto both write to the back buffer, read fromthe front buffer, manipulate an icon andcomplete a DMA transfer all whilst runningcode from the internal RAM. This is a signif-icant performance boost.

Of course, we mentioned earlier that a con-nection to external flash memory is alsoneeded, and the RZ/A supports all the nor-mal connections to non-volatile memorysuch as NOR, NAND, SDIO, MMC etc.However, it also has a special SPI Multi-I/Oserial flash connection, which supports thenew quad SPI protocol. This QSPI canachieve similar or better performance fig-ures to those of parallel flash while provid-ing the economic advantages of serial flash,as well as saving pins on the microprocessorand reducing PCB size.

Simply put: The RZ/A is simpleThe newly released RZ/A device fromRenesas has been specifically designed forthe Human Machine Interface market. Thereare several requirements in this marketwhich are not unique on their own, but theircombination makes the market a difficultone to cover with traditional systems. Theneed for RAM is large, but not so large thata microprocessor with 128MB of DDR3RAM is required.

The performance requirements are low, aslong as the device is supported by a well-designed display controller, but they are notso low that a microcontroller running at, say,100MHz could cover them.

The RZ/A contains just enough connectivityfor any HMI application, more than enoughperformance, and a good amount of RAMallowing for flexibility. It is a cost optimisedand dedicated solution that will not onlyprofit from the booming market for displaytechnology but also help drive it forward nwww.renesas.com


Future Electronics extendsARM Accreditation scheme

after success of first wave ofARM Cortex-M training

Future Electronics is to extend the scope of itsARM Accreditation Corporate Partnership toinclude ARM’s microprocessor AccreditedEngineer qualification.

In February, Future Electronics announcedthat it had become an ARM AccreditationCorporate Partner, the first distributor to doso. As part of its partnership agreement withARM, Future Electronics committed all of itsfield applications engineers (75 in the EMEAregion) to gain the prized ARM AccreditedMCU Engineer (AAME) certificate. To gainthe AAME certificate, the engineer mustcover a broad range of topics laid down inthe AAME syllabus, practise the implemen-tation of ARM-based designs and thendemonstrate knowledge in an exam inde-pendently administered by Prometric. The initial phases of the corporate partner-ship scheme have produced encouragingresults both for Future Electronics and itscustomers. In particular, the deeper knowl-edge and understanding of the ARM®Cortex®-M cores which engineers are able tooffer have proved extremely popular withFuture Electronics’ industrial customers. Fewsmall and medium-sized engineering busi-nesses are able to devote the necessary timeand resources to training their design engi-neers to AAME level, but the FutureElectronics training scheme enables them toaccess specialist ARM core expertise as partof the distributor’s technical support service. In the first phase of the programme, 45Future Electronics engineers around theworld (15 in EMEA) have been trained asARM Accreditation educators. The companyis now to extend the scheme, providing extratraining to half of these educators to equipthem to take the ARM Accredited Engineer(AAE) examination. FUTURE ELECTRONICS www.FutureElectronics.com

Distributor Rutronik offers the new SingleBoard Computer (SBC) MIO-5271 fromAdvantech. It comes in a 3.5” MI/OExtension (146x102mm) form factor,based on Intel® 4th generation Core™i5/Celeron® processors (Mobile U-series

platform). The SBC supports1600/1333MHz DDR3L, USB 3.0, SATAup to 6Gb/s (600MB/s), Intel® AMT 9.5Release and has triple independent dis-play capability. With these features, MIO-5271 responds to the requirements forgreater performance, high network con-nectivity, and smart manageability of IoTand embedded systems.

The SBC adapts the latest microarchitec-ture with 64-bit, multi-core processorsbuilt on 22nm process technology. Itdelivers improvements in CPU process-ing, graphics, security capabilities, andI/O flexibility. With an upgrade to Intel®AVX 2.0, the new SBC shows a bigenhancement in integer/matrix-basedcalculation abilities, with Intel® AES-NIallowing security algorithms to takeadvantage of hardware acceleration fordata encryption and decryption. It allowssystem integrators to build intelligent sys-tems more easily, with improved per-formance and reliability. An optimizedthermal solution for MIO-5271 makesfanless design possible on this kind ofcompact, high performance platform. It isa sound choice for medical, automation,military or transportation applications.MIO-5271 also has both iManager andSUSIAccess, developed by Advantech,integrated to monitor and control systemoperation remotely and effectively. RUTRONIK www.rutronik.com/d293116c.l

RUTRONIK EMBEDDED: New SBC from Advantechfor IoT and Intelligent Systems

XJTAG has unveiled an integrated XJFlashfeature for up to 50 times faster flash pro-gramming. XJFlash allows engineers toautomatically generate customised pro-gramming solutions that can overcome thespeed limitations generally associated withusing boundary scan to program flash

memories connected to FPGAs. By creatingcustom programming designs for eachflash/FPGA combination, XJFlash relievesthe JTAG chain of unnecessary traffic (usu-ally generated by repetitive functions suchas shifting in control, address and data bits).By doing so, programming speeds close tothe device’s theoretical maximum can be

achieved. Previously only available as aconsultancy service, the XJFlash modulesupports a wide range of flash and FGPAconfigurations, and can now be used aspart of an XJDeveloper boundary scan testproject by the end user to create a pro-gramming solution. The integration comes

alongside XJTAG’s recent release of version3.2 of its test development system. Theinnovative approach of the XJFlash moduleallows it to erase, program and verify anyflash memory provided there is access to itfrom an FPGA on the target board, all with-in the XJTAG software.X JTAG www.xjtag.com

XJTAG unveils integrated XJFlash feature




PANASONIC ERJP PULSE PROOF RESISTORSThe 0805 format high power (0.5W) SMDthick film anti-surge chip resistors haveexcellent ESD surge characteristics in com-parison to standard metal film resistors.Additionally the ERJP6W series is highly reli-able, featuring a double-sided metal glazethick film resistive element, and three layersof electrodes.

• Highly reliable multilayer electrode construction

• Compatible with all soldering process• Applications include telecommunication

equipment, automotive industry & video cameras

RS COD: 763-4461

HARTING HAN POWER T3 CONNECTORHan-power®T with 3 × Han®Q 5/0 allows foreasy power connection to using existing ornew cabling systems. The connector has 5 +E contacts, featuring four power contactsand one earth – one contact is unconnected- all with a 16A current capacity, and the “T”layout enables easy installation or removal.

• Flexible connection types for power• Uses standard Han Q5/0 Inserts• IP65 / IP67 Rating

RS COD: 787-1751

RS DIGITAL INSPECTION CAMERAThis professional inspection camera cantakeover 200 stills and record more than 60seconds of video. View difficult places for adetailed inspection of corrosion, leaks,damage, broken parts, blockages, cablesand more.

• Small 5.5mm size• Battery saver• Internal memory and SD card slot• Audio and video output• USB port

RS COD: 790-3381

POWERTRAVELLER PORTABLECHARGERSDiscover the wide range of highly efficient,performance-rich portable power products.From the waterproof powermonkeyextreme for 5V devices and the iPad, to themighty powergorilla laptop charger, eachproduct comes with a selection of inter-changeable tips for the most populardevices. Range includes:

• Powermonkey• Powergorilla• Minigorilla• Solargorilla• Solarmonkey

RS COD: 797-4927

ANALOG DEVICES DATA CONVERTERSThe award winning AD8232 low cost, singlechip heart rate monitor AFE is designed toextract, amplify, and filter small biopotentialsignals in the presence of noisy conditions,such as those created by motion or remoteelectrode placement. This design allows foran ultra low power analog-to-digital convert-er (ADC) or an embedded microcontroller toacquire the output signal easily.

• Fully integrated single-lead ECG front end• Two or three electrode configurations• 2-pole adjustable high-pass filter• Accepts up to ±300 mV of half-cell potential• Fast restore feature improves filter settling

RS COD: 786-3145

OSRAM DURIS S8 SERIES MID-POWER LEDSCompact multi-chip LEDs available in 2 differ-ent levels of luminous flux (6 or 8 chips).Featuring colour consistency that corre-sponds with 3-step, 5-step or 7-stepMcAdam ellipses, the DURIS S 8 LED isbinned at a junction temperature of 100°C toreflect real world operating conditions.

• Small Light Emitting Surface (LES) improvesoptical behaviour in directional lighting

• High Colour rendering index (CRI): 80 minimum for 3 and 5 step versions

• Low thermal resistance to enable high operating power

• Operating temperature range: -40 ... +110°C• Small footprint for clustering

RS COD: 791-6946

Aurocon Compecwww.compec.ro

www.designspark.com

Aurocon COMPEC alwaysoffers new products


Analog Devices and RenesasWireless CommunicationsPlatform Achieves Wi-SUN

Alliance CertificationAnalog Devices, Inc. and Renesas ElectronicsCorporation announced that a co-devel-oped wireless communications platformreceived Echonet Lite Profile Certificationfrom the Wi-SUN Alliance. The certificationensures compliance to Wi-SUN InternationalWireless Communications Standards adopt-ed for use in energy management applica-tions for the home and used by smart metersand home energy management systemsappliances. The Wi-SUN Alliance promotesthe adoption of open industry standards andseeks to advance wireless smart utility net-works worldwide and related interoperabili-ty and compliance certification programs.

The sub-GHz wireless communications plat-form is composed of ADI's ADF7023-J RF ICtransceiver and Renesas' RL78/G13 microcon-troller (MCU) and communications software.The platform complies with the Wi-SUN forEchonet Lite Profile for PHY layer, MAC layer,network layer (6LoWPAN, IPv6) and securitylayer (PANA) and is targeted to be a standardreference for certification testing. Developersusing this reference platform for today'sM2M, smart grid and IoT applications receivethe benefits of a standards-compliant design,enabling faster time to market.

Get questions answered by ADI engineerson EngineerZone™, ADI's online technicalsupport community: https://ez.analog.com/community/energy-metering

About the Wi-SUN Alliance: www.wi-sun.org/

Learn more about ADI's energy innovationsand find technical content: http://energy.analog.com/en/segment/nrg.html

As promoter members of the Wi-SUNAlliance, ADI and Renesas are committed tofurthering the mission of certifying wirelesscommunications interoperability across abroad spectrum of smart grid devices. Wi-SUN seeks to enable reliable, cost-effective,low power wireless products based on openglobal standards, including IEEE802.15.4g.

ANALOG DEVICES www.analog.comRENESAS ELECTRONICS www.renesas.eu


Test sourcing specialist Livingston nowstocks Sefram’s latest paperless datarecorder. The DAS1600 has a 100MHzbandwidth and offers 18 channel opera-tion as standard, with provision for deter-mining voltage, strain, pressure, tempera-ture and a broad variety of other param-eters through utilisation of the series ofaccompanying measurement boardsavailable. There is considerable scope foroperational upgrades, so that new appli-cation demands can be met as they arise.This is achieved through employment ofan extension chassis, which allows 3 extraslots to be incorporated - resulting inaccess to 72 analogue channels in total. A 500GBytehard disk isi n c l u d e d ,del iveringan impres-sive storagecapacity ofup to 128Mwords ofa c q u i r e ddata. Oncethe read-ings havebeen takenthey can betransferred from the recorder to a PC,tablet or other computing platform forfurther analysis - via its 6 × USB interfaces,the LAN (Ethernet) interface or alterna-tively through Wi-Fi communication. It hasa 15.4-inch, 1280 × 800 pixel resolution,touch-enabled display which provides

engineers with a highly intuitive userinterface, thereby facilitating the execu-tion of data collection procedures andsubsequent manipulation/examination. The data recorder is supplied with theSeframViewer software for both datatransfer and analysis purposes. VirtualNetwork Computing software can also besourced, which permits users to remotelycontrol their unit directly from an exter-nal computer. Numerous triggeringoptions are offered, as well as a FastFourier Transform (FFT) analysis capabili-ty. Comprehensive power analysis of sin-gle, dual and three phase electrical infra-structure can be undertaken, with fre-

quencies of 50Hz, 60Hz, 400Hz and 1kHzsupported. The Sefram DAS1600 is pack-aged within a compact, streamlinedenclosure measuring 298mm × 394mm ×218mm and weighing just 8kg. LIVINGSTONwww.livingston.com

Next Generation Multi-Channel Data Logging System

Mitsubishi ElectricCorporation introducesnew hybrid silicon car-bide (SiC) power semi-conductor modules forhigh-frequency switchingapplications. These latestadditions to the NFHseries of power semicon-ductor modules enabledesign engineers toreduce electric powerlosses by 40%. FeaturingSiC Schottky BarrierDiodes (SBD) and SiliconIGBTs, the modulesachieve high efficiency,

downsizing and weightreduction in inverters.

The Modules aredesigned for typical

Hybrid SiC Power Modules from Mitsubishi Electric fo


Plessey announced that it hasentered into a distributionagreement with CODICOGmbH, a demand creation dis-tributor for electronic compo-nents, headquartered inPerchtoldsdorf, Austria and withoffices acrossEurope. WithCODICO,Plessey will beexpanding itsEuropean net-work with cov-erage in Centraland EastEuropean,Italian andDanish marketfor its GaN-on-Si LED products.Sven Krumpel, President andCEO of CODICO GmbH, said“CODICO is very pleased toannounce this partnership withPlessey. We are convinced thatthe innovative technology ofPlessey and CODICO's deepknowledge of the market willenable both companies to turn ona bright light within the solid statelighting market. I strongly believethat the GaN-on-Si technology isgoing to be the next revolution inthe lighting field and that Plesseyand CODICO will be driving it.”

David Owen, Plessey's RegionalSales Director, added, “Plessey isvery pleased to work with a dis-tributor that has a wide coveragein the region. CODICO's line cardcomplements the Plessey LEDportfolio in the lighting segment

and together with its focusedteam that brings considerableknowledge of the lighting industryand customer base, will acceleratethe time to market for PlesseyGaN-on-Si LEDs in the region.” Plessey's MaGIC™ (Manufacturedon GaN-on-Si I/C) HighBrightness LED (HBLED) technol-ogy has won numerous awardsfor its innovation and ability tocut the cost of LED lighting byusing standard silicon manufac-turing techniques. PLESSEY www.plesseysemiconductors.com

Plessey expands its distribution network inEurope with CODICO Partnership for Central,East Europe and Italy


MSC Technologies, a business group of Avnet ElectronicsMarketing EMEA, a business region of Avnet Inc., announcesa new nanoRISC embedded processor module which isbased on the Freescale i.MX6 System-on-Chip. Differentmembers of the i.MX6 family of ARM Cortex-A9 processors,from single-core to quad-core, will be used for the moduleresulting in an extremely wide range of usable performance.

The MSC nanoRISC-MX6x module can hold up to 4 Gbytesof DDR3 DRAM, up to 4 GBytes of SLC NAND Flash andoptionally up to 64 Gbytes eMMC Flash. A microSD cardholder on the module enables the addition of Flash memo-ry cards. The MSC nanoRISC-MX6x module is fully compli-ant with the nanoRISC specification and provides for popu-lar embedded I/O signals such as Ethernet, USB, CAN, UART,SPI, I2C and I2S audio.The entry-level module nanoRISC-MX6S will use the single-core processor Freescale i.MX6S clocked at 800MHz for theindustrial temperature module or 1GHz for the standard-temperature range. This module version features the lowestpower consumption of typically 2.5W. There will be twodual-core versions using the Dual-Lite processor clocked at800MHz/1GHz and the regular dual-core processor clockedat 800MHz/1.2GHz for industrial/standard temperature,respectively. The quad-core processor clocked at800MHz/1.2GHz is used for the high-end module consum-ing typically 4.5W. The new nanoRISC module based on these i.MX6 proces-sors gives designers of target systems the opportunity toachieve different performance and price points by alterna-tively using the entry-level module or any of the higher-per-formance products, making use of the total hardware andsoftware compatibility between them. Considering theother nanoRISC modules available from MSC Technologies,system designers now have an extremely wide choice of per-formance, price and features among the versatile nanoRISCfamily of embedded “supercomponents”.MSC TECHNOLOGIES www.msc-technologies.eu

MSC adds nanoRISCProcessor Module with

Freescale i.MX6

Michael LeGoff, CEO of Plessey (left) withSven Krumpel, CEO of CODICO (right)

r High-frequency Switching Applicationsswitching frequencies of morethan 20 kHz.The new hybrid SiC powermodules are packaged as 2 in 1configurations with a rating of1200V and currents of 100A(CMH100DY-24NFH), 150A(CMH150DY-24NFH), 200A(CMH200DU-24NFH), 300A(CMH300DU-24NFH), 400A(CMH400DU-24NFH) or 600A(CMH600DU-24NFH). Allmodule packages are compati-ble with Mitsubishi Electric’sconventional pure-silicon basedpower modules. The 100A and150A modules, which are inte-

grated in a package with a foot-print of 48mm × 94mm, offer areduced internal inductancewhich is about 30% lower thanin the conventional modules.The 200A and 300A modules’footprint measures 62mm ×108mm, while the 400A and600A modules require just80mm × 110mm baseplate size.Typical applications are e. g.uninterruptible power supplies(UPS) and medical devicepower supplies.

MITSUBISHI ELECTRIChttp://global.mitsubishielectric.com



EM Microelectronic Releases COiN,a Complete Bluetooth® Smart BeaconCOiN Offers Longest Lasting, Longest Range, Most Secure & Flexible Bluetooth® Beacon

EM Microelectronic introducedthe COiN Bluetooth beacon.COiN is a versatile, high perform-ance, low power solution that canbe deployed anywhere iBeacon™technology is used, but whichalso supports wireless sensornetworking and many otherapplications over Bluetooth®Smart (Bluetooth with a LowEnergy Core Configuration) wire-less communications.

Low PowerDue to its unique design, COiNconsumes less than 20μA aver-age in a typical application,resulting in more than 18months’ operation from a singleCR2032 battery, which is includ-ed in the beacon. COiN alsocontains a built-in pushbuttonswitch, thus guaranteeing thatyour beacons have a full chargewhen they are deployed.Integrated red and green LEDsprovide users with feedbackabout the device’s operatingmode. Just click and stick!

Long RangeThe COiN’s integrated printedcircuit antenna not only mini-mizes cost, but maximizes com-munication range. At the 0dBmoutput power setting, EMMicroelectronic’s beacons canbe detected 75 meters away byan iPhone® 5S, and at maximumoutput power, that distanceextends up to 120 meters.

SecureDue to COiN’s optimized circuitarchitecture, it is completelyimmune to over-the-air attacks,meaning that a well-placed bea-con is very secure. It cannot be“hacked” or modified unless the

perpetrator has complete phys-ical possession of the device.

WeatherproofCOiN is shipped pre-pro-grammed, complete with aRenata CR2032 battery and aweatherproof plastic enclosurefor easy deployment, making itsuitable for use at outdoormusic festivals, sporting eventsand arenas, and anywhere abeacon is required to withstandthe elements.

FlexibleThough COiN is available in-stock pre-programmed and witha standard housing, the standardCOiN hardware and firmwareare easily modified to fit mostapplications. At the most basiclevel, COiN firmware can easilybe modified to change theUUID, MAJOR ID, MINOR ID,output power, and beacon inter-val. These changes are useful foradapting the beacon for whatev-er smartphone software applica-tion/API is being used, segregat-ing beacon populations andsub-populations, and for opti-mizing battery lifetime based on

the desired use case.Should more extensive firmwaremodifications be desired, EMoffers a complete developmentkit. The COiN Development Kitincludes five (5) COiN beacons,programming board and pro-gramming cable and is fully com-patible with EM’s line of softwaredevelopment tools for theEM6819; EM’s ultra-low powermicrocontroller. Using thesetools, customers have completecontrol over the firmware and

can create their own BluetoothSmart advertising packets andtransmit real-time sensor datasuch as temperature, light level,battery voltage, or other physicalphenomena.The COiN enclosure can be cus-tomized to sport any embossedlogo desired, making the beacontruly your product. No one willknow that you leveraged EM’sdecades-long experience andengineering effort and expertiseto create your Bluetooth beacon,and we won’t say a word, thoughenclosure customizations aresubject to a minimum purchasevolume and tooling charges.

Not much larger than theCR2032 battery that powers it,COiN can be used almost any-where. To assist in attaching anddeploying COiN, EM offers asuite of accessories. The KeyFob Accessory snaps over COiNfor attachment to key rings orfor hook or loop-based attach-ment methods such as zip-ties.The Wall Mount Accessory canbe nailed or screwed to a solidsurface, and then COiN issnapped into place, completelyhiding the Wall Mount. COiNcan also be snapped into theWatch Band Accessory and anyof a number of wrist bands forwrist-worn applications.“COiN leverages EM’s expertise inultra-low power wireless and com-puting as well as our high qualitystandards and synthesizes theminto a high performance,Bluetooth beacon that is ready todeploy out of the box, but flexibleenough to be modified for manydifferent applications,” comment-ed Michel Willemin, EMPresident. “We are alreadyengaged with many companieswho are using COiN with theirApp, API, SDK, or service toimprove their performance andlower their overall cost. Webelieve that the availability of sucha flexible, optimized Bluetoothbeacon will enable a truly perva-sive Internet of Things.”

AvailabilityCOiN, the COiN DevelopmentKit and the Key Fob, Wall Mount,and Watch Band accessories areavailable through your local EMsalesperson or distributor.

EM MICROELECTRONICwww.emmicroelectronic.com



Ericsson has won the Best Power and Energy ConversionProduct category of the Electrons d’Or 2014, one ofEurope’s most coveted electronics industry awards. Theprize was awarded for Ericsson’s BMR463-25A, the compa-ny’s third-generation 25A digital point-of-load (POL) regu-lator that features Dynamic Loop Compensation (DLC).The Electrons d’Or celebrates the very best of innovation inelectronics in categories including power, test and measure-ment, displays, memory processors, microcontrollers, and RFcircuits, as well as the most innovative French start-up.

The trophies for the 17th edition of Electrons d'Or werepresented at the awards ceremony held on June 18 at theFIEEC (Fédération des industries électriques, électroniqueset de communication) in Paris.Ericsson’s BMR463-25A delivers a 25% increase in outputcurrent over the previous module yet comes in a fully com-patible footprint. Part of the company’s 3E* series of digital-ly controlled DC/DC converters, the module also embedsthe latest DLC technology to improve stability and shortentime-to-market.

Patrick Le Fèvre, Marketing and Communication Director,Ericsson Power Modules, commented: “The development ofthe BMR463-25A results from very close cooperation with sys-tems architects. Winning this prestigious award is yet more evi-dence that we have a world-class R&D team and employ success-ful business processes and strategy to deliver new products thatdeliver better flexibility, simplicity and control parameters tomatch specific applications.”

The BMR463-25A runs the DLC algorithm as default eachtime the output is enabled. However, three more settings arealso available via the PMBus for systems architects to fullymonitor and dynamically control the energy delivered tostrategic components while reducing costs.

ERICSSON POWER MODULES www.ericsson.com/powermodules

Ericsson Power Modulesstrikes gold with

Best Power Product win atElectrons d’Or 2014

Microchip announces its firstBluetooth® 4.1 Low Energy mod-ule. The RN4020 builds onMicrochip’s deep BluetoothClassic experience and carriesboth worldwide regulatory cer-tifications and is Bluetooth

Special Interest Group (SIG) cer-tified. The integrated BluetoothLow Energy (BTLE) stack andonboard support for the com-mon SIG low-energy profilesspeeds time to market whileensuring Bluetooth compatibili-ty, eliminating expensive certifi-cation costs and reducing devel-opment risks. The module is alsopre-loaded with the MicrochipLow-energy Data Profile (MLDP),which enables designers to easi-ly stream any type of data acrossthe BTLE link.Because the RN4020 is a stack-on-board module, it can connectto any microcontroller with aUART interface, including hun-dreds of PIC® microcontrollers, orit can operate standalone without

a microcontroller for basic datacollection and communication,such as a beacon or sensor. Thisstandalone operation is facilitat-ed by Microchip’s unique no-compile scripting, which allowsmodule configuration via a simple

ASCII command interface, withno tools or compiling required.Designers of cost-sensitiveembedded applications are look-ing for turnkey solutions thatmake it easy to add the lowpower consumption and simplici-ty of Bluetooth LE connectivity,which enables several years ofoperation from a single batteryand has a large installed base ofcompliant smartphones, tabletsand computers. Example marketsthat need these low-power wire-less command-and-control solu-tions include home automationand appliances; medical andwearable devices; toys, tags, fobsand remote controls; pulse andproximity sensor-based systems;and even industrial applications.

Microchip releases the RN4020 Bluetooth®Smart Module

MICROCHIP TECHNOLOGYwww.microchip.com/get/K6QA

Key Facts:• Integrates a Bluetooth 4.1 Low Energy (BTLE) stack for use with

or without a host MCU• Turnkey solution includes all the hardware, software and

certifications for low-power wireless command-and-control connectivity

• Simple ASCII command configures stack-on-module for standalone operation

• Ensures Bluetooth compatibility whilst eliminating certification costs

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son

/ Stu

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Renesas Electronics EuropeWorks with ASTC to Produce a

Virtual Platform and Fast LinuxPorting for a new ASIC

Renesas Electronics Europe announced a col-laboration with the consulting firm ASTC inwhich it developed a new ASIC for a con-sumer electronics customer and was able toprovide a full board support package (secureboot, drivers and OS) before the silicon wasavailable. The speed and efficiency of thedevelopment and the multinational team col-laboration between Renesas and ASTCenabled Renesas to produce the ASIC excep-tionally fast, while the customer reduced timeto market for its new imaging solution.Next-generation ASIC for imagingRenesas’ next generation ASIC is designed tosignificantly enhance image quality and videoanalytics performance by incorporating cus-tom hardware accelerators into a standardARM Cortex-based ASIC. While Renesas wasengaged on the hardware development,ASTC used its VLAB Virtual Platform solution,together with existing ARM toolboxes andmodels, to create and integrate a virtual plat-form for the new Renesas ASIC. Due to thepre-silicon availability of the VLAB virtualplatform for software development, and itsadvanced hardware/software debug capabili-ties, the Linux port only took a few weeks. Asa result, ASTC delivered a Linux kernel run-ning on the virtual platform well before thesilicon was available.Fast development with no need for hardwareASTC used VLAB with the standard ARMVirtual Platform Toolbox to accelerate thedevelopment and integration of the virtualplatform for the new Renesas device. TheVLAB ARM Toolbox includes the ARMCortex-A9 ISS models, the ARM PrimeCellToolbox, and a QuickStart Reference VirtualPlatform. The QuickStart Reference VirtualPlatform for customization comprises a pre-integrated platform with sample kernel andtest cases, enabling developers to kick-startdevelopment by allowing immediate load-ing and running of software applications.Linux port in little more than two weeksAfter assembling the platform for the Renesasdevice, Renesas took a standard Linux kerneland ported it to this virtual board in just a fewweeks, helping the team achieve the goal ofhaving software running long before thehardware is available. Renesas also used thisplatform to develop the boot code – soft-ware that will cause a respin of the ASIC if it iswrong – and test that it was sufficiently robustfor the application. RENESAS ELECTRONICS www.renesas.eu


Distributor Rutronik presents the S110SoftDevice v7.0, the next major release ofNordic Semiconductor’s Bluetooth® lowenergy stack for the nRF51822 Bluetoothlow energy (BLE) and 2.4GHz proprietarySystem-on-Chip (SoC) and the nRF51422ANT™ and ANT/Bluetooth low energymultiprotocol SoCs. It enables simple,secure and reliable field updates of bothstack and application and makes it easierto design ULP wireless products.The S110 SoftDevice v7.0 offers a broadrange of new features: The Over-The-AirDevice Firmware Upgrade (OTA-DFU),together with the nRF51 Series SoC’sflash-based architecture, support a flexi-bility to firmware upgrades that is notpossible on alternative static ROM/OTP-based ULP wireless SoCs. Thus, thenRF51822 and nRF51422 SoC’s stacksand application firmware can be upgrad-ed quickly and easily using the devices’own wireless link. The OTA-DFU featureallows complete application and protocolstack upgrades and is not limited to par-tial updates and patching. Concurrent

Peripheral/ Broadcaster roles is anotherfeature of the latest S110 SoftDevice, thatallows the nRF51 series SoC to broadcastdata whilst in a connected state.

With the new support for concurrent mul-tiprotocol Bluetooth low energy and2.4GHz RF proprietary operation,Bluetooth low energy operates from theS110 SoftDevice itself while the 2.4GHzproprietary protocol runs from the appli-cation space. RUTRONIKwww.rutronik.com/877a0fde.l

Rutronik: Bluetooth 4.1 and Over-the-Air FirmwareUpgrade from Nordic Semiconductor for nRF51 Series

Intersil Corporation announced theTW6872 HD-SDI video transmitter andTW6874 quad HD-SDI receiver with DiracVC-2 mezzanine compression, an end-to-end solution enabling pic-ture perfect, latency freevideo over extendedcable distances. The newdevices are designed toconform to the SMPTEstandards for SD, HD and3G serial digital transmis-sion and offer anunprecedented level ofintegration to enablereduced system costs forvideo surveillance cam-eras, industrial cameras, digital videorecorders (DVRs) and video mixers andswitches. HD-SDI usage in the securityand industrial markets has been limitedby cable reach and the high cost ofcabling infrastructure. The TW6872triple-rate HD-SDI video transmitter andTW6874 quad HD-SDI video receiverdeliver the full benefits of HD quality

without requiring expensive cablingupgrades. Offering robust operation inreal-world installations, the TW6872/4devices use SMPTE VC-2 based Dirac

compression to enable HD video trans-mission at SD-SDI cable distances of 300+meters. High quality, picture perfect andlatency free video with extended reach isachieved through built-in features in theTW6872/4 devices that leverage both thelatest standards and Intersil's innovative cir-cuit architecture. INTERSIL www.intersil.com/tw6872-4

Intersil Introduces HD-SDI Transmitter and Receiver EnablingTransition from Analog to HD Video over Existing Coax


Continuing its long track record ofRF power technology leadership,Freescale Semiconductor intro-duces its first plastic packageddevices designed specifically forhigh ruggedness applications. The new MRFE6VP5150N/GNand MRFE6VP5300N/GN poweramplifiers are the industry’s first >65:1 VSWR rated devices to behoused in over molded plasticpackaging. Compared to ceramicRF packages, plastic packagingfeatures superior manufacturabil-ity, outstanding thermal imped-ance and significant cost benefits.By combining the advantages ofplastic packaging with theruggedness traditionally associat-ed with ceramic-housed devices,Freescale has achieved a signifi-cant technology milestone for thebenefit of its RF power customerbase. Industrial environments arenotoriously harsh. Devices are

required to not only survive, butperform optimally under varyingvoltages and operating condi-tions. With a survivability ratingof > 65:1 VSWR with simultane-ous over voltage and overdrive,Freescale’s new MRFE6VP5150and MRFE6VP5300 devices aredesigned to thrive in these envi-ronments while delivering out-standing system reliability andlow maintenance costs. Target applications for the newproducts include FM broadcast,CO2 lasers for medical applica-tions, and VHF and UHF base sta-tions for public safety radio instal-lations. These new RF powerLDMOS transistors support widefrequency range utilization –from 1.8 and 600 MHz.

FREESCALE SEMICONDUCTOR www.freescale.com/RFpower

Freescale RF Industrial Portfolio Expandswith Introduction of Rugged PlasticPackaged Power Amplifiers


Amplicon has recently launched a brand new product sec-tion on their website containing industrial grade wiredmodems and routers. Providing many new additions to theAmplicon portfolio, these modems and routers support awide range of data transmission technologies from broad-band ADSL/VDSL to legacy 56k dial-up.

Manufacturers that can be found in the Amplicon portfolioof wired modems and routers include INSYS icom, DigiInternational and Moxa. Working with quality manufacturershas allowed Amplicon to supplement their ever increasingproduct range of high quality, high reliability and industrialgrade data communication products.Amplicon wired modems and routers product rangeincludes products that are used for applications such asremote access, remote machine diagnosis, predictive main-tenance, remote device alarm notification, SCADA applica-tions, remote metering, accessing serial devices and SNMPmanagement.Industrial grade modems and routers differ from their com-mercial counterparts with various features directed at net-work reliability and resilience. In the brand new AmpliconWired Modems and Routers web section you will find prod-ucts that are designed specifically for challenging environ-mental conditions with resilience to electromagnetic inter-ference, shock, vibration and extreme ambient tempera-tures. You will also find some unique redundancy featuressuch as dual SIM card fail-over and even dual integratedmodems for a backup WAN connection such as ADSL to 3Gfall back.

AMPLICON www.amplicon.com

Amplicon introduceexciting new range of wired modems

and routers.

Legacy of plastic packaging innovation for wirelessinfrastructure equipment continues with an industryfirst for harsh industrial environments

Mouser Electronics, Inc., is the firstto stock the AD9652-310EBZDual 16-bit analog to digital con-verter (ADC) Evaluation Boardfrom Analog Devices. TheAD9652 ADC captures data at310MSPS, has a high speedpipelined architecture, and boasts

the best noise and dynamic rangeperformance in its class. The newAnalog Devices AD9652-310EBZDual ADC Evaluation Board, avail-able from Mouser Electronics isrequired to begin designing withthe AD9652 ADC, which targets

demanding high speed signalsampling applications requiringexceptional dynamic range over awide frequency range. TheAD9652 can sample signals as fastas 465 MHz. Analog signals arefirst fed to a dual, buffered front-end sample-and-hold circuit. Thesignal then goes into a pipelinedswitched-capacitor ADC. Thisunique architecture combines theaccuracy of a pipelined converter,with the stability and perform-ance of a buffered sample-and-hold. The AD9652 has digital pro-cessing blocks to continuouslytrack and correct any internalerrors that occur at any pipelinestage, ensuring continuous per-formance over various operatingconditions.MOUSER ELECTRONICSwww.mouser.com

Mouser First to Stock Analog Devices AD965216-bit ADC Evaluation Board with 310MSPS


Pelagicore and RenesasElectronics Europe Collaborateto Bring Ethernet Audio Video

Bridging to In-VehicleInfotainment

Renesas Electronics Europe announced aclose collaboration with Pelagicore with thegoal of bringing innovation to in-vehicleinfotainment networks. The combination ofRenesas expertise – with its new generationof automotive infotainment Systems-on-Chip (SoC), the R-Car series, and Pelagicorewith its open source solutions for vehiclenetworking, is designed to enable multime-dia systems with efficient Ethernet AudioVideo Bridging (EAVB) capabilities.Carmakers are looking for robust, low laten-cy networks with high quality of service forin-vehicle infotainment. Modern infotain-ment systems consist of entertainment fea-tures like radio receivers, amplifiers andmedia players, which can all integrate multi-ple connected sources. These robust sys-tems need an efficient and high-bandwidthautomotive network to ensure the qualitythat consumers expect in high-end, automo-tive environments.Automotive networks are a challenging net-work environment and modern Ethernet AVBis designed to address that environment withvery high quality of service (QoS). These net-works often carry data from navigation sys-tems and multiple camera views of the sur-rounding environment directly to passengersand drivers. Ethernet is a popular solution forin-vehicle networking due to its popularity inconsumer and industrial markets, its cost-effectiveness, and available software. Using the R-Car H2 E-AVB HW support,Pelagicore has developed an open sourceimplementation of EAVB that demonstratesan infotainment use case using the EthernetAVB network. This work is directly related to the AVB proj-ect started by Pelagicore in the GENIVI con-sortium in order to produce an automotiveEthernet AVB Reference Software Stack tobe made available to all GENIVI members asopen source. The Renesas R-Car H2 SoCplatform has been chosen because of its spe-cial E-AVB support in the MAC, which pro-vides the necessary level of performanceand precision for in-vehicle audio and videoapplications. Pelagicore and Renesas consid-er this proof of concept as the first step oftheir cooperation and plan to work togetherto bring more innovation in the future for in-vehicle infotainment networks.RENESAS ELECTRONICS www.renesas.eu


RF power industry leader FreescaleSemiconductor is introducing its secondgeneration of Airfast™ RF power solutions,delivering a new level of performance foradvanced wireless infrastructure equip-ment, including GSM/UMTS, CDMA/W-CDMA, LTE, and TD-LTE applications.Freescale’s newest Airfast family of RFpower solutions builds on the successand proven performance of the previousgeneration, which was comprised of 28Vdiscrete, single-stage power amplifiers.Leveraging and enhancing first-genera-tion Airfast circuitry, die, matching net-work and packaging technologies,Freescale has reached another industrymilestone with the next generation ofAirfast technology, which includes thefirst production RF power LDMOS partsto achieve 50 percent efficiency in aDoherty configuration. Additionally, sec-ond-generation Airfast power amplifiersexpand the portfolio’s breadth to includetwo-stage integrated circuits, incorporat-ing multiple gain stages in a single pack-age; as well as adding new offeringsbased on gallium nitride (GaN) and 48VLDMOS process technology.

Product DetailsThe initial second-generation Airfastproducts include: • A2T07H310-24S – 300W asymmet-rical Doherty transistor for wireless infra-structure applications in the 720-960MHz frequency band. In a Doherty con-figuration, this device breaks the 50 per-cent efficiency barrier at 8dB back-off

with 55dBm peak power and 18.9dB gainin a NI-1230S-4L2L package.• A2T07D160W04S – 160W dual-path transistor for wireless infrastructureapplications in the 728-960MHz fre-quency band. In Doherty configuration,this device has 51 percent efficiency at7dB output back-off with 52.5dBm peakpower and over 21.5dB of gain in a NI-780S-4L package.• A2T26H160-24S – 160W RF asym-metrical Doherty transistor for wirelessinfrastructure applications in the 2496-2690MHz frequency band. In a Dohertyconfiguration, this device has 47 percentefficiency at 8dB back-off with 52.5dBmpeak power and 15.7dB gain in a NI-780S-4L2L package.• A2I25D012N – 12W RF integratedcircuit for wireless infrastructure applica-tions in the 2300-2690MHz frequencyband. In Doherty configuration, thisdevice has 41 percent efficiency at 8dBoutput back-off with 43.5dBm peakpower and 29dB gain in a new TO-270WB-15 plastic package.• A2I22D050N – 50W RF integratedcircuit for wireless infrastructure applica-tions in the 2000-2200MHz frequencyband. In Doherty configuration, thisdevice has 42 percent efficiency at 8 dBoutput back-off with 49dBm peak powerand 28dB gain in a new TO-270WB-15plastic package.

FREESCALE SEMICONDUCTOR www.freescale.com/RFpower

Freescale extends RF technology leadership with second-generation Airfast power amplifier solutions

IAR Systems® announces that its world-leading development tools for ARMenhances and extends the R-IN32M3platform for industrial Ethernet protocolsfrom Renesas Electronics, a premiumsupplier of advanced semiconductorsolutions. The R-IN32M3 is tailored forindustrial networking applications. It sig-nificantly improves industrial Ethernet net-work performance with optimized hard-ware accelerators, while reducing costsby supporting multiple protocols such asEtherCAT®, EtherNet/IP®, PROFINET®,CANopen® and more, from a singledevice. It can be used for real-time net-work communication in gateways, I/O con-trollers, PLCs/PACs, embedded controllers,

industrial drives and countless other net-worked applications. Its design flexibilityallows one system design to serve a diver-sity of networks and applications. To easedevelopment and evaluation of R-IN32M3, IAR Systems has launched itsstarter kit IAR KickStart Kit™ for R-IN32M3which includes IAR EmbeddedWorkbench® for ARM. IAR EmbeddedWorkbench for ARM is a complete andhigh-performance development tool-chain including the highly-optimizing IARC/C++ Compiler™ and the feature-rich C-SPY® Debugger in a user-friendly integrat-ed development environment. IAR SYSTEMSwww.iar.com/renesas/R-IN32M3

IAR enhances Renesas’ R-IN32M3 development platform


Amplicon have introduced theINSYS MoRoS ADSL to theirportfolio of industrial gradewired modems and routers. TheMoRoS ADSL provides industrialdevices with internet access overphone lines and enables datarates of up to 25Mbps. TheMoRoS name stands for Modem,Router and Switch. Its name rep-resents its functionality by com-bining the features of anADSL/ADSL2/ADSL2+ modem,secure router and 4-port Ethernet switch,all built into one boxfor maximum flexi-bility. The MoRoSADSL has beendesigned for reliabili-ty in demandingapplications such astransport, factoryautomation, buildingmanagement andsecurity systems. Reliability isachieved through German engi-neering using the highest qualitycomponents, extensive electro-magnetic compatibility and lowvoltage directive testing, IP40

hardened enclosure and a -20°Cto +55 °C wide operating temper-ature range. The MoRoS ADSL’senclosure has been designed foreasy integration into cabinets andother industrial environmentswith secure DIN rail mounting, 10to 60 Volt DC power inputs viascrew terminals and a robust,compact design.To aid engineers to configure thedevice, the MoRoS has a built inweb GUI that is extremely easy to

use and navigate, all of theoptions are clearly explained, sup-porting those who are not sofamiliar with the intricacies of ITequipment.AMPLICON www.amplicon.com

Easy to use, secure and reliable ADSLrouters from Amplicon


Altera Corporation changed the game as it relates to floating-point DSP performance in an FPGA. Altera is the first program-mable logic company to integrate hardened IEEE 754-compli-ant, floating-point operators in an FPGA, delivering unparal-leled levels of DSP performance, designer productivity andlogic efficiency. The hardened floating point DSP blocks areintegrated in Altera’s 20 nm Arria 10 FPGAs and SoCs – cur-rently shipping – as well as 14 nm Stratix 10 FPGAs and SoCs.Integrated hardened floating-point DSP blocks, combined withan advanced high-level tool flow, enable customers to useAltera’s FPGAs and SoCs to address an expanding range ofcomputationally intensive applications, such as high-perform-ance computing (HPC), radar, scientific and medical imaging.

The hardened single-precision floating point DSP blocksincluded in Arria 10 and Stratix 10 devices are based onAltera’s innovative variable precision DSP architecture.Unlike traditional approaches that implement floating pointby using fixed point multipliers and FPGA logic, Altera’sresource efficient, hardened floating point DSP blocks elim-inate nearly all the logic usage required for existing FPGAfloating-point computations. This game-changing technolo-gy enables Altera to deliver up to 1.5 TeraFLOPs (floatingpoint operations per second) DSP performance in Arria 10devices and up to 10 TeraFLOPs DSP performance in Stratix10 devices. DSP designers are able to choose either fixed orfloating-point modes and the floating point blocks are back-wards compatible with existing designs. FPGAs Deliver theHighest Performance-per-Watt FPGAs feature a fine-grained, highly pipelined architecture that make them ideal-ly suited for use as high-performance compute accelerators.The inclusion of hardened floating-point DSP blocks enablecustomers to use Altera FPGAs to address the world’s mostcomplex HPC problems in big data analytics, seismic model-ing for oil and gas industries and financial simulations.

ALTERA www.altera.com

Altera Changes the Game forFloating Point DSP in FPGAs

Mouser is now shipping theFreescale® Freedom DevelopmentPlatform for Xtrinsic Sensors. This small Arduino compatibleFreedom development boardfrom Freescale Semiconductor is acost-effective platform for evalu-ating Freescale's digital gyro-scope, accelerometer, magne-tometer, and position sensors.

The Freescale FRDM FXS 9AXISFreedom Development Platformavailable from Mouser Electronics

allows developers to programand evaluate two of Freescale'sadvanced digital sensor chips.The first is the FXAS21000XTRINSIC 3 Axis Gyroscope, asmall, low power digital gyro-scope that measures yaw, pitch,and roll angular rates. The boardalso supports the powerfulFXOS8700CQ 6-Axis digital sen-sor which combines the functionsof a 3 axis 14 bit accelerometerand a 3 axis 16 bit magnetometeron a single chip. Both sensors pro-vide I2C and SPI interfaces. Thesechips can be used in a number ofapplications including an elec-tronic compass for mobiledevices, smartphones, virtualreality games and personal navi-gation devices. MOUSER www.mouser.com

Free your Sensors with the Freescale 9-AxisFreedom Development Platform from Mouser

Equipped for the most extreme con-ditions thanks to their one-piecestainless steel housing (V2A/AISI304) and hermetically sealed cableexit, the new Contrinex Extreme sen-sors with a particularly long operat-ing distance of 15 mm resist aggres-sive chemicals and are waterproofup to 80 bar. The operating temper-ature range is between -25°C and+70°C (-13°F and +158°F). The devices feature factor 1 on both

ferromagnetic and non-ferromag-netic materials and are suitable forthe most demanding applications.Sensors from the Extreme range areequipped with a high-qualityContrinex ASIC. This offers guaran-teed switching distances, highestrepeatability and optimum tempera-ture compensation. Even when usedin extreme environments, it will ensureprolonged sensor life expectancy. An IO-Link interface, integrated at no

extra charge, offers possibilities thatinclude advanced diagnostic informa-tion for easy error localization, to helpminimize downtime.Inductive full-metal sensors from theContrinex Full Inox Extreme range(series 700) with increased operatingdistance have proved highly effectiveworldwide wherever harsh environ-ments exclude the use of sensors witha plastic sensing face - whether in theautomotive and machine buildingindustries, or in mobile equipmentand packaging machines.


Contrinex presents aworld first: M12 size,

full-metal sensors with an extremely

long operating distance of 15 mm

No fewer than four new, full-metal versions (PNP, NPN, NO, NC) in size M12offer the unique benefit of a 15 mm operating distance. In this way, Contrinexadds an innovative technology to its Full Inox Extreme range as a solution forcustomers who need robust sensors with maximum operating distances.

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

DESIGN SENSORS

A world first with 15 mm operatingdistance: Contrinex presents four newM12 size, full-metal sensors in PNP,NPN, NO and NC versions


A new highly accurate absolutepressure sensor from OmronElectronic Components Europecan detect height differences ofas little as 50cm. Based onOmron’s MEMs technology, thetiny sensor module can meas-ure altitude, atmospheric pres-sure or water depth in wear-able electronics, activity moni-tors, industrial and marineinstruments and mobile phonesand cameras.The new Omron 2SMPB-01-01absolute pressure sensor is thecompany’s most accurate everpressure sensor, providingreadings relative to a perfectvacuum to ± 6Pa. The module is

just 3.8mm × 3.8mm × 1 mmmaximum, small enough to inte-grate into portable instruments.It provides an I2C output for

easy integration into digitalelectronics. The sensor uses piezo resist-ance in a full bridge circuit to

detect pressure, and is fullytemperature compensated giv-ing an absolute temperatureaccuracy of ±2°C. The 2SMPB-01-01 offers the benefit of lowpower consumption of just 9μA typical, further simplifyingits integration into portableand other battery poweredelectronic systems.The 2SMPB-01-01 can operatein three different powermodes: standard, high accuracyand low power mode. Product is packaged in 8 pinQFN structure with surfacemounting terminals.OMRONhttp://components.omron.eu

Omron launches its most accurate pressure sensor

n Optical sensorsn Sensors for logistic applicationsn Safety at work

n Optical Sensorsn Inductive Sensors

n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

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n PLCsn Temperature Controllern Timer

n Flowmetersn Level Indicators and Switchesn Pressure Sensors and Switches

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n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Heavy Duty Industrial Connectorsn Power and Data Transmission Connectors

AUTOMATION

The highly accurate absolute pressure sensor from OmronElectronic Components can detect height differences of as littleas 50cm. Source: Omron Electronic Components.


MSC Technologies, an Avnet Inc.company, announced the avail-ability of the wide-format TFTLCD module (NL13676BC25-03F) from NLT Technologies,Ltd. The new product’s key fea-

tures include typical brightnessof 1100 cd/m², a contrast ratio of900:1 and a wide operating tem-perature range of -20°C to+70°C. These characteristicsmake it ideal for use in industrialapplications, particularly out-doors. Images and text are easyto view and read on theNL13676BC25-03F. Even inunfavourable lighting conditions,the display’s optical qualities are

significantly better than average.The display diagonal is 39.5cm(15.6”) and features a resolutionof 1366 × 768 pixels on a displayarea of 344.2mm (H) ×193.5mm(V). Its external dimensions

measure 363.8mm (W) ×215.9mm (H) × 12.65mm (D).This makes the NL13676BC25-03F the largest display in the NLTHigh Bright product range. It isespecially suited to applicationsrequiring a multifunction displayto show various types of infor-mation and data simultaneouslyon a single display.MSC TECHNOLOGIESwww.msc-technologies.eu

MSC Technologies Announces High-Quality39.5cm (15.6”) LC Outdoor Display from NLT

Everlight Electronics announcesthe high-performance ArgusSeries for automotive headlightapplications. Argus meets thedemands and technical criteriaof the highest quality in themarket particularly for thehigh temperature and harshenvironment in the head-light assemblies.Low thermal resistanceand high heat dissipationrate with outstandingcost/performance ratioEverlight’s high-power Argusseries of LED headlight modulesfeature low thermal resistanceand a high heat dissipation rate.The overall package size isreduced to allow flexible spacefor the component manufactur-ers to design their headlightproducts. During the car LED

design stage, Everlight workswith several leading car lightingmanufacturers for the demandsand concepts of car LED prod-ucts in the product design.

From heat dissipation to opticaldesign, EVERLIGHT has devel-oped double-chip, 4-chip, 5-chip and 6-chip designs basedon top-notch cooperation ofoptical and heat dissipatingtechnologies.EVERLIGHT www.EVERLIGHT.com

Everlight Electronics showcases new Argus LED forautomotive headlights

Ideal for thin LED lighting-mod-ule applications, Molex’s Lite-Trap™ SMT wire-to-board con-nectors can now be orderedfrom TTI, Inc., the world’s lead-ing specialist distributor of pas-sive, connector, electromechan-ical and discrete components.The components offer alow profile, easy wireremoval, as well as lowwire insertion and highwire retention forces.With a low profile heightof just 4.20mm, the Lite-Trap connectors offerthe lowest profile avail-able of similar wire-removabletypes. Other lower-profile ver-sions are available in the mar-ket, but these are permanentone-time connection types thatdo not allow wire removal.

The termination method of theLite-Trap connector system issimilar to Molex’s Wire-Trapconnectors, and also to certaincompetitive “Poke-In” style ver-sions. A stripped wire is insert-ed into the connector andpushes open a gate-style termi-

nal that “traps” the wire. Tounmate, a button-style lever onthe housing top is pusheddown to allow the wire to bedisengaged.TTI, INC. www.ttieurope.com

Aito BV, the leader in softwareenhanced piezo (SEP) touch con-trol technology, revealed its UXDesign Studio development toolto streamline the creation of“user experience”(UX) designs forphysical user inter-faces based on SEPtouch technology.This software suiteis targeted at bothproduct designers,concerned with theoperation andresponse of touch controls, andthe embedded hardware andsoftware engineers who willimplement the design. UXDesign Studio is an essential toolthat, when used in conjunctionwith Aito’s evaluation boards andthe Arduino host platform, dra-matically eases the adoption oftouch controls by allowing therapid evaluation of design con-cepts and the validation of ideaswithout needing to prototypeearly designs or have anydetailed knowledge of theunderlying technology. Later in

the development cycle, DesignStudio provides a comprehen-sive capability for easily configur-ing the touch interface by adjust-ing the touch sensitivity and pro-

viding various tactile, audibleand visual feedback signals.With an intuitive GUI, Aito’sDesign Studio software pro-vides an easy access interfacethat allows developers to createcode that can either beuploaded directly to theArduino Nano platform, includ-ed with Aito’s evaluation kits, orused by the customer’s embed-ded software engineers toquickly create device driversfor their own host processor,using Aito’s Arduino Library. AITO www.aitochip.com

Aito’s UX Design Studio streamlines touchpanel development

Molex’s Lite-Trap™ SMT wire-to-board connectorsavailable through TTI, Inc.

PRODUCT NEWS Lighting Solutions / Display

On May 6, a rocket lifted offbound for the InternationalSpace Station (ISS). On boardwas a liquid flow sensor fromSensirion AG, Stäfa, Switzerland.The sensor is part of a researchproject by MinnehahaAcademy in Minnesota that isinvestigating the impactof microgravity on theeffectiveness of liquidflow. Among otherpotential findings, theproject has aimed toshed light on the effectsof weightlessness onthe circulatory system.The LS16 liquid flowsensor from Sensirionon board the ISS hasmeasured the flow ofdemineralized watergenerated by a piezoelectricpump in zero gravity, and com-pared the results with those of acontrol experiment on earth.Numerous applications in fluiddynamics, physics, biology andhemodynamics (the forcesinvolved in the circulation ofblood) will benefit from these

findings. Sensirion stands forinnovation. Existing and newproducts from Sensirion contin-ue to set standards and showthat in the measurement of tem-perature, humidity, gas and liq-uid flows using sensors,Sensirion’s expertise and innova-

tive drive have made it numberone worldwide. The researchteam at Minnehaha Academywas delighted to have Sensirion’ssupport: “Sensirion has been achampion of companies to haveas a partner to make this student-designed project a reality.” SENSIRION www.sensirion.com

Sensirion’s liquid flow sensor flies into space

Mouser Electronics, Inc. is nowshipping the new Magneto -resistive Sensor ICs fromHoneywell. These miniature sen-sors are capable of detectingweak magnetic fields regardlessof polarity. These sensor ICs arepart of Honeywell's NanopowerSeries and consume very littlepower. The new HoneywellNanopower Series of Magneto -resistive Sensor ICs, availablefrom Mouser Electronics, aresensitive enough to detect mag-netic fields as weak as 7Gausswhile drawing only 360nA with a1.8V supply voltage. This makesthese sensor ICs the highest sen-sitivity and lowest power sensorsin their class. Pinout for these 3-pin sensors are power, ground,and output. The supply voltageis flexible and can handle from

1.65VDC to 5.5VDC. In the pres-ence of a magnetic field thattrips the sensor, the output pin is

near the supply voltage. In theabsence of a magnetic field, theoutput pin is close to ground.The push-pull output stage doesnot require an external pull-upresistor. These MagnetoresistiveSensors are available in the SOT23 subminiature surface mountpackage and are only 1.6×2.9mm in size.MOUSER ELECTRONICSwww.mouser.com

Get Sensitive with Honeywell's Nanopower Magneto -resistive Sensor ICs Available from Mouser

Zytronic has built up a strong,widely recognized brand - pro-ducing highly responsive, accu-rate and durable touch sensorsof sizeable proportions. Throughthe success of these sensors,based on its patented ProjectiveCapacitive Technology (PCT™),the company now boasts anexpansive client base, as well as aseries of high profile industryawards. Furthermore, the array ofend applications its productshave been specified for is grow-ing constantly.

One area of increasing interestis putting touchscreen function-ality into reflective surfaces.This is seeing significant uptakein both domestic and retail sec-tors. Through its integrationpartner Display Technology,Zytronic’s proprietary sensingtechnology has been involvedin a recent deployment of thiskind, carried out for fashionablehigh street optician Kite GB. The trailblazing, touch-enabledpoint of sale unit located atKite’s flagship store in London’sEast End, utilizes a PCT touchsensor with a 42-inch activearea, sourced from Zytronic.The sensor has been applied tomirror-finished toughened glassand is capable of supporting upto 40-point multi-touch opera-tion. Via the unit, customers areable to take photos of them-selves wearing different frames,then post them on Twitter,Facebook, Instagram and othersocial media platforms - so that

their friends and family can lookat the chosen frames and givetheir opinions.In addition to the Zytronic PCTsensor, the system consists of anultra-thin LCD digital signagemonitor, supplied by DisplayTechnology, with high bright-ness output, 1920×1080 pixelresolution and wide viewingangle. Moreover, the LogitechHD Pro C920 web camera pro-vides high resolution photosand video that can be stored onthe host PC, then manipulated

and subsequently uploaded.The customized software facili-tates social interaction and thesharing of content with others.Zytronic’s PCT touch sensors relyon a matrix of 10μm thick coppercapacitors, in an XY configura-tion, embedded inside a laminat-ed substrate. This protects thesensor matrix from sources ofdamage, such as scratches,impacts, extreme temperaturesand exposure to harsh chemicalsthat often compromise the lifes-pan of touch sensors based onresistive and surface capacitivetechnologies. Likewise, in con-trast to infrared (IR), optical andsurface acoustic wave (SAW)technologies, PCT negates theneed for a bezel in which toaccommodate sensors/emitters,so that sleek, attractive, smooth-fronted designs can be realized.This is particularly in keepingwith the aesthetic demands ofthe Kite project.ZYTRONIC www.zytronic.co.u

Visionary Retail Technology Empoweredby Zytronic Touch SensorsOpticians store wows customers with mirrored point ofsale system that encourages online social interaction

PRODUCT NEWS SENSORS

Image source: fotalia



X-REL Semiconductor, the specialist in high-reliability and extreme-temperature inte-grated circuits, has broadened its XTR2Nfamily of high-temperature MOSFET transis-

tors by introducing two new mid-power P-channel and two small-signal P- and N-chan-nel transistors. Intended for high-reliability,extreme temperature and extended lifetimeapplications such as power conversion,power management, level translation andsensor interfaces, the new devices provideexcellent switching and linear characteristics,as well as very low leakage current.The mid-power P-channel transistors intro-duced are divided into two familiesdepending upon the maximum operatingvoltage. Devices XTR2N0325 andXTR2N0350 are intended for a maximumoperation drain-source voltage of -30V,whereas XTR2N0525 and XTR2N0550 cansustain drain-source voltages of up to -50V.In each sub-family, two different transistorsizes, “25” and “50”, are available providingtwo possible maximum drain currents.

The small signal transistors released are theXTR2N0307 30V P-channel MOSFET, andthe XTR2N0807 80V N-channel MOSFET.The XTR2N0307 small signal 30V P-channel

has an on-state resistance at 230°C of 7Ω,whereas that of the XTR2N0807 small signal80V N-channel is 9.1Ω, with respective con-tinuous drain currents of 350mA (900mApeak) and 200mA (450mA peak).As with all other X-REL Semiconductor prod-

ucts, parts from the XTR2N transistors familyare able to reliably operate well below and

above the -60°C to +230°C (5 years at+230°C) temperature range. Being opera-tional at high temperatures is mandatory notonly in applications where the environment isat elevated temperature, but also where self-heating of a power device makes the temper-ature increase inside the application casing.Additionally, all X-REL Semiconductor prod-ucts can be used in applications running atlower temperatures (e.g. from 100°C to200°C) where extended lifetime is expectedor where failing is not an option. For example,the expected lifetime of X-RELSemiconductor parts in a driver applicationoperating at Tj=150°C is over 35 years.The XTR2N devices are already availableand can be immediately deployed on nicheas well as on large-scale markets in high-reli-ability compact hermetic or plastic pack-ages, as well as tested bare dies.A table of performance characteristics canbe found here:

X-REL SEMICONDUCTORwww.x-relsemi.com

X-REL Semiconductor extendsXTR2N0x MOSFET transistors family

International Rectifier has expanded its port-folio of 60V StrongIRFET™ power MOSFETsavailable in various standard and perform-ance power packages. The new MOSFETs,which feature ultra-low on-state resistance(Rds(on)), are designed for a wide range ofindustrial applications including power tools,Light Electric Vehicle (LEV) inverters, DCmotor drives, Li-Ion battery pack protection,and Switched Mode Power Supply (SMPS)secondary-side synchronous rectification. Available in through-hole and surfacemount packages, the expanded 60VStrongIRFET™ family includes theIRF7580M. Housed in a low profile, ultra-

compact Medium Can (ME) DirectFET®package that delivers high current densitywhile reducing overall system size and cost,

the IRF7580M is well suited for space con-strained high power industrial designs.The family of 19 60V StrongIRFET™ powerMOSFETs offers ultra-low on-state resistance(Rds(on)) for improved performance in lowfrequency applications, very high-currentcarrying capability, soft body diode, and 3Vtypical threshold voltage to improve noiseimmunity. Each device in the family is 100%avalanche tested at industry highest ava-lanche current levels to ensure the mostrobust solution for demanding industrialapplications. INTERNATIONAL RECTIFIERwww.irf.com

IR Expands Portfolio of 60V StrongIRFET™ MOSFETs for Industrial Applications

PRODUCT NEWS ACTIVE COMPONENTS


Murata announced they havecommenced mass production of,what they believe, to be thesmallest and lightest surfacemount piezoelectric sounderavailable. Occupying significant-ly less surface area, and with acombined weight and areareduction of 44% compared toprevious Murata products, thePKMCS0909E4000-R1 measuresjust 9 × 9 × 1.7mmand weighs only160mg. Soundpressure leveloutput, meas-ured 10 cm fromsounder, is bet-ter than 65dBwhen driven witha ±1.5V 4kHzsquare wave. Maximum peak-to-peak voltageis ±12.5V. Power consumption istypically 0.6mW, which helpspreserve battery life in power

budget constrained consumerelectronic devices. Since thesounder does not use any mag-nets or coils to create sound itdoesn’t generate any electricalnoise and therefore has mini-mum impact on surrounding cir-cuitry.Typical applications for thePKMCS0909E4000-R1 includeblood glucose meters, personal

thermometers, camera strobeflash and Bluetooth dongles.MURATA www.murata.eu

Ultra compact light and low powerSMD piezoelectric sounder

Intersil Corporation announcedthe TW9966 four-channel analogvideo decoder with a built-in ana-log video encoder for around-view automotive applications.Based on Intersil's market leadingmulti-channel video surveillancetechnology, the TW9966 featuresfour analog videodecoders and an analogvideo encoder integratedinto a single chip, replac-ing up to five discretecomponents to simplifydesign and save boardspace. The TW9966video decoder andencoder is optimized forautomotive applications, offeringthe industry's best analog decod-ing performance resulting inexcellent picture quality for gen-erating 360-degree surroundimages for drivers. To increase

driver safety and reduce damageto vehicles, many leading automo-tive original equipment manufac-turers (OEMs) are providingaround-view technology as anoption in their latest models. Anaround-view monitor, alsoreferred to as a surround view

monitor, processes video fromfour cameras and then combinesthe four images into a single birds-eye view as if a camera was sta-tioned directly above the vehicle. INTERSIL www.intersil.com

Intersil Announces First Single-Chip MultipleChannel Video Decoder for Around-ViewAutomotive Applications

XP Power announced the EML15 series of 15 Watt single out-put AC-DC power supplies suitable for use in medical equip-ment. Complying with 3rd edition EN60601-1, ES60601-1,CSA-C22.2 No. 60601-1, IEC60601-1 medical safety stan-dards, this extremely compact power supply is believed to bethe smallest device at this power rating available in the indus-try. The supply provides two means of patient protection(MOPP) between primary and secondary. Measuring just 62.0× 30.7 × 24.4 mm (2.44 × 1.21 × 0.95 inches) for the open-frame pcb mount version, the EML15 occupies very littleboard space and also offers a very high power density for thistype of supply of 5.3 Watts per cubic inch. With its Class IIconstruction no earth connection is required, this being idealwhere a reliable ground connection may not be available.Eight single output models are available in the common nomi-nal output voltages from +3.3 to + 48 VDC. A peak load capa-bility allows theEML15 to pro-vide 130% ofrated outputpower in orderto accommodateshort-term highpower loads.This approachallows designersto avoid havingto specify a high-er rated powersupply and savesboth extra costand board space.In addition to anopen frame PCBmounting formatother optionalmounting pack-ages are available, these include open frame chassis mountwith connectors, and encapsulated models with either PCBmounting or screw terminals. A DIN rail mounting clip is alsoavailable for use with the encapsulated screw terminal pack-age option. The EML15 series is convection cooled and ableto operate in most environments with a wide temperaturerange of – 25 degrees C to +70 degrees C. Derating is appliedabove +50 degrees C. No forced air flow or additional heatsinking is required.The series meets the limits for Class B conducted and radiatedEMC specifications of EN55022 without the need for any addi-tional external filtering components.

The EML15 is available from Farnell, element14, approvedregional distributors, or direct from XP Power and come with a3 year warranty.

XP POWER www.xppower.com

Ultra compact 15 Watt AC-DC powersupply targets medical applications



Avago Technologies announceda new family of 14.2mm opto-coupler devices, the ACNT-Hxxx,designed for high voltage appli-

cations. The ACNT-Hxxx familyconsists of three major productseries: the ACNT-H3xx, high effi-ciency gate drive optocouplersfor driving IGBTs; the ACNT-H6xL, low power 10MBd digitaloptocouplers for system controland data communications; andthe ACNT-H79x, high linearityisolation amplifiers for currentand voltage sensing applications.Features and Benefits:• Safety Approvals for CSA, UL and IEC - IEC/EN/DIN EN 60747-5-5:

VIORM = 2,262 Vpeak- UL1577: VISO = 7,500 Vrms- Robust, reliable and fail safe reinforced

insulation• 14.2mm Creepage and Clearance- Industry’s highest insulation voltage in

compact 14.2mm SSO-8 package- Meets stringent system and

equipment regulatory requirements• High Gate Driving Current and Noise

Immunity (ACNT-H3xx)- Minimum 2A output current for

driving IGBT- Minimum 40kV/µs CMR at VCM = 1.5 kV

minimizing erroneous signals in drivingIGBT in noisy environment

• Low Power Consumption (ACNT-H6xL)- Less than 20 mW - Industry’s lowest power 10MBd

optocoupler in compact 14.2mm SSO-8 package

• Excellent Linearity and Gain Accuracy (ACNT-H79x)

- Advanced sigma-delta A/D modulation technology with full differential isolation

- 0.05% linearity and -50ppm/°C gain drift for enhanced accuracy.

AVAGO TECHNOLOGIESwww.avagotech.com

Avago Technologies Introduces New Family ofOptocouplers in 14.2mm Wide Creepage andClearance for High Voltage Applications

Murata announced the ZRBseries of monolithic ceramiccapacitors (MLCC) packaged onan interposer substratedesigned specifically to reduceacoustic “squealing” noise typi-cally induced by mechanicalvibration of the capaci-tor. Available in the samesize as conventionalMLCCs, the ZRB is avail-able in EIA 0402 (1.0 ×0.05mm) and EIA 0603(1.6 × 0.8mm) packageformats with workingvoltages of 6.3, 10, 16and 25 VDC, With thisapproach, the ZRBbecomes an ideal replacementpart to update an end-applica-tion design without the need formodification of the PCB layout.This form of acoustic noise hasbecome of concern for the

electronics industry and effectsmany types of consumer elec-tronics devices such as laptops,tablets and smartphones. ThePCB can amplify the audionoise generated by the capaci-tor, so by using an interposer

substrate the MLCC becomesmechanically isolated from thePCB. Reduction in audio noisecan be achieved against a tradi-tionally designed MLCC.MURATA www.murata.eu

Murata’s MLCC with interposer substrate reducesacoustic “squealing” noise

Exar Corporation announced anaddition to its range of telecom-munications timing productswith a new family of UniversalClocks. The XR811xxseries offers a widerange of output fre-quencies from 10MHzto 1.5GHz, with ultra-low phase noise jitterof less than 200fs.Designed for commu-nications, audio/videoand industrial applica-tions, the QFN-10 andTSSOP-8 packageddevices are footprint compatiblewith industry standard synthesiz-ers, providing a superior per-formance second source option.The design of Exar’s XR811xxsynthesizers utilizes a highly flexi-ble delta-sigma modulator and a

very wide-ranging VCO in a PLLblock that has been optimized tobe extremely power efficient.With a core current consumption

of just 20mA, these parts dissi-pate 60% less power than equiv-alent competitive devices, pro-viding a very compelling powerefficiency benefit to systemdesigners. EXAR www.exar.com

Power Integrations announcedits LYTSwitch™-2 family of iso-lated LED drivers. The new ICfamily, which delivers up to 12watts of accurately controlledoutput power, substan-tially reduces compo-nent count, resulting insimpler, smaller, morereliable LED lightingdesigns. LYTSwitch-2 LED-driverICs use primary-sidecontrol, resulting in cost-effective, single-sidedPCBs with low compo-nent counts. In addition, driverisolation allows the LEDs to beaffixed directly to a metal heatsink, avoiding the addedexpense of an electrically isolat-ing enclosure that is oftenrequired for non-isolated driv-ers. Accurate constant-current(CC) output tolerance acrosstemperature (better than ±5%at both low-line and high-linevoltages) reduces the need toover-design systems in order tomeet requirements such as theU.S. ENERGY STAR® minimum-

lumens-delivered specification.Designs using LYTSwitch-2 ICsare also highly efficient – up to90% in typical applications.LYTSwitch-2 ICs protect the LED

load from surges in line voltage,increasing bulb lifetime inregions where the mains voltageis subject to frequent peaks. Theconstant-current and constant-voltage (CC/CV) control func-tion maintains a constant voltageon the output of the driver dur-ing no-load operation, prevent-ing damage to the output filteror shutting down the driverwhen being tested or installedwith no LED string connected.POWER INTEGRATIONS www.powerint.com

New LYTSwitch-2 Isolated LED-Driver ICs fromPower Integrations Deliver More Output Power

Exar Offers Wide Frequency Universal Clocks withUltra-Low Jitter


Avago Technologies announceda new series of 3-channel reflec-tive optical encoder devices, theAEDR-87xx. The devices areideal for use in low power minia-turized motion control systemssuch as stepper motors, electri-cal actuators, piezoelectricdrives and portable medicalappliances. Expanding uponprevious genera-tion devices, thenew AEDR-87xxwith encodingresolution up to318 lines per inch(LPI) supports3.3V and 5V sup-ply voltage forlow power applications and dualanalog outputs interfacingdirectly with external interpola-tor for high precision motioncontrol measurements. Thedevices are packaged in indus-try’s smallest form factor for 3-channel reflective opticalencoder. “Reflective opticalencoder technology is vital to

many miniaturized motion controlsystems. As modern appliancesget smaller in size and consumeless power, so too are the criticalcomponents such as a motioncontrol encoder embeddedinside many of these appliances,”said Hassan Hussain, vice presi-dent and general manager of the

Motion Control Product Division(MCPD) at Avago. “Avago’s latestAEDR-87xx is the best-in-classreflective optical encoder solu-tion with added flexibilityaddressing a wide range of designchallenges for modern miniatur-ized motion control systems.”AVAGO TECHNOLOGIESwww.avagotech.com

Avago Technologies Introduces New Series ofReflective Optical Encoders for Low PowerMiniaturized Motion Control Systems

Mouser Electronics, Inc. is nowshipping the AD9139 digital toanalog converter (DAC) fromAnalog Devices. The AD9139 isa 16 bit DAC with a high dynam-ic range and a sampling rate of1.6 Giga-samples per second(Gsps). The AD9139 digital toanalog converter, available fromMouser Electronics is a highspeed, high dynamic range DACwhich permits multicarrier signalgeneration up to the desiredNyquist frequency. These fea-tures specifically target wide-band communications systemsand high speed instrumentation.Latency between the 16 bit digi-tal input and the output analogsignal is as low as two DAC clockcycles. The 16 bit word to beconverted can be loaded intothe DAC as a 16 bit word or as 8

bit bytes, making this device suit-able for use with 8-bit microcon-trollers. A high performance, lownoise phase lock loop (PLL) is on-chip to reduce component

count. The AD9139 is designedfor low power and draws only700mW when converting at1230 Msps. A proprietary filterprovides for very low noise thatminimizes signal distortion of theoutput signal. A 16 bit LowVoltage Differential Signaling(LVDS) bus is both byte andword addressable.MOUSER www.mouser.com

Analog Devices AD9139 16 bit 1.6Gsps DAC Availablefrom Mouser Electronics Murata announced the NCM6

series of isolated 6 Watt singleand dual output DC/DC convert-ers from Murata Power Solutions.Accommodating up to an ultrawide 4:1 input range, these DC-DC converters are available inthree nominal input voltageranges of either 5VDC input(4.5 – 9VDC 2:1 range),12VDC (9 – 36 VDC 4:1range) or 48 VDC (18 –75VDC 4:1 range). Eachnominal input voltage variantoffers seven output voltagemodels. Four of these are sin-gle output versions with+3.3, +5, +12 or +15VDCoutput. Three dual output mod-els provide +5, +12 or +15VDCoutput options. Recognition ofcertification to international safe-ty standards UL60950 for ITequipment and 3rd edition med-

ical safety standard UL60601 for2 MOOP is pending. The DC/DCconverters are encapsulated inorder to achieve high levels ofthermal performance and arehoused in an industry standardpackage measuring 20.0 × 32.0 ×

10.75 mm. The operating tem-perature range is from – 40 to+85°C and the device is protect-ed against damage due to excessoperating temperatures. MURATA www.murata.eu

With the single chip audiopower amplifier TB2909FNGfrom Toshiba, distributorRutronik offers a compact solu-tion, that adds the sound of aconventional internal combus-tion engine to elec-tric and hybrid elec-tric vehicles to ensurea minimum level ofsound. Electric andhybrid electric vehi-cles operating in all-electric mode aremuch quieter thanvehicles driven byinternal combustion engines. Toprotect other road users, severalvehicles are equipped with anacoustic vehicle alerting system(AVAS). It is anticipated that suchsystems will become moreprevalent as legislators seek toestablish a minimum level andtype of sound for low-speed, all-electric operation. Due to roadusers’ familiarity with traditionalvehicles, a preferred sound isthat of a normal vehicle engine.The TB2909FNG power IC is a

single-channel, Class-AB, single-ended push-pull (SEPP) amplifierspecifically developed to ampli-fy the simulated sound of a con-ventional engine. The deviceoperates from a supply of

between 6 and 16V and candeliver a maximum outputpower of 5W. Total harmonicdistortion (THD) is rated at0.08% for an output power of0.125W and output noise volt-age is 50μV. Guaranteed opera-tion between -40° and +110°Csupports use in EV warningsound systems where stable per-formance and extended temper-ature is required.RUTRONIKwww.rutronik.com/89da1022.l

Rutronik presents Single Chip AudioPower Amplifier from Toshiba

6 Watt encapsulated DC-DC converter with 4:1 inputrange meets 3rd edition medical safety standard





XP Power extends range oflow power AC input LED driversXP Power announced additions to the DLE series ofAC input LED drivers. Adding to the extensive rangeof 15 – 60 Watt LED drivers, the DLE25 & 35 series ofAC input LED drivers incorporate universal input withactive power factor correction in a two power stagedesign, eliminating flicker while providing a high effi-ciency solution. Designed as a class II isolation product,without the need for a safety earth, DLE series LEDdrivers are also approved as a class 2 limited powersource, making them suitable for a wide range of LEDapplications. Dimmable constant current versions areavailable with the facility for PWM, voltage and resist-ance programming.

Packaged in an IP67-rated enclosure measuring 93.5 ×73.5 × 33.0 mm (3.68 × 2.89 × 1.29 inches), the driversare protected against dust ingress and are waterproofto depths up to 1 metre making them suitable for usein almost any outdoor application. Typical operatingefficiency is in the range of 78% to 83%.Accommodating the extended universal input voltagerange from 90 VAC up to 305 VAC the DLE series sup-ports the 277 VAC system used in the United States.The series complies with EN61347 and UL8750 safetyapprovals and to Class B conducted and radiatednoise limits as specified by EN55015. The DLE25/35series is available from Farnell, element14, Digi-Key,approved regional distributors, or direct from XPPower and come with a 3 year warranty.

XP POWER www.xppower.com

IQD’s new IQXT-210 series TCVCXO,offers frequency stabilities down to±0.14ppm over the full industrial tem-perature range of -40 to 85 degreesC. This new model is approachingOCXO performance levels, whilstbeing packaged in a miniature 8-pad5 × 3.2mm package. Powered from a3.3V supply the IQXT-210 has a typi-cal current draw of only 12mAdependent upon the frequency,which can be specified between10MHz to 50MHz. 11 standard fre-quencies are initially offered, includ-ing 12.8MHz, 19.2MHz and 26.0MHz.Output can be specified as eitherHCMOS, 15pF load or Clipped Sine,into 10k Ohms load. The oscillatorcan be specified to include variouspulling range options, from ±5ppm to±10ppm and also ±10ppm to±15ppm. This enables the frequency

to be adjusted by a fixed amount forvarious applications and also allowsfor the oscillator to be used remotely.The IQXT-210 is primarily designed forlow power consumption applicationssuch as Femtocells, Smart WirelessDevices, Fibre Optic Networking(PON), Microwave SatelliteCommunications, LTE/4G Base Stations,

Backhaul Infrastructure, PacketTransport Network (PTN) ComputerNetworking, RF Modules, Wi-Fi plusTest & Measurement Equipment.IQD www.iqdfrequencyproducts.com

New TCVCXO from IQD delivers ±0.14ppm stability in a 5 × 3.2mm package

TTI, Inc., the world’s leadingspecialist distributor of passive,connector, electromechanicaland discrete components, nowstocks a new diodefrom Vishay. Partof the SurfLight™portfolio fromVishay, the VSMY98545 series is aninfrared, 850nmemitting diodebased on surfaceemitter technolo-gy with high radi-ant power and intensity, as wellas high speed and high reliabili-ty. It comes molded in a lowthermal resistance SMD pack-age with lens. A 42 mil chip pro-vides outstanding low forwardvoltage and allows DC opera-tion of the device up to 1A andup to 5A pulses.Further technical details of the

VSMY98545 series diodeinclude an angle of halfintensity of φ = ± 45°, low ther-mal resistance of Rthjp =

10K/W, a floor life of 168 h,MSL 3, according to J-STD-020.The components also benefitfrom lead (Pb)-free reflow sol-dering. Main target applicationsare infrared illumination forCMOS cameras (CCTV), illumi-nation for cameras (3D gaming),machine vision and 3D-TV.TTI, INC. www.ttieurope.com

Vishay’s high radiant power and high speedVSMY98545 series infrared emitting diode cannow be ordered through TTI, Inc.

Omron Electronic ComponentsEurope is addressing lightingcontrol with two new energysaving latching relays featuringthe capacity to handle the highinrush currents associatedwith this application.The new Omron G5RLU/K latching relays arealso ideal for movementcontrol, smart meter,power line switching andPV inverter applications.Latching relays are onlyenergised while switching anduse less power than non-latchingdesigns in most applications.Commenting, Fabrizio Petris,Global Application OrientedTeam Manager - BuildingAutomation, at Omron said,“Capacitors used in fluorescentlamps as starters and in parallel toLED drivers lead to particularlyhigh inrush currents in lighting cir-cuits. Omron’s new latching relaysare a great switching solution forthis and other energy manage-

ment applications, offering proba-bly the best price performance onthe market.” Both the G5RL-Uand the G5RL-K can switch up to16A and are capable of dealing

with inrush currents of up to150A. Both are offered in SPST-NO form, and are approved to aVDE standard demanding resist-ance to over 150A inrush. Theyalso carry UL TV-8, a standardthat exposes components to117A inrush currents. The G5RL-U features a single coil whilst theG5RL-K has a double coil archi-tecture. An SPDT version is alsoavailable, though the specifica-tions for this device are lower.OMRON http://components.omron.eu

Omron launches new lighting control relay

Printing semiconductor devicesare considered to provide low-cost high performance flexibleelectronics that outperformamorphous silicon thin film tran-sistors currentlylimiting develop-ments in displaytechnology.However thenanoparticle inksdeveloped so farhave requiredannealing, whichlimits them tosubstrates thatcan withstandhigh tempera-tures, ruling out alot of the flexibleplastics that couldotherwise beused. Researchersat the NationalInstitute ofMaterials Scienceand OkayamaUniversity inJapan have nowdeveloped ananoparticle inkthat can be used with room-temperature printing proce-dures. Developments in thin filmtransistors made from amor-phous silicon have providedwider, thinner displays withhigher resolution and lowerenergy consumption. Howeverfurther progress in this field isnow limited by the low responseto applied electric fields, that is,the low field-effect mobility.Oxide semiconductors such asInGaZnO (IGZO) offer betterperformance characteristics butrequire complicated fabricationprocedures. Nanoparticle inksshould allow simple low-costmanufacture but the nanoparti-cles usually used are surroundedin non-conductive ligands – mol-ecules that are introduced dur-ing synthesis for stabilizing the

particles. These ligands must beremoved by annealing to makethe ink conducting. TakeoMinari, Masayuki Kanehara andcolleagues found a way around

this difficulty by developingnanoparticles surrounded byplanar aromatic molecules thatallow charge transfer. The goldnanoparticles had a resistivity ofaround 9 × 10-6 Ωcm – similarto pure gold. The researchersused the nanoparticle ink toprint organic thin film transistorson a flexible polymer and apaper substrate at room tem-perature, producing deviceswith mobilities of 7.9 and 2.5cm2 V-1 s-1 for polymer andpaper respectively – figurescomparable to IGZO devices.As the researchers conclude intheir report of the work, “Thisroom temperature printingprocess is a promising methodas a core technology for futuresemiconductor devices.”MANA www.nims.go.jp/mana

A cool approach to flexible electronics



A nanoparticle ink that can be used for printingelectronics without high-temperature annealingpresents a possible profitable approach for manufacturing flexible electronics.

Fully printed organic thin film transistors(OTFTs) on a paper substrate. (a) Schematicof the device structure for a fully printedOTFT on paper. (b) Arrays of fully printedOTFTs fabricated on a paper substrate inkjetprinted with the NIMS logo before addingthe device. (c) An optical microscope imageof fully-printed OTFT arrays. (d) A magni-fied optical microscope image of the individ-ual device. Arrays of fully printed organicthin film transistors fabricated on paper sub-strates that had the the NIMS logo ink jetprinted on before processing.


INDUSTRY NEWS CLEANING TECHNOLOGY

Aqueous part cleaning with alkaline, neutralor acidic media ranks among the most widelyemployed technologies in many industries,e.g., automotive manufacturing and its tieredsuppliers, medical equipment production,mechanical workshops performing machin-ing, punching, drawing or bending tasks, pre-cision mechanics and optical systems.Application levels range from coarse to inter-mediate and, ultimately, fine cleaning. DürrEcoclean's new EcoCWave system, supersed-ing the existing Universal 81W line, coversthis entire application spectrum thanks to itsmodular, forward-looking technology. Withits very small footprint the system can easilybe integrated in any production process. Italso provides versatility, being easily adapt-able to changing cleanliness and throughputspecifications so that the user will enjoyinvestment certainty.

Intelligent technology yields superior cleaning qualityThe EcoCWave is equipped with two orthree flooding tanks, depending on customerspecifications. The tanks exhibit a flow-opti-mized rounded geometry and are of upright

design. Unlike the low-mounted rectangularcontainers used in conventional aqueouscleaning equipment, the round tanks preventthe formation of chip and dirt traps. Improved cleaning quality and a longer serv-ice life of the cleaning fluid are the result.Moreover, each tank has its own separate

fluid circuit comprising full-flow filtration. Thecleaning and rinsing fluid is filtered on fillingand draining as well as in the bypass. Bag fil-ters or cartridge filters can be fitted in a com-bination-type filter housing. The system's fil-tration characteristics can thus be adapted tochanging cleanliness requirements quickly

Superior quality, cost-efficiencyand process reliability in aqueousparts cleaning

EcoCWave by Dürr Ecoclean:

With its EcoCWave, Dürr Ecoclean has developed an innovative equipment sys-tem for aqueous cleaning processes which can handle a wide range of tasks –from coarse to fine cleaning – in an efficient manner. To this end, the new all-round talent comes with a list of features which ensure superior cleaning qualityand process reliability, shorter idling times, and major energy savings. Moreover,this flexible machine sets standards in terms of space demand, operator-friend-liness and design.

Thanks to its design the new EcoCWave does not only meet anycleaning task but also cares for optimized quality and efficiency incleaning processes.



and without any hardware modifications.Another contributor to improved perform-ance is the optimized rollover unit in theworking chamber. It ensures that the fluidand mechanical cleaning devices – e.g., ultra-sonic units and spraying nozzles – can reachthe product effectively from all sides. Inaddition, the design of the rollover unit min-imizes fluid drag-out.

Faster processes cut per-unit costsPowerful pumps and large-diameter pipingused throughout the EcoCWave acceleratethe operations of filling and draining thework chamber and tanks. As a result, non-productive times are minimized, productthroughput is increased and per-unit clean-

ing costs are reduced. These improvementsbenefit spray cleaning processes as well.Here, an increased number of nozzles work-ing in optimized arrays deliver a more effec-tive cleaning performance and hence, short-er cycle times even in removing coarse con-tamination. In order to shorten cycles stillfurther, the vacuum drying system availablein addition to hot-air drying has also beenimproved.

Equal to any cleaning taskDue to the use of variable-frequency drivenpumps, volumetric flow rates can be adjust-ed precisely as needed. Major energy sav-ings are achievable as a result. On the otherhand, the cleaning process can be selective-

ly adapted to meet specific requirements.Thus, different work chamber filling levelsmay be defined in immersion processes,e.g., with filling and draining cycles suitablefor cleaning parts having blind holes or com-plex geometries. An intense fluid exchangein critical component areas substantiallyboosts the system's cleaning performance. Inspraying processes, the jet strength can beadapted exactly to the part beingprocessed. Moreover, the ability to controlthe spraying pressure expands the range ofcleaning agents that can be used.Continuous reconditioning of the rinsingfluid is provided by an Aquaclean systemwhich can be integrated into the machine.The cleaning fluid in the first flooding tank isheated entirely by waste heat from theevaporation process.

Flexibility includes adaptable batch volumeThe EcoCWave has a vacuum-tight workchamber designed for batches measuringup to 670 × 480 × 300 mm. As an alternative, an enlarged work chamberfor 670 × 480 × 400 mm containers may beinstalled without enlarging the footprint.The volume adapted batch configurationreduced per-unit costs.

Easy operation with process visualizationA new colour display with self-explanatorypictographs makes the EcoCWave easy, fastand reliable to operate. Diverse processdata such as the work chamber fluid levelare indicated in real time by the built-inprocess visualization system. An acquisitionof all relevant process parameters (e.g., forthe development of cleaning programs) canbe implemented optionally.

Exterior design: space-saving and open to modificationApart from its high performance, DürrEcoclean's engineers focused their attentionon minimizing the system's footprint.Accordingly, a machine configured with twoflooding tanks needs only 1.8 sq.m. of floor-space. The EcoCWave features a stylishappearance with integrated loading systemand all-round safety-glazed enclosure. n

Contact:Dürr Ecoclean GmbH, Rainer Straub, Sales, Tel. +49 711 7006-246, [email protected]

Unlike the low-mounted rectangular containers used in conventionalaqueous cleaning equipment, the round tanks prevent the formationof chip and dirt traps.



It may have been only eight months sinceparts2clean 2013, but parts2clean 2014served up all the quality and quantity itsexhibitors and visitors were hoping for andmore. In this, its twelfth season, the interna-tional trade fair for industrial-parts and sur-face cleaning was co-located with the O&Sinternational trade fair for surface treat-ments and coatings for the very first time.Held from 24 to 26 June, the premiere ofthis double act brought over 10,900 visitorsto the Stuttgart Exhibition Center. “Theresulting synergies were a major plus for theexhibitors and visitors of both parts2clean andO&S,” said Olaf Daebler, the project direc-tor in charge of the two fairs at DeutscheMesse. “Sixty-two percent of all O&S visitorsalso attended parts2clean.” As a result, thepost-show visitor statistics for parts2cleanindicate that the show attracted no fewerthan 8,460 visitors, which is just on 70 per-cent up on parts2clean 2013. Twenty-onepercent of these visitors came from outsideGermany, as compared with 20 percent in2013. In all, 33 countries were representedin their number.

The visitor cross-over between the twoshows was greeted with enthusiasm byexhibitors, including Nathalie Etienne, CEOof Weber Ultrasonics GmbH: “For us as man-ufacturers of ultrasound components, there

were definitely major synergies with O&S.Given our product range, we actually need tohave a presence at both of these trade fairs,and so this year it was great to achieve thatwith a single showcase. This year’s parts2cleanwent very well for us.”

parts2clean 2014 featured 269 (2013: 265)exhibitors from 14 countries. It occupied6,627 square meters (71,332 sq. ft.) of netexhibition area, up a good four percentcompared with 2013.

Quality visitors with decision making authority and firm investment intentionsThe gains this year were not purely quanti-tative. Exhibitors were equally pleased withthe high level of technical understandingand decision making authority of the visitorsthey encountered. In their survey forms, 86percent of the visitors indicated that theywere involved in their organizations’ opera-tional investment decisions, and 51 percentsaid they were at the show with concrete

parts2clean 2014(24 to 26 June)

parts2clean attracts record visitor turnout– Synergies with O&S boost trade visitor count– Motivated buyers: over 50% of visitors came with definite capital investment

projects in mind



investment projects in mind. “parts2clean iswell established in the market and is veryeffective at targeting visitors who are interest-ed in industrial parts cleaning. The meetingsand dialogue we had with visitors this yearwere of an even higher quality than in previ-ous years. We believe this is due in part to thefact that this year’s parts2clean, coming as itdid only eight months after the previous show,had a higher-than-usual concentration of seri-ous visitors with concrete capital investmentprojects in mind. The other reason, webelieve, is that companies are generally takingindustrial cleaning more seriously thanbefore,” said Rainer Staub, Sales Director atDürr Ecoclean GmbH.

parts2clean 2014 also went well for LPWReinigungssysteme GmbH, as its CEO,Gerhard Koblenzer, reports: “We are verysatisfied with this year’s parts2clean. The qual-ity and quantity of the visitor contacts wemade this year were on a par with last year, ifnot better. Every year, the ratio of newprospects to existing customers in the contactswe make works out at about 60:40. Anotherinteresting thing this year is that we encoun-tered a fairly high number of visitors from out-side Germany – from places like Turkey, India,China and Eastern Europe.”

Apart from Germany, the most heavily rep-resented countries in terms of visitor num-bers were Switzerland, Austria and Italy, fol-lowed by the UK and France.

Betul Coker, a Freelance Business Consultantat Intersonik, Turkey, is also happy with this

year’s show: “parts2clean is a specialist tradefair that enables us to establish and build newbusiness relationships. This year, we also encountered relativelystrong interest from commercial agents. Ourparts2clean showcase attracted a lot ofGerman-based visitors, but also high numbersof industry professionals from other countries,such as the UK, Sweden, Finland, Denmark,Switzerland, the Czech Republic and France.We are very satisfied with this year’s show andwill be back again in 2015.”

Another person who will definitely be backat parts2clean in 2015 is Chuck Sexton,Sales Manager Industrial Products at Kyzen,USA: “parts2clean always gives us a whole lotof quality new contacts. And, no less impor-tantly, it’s also a great opportunity to manageour relationships with plant manufacturers. Wesell cleaning chemicals that are used in indus-trial plants, and so it’s always nice to come to ashow like this, where we can meet up withlarge numbers of them at one convenientlocation. We’ll definitely be exhibiting again atparts2clean in 2015.”

This year’s parts2clean show attracted visi-tors from all key industries. The followingindustries were among the most strongly

represented: mechanical and plant engi-neering, automobile and automotive com-ponents, metalworking, chemical andprocess engineering, surface technologyand processing, electronics and electrical,plastics processing, medical and pharma-ceutical equipment, precision engineering

and optics, micro-tool- and micro-mold-making, and aeronautics. And it’s clear thatthe visitors were satisfied with the show’sexhibition offering, given that 94 percent ofthem said they would recommendparts2clean to others and 60 percent saidthey already had definite plans to attendagain in 2015.

Upcoming surface technology showsby Deutsche MesseDeutsche Messe’s next surface technologyshow in Germany is the SurfaceTechnologyfair, which is part of the HANNOVER MESSEindustrial technology fair that runs from 13to 17 April 2015. parts2clean is an annualshow, whereas O&S is two-yearly, meaningthat the next parts2clean show will be a soloaffair, running from 9 to 11 June 2015, andthe next parts2clean/O&S double act will beheld from 31 May to 2 June 2016.

Deutsche Messe’s next overseas trade fairswith surface technology content are SurfaceTechnology INDIA, which runs from 10 to13 December 2014 in New Delhi andincludes a parts2clean pavilion, and SurfaceTreatment EURASIA, which runs from 12 to15 February 2015 in Istanbul, Turkey, andlikewise features a parts2clean pavilion.

Contact person for further information on parts2clean:

Deutsche MesseOnuora [email protected]

www.parts2clean.de

EP&Dee no 7

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