ꕢ뻉엩뭳땻슲꒶ - National Chiao Tung University · 2020. 4. 23. · Mapping Inkless Mapping Wafer O.Q.A. Wafer O.Q.A. Wafer CP Wafer CP. SingulationSingulation. Assembly. Process.

半導體製程簡介

指導教授 : 盧淵源教授小 組 別 : 第二組班 別 : 企業管理研究學分班小組成員 : 阮一品楊月如

余全忠 鄭豐堯葉國隆 徐澄欽陳文祥 連勝祥

大綱

IC的簡介半導體活動價值鏈晶圓設計 (Circuit Design)晶圓製造流程 (Wafer Foundry)晶圓測試流程 (Wafer Probing)IC封裝流程 (Assembly)高階封裝技術IC測試流程 (Final Test)上板測試 (Board Test)Q & A

What IC is?

IC（Integrated Circuit, 積體電路），又被稱為是「資訊產業之母」，是資訊產品最基本、也是最重要的元件。

IC 是將電晶體、二極體、電阻器及電容器等電路元件，聚集在矽晶片上，形成完整的邏輯電路，以達成控制、計算或記憶等功能，為人們處理各種事務。

IC 種類複雜，但可粗分為記憶體 IC、微元件 IC、邏輯 IC及類比 IC 四大類。IC的製作過程，由矽晶圓開始，經過一連串製程步驟，包括光學顯影、快速高溫製程、化學氣相沉積、離子植入、蝕刻、化學機械研磨與製程監控等前段製程，以及封裝、測試等後段製程方始完成。近來逐漸成為半導體製程技術主流的銅製程，其製作流程則與傳統鋁導線製程稍有不同。

MARKET SEGMENT-3C

Computing

Consumers Communications

半導體活動價值鏈

Test

Program

Front EndBack End ProcessProduct Design Board Assembly

Board AssemblyTestWafer FabProbingAssemblyCircuit Design

Materials

Fab

Wafer

FabWafer

Bank

Wafer

Sort Die

Bank

AssemblyFinal

Test

BIN

Inventory

BoardInsertion &Assembly

Board Testing

IC Design

Wafer Bumping/Probing

Finish Goods

Inventory

Circuit Design AssemblyFoundry Module, Board Assembly & Test (DMS)

Engineering Test Final Test

Materials

半導體活動價值鏈

半導體活動價值鏈 FlowWafer Sort

WaferFab

WaferFab

WaferI.Q.A.I.Q.A.

Wafer InklessMappingInkless

MappingWaferO.Q.A.WaferO.Q.A.

WaferCP

WaferCP

SingulationSingulationAssemblyProcess

AssemblyProcess

Package Test

Package Test

Package V/M

Package V/M

Packing Packing Shipping Shipping

ASSEMBLY

Final Test

Wafer MountWafer Mount

晶圓設計(Circuit Design)

DESIGN HOUSE (DESIGN HOUSE (設計廠設計廠))

••產品需求產品需求 ((Product Request)Product Request)••電路設計電路設計 ((Circuit Design) Circuit Design) ••電路模擬電路模擬 ((Simulation)Simulation)••電路佈圖電路佈圖 ((Circuit Layout)Circuit Layout)••佈圖模擬佈圖模擬 ((Layout Simulation)Layout Simulation)••光罩製作光罩製作 ((Mask)Mask)••晶柱成長晶柱成長 ((CzochralskiCzochralski Growth)Growth)••晶圓切片晶圓切片 ((Wafer Slice)Wafer Slice)

晶圓製造流程(Wafer Foundry)

WAFER FAB (WAFER FAB (晶元廠晶元廠))

••晶圓製程晶圓製程 ((Wafer Process)Wafer Process)••氧化模成型氧化模成型••感光劑塗佈感光劑塗佈••乾板設計組合乾板設計組合••曝光顯像曝光顯像••定影顯像定影顯像••蝕刻溶解蝕刻溶解••高溫擴散高溫擴散 / / 離子植入離子植入••金屬蒸著金屬蒸著••成型晶圓成型晶圓

晶圓製造流程(Wafer Foundry)

晶圓測試流程(Wafer Probing)

TESTING HOUSE (TESTING HOUSE (測試廠測試廠))

••LaserLaser RepairRepair••InkingInking••Inkless Map

Wafer Wafer FabFab

Inkless Map

IQAIQA Sort IDSort ID CPCP Inking Inking & MapReceiving & Map

InspectionInspection PackingPacking OQAOQA Shipping

IC封裝流程(Assembly)

ASSEMBLY HOUSE (ASSEMBLY HOUSE (封裝廠封裝廠))

••晶粒切割晶粒切割 ((Wafer Saw)Wafer Saw)••黏晶黏晶 ((Die Attach)Die Attach)••焊線焊線 ((Wire bond)Wire bond)••封膠封膠 ((Molding)Molding)••化學處理化學處理 ((電鍍電鍍//合成合成//酸洗酸洗..)..)••切腳成型切腳成型 ((Trim form)Trim form)••印字印字 ((Top Mark)Top Mark)••檢測檢測 ((Inspection)Inspection)

IC封裝流程(Assembly)Back EndFront End

Back side grinding Molding

Dejunk/Trim Wafer plasma

Wafer mount

Epoxy cure

Wire bond

Die attach

Back side marking

Wafer saw Post mold cure

2nd optical insp. Electric Deflash

UV erase Solder plating

Ink marking/Cure

Forming/Singulation

Strip plasma Final visual insp.

Packing

3rd optical insp. Shipping

IC封裝流程(Assembly)

高階封裝技術

高階封裝技術

Solder BumpSolder Bump

IC ChipIC Chip

SubstrateSubstrate

Flip Chip in Package(FCIP) Flip Chip on Board(FCOB)

IC ChipIC Chip

PCBPCB

V.S.

Wire bond

IC ChipIC Chip

Wire bond

PCBPCB

IC測試流程(Final Test)

TESTING HOUSE (TESTING HOUSE (測試廠測試廠))

••老化實驗老化實驗 ((Burn In)Burn In)••最終測試最終測試 ((Final Test)Final Test)••外觀檢測外觀檢測 ((V/M Inspection)V/M Inspection)

Assy Assy HouseHouse

IQAIQAIQA FTFTFT VMVMVM Top MarkTop MarkTop Mark Lead ScanLead ScanLead ScanReceiving

BakeBakeBake PackingPackingPacking OQAOQAOQA T&RT&RT&R PackPackPack Shipping

上板測試 (Board Test)

B/L ASSEMBLY (板子組裝廠)1. 表面粘著 (Surface Mount

Technology)2. 板子組裝 (PCB Module)

PRODUCTION LINE (成品組裝廠)1. 最終產品 (Final Product)

半導體製程簡介大綱What IC is?半導體活動價值鏈半導體活動價值鏈 Flow晶圓設計(Circuit Design)晶圓製造流程(Wafer Foundry)晶圓製造流程(Wafer Foundry)晶圓測試流程(Wafer Probing)IC封裝流程(Assembly)IC封裝流程(Assembly)IC封裝流程(Assembly)高階封裝技術高階封裝技術IC測試流程(Final Test)上板測試 (Board Test)