Top Banner
EP&Dee DESIGN & MANUFACTURING MAY , 2015 - ISSUE NO. 4, VOL. 13 ELECTRONICS PRODUCTS & DESIGN - EASTERN EUROPE THE EAST EUROPEAN RESOURCE FOR EMBEDDED APPLICATIONS
54

EP&Dee no 4

Jul 22, 2016

Download

Documents

Jorge Reyes

Electronics Products & Design - Eastern Europe - The May issue
Welcome message from author
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
Page 1: EP&Dee no 4

EP&DeeDESIGN & MANUFACTURING MAY, 2015 ­ ISSUE NO. 4, VOL. 13

E L E C T R O N I C S P R O D U C T S & D E S I G N ­ E A S T E R N E U R O P E

THE EAST EUROPEAN RESOURCEFOR EMBEDDED APPLICATIONS

Page 2: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu2

Table of Contents

MAY 2015

EUROSTANDARD PRESS 2000

Tel.: +40 31 805 9955

Tel: +40 31 805 9887

[email protected]

www.esp2000.ro

VAT Registration: RO3998003

Company number: J03/1371/1993

EP&Dee (Electronics Products & Design ­ Eastern Europe) is published 10 times per year in

2015 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering

decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.

© 2015 by Eurostandard Press 2000

EP&DeeSubscriptions:

office@epd­ee.eu

EP&DeeWeb page:

www.epd­ee.eu

Group Publishing DirectorGabriel Neagu

Managing DirectorIonela Ganea

AccountingIoana Paraschiv

AdvertisementIrina Ganea

WEBEugen Vărzaru

Contributing editorsRadu Andrei Ross Bannatyne

ConsultingMarian BlejanBogdan GrămescuMihai Savu

Asian Reprezentative Taiwan Charles YangTel: +886­4­3223633

[email protected]

DESIGN FEATURES

10 FPGAs Rev Up Motor Control System - Efficiency, Performance and Design FlexibilityElectric motors collectively consume a substantial portion of global electricity. According to the research firm IHS Technology, 96 percent of a motor’s lifetime costs are represented by pure electricity costs. Regulators have imposed more stringent energy standards for them, and manufacturers are scrutinizing their sizable contribution to equipment total cost of ownership (TCO). This has led to more complex motor control designs that use sensor-based and sensorless feedback loops and advanced algorithms for more precise control and greater motor efficiency.

12 Adding Intelligence to ControlThere are few applications addressed by integrated electronics that don’t require some modest form of power regulation, be that a simple current/voltage supply or a more sophisticated and optimised solution.

18 Commitment phobic? Not us

19 Kinetis MCU: A low power profileIn an embedded system, it is all about being more energy efficient across the application’s tasks, which can generally be broken into three phases: Initialization,Control and the Compute. To reduce power consumption the equation is simple, reduce the area underneath the curve; in essence, do more with less power and time.

20 Open source - sensor fusion

23 Distec now runs embedded DisplayPortEffortless control of TFT displays with PrismaECO-eDP controller board and LVDS2eDP interface.

24 Smart Analog / sensor technology Article

27 ASIC Redesign – The Answer for Discontinued PartsMAZeT Offers Redesign of Digital and Mixed-Signal ASICs that De-livers Long-Term Availability and Optimization.

28 Design a 15Amp DC/DC Converterin 15 MinutesThe proliferation of fully integrated power modules allows power engineers to quickly design a fully functional, stable, efficient DC/DC converter that meets all system requirements. Using the XR79115 from Exar as a design example, we shall demonstrate that the design can be completed in a few minutes.

30 More efficient water meters thanks to new sensors32 Temperature measurement in the brewing industry

45 Telenor Connexion helps Leading Light develop smart street lightingLeading Light has partnered with Telenor Connexion to develop a connected lighting solution launching in 2015. ActiveLights™ online will reduce the maintenance cost and provide new information services that are requested by customers.

46 MAZeT – Specialists in OPTO-ASICsJENCOLOR® color sensors and systems for light control and customized signal processing through to Opto-ASIC designs and user-specific hardware solutions.

PRODUCT NEWS

Embedded Systems(p 4, 5, 6, 7, 8, 9, 16, 17, 22)(p 23, 27)Sensors (32, 34, 35, 36, 37)Active Components(p 38 - 44)Lighting Solutions/Display(p 47)Passive Components(p 52 - 53)

8

38

95

52

449

6

Page 3: EP&Dee no 4
Page 4: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu4

Wearables developers can now immediately evaluate galvanic skin response (GSR) sens-ing with the MAXREFDES73# reference design from Maxim Integrated Products, Inc.

Applying GSR (measurementof skin's conductivity) is achallenge because designersneed to manipulate severaldiscrete chips and calibrationsoftware before completingthe sensor design. TheMAXREFDES73# integratesdigital-to-analog (DAC) andanalog-to digital (ADC) con-verters, a microcontrollerwith advanced power man-agement, firmware, and aneasy-to-use Android® appinto the industry’s first GSRreference design. Now

designers of wearables can save development and testing time, and quickly bring theirmobile medical and fitness products to market. Offered in a wristband form factor, theMAXREFDES73# includes body surface temperature readings, Bluetooth® communica-tions, and a rechargeable battery that lasts up to one week on a single charge.

Key Advantages• Fast time to market: integrates DAC and ADC signal chain components, low-power

microcontroller, external Bluetooth and Android apps, and firmware components to quickly develop and test designs

• High accuracy: 16-bit integrated analog front-end (AFE)• Low power consumption: operates for one week on one battery charge

“We based MAXREFDES73# on our award-winning MAX32600 wellness microcontroller,and are giving wearables developers a highly integrated reference design,” said SethMessimer, Business Manager for Medical Microcontrollers at Maxim Integrated. “Withall the integrated components, our customers are 80% done already, saving them designand evaluation time.”

The MAXREFDES73# reference design is available for $189 at Maxim's website and selectfranchised distributors. Hardware and firmware design files, as well as test data, are provid-ed free and available online.

MAXIM INTEGRATED www.maximintegrated.com

Accelerate Wearables Development with Industry’sFirst Reference Design for Galvanic Skin Response

Altera FPGAs Help EnableDeployment of Harris

Corporation’s Latest Falcon IIIWideband Tactical Radio

Altera Corporation announced that its 28 nmCyclone® V field-programmable gate arrays(FPGAs) have been chosen by HarrisCorporation for its newest Falcon® III wide-band tactical radio.The radio, currently in production, has beendesignated by the U.S. National SecurityAgency (NSA) to be NSA Type-1 certified,enabling Harris to field the radio for securevoice and data communications.

Altera also announced it has successfullycompleted the NSA Information AssuranceDirectorate (IAD) Secure ImplementationGuidelines (SIG) document, which providesunified government recommendations onthe use of security settings in Altera FPGAand SoC products and how these productscan be used most securely to mitigate securi-ty threats in system designs.Harris Radio in a Smaller Package withIndustry-Leading Longer Battery Life Facedwith weight, power and battery life con-straints when designing applications fordemanding military field operations, Harrischose Altera Cyclone V FPGAs to implementthe radio modem and cryptography function-ality. Altera’s Cyclone V FPGAs offer lowpower, small packaging and quick time-to-market, enabling Harris to deliver a smaller,lighter secure radio with a significantly longerbattery life to soldiers in the field, ahead ofthe competition. For information on Altera’scomprehensive FPGA and SoC product port-folio, including FPGAs, SoCs with embeddedARM® processors, Enpirion® power controlsolutions and the industry’s most extensive setof military system solutions, contact your localAltera sales representative.

ALTERA www.altera.com

INDUSTRY NEWS EMBEDDED SYSTEMS

Maxim Integrated’s MAXREFDES73# improves accuracy, dynamicrange, and power consumption for sensing galvanic skin response inmobile medical and fitness applications.

Page 5: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 5

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has reclaimed the number-one posi-tion in worldwide 8-bit microcontroller (MCU) revenue, according toindustry analyst firm Gartner’s just-published 2014 rankings. This vali-dates Microchip’s unwavering commitment and innovation efforts for its8-bit PIC® microcontroller portfolio.While many MCU vendors have deemphasized their 8-bit offerings inrecent years, Microchip has continued to innovate across all of its 8-bit,16-bit and 32-bit product lines. And it continues to grow market share inall three areas, according to Gartner’s 2014 report. In the 16-bit MCUmarket, Microchip was the fastest-growing supplier among the top 10 in2014, growing at greater than 2X the rate of any of the other top 10 com-panies. Its 32-bit MCUs broke into the top 10 ranking of 32-bit MCU sup-pliers for the first time in 2014, based on 42.3% growth.

“We are pleased to report that Microchip has regained the #1 position for8-bit microcontrollers,” said Steve Sanghi, Microchip’s president and CEO.“Four years ago, it took the merger of three Japanese semiconductor giants -NEC, Hitachi and Mitsubishi in the form of Renesas - to knock us off the #1spot for 8-bit MCUs. We said at the time that we would work relentlessly togain market share and wrest back the #1 spot. Following their merger in2010, Renesas’ 8-bit MCU business was 41% larger than ours. In every yearsince 2010, we closed the gap, and in 2014 we regained our leadershipposition, finishing 10.5% higher than Renesas.”

8-bit PIC MCUs provide developers with an easy migration path from 6to 100 pins, with little or no code change required. This MCU portfoliooffers product families with varying levels of intelligent integration,including a host of Core Independent Peripherals, which require little tono CPU intervention, freeing the core to perform other application tasks.Also integrated are Intelligent Analog peripherals, including op amps,comparators, ADCs, DACs and CTMUs; Human Interface peripherals forLCD displays and mTouch® capacitive sensing; and Communications chan-nels for Ethernet, I2C™, SPI, USB, CAN and LIN (EUSARTs). The MPLAB®Code Configurator plug-in for Microchip’s IDE makes it easy to takeadvantage of all this integration, by generating seamless, easily under-stood C code for quick insertion into projects.

MICROCHIP TECHNOLOGY www.microchip.com/Homepage-042715a

Microchip Reclaims Top 8-bit MicrocontrollerRevenue Ranking

INDUSTRY NEWS EMBEDDED SYSTEMS

Win a PIC32 Bluetooth Starter Kit from EP&Dee! The PIC32 Bluetooth Starter Kit (DM320018) is a low-costBluetooth development platform featuring thePIC32MX270F256D MCU. This kit features a HCI-basedBluetooth radio, pushbuttons, Cree high-output multi-color LED, standard single-color LEDs, accelerometer, tem-perature sensor and GPIO for rapid development ofBluetooth Serial Port Profile (SPP), USB and general pur-pose applications.The PIC32 Bluetooth Starter Kit provides a low-costmethod for the development and testing of Bluetoothdata transfer with PIC32 devices. The starter kit features aBluetooth Radio, a combination 3-D accelerometer andtemperature sensor, 16 Mb SPI Flash, an on-board debug-ger, five user buttons, as well as USB (Device and Host), I2S,I2C, and UART Interfaces.

The Starter kit offers an Android App, Demo code andBluetooth Serial Port Profile stack for free to get you start-ed. The PIC32 MCU on the Starter kit executesMicrochips’ Free Bluetooth SPP stack & Demo Code toperform full-duplex data transmission over the Bluetoothlink to showcase:• Color Mixing of Cree High Output Multi Color LED• Temperature Display

Win a PIC32BluetoothStarter Kit

For the chance to win a Microchip PIC32 Bluetooth Starter Kit, visit:

www.microchip-comps.com/epdee-pic32bluetooth

2014 Market Share Grows in 8, 16 and 32-bit MCUs;Breaks Into Top 10 for 32-bit

Page 6: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu6

INDUSTRY NEWS EMBEDDED SYSTEMS

Round Solutions, a leading engineering and service specialistfor IoT technologies, has launched its wireless PingPong IoTedge node, a flexible and powerful hardware platform for con-necting field devices to the cloud.

The RTOS supporting small form factor board with powerfulMicrochip PIC32MZ 32-bit MCU and a high-speed cellularTelit module is based on a modular hardware design principlethat simplifies the integration of custom-specific applicationsand communication standards into a single solution platform.Target applications range from cloud-connected oil tanks andintelligent waste bins up to cloud-connected gateway systemsfor manufacturing robots.

“Our PingPong platform offers software engineers an application-ready, pre-validated PingPong data exchange mechanism whicheases the IoT integration of any field device,” explains Ben Hoelke,CEO of Round Solutions. “With the supplied Round SolutionsOpen Source PingPong Software Development Kits the platformcan be configured for nearly all IoT/M2M applications, such as sen-sor reading, asset tracking, routers, measurement technology,telemetry and security control. Thus, Round Solutions' PingPongoffers companies wanting to transfer their data to IoT cloud-serversa complete solution including software libraries and source code.”

The PingPong hardware platform offers high-speed cellularmodules for the IoT connectivity as well as numerous interfacesto the field - which can also be controlled via the cloud. The stan-dard interfaces include, for example, Ethernet, USB and CAN aswell as a high-precision GNSS (Global Navigation SatelliteSystem). Developers can add various expansion cards to create anearly unlimited number of application scenarios. Application-ready expansion cards are available for WLAN, Bluetooth, I/0,Iridium satellite communications, ISM/RF, SigFox, NFC/RFID andcamera connectivity. All functions are ready for use as soon asthe expansion cards are attached to the motherboard.

ROUND SOLUTIONS www.roundsolutions.de

Round Solutions' wireless 'PingPong' IoTedge node platform connects field

devices to the cloudIntersil Corporation introduced a pair of highly integrated powermanagement ICs (PMICs) that enable the industry’s first credit card-size motherboards for high-end ultrabook and tablet computerspowered by 2-cell Li-ion batteries. The single-chip ISL95908 PMICdelivers eight voltage rails optimized to support subsystem peripher-al power requirements for new Intel IMVP8 platforms, and the single-chip ISL95906 provides eight power rails for VR12.6-compliant sys-tems. The devices measure 5.5mm × 5.5mm, enabling PC mother-boards that are 75% smaller than previously possible using discreteswitchers, inductors and capacitors.

The ISL9590x PMICs address the trend toward slimmer ultrabooks,tablets and 2-in-1 computers that offer more features and longer bat-tery life. Both PMICs integrate a controller, power and driver MOS-FETS, VTT LDO regulator, independent enable and power-goodindicators, I2C interfaces, and fault protection/monitoring for eightsynchronous buck regulators. They deliver 90% efficiency and inte-grate 2x more functionality than the nearest competitor, allowingdesigners to use fewer external components, including smaller, low-profile inductors and capacitors. Now mobile computing OEMs onlyneed three devices – PMIC, core voltage regulator and battery charg-er – to power up the CPU/GPU, battery, and subsystem peripherals:flash memory, USB, HDMI, audio, sensors, camera module and WiFi.The ISL9590x are the industry’s only single-chip solutions that sup-port the Intel and Microsoft Connected Standby standard, whichprovides an instant-on, always-connected experience similar tosmartphones. The Connected Standby low-power mode maintainsInternet connectivity, email and applications while the system isasleep. Both PMICs employ Intersil’s proprietary R4 modulation tech-nology, which delivers high light-load efficiency, ultra-fast transientresponse, and seamless continuous-conduction mode (CCM) anddiscontinuous-conduction mode (DCM) transitions.

Key Features and Specifications of ISL95908 and ISL95906:• ISL95908 provides IMPV8 regulation at 5V, 3.3V, 1.8V/2.5V, 1V,

0.975V, and 0.9V• ISL95906 provides VR12.6 regulation at 5V, 3.3V, 1.8V,1.5V, 1.05V• Eight efficient 1MHz integrated FET switching regulators• Programmable VR3 and VTT regulators for system memory,

including DDR3/L/U, LPDDR3 and DDR4

INTERSIL www.intersil.com

Intersil Announces Industry’s Most HighlyIntegrated Power Management ICs forUltrabooks and Tablets

Pre-validated PingPong data exchangemechanism eases IoT integration

Page 7: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 7

INDUSTRY NEWS EMBEDDED SYSTEMS

Microchip Technology Inc. announced that AUDI AG is network-ing the Audi virtual cockpit system in its new TT Models usingMOST® technology. Specifically, it is deploying Microchip’sOS81118 MOST150 Intelligent Network Interface Controller(INIC), which provides 150 Mbps performance, supports allMOST network data types, and includes a High Speed USB 2.0interface (PHY/HSIC) to seamlessly connect with the virtual cock-pit’s System-on-Chip processor.MICROCHIP TECHNOLOGY www.microchip.com/MOST-042015a

Microchip Technology Inc. announced that the BMW Group iscontinuing to broaden the proliferation of MOST® technologyin its vehicle infotainment networks, using Microchip’sIntelligent Network Interface Controllers (INICs). The BMW 2Series Active Tourer is BMW’s latest volume car model to imple-ment MOST technology, following the company’s wide deploy-ment among its premium models, which began in 2001.MICROCHIP TECHNOLOGY www.microchip.com/INICs-041415a

To date, more than 150 million MOST devices have been installed in over180 car models since 2001. AUDI AG, BMW and a host of other automak-ers have consistently chosen this technology for their infotainment networksbecause it provides high-bandwidth transport and audio streaming, soft-ware downloads, Ethernet Packet/Internet Protocol (IP), Synchronous,Isochronous and Control data with zero processor overhead, and provenelectromagnetic-compatibility (EMC) behavior. The MOST150 standardoffers dedicated data channels with dedicated, application-specific hard-ware interfaces to simplify communication system designs and significantlyreduce MCU software overhead. MOST technology also provides ultra-faststartup for immediate access to the vehicle’s multimedia systems.The MOST Cooperation standards enable automotive OEMs and theirTier 1 suppliers with a proven and well-supported methodology fordefining and implementing their infotainment systems, including a stan-dard physical layer and a robust method for system management andcontrol with superior reliability and Quality of Service (QoS). UsingMOST technology also results in reduced weight for easier compliancewith environmental regulations.

Audi Selects Microchip’s MOST150Technology for New Audi TT Virtual

Cockpit System

BMW Implements Microchip’s MOST®Technology to Power New BMW 2

Series Active Tourer Model’sInfotainment System

Silicon Labs introduced the industry’s most energy-friendly USB-enabled microcontrollers (MCUs). The latest addition to Silicon Labs’award-winning EFM32® 32-bit MCU portfolio, the new Happy GeckoMCUs are designed to deliver the lowest USB power drain in theindustry, enabling longer battery life and energy harvesting applica-tions. Based on the ARM® Cortex®-M0+ core and low-energy periph-erals, the Happy Gecko family simplifies USB connectivity for a widerange of IoT applications including smart metering, home and build-ing automation, alarm and security systems, smart accessories andwearable devices.

A leading supplier of USB bridge chips and smart interface ICs,Silicon Labs developed the Happy Gecko family to address the risingdemand for cost-effective, low-power USB connectivity solutions.With more than three billion USB-enabled devices shipping eachyear, USB is the fastest growing interface for consumer applicationsand is also gaining significant traction in industrial automation. Intoday’s IoT world, developers have discovered that adding USBinterfaces to portable, battery-powered connected devices can dou-ble the application current consumption. Silicon Labs’ Happy GeckoMCUs provide an ideal energy-friendly USB connectivity solution forthese power-sensitive IoT applications.Happy Gecko USB MCUs feature an advanced energy managementsystem with five energy modes enabling applications to remain in anenergy-optimal state by spending as little time as possible in activemode. In deep-sleep mode, Happy Gecko MCUs have an industry-leading 0.9 μA standby current consumption (with a 32.768 kHzRTC, RAM/CPU state retention, brown-out detector and power-on-reset circuitry active). Active-mode power consumption dropsdown to 130 μA/MHz at 24 MHz with real-world code (prime num-ber algorithm). The USB MCUs further reduce power consumptionwith a 2-microsecond wakeup time from standby mode.

Like all EFM32 MCUs, the Happy Gecko family includes thePeripheral Reflex System (PRS) feature, which greatly enhances over-all energy efficiency.

SILICON LABS www.silabs.com

Silicon Labs Introduces World’s MostEnergy-Friendly USB MicrocontrollersEFM32® Happy Gecko MCU Family Simplifies USBConnectivity for Power-Sensitive, Battery-OperatedIoT Applications

Page 8: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu8

The MOST® Cooperation - standardization organization for the leading automotivemultimedia network technology Media Oriented Systems Transport (MOST) - ispleased to announce that Volvo has integrated MOST150 into its brand new vehiclemodel Volvo XC90. “Proceeding on its path of success, MOSTCO celebrates the growingacceptance of the automotive network standard, now with the implementation by key car-maker Volvo,” stated Henry Muyshondt, Administrator of the MOST Cooperation.“With Volvo, we are pleased to welcome the fourth carmaker already embracingMOST150, following Audi, Daimler, and Hyundai. Accordingly, Volvo is taking advantageof the MOST network concept, which is inherently scalable and extendable with respectto speed and the amount and characteristics of the data channels.” Along with the higherbandwidth of 150 Mbit/s, MOST150 features an isochronous transport mechanism to

support extensive video appli-cations, as well as an Ethernetchannel for efficient transportof IP-based packet data. Thischannel carries Ethernet pack-ets according to IEEE 802.3.Thus, standard TCP/IP stackscan be used without change. Inconsequence, the latest gener-ation of MOST provides theautomotive-ready physicallayer for Ethernet in the car.Volvo’s all-new XC90 is thefirst car in its range built on

the Scalable Product Architecture (SPA) modular chassis technology developed in-house. For seamless smartphone integration, the XC90 offers Apple CarPlay andAndroid Auto, which brings selected features and services familiar to smartphoneusers directly into the car via the center console touch screen display. Users willimmediately recognize the well-known icons for their basic applications, such asphone, messages, music and navigation.

MOST COOPERATION www.mostcooperation.com

Volvo with MOST150 Altera Announces New

Spectra-Q Engine forIndustry-leading Quartus II

Software to Accelerate FPGAand SoC Design

Altera Corporation unveiled its Spectra-Q™engine, a new technology at the heart of thecompany’s proven Quartus® II software, toaccelerate design productivity and time-to-market for next-generation programmabledevices. The Spectra-Q engine extendsAltera’s Quartus II software leadership withnew capabilities that deliver unprecedented

compile time improvements, versatile and fast-tracked design entry, and drop-in IP integra-tion. Now customers can design and imple-ment at higher levels of abstraction for signifi-cantly faster design cycles to meet the nextgeneration of design opportunities.Additional information on the Spectra-Qengine is available on the www.altera.com/spectraqwebpage. The Spectra-Q engine featuresfaster algorithms and allows for incrementaldesign changes without needing to performa full design compile The engine also fea-tures a hierarchical database that enablesusers to preserve placement and routinginformation of IP blocks while makingchanges in other parts of the design. Thishelps ensure stable designs, eliminatesunnecessary timing closure efforts andreduces compile times. The new engine alsoincludes a common high-level design compil-er for better quality of results and tighterintegration between the Quartus II softwareand a variety of different front-end tools. Introducing BluePrint™ Platform DesignerBuilt on top of the Spectra-Q engine is anindustry first platform design tool calledBluePrint that allows designers to performarchitectural exploration and assign inter-faces with greater efficiency. ALTERA www.altera.com

MOST150 Implementation in the All-new Volvo XC90

INDUSTRY NEWS EMBEDDED SYSTEMS

MOST150 implementation in the all-new Volvo XC90Copyright: Volvo Car Corporation

Henry Muyshondtis the Administrator

of the MOSTCooperation

Copyright: MOST Cooperation

Page 9: EP&Dee no 4

Microchip Technology Inc. announced from the Hong Kong ElectronicsFair the release of its second generation multizone audio technology anda mobile app for use in whole-home-audio and multi-room applicationsbased on the JukeBlox® 4 platform. The JB Multizone 2.0 feature enablestightly synchronized and highly robust audio streaming to multiple speak-ers in conjunction with the JB App, a turnkey mobile app that enableseasy setup and operation of the wireless speaker.Whole-home audio and multi-room audio systems allow consumers togroup speakers into a zone to play back a common audio stream.Consumers create multiple zones each with their own audio streams suchas pop music streaming to a pair of patio speakers while the children playoutside and soothing classical music to four speakers downstairs, whiledinner is prepared.JB Multizone 2.0 utilizes advanced technology to reduce audio dropsfound in traditional Wi-Fi® streaming applications. Wi-Fi direct eliminatesthe need for each speaker in a zone to connect with the access point, there-by eliminating common problems associated with overloading accesspoints. Bypassing the access point also reduces the RF bandwidth con-sumed by half resulting in increased streaming quality and/or the ability toadd more speakers in a zone. The addition of Wi-Fi Multimedia (WMM) toWi-Fi Direct reduces source to zone speaker latency and packet loss result-ing in tightly synchronized audio playback with minimal audio drops.JB App is a complete mobile app that enables OEMs to quickly deploy acomplete whole-home-audio solution without having to manage an appdevelopment project. OEMs can choose between source code for cus-tom app development or simply rebrand the app for release to con-sumers. Consumers use the JB App to create and modify zones, selectaudio sources and easily connect the speaker to the local Wi-Fi network.JB App source code is available at no charge and supports both iOS andAndroid™ platforms.

“JB Multizone 2.0 is a complete platform to quickly deliver a robust wholehome audio solution to market,” said Sumit Mitra, vice president ofMicrochip’s Wireless Products Group. “The JukeBlox platform incorporatesadvanced wireless networking technology to create a first class consumer lis-tening experience.”

MICROCHIP TECHNOLOGY www.microchip.com/JukeBlox-041315a

Microchip Releases New MultizoneTechnology for Whole-Home-Audio andMulti-Room Applications Based on theJukeBlox® Platform

ON Semiconductor andAfterMaster Audio Labs to release

revolutionary audio chipON Semiconductor announced the release of BelaSigna300® AM with AfterMaster HD Audio Labs, Inc., anindustry-leading audio technology company based inHollywood, CA, a subsidiary of Studio One Media Inc.(OTCQB:SOMD). The new BelaSigna 300 AM digitalsignal processing (DSP) chip embedded withAfterMaster technology is a ground-breaking audiosolution that will dramatically enhance the listeningexperience on any consumer device.

Developed by AfterMaster Audio Labs in conjunctionwith ON Semiconductor, BelaSigna 300 AM can be easilyinstalled by manufacturers to provide incredible sound inany device with audio capabilities. With its miniature size,WLCSP packaging, and low power usage; even small elec-tronics such as headphones and smartphones can lever-age the AfterMaster HD processing technology, eliminat-ing the need for large or expensive hardware redesigns. The chip will operate at 4 mA from a 1.8 V source whilerunning AfterMaster HD’s algorithms to offer high-fidelity,studio-quality sound to audio-enabled devices and serv-ices, including televisions, headphones, speakers, mobiledevices, streaming services and more. Using real-timemastering and re-mastering processing technology as wellas proprietary Adaptive Intuitive Response™ mechanisms,AfterMaster HD preserves original sound quality whileintroducing greater depth, clarity and richness to any lis-tening experience.

Product distribution of BelaSigna 300 AM withAfterMaster HD will be available through ONSemiconductor’s global channel and distribution network.For pricing information, please contact your local ONSemiconductor sales office. More information includingdocumentation and development tools is available atwww.onsemi.com/belasigna

AFTERMASTER www.aftermasterhd.comON SEMICONDUCTOR www.onsemi.com

www.epd-ee.eu | May, 2015 | EP&Dee 9

INDUSTRY NEWS EMBEDDED SYSTEMS

Page 10: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu10

Authors: Jason Chiang, Sr. Marketing Manager, Industrial andTed Marena, Director, FPGA/SoC Marketing, with Microsemi (www.microsemi.com)

FPGAs Rev Up Motor Control System Efficiency, Performance and Design Flexibility

Motor designers also must support chang-ing industrial control standards and tech-nologies while providing critical system fea-tures that ensure safety, scalability and relia-bility. Meeting the twin goals of energy effi-ciency and enhanced system-level capabili-ties requires adequate processing power foralgorithm processing along with flexible andscalable system architectures. Non-volatile,secure and low-power flash-based systemon chip (SoC) FPGAs meet both challengesby delivering the necessary horsepowerwith a combination of both inherent andlayered security and reliability with protect-ed communications for Internet of Things(IoT) applications, and the ability to quicklyand easily scale from small-footprint to fea-ture-rich custom motor designs in a varietyof multi-axis or high-RPM applications.

The ChallengesWhile traditional designs use simple scalarcontrol, high-efficiency motors use Field-Oriented Control (FOC) across all torqueand speed ranges to significantly improveefficiency. Because it is current-controlled,FOC also optimizes power-inverter circuitryand the motor footprint depending on appli-cation requirements. It uses feedback loop-ing, with or without sensors, and sophisticat-ed algorithms to regulate key motor behav-iors including speed, position or angle,torque, current, and flux. While microcon-trollers (MCUs) and DSPs have traditionallybeen used for algorithm processing in single-and dual-axis designs, their processing capa-

bilities aren’t keeping up with growing multi-axis or high-rotation motor performancedemands. Adding to the challenge, motorcontrol efficiency is rarely the only concern,especially in connected factories wheretoday’s Internet of Things (IoT) environmentposes critical requirements for secure commu-nications – something that flash-based FPGAarchitectures are ideally suited to address. On the power electronics side of motorcontrol designs, there is also a migrationfrom insulated-gate bipolar transistor(IGBT) devices to silicon carbide (SiC)

power MOSFET devices. SiC solutions pro-vide higher bandgap for improved cooling(and therefore enable the use of smaller andcheaper heat sinks), greater thermal conduc-tivity to drive higher power densities, andhigher switching frequencies (greater than100kHz) which result in smaller magnetics atthe inverter stage. This, in turn, contributesto lowering the customer’s TCO. On the control side, higher switching frequen-cies are where DSPs and MCUs don’t fare well.Some DSPs may optimize a few channels forhigh-frequency switching, but they still lack

Electric motors collectively consume a substantial portion of global electricity. According tothe research firm IHS Technology, 96 percent of a motor’s lifetime costs are represented bypure electricity costs. Regulators have imposed more stringent energy standards for them,and manufacturers are scrutinizing their sizable contribution to equipment total cost ofownership (TCO). This has led to more complex motor control designs that use sensor-based and sensorless feedback loops and advanced algorithms for more precise controland greater motor efficiency.

Figure 1: An example of a flash-based SoC FPGA architecture that can be used for motor control and monitoring functions.

DESIGN FPGAs

Page 11: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 11

the ability to quickly adapt to changingrequirements, and to add more pulse widthmodulation (PWM) channels to control thepower electronics stage (in fact, this is oftenoffloaded to an FPGA). ASICs and ASSPs havethe same flexibility and scaling challenges.Flash-based FPGAs offer greater perform-ance than MCU/DSP-based solutions forhigh-speed, low-latency algorithm process-ing, while enabling the integration of addi-tional system functionality to furtherimprove TCO. Designers can use the flash-based FPGA to go beyond what MCUs/DSPscan support when scaling to higher switch-ing frequencies and more PWM channels tomatch the power electronics.Figure 1 shows a solution where a flash-based SoC FPGA with an ARM® Cortex-M3microcontroller can be used for motor con-trol and monitoring functions. The FPGAfabric is used for hardware acceleration ofmotor control functions to improve per-formance, and for design flexibility. Motorcontrol algorithms can be offloaded to theFPGA for faster parallel processing, withintelligent partitioning to ensure that allcommunications protocols in the microcon-troller subsystem can be handled with zeroimpact on the motor control algorithm cal-culations that are running in the FPGA.Capping off today’s FPGA solutions are mod-ular suites of plug-and-play IP blocks tailoredfor implementing all necessary mathematicalmotor models. Developers can determinewhich IP blocks to hardware-accelerate in theFPGA fabric so they can meet the full range ofalgorithm processing challenges. These solu-tions ensure low-power operation whileenabling developers to optimize their systemsfor reliability, safety and security using a sim-plified design process that speeds time tomarket while providing the flexibility and scal-ability to meet evolving needs.

Low-Power OperationFPGAs used for motor control design mustreduce both static and total power, especiallyat high frequencies and temperatures. FPGAsthat feature an embedded single-transistorflash cell offer an advantage as compared toalternatives that use a six-transistor SRAM cellthat must be configured from an externalROM during power-up. The latest flash-based FPGA solutions also use a comprehen-sive approach to minimizing power thatencompasses process technology, architec-ture and the design of configurable logic, aswell as embedded features including a hard-ened M3 MCU, 5G SERDES, DDR2/3, TSE,

DSP blocks, and special power modes. Thisapproach results in 50 percent lower totalpower and 10 percent lower static powerthan SRAM-based FPGA solutions.

Reliability, Safety and SecurityIn general, an FPGA is more reliable than amicrocontroller for implementing motorcontrol and network functions where deter-ministic timing is important. While there can

be milliseconds of timing variability in amicrocontroller, there are a few nanosec-onds or less in the FPGA.The best choice for security is flash-based,rather than SRAM-based FPGAs, becausethey store configuration information on-chipin non-volatile memory - the bit stream isnever exposed at start-up. They also provideimmunity to single event upsets (SEUs) thatchange configuration SRAM contents. Someflash-based FPGAs can also serve as root-of-trust devices with key storage capability toprotect hyperconnected industrial IoT sys-tems from cloning, tampering and other mali-cious attacks. These FPGAs address securityneeds with features like a physically unclon-able function (PUF) from which the PrivateKey in a Public/Private Key scheme can bederived for implementing M2M authentica-tion using Public Key Infrastructure (PKI).Other features include cryptographic acceler-ators, a random number generator, hardwarefirewalls to protect CPU/DSP cores, andDifferential Power Analysis (DPA) counter-measures that, together, allow security to belayered as needed throughout the system toprotect the hardware and data.

Design Simplicity through A ModularApproachModular and performance-oriented IPblock suites enable algorithms to be imple-mented with plug-and-play simplicity.Designs can easily be ported across multipleplatforms to speed time to market. All IPblocks are tested in simulations on actual

hardware to ensure precise torque output,and easily integrated to create task-specificmodules. Each block facilitates sharing ofcommon FPGA resources for the most effi-cient chip utilization (see Figure 2).The IP suite also includes all basic buildingblocks, including Clarke and Park transfor-mations, proportional integral (PI) con-trollers for control loop feedback, andspace vector PWM (SVPWM).

Flexibility and ScalabilityA modular IP suite also simplifies customiza-tion and scaling to support different combi-nations of multi-axis motors or high-RPMsolutions, while meeting evolving regionaltechnology standards. The more compactthe IP blocks (i.e., less than 10,000 logical ele-ments for the entire suite), the more head-room there is to support integration needs.An IP suite running on an FPGA can be scaledto drive from two brushless DC (BLDC)/step-per motor channels to a six-axis solution, or toextend motor performance beyond 70,000RPM, depending on requirements. One wayto scale to multi-axis FOC control is to time-division-multiplex each FOC loop within thedevice so each of the motors can be individu-ally controlled for different reference speedsand torque requirements. Everything is imple-mented in the FPGA fabric, leaving the micro-processor subsystem available for running acommunication protocol stack, providing thehuman-machine interface, or other tasks.Designers of electric motors must meet ener-gy mandates while ensuring systems can scaleand adapt. Flash-based SoC FPGAs providean increasingly attractive alternative to DSPs,MCUs, ASICs and ASSPs, combining the nec-essary processing horsepower with hardwareand software programmability plus broadoptions for accelerating and intelligently par-titioning functionality. Flash-based FPGAs addthe benefit of inherent security, and can serveas the root of trust for secure IoT communica-tions in the connected factory ■www.microsemi.com

Figure 2: IP blocks facilitate sharing of common FPGA resources for the most efficient chip utilization.

DESIGN FPGAs

Page 12: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu12

DESIGN POWER

Adding Intelligence to Control

Risk & RewardA ‘low risk’ method of making powersmarter is to simply monitor the supplyusing an MCU and relay the parameters itmeasures to a back-system over some formof communication interface. This approachneeds minimal additional components anddesign effort; typically restricted to addingsome method for sensing the voltage, cur-rent and perhaps temperature. Monitoringother parameters, such as duty cycle or sup-ply frequency will allow more sophisticatedcontrol over power-specific features includ-ing voltage levels. There exist a number of Switched ModePower Supply ASSPs that offer a method of

modifying its functionality based on deci-sions made through measuring criticalparameters. It offers a simple way to increaseefficiency and is a task that can be handledby a wide range of microcontrollers; serialinterfaces effectively enables an MCU tomodify the functionality of the power supplybased on monitored parameters.

A further benefit of this approach is that thepower supply itself remains under the con-trol of the SMPS ASSP, which means thedesign team need not have any specificpower supply design knowledge beyondunderstanding the parameters available formodification, and the affect of that; the key

control theory remains the domain of theSMPS engineer. The next step along the implementationcurve — and one that offers potential costsavings — is to integrate the SMPS ASSP andMCU functionality in to a single device. It isincreasingly possible to achieve this in ahigh-performance MCU that is closely inte-grated to a fast sampling ADC; an approachthat affords a fully digital, all-softwareimplantation. Of course, this approachincurs the need for greater SMPS designexpertise, and the overall performance willbe related to how much processing powerthe MCU can deliver (often limited by sys-tem-level power requirements).

There are few applicationsaddressed by integrated elec-tronics that don’t require somemodest form of power regulation,be that a simple current/voltagesupply or a more sophisticatedand optimised solution. However,with an increased focus on effi-ciency at every level it is becom-ing common to extend the simpleto include some form of intelli-gence. Even a relatively unsophis-

ticated control algorithm can deliver performance benefits such as reduced power con-sumption, while with a little more effort any device can now include more advanced fea-tures such as maximum power tracking, refined battery charging, environmentally awaresettings and improved fault tolerance. This is a perfect scenario for low-cost microcontrollers, even the smallest device is nowpowerful enough to execute complex algorithms, while providing machine- and human-interfaces. The ability to accommodate some form of standardised communication inter-face, such as SMbus, LIN or Ethernet adds another level of value.

Author: Joseph Julicher, Engineering Manager, MCU08 Applications, Microchip Technology Inc.

Page 13: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 13

DESIGN POWER

The Hybrid ApproachThe middle-ground between the twoscenarios described above is whatsome term the Hybrid Approach. Inthis case, a mixed-signal controllerwhich integrates the necessary ana-logue peripherals are, again, fullyintegrated and one such device is thePIC16F753. This device features anoperational amplifier, slope compen-sator, DAC, comparators and PWMcontroller in a single 14-pin MCU.

Each of the peripherals is programma-ble, allowing them to be combined ina variety of ways to create a largenumber of current mode power sup-plies. As they are software-controlled,configuration is dynamic, allowing itto adapt to changing power supplyconditions. This could see the deviceconfigured to operate as a hystereticcontroller with a simple firmwarefeed-forward regulator when instandby mode, but allowing the sup-ply to be quickly reconfigured forcontinuous current mode at a differ-ent operating frequency when morepower is demanded.

Because the supply’s control residesentirely within the MCU there is noneed for additional components tobe added later in the design cycle,which has the added benefit of bothsimplifying the design and loweringthe component count. Furthermore,as the solution is fully integrated thefirmware has total visibility of thepower supply parameters withoutsignificantly changing the designprocess, while the communicationsand intelligence interface can bedeveloped and verified by the powersupply engineering team.

A typical power supply based on thePIC16F753 is shown in Figure 1; mostimplementations are minor variationsof a common SMPS configuration. TheComplementary Output Generatorproduces a complementary outputwith a programmable deadband fromrising and falling inputs, while the CCPis configured to produce a program-mable frequency rising edge. Thecomparator, C1, produces the fallingedge when the current exceeds theoutput of the slope compensator.

Figure 1

Figure 2

Page 14: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu14

DESIGN POWER

The CCP and C1 can be combined tocreate a maximum duty cycle, which isneeded by some topologies such asboost, flyback and SEPIC. The opera-tional amplifier, OPA, is used to providefeedback and compensation, while theDAC is used to provide the Op Amp’sreference (although the Fixed VoltageReference, FVR, can also be used if pro-grammable levels are not required). Theslope compensator can be reset by thecomparators or the COG, and it uses aprogrammable current sink to decay apre-charged capacitor (in this case, thecharge level is set by the OPA).

This is a relatively simple configurationand Figure 2 shows an example of itoperating as a boost supply regulatingcurrent in a LED string. The flowcharts inFigure 3a through 3c depict the levels ofintelligence that can be added once ithas been configured, allowing it target arange of applications.

ConclusionThe addition of intelligence to a powersupply has far-reaching benefits and caneither be achieved simply, by adding anMCU, or more comprehensively by usinga more capable, fully integrated solutionsuch as a high-performance dsPIC ormixed-signal MCU that integrates all theperformance and peripherals needed torealise a sophisticated single-chip SMPS.

However it is delivered, smart power hasthe potential to impact significantly onelectrical device operation and — moreimportantly — efficiency. With today’shighly capable, low-cost and fully inte-grated solutions, adding intelligence hasnever made more sense.

The Microchip name and logo, MPLAB,dsPIC and PIC are registered trademarks ofMicrochip Technology Inc. in the USA andother countries. PICkit is a trademark ofMicrochip Technology Inc. All othertrademarks mentioned herein are theproperty of their respective companies.

www.microchip.com

Figure 3a

Figure 3b

Figure 3c

Page 15: EP&Dee no 4
Page 16: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu16

INDUSTRY NEWS EMBEDDED SYSTEMS

SiBEAM Inc., a pioneer and leader in millimeter-wave technolo-gies for wireless communications, today announced a keyUltraGig™ design win with Letv’s Le Max smartphone. FeaturingSiBEAM’s UltraGig SiI6400 transmitter, Le Max is the world’s firstsmartphone offering60GHz millimeter-wave wireless videotechnology in vol-ume production. LeMax was announcedin mid-April 2015and it establishes anew benchmark forlow power millime-ter-wave design inmobile device formfactors. Le Max willbe available for pur-chase starting inJune. The inclusionof SiBEAM’s wirelesstechnology in thedevice expands theconsumer contentexperience for Letv’sfilm, television, andgaming services to mobile consumers. The UltraGig SiI6400transmitter is a single-chip solution that integrates networkprocessor, RF transceiver, and in-package antennas, offeringFull HD quality with near-zero latency for immersive entertain-ment and gaming.“SiBEAM’s 60GHz millimeter-wave wireless expertise is unparal-leled and their video technology gives consumers a seamless,interactive experience from the phone to the TV,” said YukuanDing, Product Director at Letv. “As wireless connectivitybecomes increasingly important to consumers, Letv will continueto offer products with innovative technologies that enhance theconsumer experience.”Leshi Internet Information and Technology Co. is China’s lead-ing Internet content and entertainment provider, offeringInternet, movie and TV content as well as Internet TVs and set-top boxes. The company launched its first smartphone, abezel-less device, earlier this year. “We are thrilled to see our wireless technology included in theworld’s first 60GHz smartphone,” said David Kuo, senior direc-tor of marketing for SiBEAM. “The Letv’s Le Max design win isnot only a key milestone for the wireless industry, but also show-cases SiBEAM’s leadership in millimeter-wave advancement andfulfilling the promise of gigabit wireless experience for consumersworldwide.”SiBEAM www.sibeaminc.com

SiBEAM Captures world’s first 60GHz millimeter-wave smartphone Design winin LeTV’s Flagship Smartphone, Le Max

XP Power announced the DDC15 and DDC30 series of low profile 15Watt and 30 Watt DIN rail format DC-DC converters. The range isdesigned to offer additional voltages in DIN rail power systems, pro-vide isolated outputs & noise immunity or support battery powered orbattery backed applications. The single output converters accommo-date the wide 4:1 input range from 9 – 36 VDC suiting a 12 or 24 VDCnominal input. Both series are available with a choice of a 5, 9, 12, 15 or24 VDC nominal output. Additionally, the DDC15 model is availablewith a 3.3 VDC output. Input to output isolation is 1500 VDC.

Occupying less DIN rail space than similar units available on the mar-ket, these slim compact convection cooled units measure just 91 x56.5 × 18mm for the DDC15 and 91 × 56.5 × 35 mm for the DDC30.Capable of operating over a wide temperature range from – 40 to +70°C, the DDC series delivers full power up to +50°C and suits use inmost environments where the applications require extended operat-ing temperatures.The DDC15 and DDC30 converters have internationally recognizedsafety approvals for UL508 (industrial control equipment), and ITapprovals per EN60950-1 A12:2011 and IEC60950-1 +A1:2009 .Theunits also meet the Class B EN55022 specification for both radiated andconducted emissions without the need for any additional filtering com-ponents saving both extra cost and footprint. The front panel hosts twoLEDs that provide indication of DC input status along with access toscrew terminals for input and output connections. The DDC30 frontpanel includes a potentiometer for output voltage adjustment.

The DDC series provides convenience for the system designer inaccommodating additional supply voltages from a single DIN rail instal-lation rather than having to incorporate multiple power supply formats.XP POWER www.xppower.com

DIN rail DC-DC converters offer a wideinput and noise immunity for industrialapplications

UltraGig SiI6400 WirelessHD® Transmitter ValidatesCompany’s Leadership in Low Power Millimeter-Wave RFon CMOS Solutions for Battery Operated Devices

Page 17: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 17

Maxim Integrated Products, Inc. addresses the need for higher through-put, smaller footprint, and lower power in industrial automation with theMAX14900E digital output switch.This eight-channel integrated circuit (IC) provides up to 70x faster speed,uses over 20% less power, and occupies 40% less space than existing solu-tions - all factors required in today’s faster, more localized, smaller endproducts. It is controlled by an eight-bit parallel interface, or via a stan-dard Serial Peripheral Interface (SPI) which is also used for configurationand monitoring. Multiple devices can be daisy-chained to support addi-tional I/O points via the single SPI interface, requiring only three isolatorsfor all channels to provide further savings in cost, board space, andpower. The serial mode includes cyclic redundancy checking (CRC) forassured data integrity, as well as global and per-channel diagnostics forremote system monitoring.Maxim offers both a complete reference design (MAXREFDES63#) as wellas an evaluation (EV) kit with special prototyping features. The credit-card-sized reference design integrates the MAX14900E, a microcon-troller, isolated I/O port, power supplies, UART, and USB port to simpli-fy incorporating the device into the final OEM product design, as well asprovide a means for quick evaluation.Key Advantages• Low power; high voltage: The eight digital channels require just 3mA

(maximum) of supply current; operates from a wide supply range of 10V to 36V and thus compatible with the 24V rail of many factory systems.

• High speed and drive: With an input-to-output propagation delay of 0.3usec (typical)/0.8usec (maximum), it can support fast switching rates of up to 100kHz in push pull configuration. On-resistance, a critical factor in static power dissipation is just 85mΩ (typical) and 165mΩ (maximum). It can drive current loads up to 850mA; outputs can be used in parallel to achieve even higher drive-current rating.

• High integration and space savings: Housed in a tiny, 48-pin 7 mm × 7 mm QFN package; uses significantly less board space.

• Data integrity: Offers per-channel and global diagnostics/monitoring via its SPI port, while users can access the I/O via an eight-bit parallel port. The serial link includes CRC error detection for enhanced data-link integrity.

MAXIM INTEGRATED www.maximintegrated.com

High-Side Switch Boosts Throughput andChannel Density; Reduces Dissipation andFootprint

Altera Speeds IEC 61508-compliantDesigns with Certified 28 nm

FPGAs, SoCs, and ToolflowsAltera Corporation announced the availability of the lat-est version of its Industrial Functional Safety Data Package(Ver. 3), www.altera.com/solutions/industry/industrial/applications/automation/functional-safety.html - for sys-tems designers using Altera field programmable gatearrays (FPGAs). The safety pack provides TÜVRheinland-certified toolflows, IP and devices includingCyclone V FPGAs, enabling faster time for market forindustrial safety solutions to IEC 61508 up to SafetyIntegrity Level 3 (SIL3).

Under industrial safety mandates, industrial equipmentmust be certified to ensure electrical, electronic or pro-grammable electronic systems that carry out safetyfunctions meet industry-standard safety guidelines.Generally, such products must fulfill requirements of theIEC 61508 standard to safety integrity level 3 (SIL 3),and meet the ISO 13849 standard to performance levelcategory 4 (PL e Cat 4.)In addition, as the complexity of safety designs increas-es, the need to provide advanced safety functions andto integrate safety functionality with the application, hasled to the need for advanced certified toolflows, such asAltera Safety Design Partitioning toolflow, offered inthis latest version of the Functional Safety Data Package.This partitioning toolflow gives designers the ability toseparate the safe and non-safe portions of the design,allowing user updates of the non-safe portion with min-imal safety re-certification effort.

Altera-based Board from NewTec Now Available Altera,also announced the availability the Cyclone V-basedSafeFlex Functional Safety board from partner NewTecGmbH, which was demonstrated at the SPS IC Drivesevent in Nuremberg, in November, 2014 and satisfies therequirement for IEC 61508 to SIL 3in addition to ISO13849 to PL e Cat 4.

ALTERA www.altera.com

INDUSTRY NEWS EMBEDDED SYSTEMS

Page 18: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu18

So then, can a microcontroller product linebe immortal? Of course not, but manyengineers wish they could continue to purchase the same microcontroller in perpetuity. And while not eternity, theproof of this desire is exemplified by somecomponents of our MCU portfolio still selling in production for more than 25years. Clearly, engineers value supply assur-ance or steady production availability foran extended period. The reasons vary. For some, their products are expected tobe sold in the market unchanged for many,many years. For others, launching a productto market requires passing stringent certifi-cation and safety tests. Any changes later tothe system components would requirecostly re-certification.

For many, the adage “if it’s not broken,don’t fix it” applies. To address this need,Freescale created the Product Longevityprogram – making a broad range of devicesavailable up to 15 years.

Longevity, in this use of the word, refers tothe minimum lifetime commitment thatFreescale makes. Not to be confused withproduct reliability that indicates how long acomponent can be expected to operate ina system, longevity refers to the minimumduration from component introduction thatcustomers can expect to continue purchas-ing the component that is compatible withtheir system design. Understanding a component’s longevity is akey device selection criteria for a new sys-tem design.

So while not immortal, Freescale endeavorsto perpetuate the lifetime of our cus-tomer’s products through the long-termsupply of essential components.

Take a look at the Product Longevity site atwww.freescale.com/productlongevity andbrowse the list of devices that we plan toproduce (and the terms and conditions foreach) for at least 10 years, and in somecases 15 years.

So, there you have it: we’re not afraid ofcommitment.■

www.freescale.com

“I don’t want to achieve immortality through my work. I want to achieve it through not dying.”– Woody Allen

By Michael HaightMichael Haight is in business development for the Microcontrollers Division at Freecale

DESIGN MCUs

Commitment phobic?

Not us

Page 19: EP&Dee no 4

1919www.epd-ee.eu | May, 2015 | EP&Dee

DESIGN MCUs

Our ever-changing world of electronicsElectronics have made great strides since thefirst radio receiver/transmitter, a.k.a. the“walkie-talkie,” was introduced by Motorolain 1940. Since then, rapid advancementsand breakthrough innovations continue toimpact the way we interact with our world.We’re surrounded by embedded proces-sors and sensors in battery-operated mobiledevices like phones, tablets and other“smart” electronics. Ultimately, our world isdriven by embedded software that con-stantly collects and interprets data to makereal-time decisions. As consumers, weexpect extremely high performance fromour devices, and the growing expectation isthat each product release will bring morefunctionality, longer battery life, lowerprices, a better software experience, and aproduct safer for our environment. As thenumber of battery-operated devicesincreases, the importance placed on theembedded system to meet those require-ments is that much greater. If you’re a designengineer, you know this all too well, which iswhy you will be glad to hear that the KinetisMCUs are built around these requirements,especially power efficiency.

Kinetis microcontrollers are drivinglow power, even lowerIn the past, integrated circuit manufacturerswere pushed to deliver products withgreater performance and integration.Today, expectations have been raised.

Energy efficient appliances, electric vehicles,LED lighting and televisions started thetrend, but devices are getting much smarter:they are starting to make autonomous deci-sions without human intervention. Smarterintegration, performance efficiency and cre-ative solutions to solve the low power chal-lenge have become a top priority for theintegrated circuit manufacturers.The Kinetis MCUs have been built aroundreducing power consumption and will con-tinue to differentiate themselves from otherMCUs on the market.

Driving down power consumption,one device at a timeHere are just a few low power techniquesintegrated into the Kinetis portfolio, whichhelp to reduce power consumption.• Low power boot: Optimized for the

lowest power during the boot process by providing non-volatile control bits to set default chip clocking upon device power up

• Smart clocking: Scalable performance, as needed to meet application needs, through various clock sources and multipliersto set the clocks for peripherals or CPU, across all power modes

• Ultra-efficient processing: Real-time controland computation through the use of the world’s most efficient processor cores, the ARM® Cortex®-M, supplemented by Freescale proprietary hardware accelerators

• Flexible low power modes: Numerous power modes to power gate memories

and peripherals, allowing for dynamic and static power optimization that fits a wide range of use cases

• Autonomous, low power peripherals: Precious energy savings by enabling strategic peripherals to operate, and function with decision making capabilities,in power down modes, so that time spent sleeping can be extended

Kinetis MCUs can make a difference,and will be there to help when milliamps make a world of differenceToday’s embedded systems are not like thehardware-driven systems of our past. Theyare more complicated applications, withreal-time tasks that include harvesting datafrom sensors, computing algorithms andmaking informed decisions. These applica-tions require hardware that balances per-formance with power, but more so thanever, they require advanced software devel-opment. And as we move deeper into thisnew world, the need for power efficientdevices is growing. The innovation drivingthe Kinetis portfolio is fueled by the desireto design microcontrollers that consume lesspower, offer flexible power modes, smarterperipherals, and tightly integrated softwareand enablement solutions. To keep up onwhat the team has been working on, you cancheck out Freescale.com/lowpower. As newpower efficiency updates are made, we’llshare it here on the Embedded Beat ■www.freescale.com

In an embedded system, it is all about being more energyefficient across the application’s tasks, which can generallybe broken into three phases: Initialization, Control andthe Compute. To reduce power consumption the equationis simple, reduce the area underneath the curve; inessence, do more with less power and time. This is achieved by being best-in-class in not just one ofthese phases, but in all three.

By Justin Mortimer, Kinetis MCU product manager

Kinetis MCU: A low power profile

Page 20: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu20

DESIGN MCUs

It’s been quite a while since I’ve updated you on the status ofFreescale’s sensor fusion efforts (One-stop-fusion-shopping atfreescale.com/sensorfusion). We haven’t been idle. We’ve addedsupport for FRDM-KL46Z boards and for Kinetis Design StudioIDE. The Sensor Fusion Toolkit for Windows has been expandedwith new and improved features. We’ve updated our user manu-al and vastly upgraded the content in the sensor fusion data sheet.

We’ve added a community support page atcommunity.freescale.com/community/sensors/sensorfusion. Butthe really big news is that we’ve taken the entire sensor fusionlibrary open source. It’s FREE. We got a lot of requests for lessrestrictive licensing terms and easier license checking in the code.We fixed both by eliminating all license checks, supplying theentire library in source form (no more node locked binaries) andswitching to a very flexible BSD license file. Source files mustretain the Freescale copyright, but you are free to use the codewith any set of sensors or MCUs, at no cost what-so-ever. This is Freescale’s way of encouraging broad adoption of sensorfusion-based techniques, regardless of who your supplier is.Which leads me to…

This week, at the MEMS User Group Executive Congress inScottsdale AZ, executive director Karen Lightman, announcedthe MIG Accelerated Innovation Community (AIC). The AIC isintended to facilitate sharing and adoption of algorithms for sen-sor fusion and analytics, shortening time to adoption, and (by

enabling re-use) allowing its users to focus on development ofnext generation functions. Freescale seeded the effort by con-tributing our sensor fusion library, documentation and source filesfor Windows and Android-based visualization tools. We’ll beexpanding these offerings in coming months.

Steve Whalley, MIG chief strategy officer, added that “AnalogDevices and NIST have already come on board, and PNI Sensor Corp.will contribute three algorithms: quaternion to heading pitch and roll;heart rate monitoring using PPG sensor; and step counting. We alsofully expect other MIG member companies to add further algorithmsto AIC over the next 30 to 60 days, providing a rich baseline algorithmcapability to assist developers with sensor fusion solutions.”

There have been a few sensor algorithm libraries on the web. Butthey were generally limited in ability or via license restrictions.Corporate acquisitions of Sensor Platforms, Movea and othersearlier this year have taken a number of commercial offerings outof the general market. The AIC makes professional level solutionsavailable for everyone else. Visit the MIG Open Source SensorFusion site to register and gain access to GitHub based code, doc-umentation and tools. In the spirit of full disclosure, my team andI authored much of the material currently on the site, so if youhave suggestions, please feel free to send them my way.

AIC also opens the door for companies to provide professionalsupport options, which Freescale plans start offering this month.The company will be making a bundled sensor fusion develop-ment kit (FRDM-SFUSION) available for purchase this month.The kit is offered at a suggested resale price of $170 USD andincludes Freescale’s FRDM-K64F, FRDM-FXS_MULTI-B boardspre-programmed with sensor fusion software compatible withour standard Sensor Fusion Toolbox for Windows.

Also available is a premium software development supportpackage that includes a private portal with up to 50 hours sup-port at a price of $10,000 USD. For more information, pleasevisit www.freescale.com/FRDM-SFUSION.

I’m really excited about taking our fusion library open source. I’malready seeing faster adoption, and I’m looking forward to othercontributors reviewing and adding to our work products, andadding their own. It’s a fun time to be in the sensor’s business ■www.freescale.com

By Michael StanleyMichael Stanley manages the systems/algorithms team within Freescale’s Sensors Solutions Division.

Open source sensor fusion

Page 21: EP&Dee no 4
Page 22: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu22

INDUSTRY NEWS EMBEDDED SYSTEMS

Toshiba Electronics Europe has launched a HardwareDevelopment Kit (HDK) and Software Development Kit (SDK)that together form a development platform for the TZ1000ApP LiteTM series. Suitable for wearable and IoT devices theTZ1000 series application processors enable activity levelmonitoring as well as taking a pulse and checking heart rate.

Toshiba is supplying IoT device developers with the HDK andSDK since May 7th, and is also conducting a trial campaign thatoffers a limited quantity of reference boards and the develop-ment environment free of charge. The TZ1000 series devices integrate a sensor, a processor, flashmemory, and a Bluetooth® Low Energy controller in a singlepackage. The series is designed to provide single-device solu-tions for measuring, processing, saving and communicating thedata required for wearable and IoT devices. The development environment includes a HDK embeddedwith the TZ1001MBG processor and a biometric sensor boardthat measures pulse waves and the heart’s electrical activities.The SDK includes driver software that controls each compo-nent incorporated in TZ1001MBG, middleware that measuresactivity and pulse waves, and application software that controlsthe overall system. The platform is supported by recommended developmenttools, including Keil® MDK-ARM and IAR EmbeddedWorkbench® for ARM. The kits will allow users to evaluate and develop software in anenvironment closer to their final products and to optimise use ofthe application processor for specific applications. The develop-ment environment will contribute to reduced design man-hoursand shorten time-to-market. Toshiba aims to further strengthen the TZ1000 series line-upwith the development of software algorithms to measure weakbiological signals, like pulse waves and the heart’s electrical activ-ities, as well as environmental data such as temperature andhumidity.TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com

Toshiba Launches Application ProcessorDevelopment Platforms for Wearable

and IoT DevicesEricsson has introduced a new DC/DC converter module based onthe company’s innovative and proprietary power topology known asHybrid Regulated Ratio (HRR) technology. The latest member of thePKM-NH series, the PKM4817LNH has been optimized for paralleloperation to power 2200W boards in extreme-data-demand appli-cations in the datacom industry.Offering 800W of power per unit, up to three PKM4817LNH mod-ules can be connected in parallel to achieve a total deliverable powerof 2200W. Parallel mode uses Droop Load Sharing, which means theoutput voltage has a typical droop characteristic, whereby the outputvoltage slightly decreases when the load is increasing, while stayingwithin system voltage limits.

Ericsson’s advanced HRR topology combines two power-controlmethods – voltage-regulation and ratio-regulation – and guaranteeshigh performance across the 45V to 60V input voltage ranges com-monly used in datacom systems that are powered by front-end recti-fiers. HRR offers excellent response to line and load transients andguarantees the output voltage will remain stable and immune fromvoltage deviations that are due to power disturbances on the systembus. This means it retains intermediate bus voltage integrity withinthe tolerance band required by power system architects.

Patrick Le Fèvre, Marketing and Communication Director, EricssonPower Modules, says: “The ability to operate these advanced high-power-density DC/DC converters in parallel meets the increasing needin the datacom industry for ever higher power with boards now reach-ing 2kW. The combination of Ericsson’s HRR technology and the abilityto easily parallel these new modules makes it possible to deliver the nec-essary high-density power required in extreme data traffic applications.”

Available in a quarter-brick format with a footprint of 57.9 x 36.8 x11.4mm, the PKM4817LNH operates with an input voltage range of45V to 60V and delivers an output voltage of 10V-11V at 80A withinthe operational system voltage between 51V and 60V. Below 50V, inregulated-ratio mode, the output voltage self-adjusts for optimal oper-ation and secures a stable voltage of 9.0V to 11V, even if the system busvoltage delivered via the front-end rectifier is operating abnormally.

ERICSSON POWER MODULES www.ericsson.com/powermodules

Ericsson converter brings unparalleledhigh power capability to highly demanding data networks

New HDK and SDK designed to increaseproduct development efficiency

Page 23: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 23

INDUSTRY NEWS EMBEDDED SYSTEMS

Distec now runs embedded DisplayPort

Distec - leading German specialist for TFTflat screens and system solutions for indus-trial and multimedia applications – presentsthe autonomous TFT controller boardPrismaECO-eDP, the latest member of theproven Prisma family.

“In modern TFT displays with full HD resolu-tion, manufacturers are focusing more andmore on embedded DisplayPort (eDP) as aninput interface because compared to LVDSthe eDP standard enables higher data ratesand improved EMI performance at optimized

power consumption,” says Matthias Keller,COO Components at Distec. “This concernsparticularly the medium sizes since the eDPinterface is available in all current Intel andAMD chips, especially in the notebook /ultrabook area. Therefore eDP replaces LVDSofficially on PC platforms this year.” In addition to PRISMAeco-eDP the rangeof Distec’s intelligent eDP solutions includesthe small LVDS2eDP interface. Integrated inthe customer’s existing design, it simplyconverts the existing LVDS interface to eDP.Thus the customer may keep his controllersolution but still use one of the modern,sleek full-HD displays (eg. 12.5").

Cost-effective, space-saving andpowerful multimedia cardPrismaECO-eDP

PrismaECO-eDP features an HDMI and aDisplayPort input. It controls TFT displaysquickly and easily via dual-lane eDP inter-face and supports a resolution of currentlyWSXGA (1600×900) to WUXGA

(1920×1200). The brightness of the back-light can be controlled via Pulse WidthModulation (PWM) or analog voltage, butcan also be adjusted automatically to ambi-ent light conditions by using an optionalambient light sensor.A particular advantage of PrismaECO-eDPis the fact that it can be adjusted individual-ly to the requirements of the application. The exclusive configuration softwareChandlerRover enables for example portselection, timing, EDID programming andmany other settings. This is particularly use-ful for system integrators who can adjust thePrismaECO-eDP individually for each cus-tomer. Your configurations and OSD menusettings can be downloaded from the EEP-ROM of the controller board and easily betransferred to other boards. This allows fora quick serial production of precisely con-figured TFT controller boards for variousapplications. Thus, the PrismaECO-eDP isthe universal basis for custom projects withdifferent TFT displays.DISTEC www.distec.de

Effortless control of TFT displays with PrismaECO-eDP controller boardand LVDS2eDP interface

Distec‘s PrismaECO-eDP-controller board andLVDS2eDP interface board enable comfortablecontrol of TFT displays with eDP interfaceCopyright: Distec GmbH

Matthias Keller is COOComponents at Distec GmbHCopyright: Distec GmbH

Page 24: EP&Dee no 4

DESIGN SMART ANALOG IC

Smart Analog / sensortechnology ArticleThe world of industrial automation is entering the fourth industrial revolution. A paradigmshift in which rising awareness of energy efficiency, environmental concerns and regulations,qualitative productivity and operational health and safety, contribute to the continuedgrowth of machine to machine (M2M) technology. “Smart production” will become a normin the manufacturing engineering sector, where intelligent machine systems, through net-works interconnectivity will be capable of managing industrial production processes inde-pendently from human intervention, thereby making the “Internet of Things” a reality.

The M2M communications are made possi-ble with the use of industrial instrumenta-tion comprising of intelligent sensors capa-ble of capturing events (such as tempera-ture, location, consumption, levels, move-ment etc.) and relaying the data over a net-work (wireless, wired or hybrid) to an appli-cations (software program) that translatesthe captured event into meaningful informa-tion that can be analyzed and acted upon.Looking closer into the intelligent sensorsystem structure, the sensor (or transducers)are connected to one or more microcon-troller units (MCUs) that are at the core ofembedded system. The sensor’s outputgoes to the MCU’s input. The MCU process-es that incoming signal and executes controlfunctions accordingly. Depending on theapplication and situation, the sensor’s signalmight cause the MCU to execute tasks pre-defined by the user. The purpose of a sen-sor is to detect or measure, while the pur-pose of the MCU is to execute control inaccordance with the incoming information.When used together and properly inter-faced, these components function as "detectand control" electronics, enabling greaterfunctionality, convenience, safety and effi-ciency in embedded sensors systems.However the transducers’ output signal gen-erated may be very weak, into a noisy envi-

ronment, or delivered in a format incompat-ible with the one required by the MCU.Almost all MCUs have built-in analog-to-digital converter functions (ADCs or A/Ds)for translating analog sensor signals into adigital format. But those ADCs have restrict-ed capabilities; for instance, they generallyaccept only a limited range of input volt-ages. To boost these signals to the levelrequired by the MCU, or perform the nec-essary bridging (adaptation) function toimplement signal compatibility between thetransducer and the MCU, an Analog FrontEnd (AFE) is necessary. Furthermore, thetransducers’ output may contains too manyunwanted frequencies. This noise must beremoved before the analog signal is con-verted to digital. The AFE solution employslow-pass filter circuitry to block out high-frequency noise and/or high-pass filter cir-cuits to remove lower-frequency noise.Until recently, analog circuits were typicallydesigned manually by trial and error, whichrequired a considerable amount of time andexperience to complete a design, in somecases up to a year. Engineers today in thefast developing industry, are looking forsolutions enabling them to reduce thedevelopment time of their analog circuit,and release their products faster to the mar-ket. To answer the needs, a new type of AFE

design approach was needed, which is easyto apply, flexible, quick and effective.After carrying out large scale investigationinto analog circuit for sensors, the analogexperts in Renesas’ R& D labs have perfect-ed proprietary Smart Analog circuitry anddevelopment tools that can significantlyreduce the time and effort engineers mustexpend to develop new AFEs. Using theprogramming side from the MCU, SmartAnalog, makes use of the MCU to controlthe design of analog circuit, adjust its struc-ture and its characteristics into a sensorapplication.

Smart Analog circuits are designed at a com-puter screen using configurable designedoperational amplifier circuits that greatlyreduces the design time.As a sensor equipped system uses differenttype of transducers, for many different pur-poses, each of these sensors must have itsown analog circuit. Renesas Electronicstherefore designed a platform that enablesthe user to design the most basic analog cir-cuit to the more advanced Op-amp basedtopologies, by selecting and combiningappropriate types of Op-amp. The AFE Engineer is able to get his develop-ment projects up and running quickly andeasily, with the powerful GUI-based sensor

EP&Dee | May, 2015 | www.epd-ee.eu24

Author: Bruno Nelta, Industrial & Communications Business GroupRenesas Electronics Europe GmbH

Page 25: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 25

configuration software tool that enables “onthe fly”, i.e. while system is operating, config-uration and simulation of the analog front-end. The designer can easily, via simplemouse operation at the screen of a personalcomputer or work station, select the wiringand connections between the analog

blocks, change gain values or do offset tun-ing, and adjust other parameters. This great-ly simplifies sensors calibration or debug-ging and can reduce the overall design leadtime between 3 to 8 months significantlylowering development costs.

The Technology offers customizable multi-ple single-channel general-purpose ampblocks can be used to produce tailored I/V

trans-impedance converter/amplifiers, non-inverting amplifiers, inverting amplifiers, dif-ferential amplifiers, or summing amplifiers.The chip can be custom-configured toimplement a range of signal amplificationgains and it provides an adjustable span ofsignal voltage offsets (see Figure 1).

Additionally, the single-channel general-purpose amp in the AFE can be configuredto implement a single-channel high-imped-ance instrumentation amplifier. This type of differential amplifier is essentialfor interfacing to high-impedance sensors

such as piezoelectric types (see Figure 2).Other elements found in the Smart Analogblocks portfolio are single-channel amp

(with sync detection), single-channel low-pass filter with variable cutoff frequency,single-channel high-pass filter with variablecutoff frequency, high precision 16-bit or24-bit Delta-sigma A/D converter with built-in AUTOSCAN sequencer and programma-ble gain instrumentation amplification.

Compared to the classical discreteapproach, component count can bereduced by as much as a factor of ten, allow-ing for a much smaller overall footprint.Additionally, the power-on/off feature ofeach block of Smart Analog subsystem

yields significant savings in power consump-tion, in some cases as much as 20 percent.

DESIGN SMART ANALOG IC

Figure 1: Customized examples of the configurable amp in the Smart Analog IC

Figure 2: High-impedance instrumentation amp built from the AFE chip’s 3-channel configurable amplifier

Page 26: EP&Dee no 4

DESIGN SMART ANALOG IC

The Smart Analog platform approach is par-ticularly versatile and convenient. It can beimplemented in two ways. One methodbased on a Smart Analog IC, which is a sin-gle-chip silicon die implementation of anAFE. System engineers insert it into theembedded control system to connect thetransducer to the MCU. The other oneapplies a Smart Analog MCU, a device thatcombines both AFE and MCU chips into asingle, integrated package. The Smart Analog MCU combines a SmartAnalog IC and an MCU into a space-saving,single-package device simplifying thedesign of sensor-based embedded controlsystems. Its internal MCU can be used tooptimize the sensor compatibility of the AFEchip, as well as to control that chip’s signal-interfacing characteristics. Due to thisunique combination of capabilities, theSmart Analog MCU is the only AFE solutionthat can handle the different outputs fromdiverse types of voltage, current and differ-

ential-output sensors. It provides enoughconnection terminals to accommodate allthe sensors typically needed, eliminatingthe traditional requirement to have a sepa-rate AFE circuit for each sensor. The SmartAnalog MCU helps shrink the circuit board,while simultaneously decreasing systemcomponent counts and costs.The reconfigurable characteristics of Smartanalog, means that Engineers now have afield programmable solution which can beused to plan sensor sensitivity loss overtime. Existing AFE design approaches makeit necessary during the manufacturingprocess to perform manual trimming tocompensate for variations in sensor charac-teristics. By contrast, a Smart Analog MCUautomates this process with the implemen-tation of automatic self-correction features.Thereby cutting system production andcommissioning costs, while increasing thesensor-based system’s operating lifetime Using the new Smart Analog solutions, engi-

neers can readily select the configurationand main features of the AFE they requireand, thereafter, change those selections asoften as necessary. This flexible design capa-bility significantly reduces the time that oth-erwise would be necessary for componentselection, board design, and parts procure-ment. Now the AFE portion of the system-development process can proceed muchfaster and more efficiently.Smart Analog technology represents a newinnovative platform for AFE design contribut-ing to the implementation of enhanced fea-tures into intelligent sensors, with the addedvalues of downsized systems, shorteneddesign cycle and lowered system cost. By sav-ing cost and time, the new customizable semi-conductor devices enable sensor manufac-turers, acting in the development of smarterfactories, to create products that otherwisemight be too expensive to produce or taketoo long to bring to market ■www.renesas.com

EP&Dee | May, 2015 | www.epd-ee.eu26

Renesas Electronics Europe Launches its Stream it!Kit for H.264 Encoding and Streaming in Real TimeRenesas Electronics Europe, a premier provider of advanced semi-conductor solutions, today announced the availability of its “Streamit!” kit, a complete evaluation platform for H.264 encoding andstreaming in real-time. The new kit includes all the hardware, soft-ware components and demonstration programs manufacturersneed to start development of cost-optimised video surveillancesystems, video door phones, access control and intrusion detectionsystems. Renesas’ new “Stream it!”kit enables designers of advancedsecurity and multimedia applica-tions to develop scalable systemswith the shortest time-to-market,reduced component count andoptimised PCB footprint. The“Stream it!” kit comes pre-loadedwith the H.264 Encode andStream demonstration, but canalso run two additional streamingdemonstrations included in thekit. For developers of industrial sensor and home automation sys-tems, the “Stream it!” kit can be used to log sensor status informa-tion, while sharing the collected data on a web server. For stream-ing applications targeting the consumer segment, internet radioMP3 files can be streamed to the “Stream it!” kit, decoded andplayed over headphones. In the pre-loaded video streamingdemonstration, a CMOS camera module is connected to RZ/A1L’sCapture Engine Unit and captures video in YUV format. The videostream is subsequently encoded using H.264 technology with up to40 fps. RTP packets are streamed using FreeRTOS and the UDP/IPstack and played on the PC side VLC player.RENESAS ELECTRONICS EUROPE www.renesas.eu

Renesas Electronics Improves Energy Efficiencywith Precision Control Solution for HomeAppliances, Industrial and Office EquipmentRenesas Electronics continues to develop embedded solutions thatcontribute to a reduced energy footprint. The company intro-duced the RX23T Group of microcontrollers (MCUs), designed toenable highly precise control of inverter circuits employed in ener-gy-efficient electric home appliances, industrial machinery, andoffice equipment. Based on the fast RX core, the new 32-bit MCUsare ideal for building high-performance inverter control systems forapplications such asDC motor control inenergy-efficient elec-tric home appliancessuch as refrigerators,air conditioners, wash-ing machines, vacuumcleaners, and fans;entry-level to mid-range industrial equip-ment such as general-purpose inverters, electrical tools, and drones;and office equipment. The functions are optimized for inverterdrive control, including the inclusion of an on-chip floating pointunit (FPU) that reduces code size and development time both by30 percent. Energy efficiency regulations have become stricter inmany countries in recent years, expanding to include entry-leveland mid-range energy-efficient electric home appliances and indus-trial equipment. System designers in these price-competitive mar-kets are looking for new approaches to achieve the reduced powerconsumption desired within increasingly constrained budgetrequirements for energy-efficient, cost-attractive products.

RENESAS ELECTRONICS EUROPE www.renesas.eu

Page 27: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 27

INDUSTRY NEWS EMBEDDED SYSTEMS

ASIC Redesign – The Answer for Discontinued Parts

MAZeT GmbH, specialized in the develop-ment and custom production of embed-ded systems and optoelectronics, devised aredesign strategy for digital and mixed-sig-nal ASICs (application-specific integratedcircuits) as an answer to discontinued parts.With this move, MAZeT is guaranteeing thefuture operability of existing electronicsdevelopments.

“ASICs offer significant benefits compared tostandard ICs,” explains Dr. Fred Grunert,Managing Director of MAZeT. “An electronicsconcept geared towards a specific applica-tion contains precisely the required functionrange, which consequently reduces costs andresults in a compact solution. The electricalproperties are also improved. On the down-side, parts are only available for approx. six toeight years, and stock-keeping is limited to nomore than two years. To help companiesstruggling with these issues, MAZeT devel-oped the redesign solution. A redesignincreases availability and also makes it possi-ble to further optimize the ASIC.”

MAZeT is designing thenew ASIC to be compati-ble to the original ASICboth in terms of its func-tionality and connectionoptions, keeping follow-upto a minimum. The semi-conductor technology isselected based on thepremise that it is availableover the long haul. MAZeTthus demonstrates that anASIC redesign can be ahighly efficient alternative.

Digital and Mixed-Signal ASICsThere are purely digitaland mixed-signal ASICs. Asconcerns the redesign ofdigital ASICs, variousmethods are available,such as, for instance, mask-programmable and stan-dard-cell technology orreplacement with a pro-grammable logic module.

A mixed-signal ASIC contains digital mod-ules as well as an analog part of variablesize. The redesign effort is reduced byusing analog or digital IPs, a database that isas complete as possible, comprehensiveand detailed documentation of the ASIC,as well as a testing environment. Whenimplementing a concrete redesign orderfor a mixed-signal ASIC, MAZeT eliminatedthe weaknesses of the original ASIC: Forexample, the previous 0.6 μm CMOS tech-nology was replaced by 0.35 μm CMOStechnology, which will be available over thelong term. The entire pin assignment wasretained despite the improved redesign,allowing the existing printed circuit boards(PCB) to be still used.

Prerequisites for ASIC RedesignSuccessful ASIC redesign is subject to sev-eral conditions. The more of these are met,the lower the design risk, developmenttime, and redesign costs. The top priority isto provide a technical description includinga requirements specification, circuit plan,

high-level language description, netlist, anddata sheet in order to ensure functionalcompatibility. The testing vectors and envi-ronment are essential for delivering theproof of functionality needed for seriesproduction. What is also important is thedescription of the dynamic behavior as thelogic elements such as gates, flip-flops,memory etc. of a new semiconductor tech-nology often exhibit different delay timesand the analog transistors display a differ-ent electrical behavior, i.e., they representdifferent models. Other prerequisitesinclude the testing program for the circuittester, precise documentation of the ASIC’selectrical functions, the electrical characteri-zation of the input/output behavior, thesupply voltage concept, the ESD and EMCconcept, as well as the GDS2 data set.

MAZeTwww.mazet.de

MAZeT Offers Redesign of Digital and Mixed-Signal ASICs that De-liversLong-Term Availability and Optimization

ASIC redesign by MAZeT: user-specific solutions for signal ASICs

Page 28: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu28

DESIGN POWER MODULES

Design ProcedureStep 1Select the Soft Start CapacitorPlace a capacitor CSS between the SS and AGND pins to program thesoft-start, as shown in Figure 1. CSS can be calculated using the equation:

CSS = TSS × 10μA / 0.6V

Where: CSS = Soft start capacitor value in μFTSS = the soft start time of your choice

Step 2Select the DCM/CCM ModeThe DCM/CCM mode is based on the control signal EN/MODE as

shown in Figure 2.If EN/MODE = 2V-2.8V -> CCM modeIf EN/MODE ≥ 3.1V -> DCM/CCM mode

Step 3Program the On–TimeThe On–Time TON is programmed via the resistor RON shown inFigure 1 according to following equation:

RON = ((VOUT /fSW × η) - VIN × 25 × 10-9) / 2.85 × 10-10

Where:VOUT = Output VoltagefSW = Desired Switching frequencyη = Conversion EfficiencyVIN = Input Voltage

The proliferation of fully integrated power modules allows power engineers to quickly designa fully functional, stable, efficient DC/DC converter that meets all system requirements. Usingthe XR79115 from Exar as a design example, we shall demonstrate that the design can becompleted in a few minutes.Exar’s XR79115 is a synchronous step-down 15Amp fully integrated DC/DC converter thatrequires no control loop compensation because it employs a proprietary emulated currentmode Constant On-Time (COT) control scheme.

By Alan Elbanhawy, Principal Applications Engineer, Exar

Figure 1: Typical Application

Schematic

Design a 15Amp DC/DC Converterin 15 Minutes

Page 29: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 29

DESIGN POWER MODULES

Step 4Calculate the Over–Current Protection (OCP)If the load current exceeds the programmed over–current IOCP forfour consecutive switching cycles, then the power module will enterhiccup mode.The OCP current limit is calculated via the resistor RLIM shown inFigure 1 according to following equation:

RLIM = (IOCP × RDSON + 8mV) / ILIM

Where:RLIM = Resistor value for programming IOCP

IOCP = Over-current threshold to be programmedRDSON = 5mΩ = MOSFET rated on ResistanceProgram the Output Voltage

Step 5Program the Output VoltageUse an external voltage divider feedbacknetwork as shown in Figure 3 to programthe output voltage VOUT.

Where:R1 = R2 × ((VOUT / 0.6) -1)CFF = 1 / (2 × π × 80KHz × R1) RFF = 0.015 × R1

Step 6Select the Input CapacitorBefore starting this step, determine the acceptable input ripple volt-age VPP. Then calculate the minimum acceptable capacitor valueusing the formula below.

CIN(MIN) = 1 / (((VPP / IOUT) - ESR) × 4 × fSW)

Where:CIN (Min) = Minimum acceptable input capacitor valueVPP = Acceptable peak–to–peak input ripple voltageESR = Equivalent Series Resistor of the selected capacitorIOUT = Output load currentSelect a ceramic capacitor with a voltage rating that matches theinput voltage VIN with a 30% safety margin. The capacitor’s ripplecurrent rating must be greater than the RMS current.

IRMS = IOUT × √((VOUT / VIN) × (1 - (VOUT / VIN)))

Step 7Select the Output CapacitorsBefore starting this step, determine the maximum load current stepyou expect to encounter ΔIOUT, and the maximum voltage droopacceptable VDROOP. Typically the most important factor when deter-mining the output capacitor value is the acceptable droop voltageduring the transient response. Calculate the value of the output capacitor using the formula below.

COUT = (KC x ΔIOUT) / (VDROOP × fSW)

Where:KC = constant between 2 and 5ΔIOUT = Maximum current stepVDROOP = Maximum droop voltagefSW = Switching frequencySelect ceramic capacitors with a ripple current rating greater thanthe RMS current.

IRMS = (1 /(2 × √3)) × (VOUT × (VINMax-VOUT)) / (0.56 × 10-6 × fSW

× VINMax" )

Where:VOUT = Output VoltageVINMax = Maximum input voltagefSW = Switching frequency

Online AssistanceFor additional assistance, please refer to the following web pages onExar’s website.• CAD CAE Library: www.exar.com/common/content/default.aspx?id=10330• Complete evaluation board offerings: www.exar.com/evaluationboards

ConclusionThe steps outlined in this article allow a power system engineer toquickly calculate all the necessary external components to design aworld class DC/DC converter ■

Exar, XR and the XR logo are registered trademarks of Exar Corporation.All other trademarks are the property of their respective owners.www.exar.com

Figure 3

Figure 2: DCM/CCM Mode Selection

Page 30: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu30

DESIGN SENSORS

More for less

The water meter needed to measure thewater flow precisely with a battery-oper-ated, radio-controlled counter. The sensoris positioned behind a 6 mm-thick glasspanel in a housing made of stainless steelor aluminum, and the magnet is housed inan ethylene glycol antifreeze solution. Afurther sensor which detects the presenceor absence of a magnetic field is used fortamper evidence purposes. In addition,this can also function as a configurationswitch for determining the time for thecommunication of the measured values tothe remote readout device. The data aretransmitted via radio link to a remotereadout device, which collates them.

Mirakonta had previously used a reedswitch as a water flow meter, but this didn'talways deliver precise consumption values.A new sensor model would not only need todetermine more accurate values, but alsomeet the increasing demands on energyefficiency. For support with this task, themanufacturer turned to Rutronik.

Higher precision at lower energy consump-tion – those were the Spanish manufacturerMirakonta’s requirements when developinga new premium water meter. The focus of the project was on the sensorand Rutronik was on hand throughout tooffer the company support.

More efficient water metersthanks to new sensors

Page 31: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 31

DESIGN SENSORS

Mirakonta has already been working closelywith the distributor for five years.

“In the past, we would have chosen a magnetsensor with low energy requirements for thistype of application,” explained ThomasKepcija, Product Sales Manager Sensors atRutronik. “This time, however, Mirakonta’srequirements on the energy consumptionwere so strict that those models simply could-n’t comply with them. As such, the new devel-opment from Honeywell Sensing and Controlcame at just the right time.”

The sensor specialist launched the indus-try’s first anisotropic magneto-resistive(AMR) nanopower sensor. With an energyconsumption in the nano range (360 nA)and high sensitivity of typically just 7 Gauss,it satisfies both criteria. Durable and ultrasensitive

Compared with other magnetic technologies,magneto-resistive sensor ICs offer a number ofadvantages: They are smaller, more durable, andmore reliable than reed switches, but still offer thesame sensitivity and are in the same price range. Assuch, they are ideal for battery-powered applica-tions, which function with a very low energy con-sumption and a large air gap, and for which it wasonly possible to use reed switches up until now.Compared with Hall-effect sensors, the increasedsensitivity of the nanopower sensor ICs of typical-ly 7 Gauss and maximum 11 Gauss makes it possi-ble to use them with an air gap twice as large.

“In addition, they take up less space and reducecosts, as smaller, weaker magnets can be used.Engineers are also afforded more design flexibility,as, thanks to the extreme sensitivity, they can workwith higher tolerances when it comes to the magnet-ic activation of the sensor,” summed up ThomasKepcija.

Rutronik provided Mirakonta with detailed techni-cal data and sent sample items within just a few daysfor testing of the new sensor. The tests showed: thenew sensor mastered all the challenges with flyingcolors. This positive result paved the way for devel-oping the new water meter.

Nicolas Roche, the product manager at Honeywell,is convinced that the nanopower range will giveMirakonta a new impulse, “In Mirakonta’s case, thisimproves the monitoring while reducing the energyconsumption and ultimately the costs. In addition, thelife span of the battery corresponds to that of the sen-sor and it was possible to eliminate the shortfalls ofolder technologies like the failure or gradual loss ofstability of the switches. All this makes the sensor agame-changing, sustainable product.” ■

Rutronikwww.rutronik.com

Page 32: EP&Dee no 4

Temperature measurement in the brewing industry

Beer is the most popular alcoholic beverage in Germany and manyother countries. Constantly high microbiological quality is a key suc-cess factor in the brewing of beer. Temperature - as a critical processparameter - is monitored during the entire brewing process. TheLABOM resistance thermometer with clamp-on technology is anexcellent solution for this challenging process environment.

It meets the criteria and requirements relating to hygiene regula-tions, accuracy, easy and flexible installation and price.

The solution: The LABOM resistance thermometer with clamp-ontechnology for tightening strap installation, model series GA2620. Your benefits: The LABOM resistance thermometer with clamp-ontechnology is ideally suited for temperature monitoring and processcontrol for sterile applications in the food industry. With the flexibletightening straps, the probes can be adapted for different pipecross-sections, and can be retrofitted for existing plants. As the sensor is mounted on the outside of the pipe, there are nodead zones, gaps or reduced flow conditions. The cleanability ofthe plant is not affected.

DEVICE DESCRIPTIONResistance thermometer with clamp-on technology for tighteningstrap installation, type series GA2620

Hygienic temperature measurement, no contact with medium, forpipe diameter > 57... 200 mm

• Measuring system patented• High accuracy, fast response• Quick and cost efficient installation• No welding, no interruption of process, consequently no dead

zones• No additional isolation required• Measuring resistor 1 × Pt 100, 3-wire circuitry, class A• Measuring range: -20°C up to + 160°C• Measuring insert can be recalibrated, replaceable;

the installation arrangements are unchanged• Ex-protection: TÜV 08 ATEX 554093 X• Option: 4... 20 mA transmitter

EP&Dee | May, 2015 | www.epd-ee.eu32

Contrinex C12 Series: save space, keep performanceThe new C12 series of photoelectric sensors from Contrinexoffers reflex, through-beam and background suppressiontypes in a subminiature cubic housing.

PRODUCT NEWS AUTOMATION

The very small dimensions of these sensors enable installationwherever space and optical opening are limited. Despite theirsize, all C12 sensors have long sensing ranges. In particular, thebackground suppression type has a sensing range up to 120 mmand sensitivity adjustment by a 3-turn potentiometer.

Your advantages:• Subminiature housing:

7.7 × 21.8 × 13.5 mm3 or 7.7 × 27.5 × 13.5 mm3

The LABOM resistance thermometer with clamp-on technology– the alternative to conventional invasive temperature measurement in a pipe

Hygienic temperature measurement with nocontact with mediumPrecise measurement technology - with nodead zones - meets standards in the foodindustry

Dead zones with conventional Pt 100 (left) vs. GA2620 (right)

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

Page 33: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 33

n Optical sensorsn Sensors for logistic applicationsn Safety at work

n Optical Sensorsn Inductive Sensors

n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

Leuze

Contrinex

Sensor Instruments

n Linear Sensorsn Angle Sensorsn Tilt Sensors

n PLCsn Temperature Controllern Timer

n Flowmetersn Level Indicators and Switchesn Pressure Sensors and Switches

ASM

Selec

Koboldn Linear Solenoidsn Permanent Electromagnets

Harting

HTP

Intertec

Visit our online shopwww.oboyle.ro

n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Heavy Duty Industrial Connectorsn Power and Data Transmission Connectors

AUTOMATION

• Small visible light spot thanks to red pinpoint led

• Long sensing ranges• Background suppression up to 120 mm

with 3-turn potentiometer• Excellent background suppression

characteristics• 45° angle cable outlet for easy installation

Application: roboticsThe C12 series is perfect for installation onmoveable parts in any robotics application.

The small visible light spot and long sensingranges mean that every moveable part,however small or inaccessible, can detect itsown position or the presence of an object.

PRODUCT NEWS SENSORS

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

Page 34: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu34

FLEXIBLETwo autonomous protectivefunctionsThe device offers two inde-pendent protective functionsand thereby acts as two singlelaser scanners. You save your-self one device!

HIGH-PERFORMANCE270° scanning angle / operat-ing range of 8.25 mIts large scanning angle incombination with large oper-ating range enables reliablesafeguarding, even at corners

and edges. As a result, a sec-ond laser scanner is not need-ed in many cases.

USER FRIENDLYIntelligent connection unitThe simple mounting of thesafety laser scanner is basedon a separate unit with inte-grated cable management.This unit also makes possiblefaster device upgrades orsensor replacement withoutelectronic and mechanicalrealignment.

PRODUCT NEWS SENSORS

Leuze RSL 400: Area and access guard-ing was never so simple and efficient!

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

• Separate connection unit with integrated cable management for uncomplicated mounting

• Large, plain-text display with electronic spirit level for simple alignment

• Integrated Ethernet interface for full network connectivity• Sensors are demonstrably very robust against dust thanks to

high resolution• “Sensor Studio” software for fast configuration with just five

mouse clicks

Purchase one – get two - RSL 400With the new RSL 400 safety laser scanner, we have set a newstandard worldwide in the supreme discipline of safety sensortechnology. With our decades of experience, we have suc-ceeded in developing a device that uses clever detailed solu-tions to – in many cases – perform two tasks simultaneously.

It has never been easier to use a safety laser scanner than withthe new RSL 400 from Leuze. In spite of exceptional performancecharacteristics, mounting, alignment and operation areunmatched in this segment.

Tape Extension Position Sensors POSITAPE• Measurement range 0...20000 mm• Analog, 4...20mA, SSI, CANopen, J1939• Protection class IP68/IP69K

Magnetostrictive Position SensorsPOSICHRON• Measurement range 0...5750 mm• Analog, 4...20mA, SSI, CANopen, J1939• Protection class IP64 up to IP67

Magnetostrictive Position SensorsPOSICHRON • Measurement range 0...5750 mm• Analog, 4...20mA, SSI, CANopen, J1939• Protection class IP67/IP69K

Angle Sensors and Encoders POSIROT• 360° angle sensor• Non-contact, no wear• With external position magnet• Protection class up to IP67

Inclination Sensors POSITILT• 1/2 axes inclination sensor, ±180°, ± 60° • In MEMS technology • Analog output, CANopen, J1939• Protection class IP67/IP69K

Inclination Sensors POSITILT • 1/2 axes inclination sensor, ±180°, ± 60°• Analog output, CANopen, J1939• Protection class IP67

Robust Sensors for position / inclination /angle measurement

Page 35: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 35

Leuze LPS 36 line profile sensor• For the measurement of moving objects and

the creation of 3D information• Calibrated system, measurement value display

in mm• Measurement range: 200 – 800 mm• Length of laser line: max. 600 mm• Measurement data transfer via Fast Ethernet• Optional incremental transmitter input• Measurement time: 10 ms

PRODUCT NEWS SENSORS

Label detection with Leuze forked sensors• Scaleable types of forked sensors – you only pay for what you really need!• Easily visible marks – fast changeover to new labels safes costs due to the reduction of time• Slim line design – allows space and cost reduced design of your machines • 10 kHz switching output frequency – your machines will be faster, more reliable

and more precise regarding to exactly placed labels and high performance output

Tool identificationArea: Robot workplacesDuty: Bar code, Presence inspection, 2D-code, Orientationdetection, Quality control, Dimension, contour, volume Business sectors: Machine tools

Leuze LSIS 412i smart camera• Fast setup of tests by means of configurable

software via standard web browser• Storage of camera and illumination settings

in the program (incl. motorized adjustment of focus position)

• Image preprocessing functions, such as smoothing and filtering

• Test for presence, completeness, type, position and angle• Position and rotational compensation (360°)• Automatic brightness adjustment• Statistical data• Image memory for process-, error- and reference images• Real-time clock for date and time stamp• User management with password protection

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

Leuze Series GS 61 – reliable functioncomes along with a favorable price

• Use sensors with potentiometerwithout any tool – save time and use it in an easy way

• Sensor with teach in function – fast and easy. Save your time and money during start-up. Errors and costs will be reduced to a minimum level

• Lockable teach button – eliminates needless costs caused by non professional use by the operator

• Professional industrial design with IP 65 protection will bring your maintenance costs down.

Leuze GSU 14C – the solution forevery label application

• Works with any kind of labels – Clear on Clear is no longer a problem. Changeover time and costs are as low as possible.

• Easy Teach – teaching also works with very thin materials. Start-up time and costs as low as possible.

• ALC Auto Level Control – the sensor will compensate pollution and different structure of the material. ALC avoids costs for down time and cleaning periods

• Operation mode is signalized by LED – one look says that everything is ok.

Leuze Series GS 63 – advanced line for high levelavailability

• Teach button – fast and easy. Fastest start-up and changeover will reduce down time and save your money

• Teach function – the sensor will immediately be in an optimized operation range. No down time due to errors with the adjustment. The function of the machine will become independent from the operator.

• ALC Auto Level Control – the sensor will compensatefor pollution and different structure of the material. ALC avoids costs for down time and cleaning periods

• The sensor that always works – successful teach means successful functionality. Any error in use and adjustment will be signaled at once. Down time and changeover time will be reduced to a minimum level!

• Userfriendly - metal body in food design and parameter store for 30 different labels.

Page 36: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu36

Electronic Differential Pressure Switch from Tecsis

Reliable switching for public transport with Contrinex sensors

The integrated electronics convert themeasured values into switching signals andelectrical output signals. The 3½ digit LEDshows the actual measuring values.The differential pressure switch is particularlycharacterised by its high measuring accuracyof typically 0.8% (max. 2.5%) of the adjust-ment range. The switching points and switch-ing function can be programmed easily.

The 3-button operation ensures the simplesetting of the output signals and measure-ment parameters (scaling, damping, zeropoint stabilization, zero balance, characteris-tic curves conversion).

When a trolley bus reaches a road junction,wire-switches, installed on the overheadconductor cables, control its direction oftravel. Switches may be in the default“straight-through” position or in “turnout”

position. As a bus passes a switch in turnoutposition, a sensor mounted on the overheadcables detects the presence of the currentcollector. The control system then resets theswitch to the default position.

Customer value

• Exceptional reliability in a harsh outdoor environment

• Automatic operation with optimal space utilization

• Elimination of switching errors during year-round operation

• Significantly reduced maintenance costs

Advantages of through-beam Contrinexsensor LLK-3030-00#-502

• All-electronic device with sensing range up to 12,000 mm

• Large sensing range available in physically small sensor

• Exceptional resistance to vibration during operation, IP67

Medium-voltage current transformers for indoor usage from GMWCurrent transformers are special transformers for the proportional transformation of high currents into directly measurable values. Their construction and physical operating prin-ciple enables a galvanic separation of the primary circuit from the measured circuit, thereby providing a protection for sequentially connected instruments in the event of a fault.GMW’s Medium-voltage current transformers for indoor application, which are converting multiple primary currents proportional and in-phase into measurable andstandardized secondary currents.These transformers are fully resin-hardened in polyurethane and are serving apart of their main function as a current transformeras well as a bus bar support.

The new electronic differential pressure switches Tecsis S1510 have a robust measuringsystem and can be used for system pressures up to 16 bar.

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

Current transformers for indoor application, 7.2kV, 12kV and 17.5kV

Primary switchable support type currenttransformers for indoor application,

7.2kV, 12kV and 17.5kV – Narrow typeaccording to DIN 42600

Current transformers for indoor applica-tion, 24kV – Narrow type according to

DIN 42600

Voltage transformers for indoor usage,7.2kV; 12kV; 17.5kV and 24kV – Narrow,

small and large type according DIN 42600

PRODUCT NEWS AUTOMATION

Page 37: EP&Dee no 4

MTS Sensors introduces a newrobust, high performance mag-netostrictive position sensor,using its innovative Temposonics®technology. The ET sensor isvery well suited to deploymentin applications with high tem-perature environments. It candeliver up to 0.005mm resolu-

tion when used in combinationwith a suitable controller. Industrial facilities dedicated topressboard production or theprocessing of steel/iron needinstrumentation that providesmaximum safety and reliability,regardless of difficult workingconditions. The new ET productoffering significantly extends

the supported temperaturerange of the MTS E-Series, withthe ability to precisely deter-mine exact positions even at105°C temperature levels. Thissmall rod sensor can be inte-grated directly into a cylinder,with rod length options cover-ing 50mm to 3000mm. It

exhibits linearitydeviation of lessthan 0.02% (fullscale). ET sensors haveliquid ingressprotection inaccordance with

IP68. Furthermore, ATEX certifi-cation for hazardous areas isavailable. These devices areequipped with a start/stopinterface. They also have thecapacity for sensor parametersto be automatically uploaded.A 316L stainless steel variantcan be specified if needed.MTS SENSORS www.mtssensors.com

High Accuracy ATEX-Certified MagnetostrictiveSensing Device

MTS Sensors unveils the new T-Series of magnetostrictive linearposition sensors. These high res-olution devices, which are basedon the company’s proprietaryTemposonics® technology, areoptimized for use in hazardousworking environments, wherethey might be exposed toflames, caustic substances and

potentially explosive atmos-pheres (such as chemical plants,offshore oil/gas rigs, etc.). Theyare the first linear positioningsensors in the industry to meetsafety integrity level (SIL) 2 stan-dards. In addition, they are fullycompliant with ATEX and IECExZone 0/1, Zone 1, Zone 2, Zone21 and Zone 22 safety certifica-

tions covering the protectiontypes “flameproof” and “increasedsafety”. T-Series devices are sup-plied in an all stainless steeldesign. Alternatively a highlycorro-sion-resistant stainlesssteel version is available. Thesedevices can withstand shocks ofup to 100g, vibrational force ofup to 15g (for frequencies from20 Hz to 2000Hz). When oper-ating at 60°C, their mean time tofailure (MTTF) figure is 100 yearsand have an extensive opera-tional temperature range cover-ing -40°C to +85°C (+185 °F) incertain models and can copewith pressures of 350 bar (5000psi) static. Protection from liquidingress is assured thanks to thesedevices’ IP66, IP67, IP68, IP69Kand NEMA 4X compliance. Theyalso offer a high degree of immu-nity to electro-magnetic radia-tion, in accordance with IEC/EN61326-2-3 (Class B).MTS SENSORS www.mtssensors.com

High Accuracy, Heavy Duty MagnetostrictivePosition Sensors PIL announces the availability of its

new P43 ultrasonic sensors tomeasure distances. Applicationsinclude object recognition foragriculture and fluid levels, dis-tance measuring for trucks andloading ramps, level sensing industy conditions, parking lotdetection/barrier monitoring aswell as a variety of other industrialand manufacturing applications. The PIL P43 ultrasonic sensorsprovides the industry’s greatestrange – from 250 mm to up to6000 mm. M12, M18 and M30dimensions are available - withor without thread or cubic hous-ing. Highly accurate, it provides asmall sound cone shape, twointegrated internal LED’s forecho justification, and analoginternal sensors – no need fordigital translation and no loss ofaccuracy. The P43 provides astandard analog 0-10V / 4-20mA output and two switchingoutputs. In addition to thesefixed settings, the P43 series can

be programmed via Teach-In forvarious other custom settings.Ultrasonic sensors use an ultra-sonic transducer to send andreceive sound waves. Speciallycoded ultrasonic signals aretransmitted in a set pattern.

After being reflected from theobject to be measured, the sig-nals are received by the sensorand decoded. The recordedtime of flight is temperaturecompensated and converted todistance data. PIL SENSOREN www.pil.de

Unitronic presented for the firsttime at the trade show SENSOR+TEST 2015 in Nuremberg, alow-power USM-MEMS-VOCsensor module that enables anespecially rapid detection of dif-ferent volatile organic com-pounds (VOCs) in the air. TheUnitronic Sensor Module (USM)has small dimen-sions of only 15 ×17 × 3 mm. It isequipped with ah i g h - p re c i s i o n ,long-term stableTGS 8100 minia-ture Micro-Electro-M e c h a n i c a lSystems (MEMS)sensor from Figaroand reacts within less than 8 sec-onds to the release of harmfulgases. The current consumptionin continuous operation is lessthan 14 mA.The USM-MEMS-VOC isdesigned for a supply voltage

of 1.8V. As a result of its lowcurrent consumption and smallsize, the sensor module is espe-cially suited for use in battery-operated applications. A PWMsignal for analog interpretation,three digital outputs, a UARTinterface, automatic base-leveladjustment and automatic

humidity/temperature com-pensation by means of anoptional external sensor makesit easy to integrate the USM-MEMS-VOC into a wide rangeof applications.UNITRONIC AG www.unitronic.de

Ultra-compact, low-power USM-MEMS-VOC sensormodule enables rapid measurement of air quality

PIL Launches P43 Long Range UltraSonic Sensors

www.epd-ee.eu | May, 2015 | EP&Dee 37

PRODUCT NEWS SENSORS

Page 38: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu38

Power Integrations SimplifiesDesign of Industrial PSUs for 440-VAC Line Input

PRODUCT NEWS ACTIVE COMPONENTS

Toshiba Electronics Europe haslaunched a new -40V P-ch MOSFETideal for use in automotive applica-tions such as reverse battery protec-tion and motor control. TheTJ200F04M3L offers an improveddesign which is capa-ble of reducing con-duction losses. It willconform to the AEC-Q101 automotivestandard qualifica-tion requirements.This new powerMOSFET achievesclass leading lowON-resistance bymounting a chip fab-ricated withToshiba’s U-MOS VItrench process in a TO-220SM (W)package, which utilises a Cu (copper)connector. The low ON-resistance ofthe new product contributes to

reduced conduction losses in elec-tronic devices.The TJ200F04M3L offers absolutemaximum ratings of VDSS = - 40V, ID =- 200A and RDS(ON) Max = 1.8mΩ atVGS = 10V. The power MOSFET is

capable of operating at a maximumchannel temperature of 175°C.TOSHIBA ELECTRONICS EUROPEwww.toshiba.semicon-storage.com

Toshiba Launches New -40V P-ch Power MOSFET forAutomotive Applications

XP Power announced the publicationof The Essential Guide To PowerSupplies. Written as a technical guidefor equipment design engineers andspecifiers of power supplies, the 156-page guide is a reader-friendly refer-ence for understanding all majoraspects of AC-DC power supplies,DC-DC converters and their integra-tion into today’s electronic equip-ment. The guide outlines recentchanges in legislation for safety andenergy efficiency, including the newrequirements for CE marking, the lat-est Level VI energy efficiency specifi-cation and the EU Code of Conduct. Inaddition, the guide gives details onthe new IEC 62368 standard thatreplaced IEC 60950 in 2014.According to Gary Bocock, the guide’sauthor and XP Power’s TechnicalDirector, “The guide will be valuable toequipment designers at any level ofexperience. It combines an overview ofbasic power terms and concepts and in-depth design considerations for AC-DCpower supplies and DC-DC converters.”Drawing on best practice and industrytrends, the guide outlines methods of

maximising the efficiency, reliabilityand lifetime of power supply prod-ucts. These are incorporated in thegreen mode topologies and powersupply de-rating sections.The Essential Guide To Power Supplies

is supplemented by technology edito-rials that provide practical informationon understanding efficiency, coolingwithout a fan, removing heat fromsealed enclosures and selecting powersupplies for LED lighting applications. XP POWER www.xppower.com

Informative technical guide to the changing world ofpower supplies

Power Integrations announced a new referencedesign (DER-479) demonstrating an industrialpower supply using the company’s LinkSwitch-4TM family of CV/CC primary-side regulated(PSR) switcher ICs with a 1200 V bipolar junctiontransistor (BJT). The design supports 440 VAC lineinputs and features three outputs which combineto provide up to 11 W of highly accurate constant-voltage DC power.

LinkSwitch-4 controllers feature an adaptive baseand emitter switched drive scheme to boostswitching performance and increase efficiency.The advanced switching technique is especiallybeneficial in high-voltage applications as it reducesslow turn-off switching losses and eliminates BJTfailures due to secondary breakdown, improvingthe reverse-bias safe operating area (RBSOA) andsystem reliability. Additionally, the LinkSwitch-4controller’s primary-side regulated sensingmethodology eliminates expensive and unreliableoptocouplers, replacing them in the feedbackloop with a simple transformer winding. Thedesign uses just 50 mW under no-load conditionswhile maintaining a fast transient response. The 65kHz operating frequency minimizes transformersize, reducing system cost and PCB footprint.LinkSwitch-4 devices also compensate for a num-ber of factors including: transformer inductancetolerances; input line voltage variations; cable volt-age drop; and external component temperaturevariations.

Comments Silvestro Fimiani, senior product mar-keting manager at Power Integrations: “Power supplies for high-voltage systems such asthree-phase meters and motor drives can be chal-lenging to develop – efficiency, reliability and com-ponent count often suffer in such designs. By pairingthe LinkSwitch-4 controller with a 1200 V BJT, thedesigns become very straightforward and extremelyreliable.”POWER INTEGRATIONSwww.power.com

Page 39: EP&Dee no 4

Exar Releases New 40V PowerBlox Family

PRODUCT NEWS ACTIVE COMPONENTS

www.epd-ee.eu | May, 2015 | EP&Dee 39

New high-speed A/D converters fromMicrochip feature high integrationlow-power 14-/12-bit, 200 Mspsstand-alone ADCs Microchip announces two families of new high-speed A/D con-verters: the MCP37DX0-200 and MCP372X0-200 families.These families feature 12- and 14- bit pipelined A/D converterswith a maximum sampling rate of 200 Mega samples per second(Msps). The 12- and 14-bit devices feature high performance ofover 67 dB Signal-to-Noise Ratio (SNR) and over 96 dB SpuriousFree Dynamic Range (SFDR). This enables high-precision meas-urements of fast input signals. These families operate at very low-power consumption of 338mW at 200Msps including LVDS dig-ital I/O for the 12-bit devices and 348mW for the 14-bit devices.Lower power-saving modes are available at 80mW for standbyand 33 mW for shutdown.

The MCP37DX0-200 and MCP372X0-200 include various digitalprocessing features that simplify system design, cost and powerusage for designers. These families also include decimation filtersfor improved SNR and phase, offset and gain adjustment. Data isavailable through the serial DDR LVDS or parallel CMOS inter-face and configured via SPI. An integrated digital down-convert-er is included in the MCP37DX0-200 family making it ideal forcommunications applications. The 12-bit devices include an inte-grated noise-shaping requantizer which enables users to lowerthe noise within a given band of interest for improved accuracyand performance. These families are targeted for applications inthe communications markets such as base stations, test equip-ment, and IF receivers, among others.

The MCP37DX0-200 and MCP372X0-200 are supported byMicrochip’s MCP37XX0-200 14-bit 200 Msps VTLA EvaluationBoard (ADM00652) priced at $450.00, and MCP37XXX High-Speed ADC Data Capture Card (ADM00506) priced at $599.00.

The MCP37DX0-200 and MCP372X0-200 families are availablenow for sampling and volume production in 124-lead VTLApackages. MICROCHIP TECHNOLOGYwww.microchip.com/MCP37DX0-200-MCP372X0-200-Page-051115a

Exar Corporation introduces a new line of 40V switching regula-tors to add to its popular PowerBlox™ family of DC/DC converterproducts. The XR76203, XR76205 and XR76208 are synchronousstep-down regulators supporting point-of-load (POL) supplies of3A, 5A and 8A, respectively. The devices are designed to providea wide 5V to 40V input voltage range while providing excellenttransient response and output accuracy over the entire voltagerange using Exar's proprietary emulated current mode ConstantOn-Time (COT) control loop. These devices deliver power to awide range of industrial and networking equipment typically pow-ered by well regulated 24VDC, classical telecom 18V to 36V or24VAC supplies.

With a proprietary emulated current mode COT control scheme,the XR76203, XR76205 and XR76208 provide extremely fast lineand load transient response using ceramic output capacitors. Theyrequire no loop compensation, simplifying circuit implementationand reducing overall component count. The control loop also pro-vides 0.07% load and 0.15% line regulation and maintains constantoperating frequency. A selectable power saving mode allows theuser to operate in discontinuous mode (DCM) at light currentloads, significantly increasing the converter efficiency. A host ofprotection features, including overcurrent, over-temperature,short-circuit and UVLO, helps achieve safe operation underabnormal operating conditions.

“The new line of 40V PowerBlox regulators follows the recent releas-es of the 40V XR75100 synchronous controller and XR77129 univer-sal PMIC and shows Exar’s commitment to its industrial customerbase,” said Jon Cronk, Exar’s director of marketing for powerproducts. “Exar's proprietary emulated current mode architecturesets it apart from competition in terms of load and line regulation andtransient response. The common 5mm x 5mm package size allowsdesigners to easily scale across a wide range of power levels.”

The XR76203, XR76205 and XR76208 are available in RoHS com-pliant, green/halogen free, space-saving 30-pin 5mm x 5mm QFNpackages. The XR76203, XR76205 and XR76208 are priced at$1.85, $2.30 and $2.90, respectively in 1,000-piece quantities. Formore information, visit www.exar.com/powerblox.Summary of features:• Integrated controller, drivers, bootstrap diode and MOSFETs• Wide 5V to 40V input voltage range• Patented constant on-time control• Stable with ceramic output capacitors• Exceptional line/load regulation

EXAR www.exar.com

Page 40: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu40

1200 V Dual-Channel Gate-DriverCore from Power IntegrationsEliminates Opto-Couplers

PRODUCT NEWS ACTIVE COMPONENTS

Toshiba Electronics Europe has intro-duced a new four pin TO-247 MOS-FET package targeting power factorcontrol for high power Smart PowerStage (SPS). The new package isequipped with high speed DTMOS-Hchips with low QGD to optimiseswitching behaviour.In conventional three pin TO-247 packages, parasitic induc-tion at the source pin causesincreased losses with increasingswitching frequency. With thenew TO-247 4L package anadditional source signal termi-nal is separated as a ‘Kelvinsource’. By using this sourcepin, di/dt and switching efficiency canbe increased. Compared to a threepin solution, the switching loss E(on)will be reduced by the new four pinsolution by about 15%. The DTMOSIV-H chips are made using Toshiba’sDeep Trench technology that delivers

lower ON resistance (RDS(ON)) at highertemperatures, compared to conven-tional super junction MOSFETs. It alsooffers reduced turn-off switching loss-es (EOSS) than previous technologygenerations. The combination of

smaller increases in RDS(ON) at hightemperatures and reduced EOSS pro-vides higher efficiency for power sup-plies and assists designers in minimis-ing system size. TOSHIBA ELECTRONICS EUROPEwww.toshiba.semicon-storage.com

Toshiba Introduces New Four Pin TO-247 Package forDTMOS IV-H Power MOSFETs

XP Power announced three SIP pack-aged 1 Watt DC-DC converters withboth single and dual output models.Aimed at applications requiring a highperformance DC-DC converter, theproducts feature industry standardpinouts and offer an increased effi-ciency, higher isolation, and a wideroperating temperature range thanprevious products.The ITA, ITB and ITV series convertersprovide an unregulated output in asmall, industry standard, plastic casedSIP-7 package, allowing drop inreplacement capability for improvedperformance without redesign. ITAand ITB series converters feature1,500VDC input / output isolation,with the ITV boasting an isolation of3,000VDC.With their small size, the most impor-tant application areas for the convert-ers are in mobile, portable and wire-less products or indeed when isolationor DC-DC voltage conversion is need-ed in any product. Such products areused in automation and process con-trol, broadcast, fixed telecom, instru-mentation, networking/datacom/com-

puting, mobile comms and transportindustries.Measuring in at a small 19.5 x 6.0 x10.0 mm (0.76 x 0.24 x 0.39 inches) theconverters offer a good power densi-ty of 14 Watts per cubic inch. They

take up less PCB space allowingdesigners more room to add extra fea-tures, alternatively they can reducethe overall size of the end product.XP POWER www.xppower.com

XP Power’s latest 1W DC-DC converters offer a widertemperature range and increased isolation

Power Integrations launched its 2SC0115T2A0-12dual-channel gate-driver core for 90kW to 500kWinverters and converters. Leveraging SCALE™-2+integrated circuit and isolated transformer tech-nology for DC/DC power and switching signaltransmission, the new driver core improves systemreliability and performance by eliminating theneed for an opto-coupler. The driver core’s rein-forced electrical isolation targets systems with a

working voltage of 900V, which is typical for 1200V IGBT modules and complies with the PD2 andOV II requirements of IEC 60664-1 and IEC61800-5-1. The 2SC0115TA0-12 gate-driver coresupports modules up to 2400 A and switching fre-quencies of up to 50kHz.With a footprint of 53.2 × 31 mm and a profile[height?] of just 13 mm the 2SC0115TA0-12 gate-driver core is the most compact industrial unit of itstype available. The highly integrated SCALE-2+chipset uses about 85% fewer components thancompeting products and includes short-circuit pro-tection by Vce-sat monitoring and independentsupply-voltage monitoring from both the primaryand secondary side. The new gate-driver coreincludes Soft Shut Down (SSD) protection for appli-cations with low stray-inductance. For moredemanding environments the 2SC0115TA0-12supports full Advanced Active Clamping (AAC) tocontrol the IGBT voltage overshoot during turn-off. Each of the two output channels is electrically iso-lated from the primary side and the other second-ary channel.

Comments Michael Hornkamp, senior director ofmarketing for high-power products at PowerIntegrations: “The 2SC0115TA0-12 gate-drivercore is an ideal platform for 600 V and 1200 V IGBTmodules in medium power applications such as gen-eral purpose drives, UPS, photovoltaic inverters andmedical applications, especially those with challeng-ing, fast-switching requirements.”POWER INTEGRATIONSwww.power.com

Page 41: EP&Dee no 4

Intersil’s Latest PowerNavigator™ GUISpeeds Digital Power System Design,Validation and Monitoring

PRODUCT NEWS ACTIVE COMPONENTS

Microchip’s new dsPIC33EP “GS” family isoptimised for digital power applicationsMicrochip announces the 14-member dsPIC33EP “GS” family ofDigital Signal Controllers (DSCs). The dsPIC33EP “GS” familydelivers the performance needed to implement more sophisti-cated non-linear, predictive and adaptive control algorithms athigher switching frequencies. These advanced algorithms enablepower-supply designs that are more energy efficient and havebetter power-supply specifications. Higher switching frequen-cies enable the development of physically smaller power sup-plies that offer higher densities and lower costs. Compared withthe previous generation of DSCs, the new dsPIC33EP “GS”devices provide less than half the latency, when used in a three-pole three-zero compensator, and consume up to 80% lesspower in any application.

This new dsPIC33EP “GS” family includes advanced features suchas Live Update Flash capability, which is especially helpful forhigh-availability or “always-on” systems. Live Update can beused to change the firmware of an operating power supply,including the active compensator calculation code, while main-taining continuous regulation. Variants from this new digital-power-optimised DSC family are available in the industry’s small-est, 4 x 4 mm UQFN package for space-constrained designs.

View a brief presentation: www.microchip.com/Presentation-051215a

Other key features of this family include up to five 12-bit ADCswith as many as 22 ADC inputs, providing total throughput of 16Mega samples per second (Msps) with a 300 ns ADC latency.The dsPIC33EP “GS” devices include 12-bit DACs for each of thefour analogue comparators, for higher-precision designs. Thetwo on-chip programmable gain amplifiers can be used for cur-rent sensing and other precision measurements. Including theseadvanced analogue amplifiers on the device reduces the num-ber of external components required, thereby saving cost andboard space.

These features, combined with the overall high performance ofthe dsPIC33EP “GS” family, make it well suited to a wide range ofapplications including: computing & telecoms AC/DC and DC/DCpower supplies; industrial solar inverters, LED lighting, HID light-ing, battery chargers, projectors and welders; and automotive LEDand HID headlights and DC/DC converters; among others.MICROCHIP TECHNOLOGYwww.microchip.com/dsPIC33EP64GS506-051215a

Intersil Corporation unveiled PowerNavigator™ version 5.2, a free,downloadable graphical user interface (GUI) that helps systemdesigners quickly configure, validate and monitor their power sup-ply architectures. The new features included in PowerNavigator5.2 enable a high degree of power supply optimization.Combined with the drag-and-drop GUI interface, PowerNavigator5.2 makes it straightforward to change features and functions of adigital power supply design without writing a single line of code.The PowerNavigator 5.2 software GUI allows for configuration andmonitoring of Intersil’s portfolio of PMBus™-enabled digital powerproducts, including digital regulators, controllers, multiphasedevices, power modules, and digital power monitors. Using a PC,USB interface and a few mouse clicks, designers can configure andchange any parameter, telemetry or rail sequencing for their digi-tal power supply. Intersil’s PowerNavigator version 5.2 includesthree new innovations:

• PowerMap adds more real-time information to the power railblocks, such as device name, phase count, output voltage, outputcurrent, PMBus addresses, and current sharing capability. Thisadditional information helps users more quickly visualize their sys-tem. PowerMap’s realistic system level view, with zoom-in/out andscrolling, replicates a system with multiple power rails deliveringpoint-of-load current to ASICs, processors, DSPs or FPGAs.• Rail Inspector quickly guides users through the power supplyparameters set up. Rail Inspector brings up rail name and showsthe number of devices, device address and status, as well as impor-tant supply parameters: input voltage, switching frequency, outputvoltage, and load current. Device options include clock synchro-nizing, sequencing, and current sharing. Users can then load andsave configuration files in both text and hex formats.• RailScope simplifies system validation, giving users the ability toplot all device telemetry – such as input voltage, output voltage,output current and temperature – for up to four rails at a time.RailScope’s system logging feature automatically logs telemetryand fault data for later analysis.To download the PowerNavigator 5.2 GUI, watch a tutorial videoand begin a design, visit: http://www.intersil.com/powernavigator.To learn more about digital power, download our whitepaper.INTERSIL www.intersil.com

www.epd-ee.eu | May, 2015 | EP&Dee 41

Page 42: EP&Dee no 4

Power-monitoring IC fromMicrochip adds advanced features for high-accuracy powermeasurement in commercial and industrial designs

PRODUCT NEWS ACTIVE COMPONENTS

New CIS type image sensor produces crisper images even when recording in high contrast light conditionsToshiba Electronics Europe hasannounced that it will start mass pro-duction of a new CMOS imagesensor with a 1/3 inch optical for-mat and full HD (1080p) resolu-tion. The TCM3232PB meets therequirements for high resolution,high-speed frame rate and highfidelity images needed for indus-trial use, and is suitable for appli-cations in security and surveil-lance cameras, monitor camerasand driving recorders.Employing Toshiba’s innovative HDR

(High Dynamic Range) function, thisnew sensor, gives 108dB of dynamicrange and is optimised to captureclear images without distortion even in

high contrast light conditions. The sen-sor also allows video to be captured infull resolution at 60fps to create natu-ral, smooth footage.The TCM3232PB is housed in a com-

pact PBGA (plastic Ball Grid Array)

package, measuring 10mm x 10mm,and will be entering production at theend of April 2015.TOSHIBA ELECTRONICS EUROPEwww.toshiba.semicon-storage.com

Toshiba Launches 1080p Full HD CMOS Image Sensorfor Industrial Applications

Integrated Device Technology, Inc.(IDT®) announced that IKEA choseIDT’s wireless power transmitters toembed in its furniture and accessoriesfor convenient wireless charging ofenabled portable devices. IDT’sP9030 magnetic induc-tion transmitters areembedded in new IKEAproducts including sidetables and lamps. Theproducts will soon beavailable in storesthroughout NorthAmerica and Europe.In addition to the furni-ture, IKEA has devel-oped a line of chargingpads as well as a wirelesscharger that consumerscan build into furniture themselves—all built around the IDT wirelesspower semiconductor.“IKEA revolutionized the furnitureindustry, and it continues to prove itselfan innovation leader with the integra-tion of IDT wireless charging transmittersinto its products,” said Arman Naghavi,IDT’s vice president of Analog Power

Technology. “The company’s adoptionof our Qi technology underscores thetraction we’re seeing as the wirelesspower ecosystem continues to expand.”The P9030 transmitter complies withthe Wireless Power Consortium’s

(WPC) Qi standard, delivering a 5Wsingle-chip solution in a compactpackage. IDT wireless power transmit-ters and receivers have also beendesigned into smart phones, phoneaccessories, wearables and chargingstations.INTEGRATED DEVICE TECHNOLOGYwww.idt.com

IKEA Furniture Features IDT Wireless Charging

The International Furniture Retailer is Selling Innovative Furnitureand Home Accessories with Embedded Wireless Power Transmitters

Microchip announces the addition of a new mem-ber to its power-monitoring IC portfolio, theMCP39F511. This highly integrated and accuratesingle-phase power-monitoring IC, designed for thereal-time measurement of AC power, combines themost popular power calculations with uniqueadvanced features, making it ideal for use in high-performance commercial and industrial productssuch as lighting and heating systems, smart plugs,power meters and AC/DC power supplies.

View a short video on Microchip’s metering products:www.microchip.com/Metering-042115a.

To address industry requirements for better accu-racy across current loads, additional power calcula-tions, and event monitoring of various power con-ditions, the MCP39F511 power-monitoring ICprovides all of the popular standard power calcu-lations combined with advanced features. Theimport and export of active energy accumulation,four-quadrant reactive energy accumulation, zero-crossing detection and dedicated PWM outputhave now been integrated on-chip, along with theability to measure active, reactive and apparentpower, RMS current and RMS voltage, line fre-quency, and power factor.

Allowing for more accurate power measurements,which is critical in higher-performance designs, thisnew device is capable of just 0.1 % error across awide 4000:1 dynamic range. Additionally, its 512bytes of EEPROM allow operating-condition stor-age. The MCP39F511 also includes two 24-bitdelta-sigma ADCs with 94.5 dB of SINAD perform-ance, a 16-bit calculation engine, and a flexibletwo-wire interface. A low-drift voltage reference,in addition to an internal oscillator, is integrated toreduce implementation costs.

MICROCHIP TECHNOLOGYwww.microchip.com/MCP39F511-042115a

EP&Dee | May, 2015 | www.epd-ee.eu42

Page 43: EP&Dee no 4

Digi-Key Spotlights its New TechZones; At-A-Glance Technical Content SimplifiesOnline Part Selection for Design Engineers

PRODUCT NEWS ACTIVE COMPONENTS

Murata launches ultra compact rotaryposition sensorMurata announced what is believed to be the world's smallestrotary position sensor. Measuring just 4.0 × 4.5 × 2.0 mm theSVM4 series is approximately an eighth of the size of Murata'sprevious position sensor the SV03. Despite its miniscule dimen-sions the SVM4 exhibits a linearity of ±2% and suits a wide vari-ety of space-constrained applications such as finger-joint con-trollers in humanoid robots or to provide angular control in verycompact spaces such as in radio-controlled model and gameconsole controllers. The effective rotational angle is 240° andwith a useable temperature range from - 40°C to +85°C can beused in most operating environments.

Other potential applications for the SVM4 include use in wear-able devices such as headsets and hearing aids or as a lens/irisfeedback sensor in compact digital cameras.Mass production is scheduled to commence during August 2015.MURATA www.murata.com

Toshiba Launched 4500V 1200A IEGT ModuleToshiba Electronics Europe has launched a high – current 4500V,1200A power module for use in rail traction, industrial motor con-trol, renewable energy systems and electricity transmission anddistribution applications.The MG1200GXH1US61PMI (plastic case moduleIEGT) integrates an N-channel IEGT (injection-enhanced gate transistor)and a fast recovery diode(FRD) into a standardpackage with a footprintof just 140mm × 190mm.Designed to be used at much higher currents in the 4500Vmodule class, the new module will also save energy, space andweight in high-power switching converter/inverter and motorcontrol designs. The MG1200GXH1SU61 offers an isolation voltage rating of6000 VAC (rms for one minute) and can handle a peak turn-offcollector current of 2400A. Collector power dissipation (at25°C) is 4000W. An operating temperature range of -40°C to+150°C ensures compatibility with the extended temperatureenvironments that characterise high voltage applications.TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com

Global electronic components distributor Digi-Key Electronics, theindustry leader in electronic component selection, availability anddelivery, announced its new and improved online TechZones, aspart of a recent series of web site updates. The TechZones aredesigned to give design engineers an at-a-glance aggregate view ofnew products, technical resources and application-specific content.This week, Digi-Key will debut its newest and most comprehensiveTechZone – Lighting Solutions - at LIGHTFAIR in New York City.

Digi-Key’s TechZones include:• Lighting Solutions• Energy Harvesting

Solutions• Microcontroller

Solutions• Power Solutions• Sensor Solutions• Wireless SolutionsThe new TechZone pro-vide engineers with an at-a-glance aggregate viewof product informationand highlights, videos,articles, suppliers, refer-ence designs and indus-try-specific solutions. The easily accessible information saves cus-tomers time, making it easy to access products, solutions and techni-cal content directly related to their projects. Localized versions of thenew TechZones are accessible on all of Digi-Key’s global websites.

Lighting Solutions TechZoneThe featured Lighting Solutions TechZone features a compilationof new product content and an easy-to-use component selectiontool. The new features of the page include the Product Selector,LED Modules and Light Engines guide along with a comprehensiveview of all industry suppliers. New products and component infor-mation from all Digi-Key lighting component manufacturers is easyto access in one convenient location versus residing only in theSupplier Marketing Centers.

New features include:• The central aggregate collection of all Lighting Solutions

organizes content by manufacturer, application and component type, making it easy for engineers to access the most relevant products and solutions.

• The LED Modules and Light Engines sections offer the most up-to-date and innovative supplier LED modules and engines. Modules and engines take product development to the next level by simplifying design and reducing cycle time, allowing fixtures and luminaires to be introduced into the market at a faster pace

• Digi-Key’s Lighting Product Selector allows the opportunity for designers to quickly browse and locate components to develop solid-state fixtures and luminaires. Categories include LEDs, drivers, optics, thermals, interconnect and protection devices.

DIGI-KEY ELECTRONICS www.digikey.com

www.epd-ee.eu | May, 2015 | EP&Dee 43

Page 44: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu44

Microchip introduces EtherCAT®slave controller With integratedPHYs for industrial Ethernet andInternet of Things applications

PRODUCT NEWS ACTIVE COMPONENTS

Integrated Device Technology, Inc.(IDT®) announced its collaborationwith Blu Wireless Technology todemonstrate integrated wirelesscharging with ultra-fast 60 GHz WiGig®data transmission, a combination thatwill enable consumers to charge theirphones and tablets while streamingthe highest quality 4KHD video and photos totheir televisions andcomputers - all withoutthe need for cords. The collaboration willteam IDT’s expertise inwireless power with BluWireless’s know-how inWiGig, which allowsdevices to communicatewirelessly at multi-gigabitspeeds. The single-mod-ule technology targetedby the companies will, forexample, enable consumers to wireless-ly charge their devices while cordlesslytransmitting uncompressed video of1080p directly to their HDTV.WiGig technology uses the 60 GHz

band to deliver 7 GHz bandwidth. Asynchronization of data on a portabledevice that today would take twohours and use up nearly a third of abattery’s charge can be completed,with WiGig, in just 45 seconds andconsume only 2 percent of the charge.IDT’s semiconductors are enabling

wireless charging today in a quicklygrowing ecosystem of applicationsthat includes smartphones and acces-sories, wearables and furniture.IDT www.idt.com

IDT Teams with Blu Wireless to Unite WirelessCharging and WiGig Data Transmission

u-blox announces the CAM-M8C, asmall, low profile GNSS positioningmodule with an integrated widebandchip antenna for reception across theentire L1 band. The module offerssimultaneous GNSS operation forGPS/GLONASS, GPS/BeiDou, orGLONASS/BeiDou to deliver accurate,jamming-resistant and reliable position-ing anywhere in the world. Featuringindustry-leading sensitivity, the CAM-M8C integrates a u-blox M8 satellitereceiver, crystal oscillator, SAW filterand low-noise amplifier. It also has aninput for an external active antenna andwhen using this option the internalantenna acts as a backup. Thanks to itsnovel antenna design the module main-tains its performance regardless ofphysical orientation. This makes theproduct highly suitable for mobileapplications with frequent change ofbearing.The CAM-M8C is footprint compatiblewith u-blox UC530 and UC530M mod-

ules, providing an easy upgrade path.To further accelerate design and devel-opment, an evaluation kit, the EVK-M8CCAM, offers a quick way tobecome familiar with the CAM-M8Cmodule and assess its performance inspecific applications. The u-blox M8GNSS receiver antenna module is deliv-ered in u-blox Professional Grade and isqualified to JEDS47 and ISO16750 stan-

dard: “Road vehicles – Environmentalconditions and testing for electrical andelectronic equipment”. The product ismanufactured in ISO/TS 16949 auto-motive-certified production sites, ensur-ing the highest quality and reliability.U-BLOX www.u-blox.com

u-blox tiny surface-mount GNSS global positioningmodule supports all satellites and concurrent operation

Microchip announces the LAN9252 stand-aloneEtherCAT® slave controller with two 10/100 PHYs.This highly integrated device’s dual 10/100Ethernet transceivers support both fiber and cop-per, along with cable diagnostics capabilities. TheLAN9252 supports traditional Host Bus andSPI/SQI™ communication, along with standalonedigital I/O interfaces, providing system designersthe flexibility to select from a wide range of micro-controllers when implementing the real-timeEtherCAT communications standard.

Additionally, the LAN9252 reduces system complex-ity and cost for developers using EtherCAT in facto-ry-automation, process-control, motor/motion-con-trol and Internet of Things (IoT) industrial-Ethernetapplications. Technology research firm ARCAdvisory Group is forecasting Ethernet’s double-digit growth for use in industrial networks, partlyfuelled by applications in the emerging IoT segment.With EtherCAT technology’s “on-the-fly” processingand use of standard Ethernet cabling, Microchip’sLAN9252 slave controller offers the high level ofintegration and cost optimisation required for cur-rent and future industrial applications.Fully compliant with the EtherCAT standard andinteroperable with all EtherCAT systems, theLAN9252 EtherCAT slave controller includes 4Kbytes of Dual-Port RAM (DPRAM) and threeFieldbus Memory Management Units (FMMUs). TheLAN9252 also features cable diagnostics supportthat allows field service technicians to rapidly andeffectively diagnose line faults and provides for fibreconnectivity. This EtherCAT slave controller is avail-able in commercial, industrial and extended industri-al temperature ranges, in low pin-count and smallbody size QFN and QFP-EP packages.The LAN9252 EtherCAT slave controller is avail-able now for sampling in 64-pin QFN and QFP-EPpackages.MICROCHIP TECHNOLOGYwww.microchip.com/EtherCAT-041715a

Page 45: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 45

DESIGN LIGHTING SOLUTIONS

Telenor Connexion helps Leading Light developsmart street lighting Leading Light has partnered with Telenor Connexion to develop a connected lightingsolution launching in 2015. ActiveLights™ online will reduce the maintenance cost andprovide new information services that are requested by customers.

Leading Light is an innovator within cli-mate-smart lighting solutions. The energyefficient solutions are used by municipali-ties, utilities and companies, helping theseto achieve environmental goals while at thesame time creating a safe environment. Bypartnering with Telenor Connexion, an IoTfocused extension of Telenor Group, oneof the world’s largest telecom companies,Leading Light is provided an end-to-endservice, Telenor Cloud Connect, rangingfrom solution design to operations.

Telenor Connexion has worked togetherwith Leading Light to optimize everythingfrom hardware design, information man-agement and end user experience.

“Hardware design, data communication andapplication development are all critical partsin the solution. Partnering with TelenorConnexion has helped us reduce develop-ment time and also provides us with a solidfoundation for new innovative services”, saysNiclas Perkman, CEO at Leading Light.

The understanding of the complete solu-tion is vital in the operations phase, whereTelenor Connexion will host and supportthe lighting solution as well as ensure that itevolves over time.

“We are very happy to be able to supportLeading Light in developing this connectedlighting solution”, said Marie Gustavsson,Regional Sales Manager Nordics at TelenorConnexion. “The energy efficient solution,and the environmental goals it supports, real-ly taps into one of our core business values:sustainability. By using and exploring newways of smart technology we can developsustainable solutions with minimal impact onthe environment.”

LEADING LIGHTwww.leadinglight.seTELENOR CONNEXIONwww.telenorconnexion.com

Leading Light connected lighting solutionSotenas, Sweden.Source: Leading Light

ActiveLights™ connected lighting solution

Source: Leading Light

Leading Light connected lighting solution Djurgarden, Sweden

Source: Leading Light

Page 46: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu46

DESIGN OPTO-ASICs

MAZeT – Specialists in OPTO-ASICs

MAZeT GmbH presented new productsand innovative sensor solutions in thefields of LED light, process analytics, qual-ity control, and color measurement in hall12, booth 386 at the SENSOR+TEST tradefair, which was held from 19 to 21 May2015 in Nuremberg, Germany.

The JENCOLOR® sensors contain photodi-odes combined with structured interferencefilters. Typical features include high operat-ing frequency, parameters with long-termstability within a specified temperaturerange, low-tolerance spectral transmission,and operating temperatures above 100°C.The sensors can be delivered as electroniccomponents or as part of application-spe-cific modules and devices. User-specificsolutions for hardware, firmware, software,and support in the calibration of user-spe-cific solutions also form part of the MAZeTservice package.

Requirements for Opto-ASICs – highsensitivity and age-resistantPackaging is a priority with Opto-ASICs. Theproperties it offers need to ensure theseamless processing in the manufacturingprocess of an electronic module and guar-antee the functional features for the entirelifespan. More than 50,000 operating hoursare required for the LED light application inparticular. High sensitivity, bandwidth, ADC resolution,and spectral selectivity are parameters thatcan play an important role especially in theapplication areas of process instrumentationand color measurement. The many different functions offered by theserial interface of the sensor signal amplifierenable optimal adjustment to the variouscustomer applications and processes forrecording readings.MAZeT has been a successful provider ofOpto-ASICs and embedded systems forseveral years. At this year’s trade fair, thecompany will use selected demonstrators topresent the capabilities of its LED light colorcontrol and how to determine spectral foot-prints of fluids composed of highly variedsubstances.MAZeT now offers the option of adaptingexisting standard products to the customer’s

application requirements by varying thespectral filter characteristics. These applica-tion-specific hyperspectral sensors offer thechance to explore new application areaswith cost-efficient, spectrally resolved opti-cal point sensors.

MAZeT provides solutions for line and matrixsensors with low complexity for spatiallyresolved optical sensors. These can be adjust-ed according to the customer’s requirementson request. The pixels can be combined withspectral filters if this function is required.At the trade fair, Opto-ASIC specialists from

MAZeT have advised interested customers onthe options in terms of technology, costs, anddevelopment time for their project on site.

Spectral data gains increasing importanceMAZeT offers hyperspectral sensors as stan-dard electronic components for the VISrange. A development kit is available in sev-eral different versions to support the cus-tomer. The data logging and evaluation soft-ware ensures rapid start-up of the sensorevaluation board and allows the customer toefficiently work on the solution for hisdefined task.The JENCOLOR® hyperspectral sensors areparticularly well suited to calculating thespectral footprint of transparent fluids witha continuous spectrum.

A further application scenario is in thearea of quality assurance and processinstrumentation.

It is possible to quickly expand the analyz-able spectral range in the NIR range (< 1000nm) and the UV range (> 250 nm) at anytime (for example, by adjusting the filtercharacteristics) and at low cost.

The electronic sensor components arealways delivered in the familiar design of theMMCS6CS hyperspectral sensor.

Customized signal analysisMAZeT also offers integrated signal process-ing ASSPs to complement its JENCOLOR®sensors. The MAZeT product line rangesfrom programmable, multi-channel transim-pedance amplifiers, right through to signalamplifiers with an I2C or SPI port.

A key functional component of the new gen-eration of signal amplifiers are the analog-to-digital converters, which are tailored to therequirements of the JENCOLOR® sensors.These signal amplifiers need to reliably cap-ture photocurrents from multiple powersources at the same time and convert them inhigh resolution. MAZeT provides a measure-ment value resolution for this of up to 20 Bit(20 fA/LSB to 5 nA/LSB). The absolutedynamic is greater than 1:1,000,000.

MAZeTwww.mazet.de

JENCOLOR® color sensors and systems for light control and customized signalprocessing through to Opto-ASIC designs and user-specific hardware solutions

Figure 1: Programmable sensor amplifier with SPI port

Figure 2: Customized packaging

Page 47: EP&Dee no 4

Mouser Electronics, Inc., theglobal authorized distributorwith the newest semiconductorsand electronic components, isnow stocking the LUXEON 5258LEDs from Lumileds. Engineeredto serve as a single 4.8 mm opti-cal light source, the LUXEON5258 is a multi-die package LEDthat provides precise beam con-trol and high luminance from asingle package. These LEDs use a5258 surface mount package,and are available in 24V and96V options for a variety ofdirectional LED lighting applica-tions. The Lumileds LUXEON5258 LEDs, available fromMouser Electronics, feature asingle 4.8mm optical light emit-ting surface (LES) that provideshigh-flux and high-efficacy,improving the quality of lightwhile avoiding the showerheadeffect common with distributed,multi-die solutions. The devicesare offered in two voltage ver-sions of either 24V or 96V, andare available in warm white colortemperature ranges of 2700K

and 3000K. The color renderingindex (CRI) of the LUXEON5258 is rated at 80, and thedevices offer hot-color targetingto ensure that the LEDs are with-in color target at ANSI applica-tion conditions of 85°C. All theLUXEON 5258 devices are also

binned with either a single 3-step or 5-step MacAdam ellipseto ensure color uniformity, andare compatible with low costand high efficiency drivers.Lumileds LUXEON 5258 LEDsoffer some of the best efficacyand flux metrics in the markettoday, providing superior relia-bility and droop curve overother competing solutions. MOUSER ELECTRONICSwww.mouser.com

Lumileds LUXEON 5258 LEDs for DirectionalLighting Applications Now at Mouser

DSL (Datasound LaboratoriesLtd.), sole UK distribution armof Aplex Technology Inc.,reveals the latest in passivecooling technology with theirIntel Core i7 processor basedfanless Panel PC's, the APC-3x19. The front IP65 protectedAPC-3x19 Panel PCs, specifiedfor 0-50°C operation containabsolutely no moving parts -reliability and longevity, the keystones of industrial and embed-ded computing, are satisfiedwith ease. For ultimate reliabili-ty the APC-3x19 Panel PCs alsonatively support RAID. Widely self-configurable,clients can specify their ownDDR, SSD and pre-installed OSpreferences, even expand theI/O themselves utilising the in-built PCI or PCIe x16 expansionslot. With display sizes of 15"-24" 1080P, the ability to cus-

tomize the APC-3x19 Panel PCto do exactly what OEMs, sys-tem integrators and industrialend customers want is the icingon the cake. Customers achievetheir own unique I/O function-ality and exact connector loca-

tions via multiple I/O easyinstall peripheral modules orDSL design services. Aesthetical customizations withcompany branded bezel colourand company logo are furtherdesign options as well as thebezel material. DSL www.dsl-ltd.co.uk

The latest in passive cooling technology

MSC Technologies is offeringInnovative LMH2+ withunprecedented combination of125 lumens-per-watt Efficacyand 90 CRI in a Small FormFactor. The LMH2+ is the onlyLED module that allows lightingmanufacturers to achieve a sys-tem efficacy of 100 lumens-per-watt with high light quality.Featuring elements of Cree’sinnovative SC5 Technology™Platform, the groundbreakingefficacy of the LMH2+ drivesnew applications, enables smallerluminaires and lowers systemcost. The LMH2+ allows lightingmanufacturers to address morechallenging installations such asthose with space constraints orhigher ambient temperatures.The LMH2+ is a drop-in upgradefor LMH2-based designs, pro-

viding an immediate boost inperformance compared to theprevious generation. Like allLMH2 modules, the LMH2+delivers the same efficacy acrossall color temperatures.

Lighting manufacturers can alsoleverage existing ecosystems,tooling and optic design ele-ments to accelerate time to mar-ket and lower design cost. Inaddition, UL® rating will be avail-able for maximum and nominalcurrents to provide more driveroptions and design flexibility.MSC TECHNOLOGIESwww.msc-technologies.eu

EVERLIGHT ELECTRONICS CO.,LTD. demonstrated its compre-hensive portfolio of LED compo-nents for lighting and automo-tive applications at LIGHTFAIRInternational, May 5-7. Highlightsat the EVERLIGHT Booth #1329included the High Efficiency LEDEAHE 5630 (0.2W) and the UltraWarm White LED EAHP 3030(1.0W) and color choice LEDsolutions for general lighting aswell as existing popular packagesavailable in all colors for horticul-ture lighting.EVERLIGHT's EAHE 5630(0.2W) achieves 180lm/W forhigh efficiency tube applicationsand has found its way as a pre-ferred LED into many otherapplications such as downlights.

At a cool white temperature of5700K, 187lm/W is achieved.The new EAHP 3030 series (1W)provides a very warm 2200K thatreplicates the color temperatureof traditional incandescent orhalogen lighting. This is ideal fordecorative and accent lighting.EVERLIGHT's popular Shuen,3535 and 2835 packages arenow available with all colors andare perfectly suited for horticul-ture lightings. Furthermore, therewill be a sneak preview ofupcoming, soon to beannounced EAHP5050 andEAHP9595 packages, primarilyintended for high lumen densityapplications.EVERLIGHT ELECTRONICS CO. LTD. www.everlight.com

EVERLIGHT exhibited complete LED componentportfolio for lighting and automotive applicationsat LIGHTFAIR 2015

New LMH2+ LED Modules from Cree with 30%better performance

www.epd-ee.eu | May, 2015 | EP&Dee 47

PRODUCT NEWS Lighting Solutions / Display

Page 48: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu48

INDUSTRY PRODUCT NEWS

Do you need various products at a high level quality? Do you want a single providerfor a wide range of technical products, which at the same time can offer you offline oronline technical support free of charge? If you want all the above and more like orderswithout threshold value in a short amount of time, you can choose with confidence theonly authorized dealer of RS in Romania.

Aurocon COMPEC is the solution for your needs, giving you the option to choose morethan 550.000 products from over 2.500 manufacturers, being the optimum choice for awide range of technical products for several industries.

With an extensive range available in stock, reli-able service and support, Aurocon COMPEC make it easy for you tofind and buy whatever you need. Whenever you need high-qualityparts on time and on budget, you can count on us.

Designed around the needs of your business, our suiteof free eSolutions helps you do away with non-valueadded activities and maintain more control over thepurchase-to-payment cycle.

At Aurocon COMPEC, we’re committed to acceleratingthe find, design and buy process and we dedicated toproviding greater savings, value and assurance whenever you buy from us.

On our website, you can find details about each product including the technical datasheet, prices, information regarding product availability or several methods of packagingand shipment.

We rely on 20 years of experience and on our qualified personnel so we can guarantee the best products andhigh quality services at competitive prices, based on customer feedback. We put at your disposal all of this sothat you can place the order very easy by email, phone, fax or online on our user friendly website.

In concordance with this we present you a few information with what we launched in April.

Information Launched in April

Page 49: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 49

INDUSTRY PRODUCT NEWS

NAME SEARCH ON RS PRODUCT DETAILS

MKP1848C series

MKP1848C 15μF Polypropylene Film Capacitors, Ideal for inclusion in industrial power applicationsthrough-hole - Battery Chargers, Motor Drives, Renewable

Energies Inverters, UPS.

MKP1848S series

MKP1848S 20μF Polypropylene Film Capacitors, Use in Battery Chargers, LED Street Lighting,through-hole On Board Chargers (EV/HEV)

AY2 series

AY2 Series through-hole Available in industry-standard packagingDielectric Ceramic Capacitors for small batch runs. Now reduced in price.

20 LHE Series

20LHE Series Linear Hall RoHS compliant with a long operational effect position sensor life - ideal for designing into switches and

indicators for harsh environments.

Form Vishay brand we introduced in our range a major of passives, like:

NAME SEARCH ON RS PRODUCT DETAILS

Motor Protection

SM1 series motor protection circuit breakers Features an integrated magnetic trip indicator which avoid closing operations during short-circuit conditions and preventing risk of damage and down-time.

Miniature Circuit Breakers

P1MB series miniature circuit breakers Quick, snap-on mounting on DIN rail. We offer this full range of popular items direct from stock.

GX series

GX series rotary switches Long life and high breaking capacity, quick and easy to install. Great value when compared to other major brands.

In add new automation and control devices form Lovato brand.

Page 50: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu50

INDUSTRY PRODUCT NEWS

Author: Mihaela SârbuAurocon Compec

For more information about the products please access http://ro.rsdelivers.com/ you cancontact us by email: [email protected], tel: 0213 046 233, fax: 0213 046 234.

BRANDS NAME SEARCH ON RS PRODUCT DETAILS

Tektronix Each model is multi-functional with integrated basic spectrum analyzer, Wave Inspector Navigation, MSO, serial and parallel bus triggering and analysis, and digital voltmeter. Optional instrument upgrade and application modules can be bought at the time of the initial scope purchase or at any time afterwards.

Barth Elektronik New technology mini logic controllers, the size of a match box, ideal for embedding in small, stand-alone machines or vehicles.It is easy to program and mount, economical with kow power consumption.

Siemens The latest release of SIMATIC CPU’s, offering faster processing of the control programme, and ethernet networking interface with central access via the IP-address of selected modules – diagnostics and control anytime, anywhere!! Market-leading technology for machine and panel builders developing process automation systems.

From great opportunities in Test and Measurement range, we add several productsfrom various brands, like:

RS No. Mfr. Part No.797-3324 MDO3054 797-3346 MDO3014 797-3337 MDO3034797-3334 MDO3024

RS No. Mfr. Part No.864-4535 0850-0500864-4538 0850-0600864-4532 0660-0500864-4541 0660-0600

RS No. Range862 - 4455 or CPU 1211862 - 4468862 - 4461 or CPU 1212862 - 4474862 - 4477 or CPU 1214862 - 4480862 - 4483 or CPU 1215862 - 4496862 - 4499 CPU 1217

Page 51: EP&Dee no 4
Page 52: EP&Dee no 4

EP&Dee | May, 2015 | www.epd-ee.eu52

PRODUCT NEWS PASSIVE COMPONENTS

New Vishay Intertechnology Thick FilmChip Resistors Deliver High Voltages to 500V in Compact 0805 and 1206 Case SizesVishay released a new series of thick film chip resistorsdesigned to meet the demand for high voltages in indus-trial and medical applications while saving valuable PCBspace. Vishay DraloricRCV e3 devices offerhigh limiting elementvoltages of 400 V and500 V in the compact0805 and 1206 casesizes, respectively.With their high volt-ages, RCV e3 series resistors can replace multiple stan-dard devices of the same size to save placement cost andboard space in power supplies, battery chargers, vacu-um tubes, and converters. The RCV0805 e3 andRCV1206 e3 feature operating voltages of 400V and500V, respectively; power ratings of 0.125W and0.25W; insulation voltage > 500V; and high-temperatureoperation to +155°C. The devices offer tolerances of 1% and 5 %, TCR of ±100 ppm/K and ± 200 ppm/K, anda resistance range from 100kΩ to 10MΩ. VISHAY INTERTECHNOLOGY www.vishay.com

Housed in a small 2.0 × 2.5 × 0.8mmceramic package, IQD’s new IQXT-260series of digitally compensatedTCXOs, employs an analogue ASIC forthe oscillator and a high order temper-ature compensation circuit that pro-vides a smoother signal. With a maxi-

mum current consumption of only2mA, the IQXT-260 offers stabilitiesdown to ±0.5ppm over an operatingtemperature range of -40 to 85°C witha clipped sinewave output. Operatingfrom 1.8 to 3.3V, the new range is avail-able in three versions: TCXO, VCTCXO& TCXO with enable/disable function,

all across a frequency range of 10 to52MHz. The version with theenable/disable option only requires astandby current of typically <0.01μA,which is ideal for battery operatedequipment. As frequency bands suchas 2.4GHz become overcrowded andthe bandwidths need to be narrower,the precise signal and tighter frequen-cy stability of a TCXO solution is idealplus frequency slope and perturbationspecifications can be customised tosuite application requirements. TheIQXT-260's high stability, low powerconsumption, small footprint and pow-erful compensation method makes thisnew TCXO ideally suited for demand-ing GPS mobile applications includingPortable Navigation Devices as well asWi-Fi, WiMax, WLAN and Ethernetapplications.IQD FREQUENCY PRODUCTS LTDwww.iqdfrequencyproducts.com

New miniature Low Power TCXO/VCTCXO launched by IQD

Vishay Intertechnology PLTT Precision High-Temperature Thin Film Chip Resistor NowAvailable in Automotive-Qualified 0603 CaseVishay announced that its PLTT precision high-tem-perature thin film chip resistor is now available in anAEC-Q200 automotive-qualified 0603 case size.Providing a greater than 100 °C extension over con-ventional chip resistors, the Vishay Dale Thin FilmPLTT 0603 features a wide operating temperaturerange from -55°C to +230°C, a low absolute TCRdown to ± 5 ppm/°C, and laser-trimmed tolerancesdown to ± 0.02%.With stable filmand performancecharacteristics of0.5% ppm at+175°C for 2,000hours at 50% ofrated power, the resistor released today is optimizedfor the low-noise single-signal processing required tocompensate for low offset and temperature drift inhigh-temperature automotive environments, such asexhaust sensing. The device will also deliver reliableperformance in down-hole applications, high-precisionoil and gas exploration, and telecommunications andindustrial equipment. The PLTT 0603 provides a wideresistance range from 250Ω to 150kΩ, with nonstan-dard values available. The devices feature very lownoise of < -30 dB, a low voltage coefficient of 0.1ppm/V, power dissipation ratings from 150mW to 1W,and 75V to 200V maximum working voltages. VISHAY INTERTECHNOLOGY www.vishay.com

Page 53: EP&Dee no 4

www.epd-ee.eu | May, 2015 | EP&Dee 53

Vishay Intertechnology Releases Super Red, Red,Amber, and Yellow Ultra-Bright LEDs in CompactSMD Packages With Dome LensesOptoelectronics group of Vishay Intertechnology, Inc. has intro-duced a new series of super red, red, amber, and yellow ultra-bright LEDs in compact untinted surface-mount packages withdome lenses. Utilizing the lat-est ultra-bright AllnGaP on Sichip technology, the VishaySemiconductors VLD.1235..series delivers the industry'shighest brightness with lumi-nous intensity to 35500 mcd.With their high brightness and small 2.3 mm by 2.3 mm by 2.8 mmfootprints, the LEDs released today are the perfect choice for reli-able performance in a wide range of applications, including trafficsignals and signs, interior and exterior lighting, and indicators andbacklighting for audio and video equipment, visible light barriers,appliances, and industrial equipment. Available in gullwing and reverse gullwing versions, the devicesoffer high luminous flux and incorporate larger chip sizes to with-stand drive currents up to 70 mA. The LEDs offer a narrow ± 11°angle of half intensity and withstand ESD voltages up to 2 kV inaccordance with JESD22-A114-B. The devices are luminous- andcolor-categorized per packing unit. VISHAY INTERTECHNOLOGY www.vishay.com

Vishay Intertechnology Ultrasoft Recovery FREDPt® Gen 4 Ultrafast Diodes Reduce ConductionLosses and Increase EfficiencyVishay Intertechnology introduced 28 new 600V and 650V FREDPt® Gen 4 Ultrafast recovery diodes optimized for high-frequencyconverters in power modules, motor drives, UPS, solar inverters,and welding machine inverters. Offered as die in wafer form,Vishay Semiconductors “H” and “U” series devices offer ultra-lowforward voltage and reverse recovery charge to reduce losses andincrease efficiency, whiletheir extremely soft turn-off behavior minimizesovervoltages under allswitching conditions. Thedevices released today aredesigned for use as anti-parallel diodes in combina-tion with Vishay's new Trench insulated gate bipolar transistors(IGBTs). Together, the Ultrafast diodes and IGBTs provide low EMIand plug-and-play reliability for single- and three-phase inverters,as well as full- and half-bridge DC/DC converters. The “H” and “U”series devices can also be used as stand-alone components forpower factor correction (PFC) circuits, boosters, choppers, andsecondary-side rectification. Designed to minimize conductionlosses in medium-speed circuits, 600 V “U” series diodes featureextremely low forward voltage down to 1.4 V for 600 V devicesand 1.48V for 650V devices. Optimized to deliver high speedsfor higher-frequency applications, “H” series diodes offer reverserecovery times down to 25ns with low typical forward voltagesdown to 1.65V for 600V devices and 1.74V for 650V devices. VISHAY INTERTECHNOLOGY www.vishay.com

PRODUCT NEWS PASSIVE COMPONENTS

LEM extends its range of high-accuracy current transducers, announc-ing the new series of IT xx5 transducers for non-intrusive and isolat-ed nominal measurements of DC, AC and pulsed currents from 60 Ato 600 A. The range includes 4 new models: IT 65-S, IT 205-S, IT 405-S and IT 605-S. These new models offer an extended operating tem-perature range of -40 to +85°C, compared to the +10 to +50°C tem-perature range of previous IT models, allowing their use in a widerrange of applications, including high precision power supplies, med-ical equipment, calibration units, precision and high stability invert-ers, power analysers and metering.

These new models provide the high performance of fluxgate technol-ogy based transducers across the extended temperature range, deliv-ering extremely high accuracy with linearity over temperature rangebetter than 12 ppm, and a low offset over temperature rangebetween 36 to 400 ppm (according to the model). The fast responsetime to di/dt step changes is less than 0.5 μs, due to a precise and con-sistent winding process.The IT xx5 series has been designed to operate from a bipolar +/-15V DC power supply and will accommodate round primary conduc-tors of 26 and 30 mm diameter, depending upon the model used. Inaddition to their normal current output, the transducers offer anadditional output indicating the transducer state (low or high outputlevels) and an external LED showing normal operation.The new IT xx5 range is also fully compatible with the previous LEMIT range, fitting the same footprint. These transducers can be easilyretrofitted into old installations while maintaining the various com-pact sizes for each current range and a variety of panel mountingtopologies (flat or vertical), without compromising the high insulationlevel provided between the primary and measurement circuits.The transducers are CE marked and are covered by LEM’s five-yearwarranty.

LEM www.lem.com

LEM new IT xx5 series provides exceptionalaccuracy over wide temperature range of -40°C to +85°C

Key points:• Closed-loop Fluxgate transducers measure DC, AC or pulsed current

from 60 A up to 600A • Exceptional accuracy over the temperature range from 0.004%

to 0.04 % of IPN• Wide operating temperature range from -40 to +85ºC• Very low offset over temperature range up to 400 ppm• Excellent linearity over temperature range up to 12 ppm• Variety of panel mounting topologies

Page 54: EP&Dee no 4