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Architectural-Level Prediction of Interconnect Wirelength and Fanout Kwangok Jeong, Andrew B. Kahng and Kambiz Samadi UCSD VLSI CAD Laboratory [email protected] CSE and ECE Department University of California, San Diego
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Architectural-Level Prediction of Interconnect Wirelength and Fanout

Jan 28, 2016

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Architectural-Level Prediction of Interconnect Wirelength and Fanout. Kwangok Jeong, Andrew B. Kahng and Kambiz Samadi UCSD VLSI CAD Laboratory [email protected] CSE and ECE Department University of California, San Diego. Done. Ongoing. Motivation. - PowerPoint PPT Presentation
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Page 1: Architectural-Level Prediction of Interconnect Wirelength and Fanout

Architectural-Level Prediction of Interconnect Wirelength and Fanout

Kwangok Jeong, Andrew B. Kahng and Kambiz SamadiUCSD VLSI CAD Laboratory

[email protected]

CSE and ECE DepartmentUniversity of California, San Diego

Page 2: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (2/12)

Motivation• Early prediction of design characteristics

• Interconnect wirelength • Interconnect fanout• Clock frequency• Area, etc.

• Enable early-stage design space exploration• Abstractions of physically achievable system

implementations• Models to drive efficient system-level optimizations

• Existing models fail to capture the impact of (1) architectural and (2) implementation parameters• Significant deviation against layout data

Done

Ongoing

Page 3: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (3/12)

Existing Models• Wirelength statistics

• Christie et al. [2000]• Point-to-point wirelength distribution based on Rent’s rule

• Extends Davis et al. wirelength distribution model

• Significant deviation against layout data

• Fanout statistics• Zarkesh-Ha et al. [2000]

• Error in counting the number of m-terminal nets per gate

• Significant deviation against layout data

• Existing models fail to take into account combined impacts of architectural and implementation parameters

Question: What is the impact of considering architectural parameters in early prediction of physical implementation?

Page 4: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (4/12)

Implementation Flow and Tools

• Timing-driven synthesis, place and route flow• Consider both architectural and implementation parameters for

more complete modeling of design space• Rent parameter extraction through internal RentCon scripts

ArchitecturalParameters

ImplementationParameters

Router / DFT RTL(Netmaker / SPIRAL)

Wiring Reports

Wirelength and Fanout Models

Model Generation(Multiple Adaptive

Regression Splines)

Place + Route(SOC Encounter)

Synthesis(Design Compiler)

Page 5: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (5/12)

Design of Experiments• Netmaker generation of fully synthesizable router RTL code• SPIRAL generation of fully synthesizable DFT RTL code

• Libraries: TSMC (1) 130G, (2) 90G, and (3) 65GP

• Tools: Netmaker (University of Cambridge), SPIRAL (CMU), Synopsys Design Compiler and PrimeTime, Cadence SOC Encounter, Salford MARS 3.0

• Experimental axes:• Technology nodes: {130nm, 90nm, 65nm}• Clock frequency• Aspect ratio• Row utilization• Architectural parameters: {fw, nvc, nport, lbuf} for routers and

{n, width, t, nfifo} for DFT cores

Page 6: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (6/12)

Modeling Problem• Accurately predict y given vector of parameters x• Difficulties: (1) which variables x to use, and (2) how different

variables combine to generate y

• Parametric regression: requires a functional form• Nonparametric regression: learns about the best model from

the data itself For our purpose, allows decoupling of underlying

architecture / implementation from modeling effort

• We use nonparametric regression to model interconnect wirelength (WL) and fanout (FO)

noise)x(fy +=

Page 7: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (7/12)

Multivariate Adaptive Regression Splines (MARS)• MARS is nonparametric regression technique• MARS builds model of form:

• Each basis function Bi(x) takes the following form:• (1) a constant, (2) a hinge function, and (3) a product of two or

more hinge functions

• There are two steps in the modeling:• (1) forward pass: obtains model with defined maximum number of terms• (2) backward pass: improves generality by avoiding an overfit model

k

iii )x(Bc+f(x)=c

10

→ →

^

Page 8: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (8/12)

Example Proposed Model

• 2 Models: (1) interconnect wirelength, and (2) interconnect fanout• Closed-form nonlinear equations with respect to architectural and

implementation parameters• Suitable to drive early-stage architectural-level design exploration

B1 = max(0, nDFT - 16); B2 = max(0, 16 – nDFT); B4 = max(0, nfifo - 2); …B30 = max(0, width - 16)×B9; B33 = max(0, 16 - nDFT)×B18

FOavg = 3.707 + 0.003×B1 - 0.034×B2 - … - 8.567e-6×B30 - 1.225e-5×B33

B1 = max(0, nDFT - 16); B2 = max(0, 16 – nDFT); B4 = max(0, 16 - width)×B1;B5 = max(0, util – 0.5); … B35 = max(0,t - 2)×B31;

WLavg = 22.487 + 0.056×B1 - 0.328×B2 + … - 0.003×B27 - 0.013×B34

Wirelength Model

Fanout Model

Page 9: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (9/12)

Impact of Architectural and Implementation Parameters

• Prop. • WL and FO are directly

modeled from architectural / implementation parameters

• Model 1• Rent’s parameters are modeled

from architectural / implementation parameters

• Model 2• Rent’s parameters are modeled

from architectural parameters , for impacts from

implementation

• Model 3• Rent’s parameters are extracted

from implemented layout

)c,,c,x,,x( MARSFO,WL circn

circ1

archn

arch1

)c,,c,x,,x( MARSk,p,N circn

circ1

archn

arch1

)k,p,N( ZarkeshHaOF

)k,p,N( ChristieWL

)x,,x( MARSk,p,N archn

arch1

)k,p,N( ZarkeshHaOF

)k,p,N( ChristieWL

layout Actualk,p,N

)k,p,N( ZarkeshHaOF

)k,p,N( ChristieWL

Page 10: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (10/12)

Model Validation

• WL estimation error reductions• DFT: max. error 73% (79.5% 21.3%), avg. error 81% (18.1% 3.1%) • Router: max. error 70% (59.9% 17.9%), avg. error 91% (27.2% 2.3%)

• FO estimation error reductions• DFT: max. error 74% (22.7% 5.7%), avg. error 92% (10.1% 0.8%) • Router: max. error 92% (18.2% 1.4%), avg. error 96% (5.6% 0.2%)

2.9

3.1

3.3

3.5

3.7

3.9

4.1

3 3.2 3.4 3.6 3.8 4 4.2

Actual Average Fanout

Est

ima

ted

Ave

rag

e

Fa

nou

t

101214161820222426283032

10 15 20 25 30

Actual Average Wirelength (um)

Est

ima

ted

Ave

rag

e W

ire

len

gth

(u

m)

8

13

18

23

28

33

38

43

48

53

10 15 20 25 30

Actual Average Wirelength (um)Est

imat

ed A

vera

ge W

irele

ngth

(um

)

2.5

2.7

2.9

3.1

3.3

3.5

3.7

3.9

4.1

2.9 3.1 3.3 3.5 3.7 3.9 4.1

Actual Average Fanout

Est

imat

ed A

vera

ge

Fan

out

Prop.(WL)

Prop.(FO)

Chr ZH

Page 11: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (11/12)

Recent Extensions• Used described methodology to develop models for

• (1) chip area and (2) total power

• Area model• Sum of standard cell area + whitespace• On average within 5% of the layout data

• Power model• Includes both dynamic and leakage components• On average within 6% of the layout data

Page 12: Architectural-Level Prediction of Interconnect Wirelength and Fanout

UCSD VLSI CAD Laboratory - ISOCC, Nov. 23, 2009 (12/12)

Conclusions and Future Directions• Proposed a reproducible modeling methodology based on RTL

to layout implementation• Developed accurate DFT and router interconnect wirelength

(WL) and fanout (FO) models• Improvement over Model 3

• WL: up to 81% (91%) error reduction on average for DFT (router) cores• FO: up to 92% (96%) error reduction on average for DFT (router) cores

• Improvement over Model 2• WL: up to 85% (85%) error reduction on average for DFT (router) cores• FO: up to 89% (96%) error reduction on average for DFT (router) cores

• Future Directions: • Model maximum fclk w.r.t. architectural and implementation parameters• Estimators of achievable power/performance/area envelope • Enable efficient system-level design space exploration