AMC Short Spec

PICMG AMC.0

Advanced Mezzanine Card Short Form Specification

June 15, 2004

Version D0.9a

Do Not Specify or Claim Compliance to the Draft Specification

® Copyright 2004, PCI Industrial Computer Manufacturers Group.

The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.

NOTICE:

The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products.

WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.

In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third party.

Compliance with this specification does not absolve manufacturers of AdvancedTCA™ equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.).

The PICMG® and CompactPCI® names and the PICMG®, CompactPCI®, and AdvancedTCA® logos are registered trademarks and ATCA is a trademark of the PCI Industrial Computer Manufacturers Group.

All other brand or product names may be trademarks or registered trademarks of their respective holders.

PICMG AMC.0 Short Form Specification Version D0.9aPage 1 of 57

Introduction and objectives 1

1.1 OverviewThe PICMG® Advanced Mezzanine Card (AMC) specification defines the base-level requirements for a wide-range of high-speed mezzanine cards optimized for, but not limited to, AdvancedTCA® Carriers. This base specification defines the common elements for each implementation including mechanical, management, power, thermal, and interconnect. Subsidiary specifications will define the usage requirements for each interface implementation. Target interfaces include PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet.

1.2 IntroductionAMC defines a modular add-on or “child” card that extends the functionality of a Carrier board (see Figure 1-1). Often referred to as mezzanines, these cards are called “AMC Modules” or “Modules” throughout this document. AMC Modules lie parallel to and are integrated onto the Carrier board by plugging into an AMC Connector. Carrier boards may range from passive boards with minimal “intelligence” to high performance single board computers.

Figure 1-1 Four Single-Width AMC Modules on an ATCA Carrier board


AMC enables a modular building block design for both industry standard and proprietary Carrier boards. This AMC specification enables larger markets with more unique functions and creates economies of scale that lower prices.Mezzanines range in terms of their functionality but typically include the following categories:

• Telecom connectivity (ATM/POS (OC-3/12/48), T1/E1, VoIP, GbE, etc.)

• Processors (CPUs, DSPs, and FPGAs)

• Network communication processors (NPUs)

• Network communications co-processors (Classification, Security or Intrusion Detection)

• Mass storage

1.2.1 Next generation mezzanine standardAMC represents the industry’s next generation mezzanine standard supporting high-speed interfaces and AdvancedTCA optimization. In the early 1990s, another base mezzanine standard was developed to support parallel interfaces and was optimized to support PCI and CompactPCI environments. This earlier specification is the IEEE-P1386 Common Mezzanine Card (CMC) specification. Many subsidiary specifications to CMC have been developed including:

• IEEE Std P1386.1-2001 PCI Mezzanine Card (PMC)

• PICMG 2.15 PCI Telecom Mezzanine/Carrier Card (PTMC)

• ANSI/VITA 32-2003, Processor PMC (PrPMC or PPMC)A new mezzanine specification, rather than an extension of the CMC standard, was required to meet the design objectives of high-speed LVDS interface support and AdvancedTCA optimization. As such, AMC is not backward compatible with mezzanine standards based on the CMC specification.AMC is designed to take advantage of the strengths of the PICMG 3.0 ATCA specification and the Carrier grade needs of Reliability, Availability, and Serviceability (RAS). These strengths and needs required a new Hot Swappable mezzanine that could either maximize density through the use of Stacked Modules or through the use of greater surface area and Component height. In addition, the needs of higher electrical power with higher I/O bandwidth were also compelling reasons to launch a new mezzanine base specification.

1.2.2 ScopeThis AMC.0 specification defines the framework or base requirements for a family of anticipated subsidiary specifications. The objective of this document is to define the requirements for mechanical, thermal, power, interconnect (including I/O), system management (including hot swap), and regulatory guidelines. It includes the definitions and requirements for Face Plates with ejectors, defined component spaces, complete mechanical dimensions, thermal definitions, mounting, guides, and a connector necessary to interface between the Module and the Carrier board will also be defined.AMC.0 will not define specific interconnect usage, although it will be optimized for current and emerging High-Speed LVDS Interconnect standards, such as PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet. These interconnect definitions will be specified through further subsidiary work.

1.2.3 Design goalsThis PICMG AMC specification was written with the following design goals in mind:

• PICMG 3.0 optimized: All elements must work within the bounds of the PICMG 3.0 base specification and build upon its strengths of Reliability, Availability, and Serviceability (RAS). The AMC Module will not be limited by other chassis standards.

• System management: System management will be an extension of the PICMG 3.0 Shelf management scheme.


• Hot Swap support: Hot Swap of AMC Modules will be enabled in support of Availability and Serviceability objectives. The focus will be on front loadable Hot Swap Modules with non Hot Swap being an optional implementation.

• Low Voltage Differential Signaling (LVDS) interconnect: AMC will be optimized for High-Speed LVDS interconnects.

• Low pin count: The interconnect will be conservative in its total pin count, thereby reducing the amount of space required on both the Module and the Carrier board, yet provide sufficient real estate for intended interconnects and usage models.

• Support for a rich mix of processors: This includes compute processors (CPUs), network processors (NPUs), digital signal processors (DSPs), and input/output (I/O).

• Reduced development time and costs: The reduced total cost of ownership will be accomplished through component standardization and by driving economies of scale.

• Communications and embedded industry focus: Target usage includes support for edge, core, transport, data center, wireless, wireline, and optical network design elements.

• Modularity, flexibility and configurability: Support for a minimum of four Modules across a given ATCA Carrier, dual width mezzanines, and stacked mezzanines.

• Future advances in signal throughput: Anticipate advances in interconnect technologies by supporting a minimum of 12.5 Gbps throughput per LVDS signal pair.

1.2.4 Theory and operation of usageEach AMC Module is designed to be Hot Swappable into an AMC Connector, seated parallel to the host Carrier board. The Carrier Face Plate is to provide one or more slot openings through which the Modules are inserted into AMC Bays. Module Guide Rails support the insertion of the Modules into the AMC Connectors (see Figure 1-2). The AMC Bay opening provides mechanical support as well as EMI shielding.Connectivity between the AMC and the Carrier is provided via a one-part, replaceable connector that is attached to the Carrier board. The connector resides on the Carrier board at the rear of the AMC Module.The Module’s I/O can be via the Face Plate or via the AMC Connector. If the I/O is through the Connector, the I/O may also be routed to the host’s backplane or RTM (Rear Transition Module), as is commonly done on ATCA systems.The AMC specification defines usage requirements for a single Carrier board and single ATCA (or proprietary) chassis slot implementation.


Figure 1-2 General orientation and insertion of AMC Modules

Note: Figure 1-2 is shown without the Side 1 Component Cover.

1.2.4.1 Multi-Width modules

AMC supports two Module width definitions: Single-Width and Double-Width.

• Single-Width Modules: The standard width for an AMC Module is approximately 74 mm and is referred to as a Single-Width Module. A maximum of four Single-Width Modules fit across an ATCA Carrier board as shown in Figure 1-2. (Can be abbreviated as 1x Module.)

• Double-Width Modules: AMC.0 also supports a Double-Width Module whose width is roughly twice that of a Single-Width Module at approximately 149 mm. The wider Module enables designs that would otherwise not fit on a Single-Width implementation. Double-Width Modules utilize a single AMC Connector. A maximum of two Double-Width Modules are designed to fit across an ATCA Carrier board. (Can be abbreviated as 2x Module.)

A mixture of both Single-Width and Double-Width Modules is permitted (see Figure 1-3). It is important to note that while most illustrations demonstrate Carrier boards fully populated with AMCs, this is not a requirement. It is also important to note that some designs may only support one or two Single-Width AMC Modules.

Single-Width,Full-Height

AMC Module

AMC Guide Rails

AMC Connector


Figure 1-3 Single-Width and Double-Width Full-Height Module Configuration


1.2.4.2 Multi-height Modules

AMC defines two standard height configurations: Half-Height Modules and Full-Height Modules.Full-Height Modules: Full-Height Modules are defined to maximize the amount of component and thermal space available on Component Side 1 of the AMC Module. Full-Height Modules cannot be stacked. (See Figure 1-3, Figure 1-6, and Figure 1-9.)Half-Height Modules: Half-Height Modules are similar to Full-Height Modules, with the exception of reduced component space on the Module’s Component Side 1 (See Figure 1-4, Figure 1-7, and Figure 1-8). The term “Half-Height” implies that two Modules equally split the maximum height available in a stacked implementation and should not be taken literally as being half of a Full-Height Module.Table 1-1 presents a general analysis of the different types of connectors that fit on both Half-Height and Full-Height Modules.

Table 1-1 Connectors that fit Half-Height and Full-Height Modules

Connector types Full-Height Half-Height

XPAK (low profile) Yes (1 on a 1x; 3 on a 2x) Yes (1 on a 1x; 3 on a 2x)

XPAK2 (X2 MSA)(low profile) Yes (1 on a 1x; 3 on a 2x)

Yes (1 on a 1x; 3 on a 2x)(Subject manufacturer specified pin length)

XENPAK Yes (1 on a 1x; 3 on a 2x) No

SFP (MiniGBIC) Yes (4 max. -1x) Yes - (4 max.-1x)

RJ-45 Yes (4 max. -1x) Yes - (4 max.-1x)

Double-Width,Full-Height

Module

Single-Width,Full-Height

Modules


Table 1-2 presents a general assessment of a variety of AMC Modules that would typically be expected to fit on the configurations identified.

1.2.4.3 Carrier types

AMC supports three types of Carrier board configurations.

• Conventional Carriers: The term Conventional Carrier refers to a full Carrier board without any required cutouts and allows components to be placed on the Carrier below AMC Modules. Conventional Carriers support both Full-Height and Half-Height Modules (see Figure 1-6 and Figure 1-7). Conventional Carriers also support up to four Single-Width or two Double-Width Modules across an ATCA Carrier board.

• Cutaway Carriers: The term Cutaway Carrier is derived from the fact that the Carrier board below the AMC Modules must be cut-away to support Stacked Modules (see Figure 1-4). By cutting the Carrier Board, this permits the maximum component height possible for Half-Height Modules and ensures the needed space for I/O interfaces on the Face Plate (see Figure 1-8). Full-Height Modules can be inserted into the upper Bay of a Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-9). Cutaway Carriers can support up to eight Single-Width, Half-Height Modules (see Figure 1-4) or four Double-Width, Half-Height Modules across an ATCA Carrier board. A maximum stacking of two Modules is permitted.

• Hybrid Carriers. Hybrid Carriers combine both Conventional and Cutaway Carrier sites on a single Carrier board.

Table 1-2 Sample Module configurations and functionality

AMC Module configurations Example functionality

Single-Width, Half-HeightDisk Drive, DSP Array, FPGA Array, Encryption Engine, T1/E1/J1 Line Cards, T3/E3 Line Cards, OC-3/12/48 Line Cards, GbE WAN Cards, 10 GbE Optical WAN Card, InfiniBand WAN Card, Memory Arrays

Single-Width, Half-Height and Full-Height CPU Boards, DOCSIS Cable Modem, Baseband Modem, Radio Cards

Double-Width, Half-Height and Full-Height NPU Boards


Figure 1-4 Single-Width, Stacked Modules on a Cutaway Carrier


1.2.4.4 Connector types

AMC.0 defines two fundamental Connector types to support Single-Layer and Stacked Module implementations: B and AB.

• B Connector:The B Connector is used in association with Conventional Carriers and can support a Single-Layer Module implementation. Both Full-Height and Half-Height Modules are supported (see Figure 1-6 and Figure 1-7).

• AB Connector:The AB Connector is used in association with Cutaway Carriers and supports up to two Stacked Half-Height Modules or one Single-Layer Full-Height Module in the upper Bay when the lower Bay is not occupied. (See Figure 1-8 and Figure 1-9).

Figure 1-5 Overview of AMC Connector housings

Style A+B+

Style AB

Style B/B+

Slot B

Slot A

86

86

85

85

85

85

1701

1701

1

1

86

85

1701


1.2.4.4.1 Basic and Extended Connectors

AMC Modules use a card-edge connection style, which consists of conductive traces at the edge of the Module PCB. The conductive traces at the edge of the AMC act as male pins, which mate to a female connector mounted on the Carrier board.AMC supports two Connector styles in association with the B and AB Connectors: Basic and Extended.

• Basic Connector: The term “Basic” is associated with AMC Connectors that are equipped with conductive traces on only one side of the Connector. This provides cost and real estate savings for designs that do not need a large amount of I/O connectivity. The mating Connector for the single-sided design contains 85 pins and is designated simply as either B or AB. (See Figure 1-5.)

• Extended Connector: The Extended Connector is equipped with conductive traces on both sides of the Module edge. The mating connector for the two-sided design contains 170 pins per AMC Connector and is designated with a “+” following the connector type (e.g., B+ and A+B+).

1.2.4.5 Module Orientation on a Conventional Carrier

AMC Modules on a Conventional Carrier are placed such that Component Side (B1) of the Module faces the Carrier board (see Figure 1-6). The mechanical envelope is optimized for Single-Layer Full-Height Modules, which allow for taller components towards the front portion of the Module. This mechanical envelope is maintained for both Full-Height and Half-Height Modules so as to encourage industry interoperability (see Figure 1-7). Additional components may be placed on Component Side 2 (B2) of the Module.

Figure 1-6 Full-Height Module orientation in a Conventional Carrier

Figure 1-7 Half-Height Module orientation in a Conventional Carrier

1.2.4.6 Module orientation on a Cutaway Carrier

Cutaway Carriers are designed to enable Stacked Half-Height Modules. The Stacked Modules are oriented such that Component Side 1 of each AMC Module faces in the same direction towards where the Carrier board would be. Additional Components may be placed on Component Side 2 (A2 or B2) of each AMC Module (see Figure 1-8). Cutaway Carriers also may support a Single-Layer Full-Height Module in the B/B+ layer only (see Figure 1-9).

Conventional Carrier

B/B+Connector

Component Side B1

Component Side B2

Carrier Board Components

Mod

ule

B

Component Side B1Component Side B1


B/B+Connector

Component Side B1

Component Side B2

Carrier Board Components

Mod

ule

B ConnectorComponent Side B1Component Side B1


Figure 1-8 Stacked, Half-Height Module orientation in a Cutaway Carrier

Figure 1-9 Single-Layer, Full-Height Module in Cutaway Carrier

1.2.4.7 Component Covers

A metal encasement above (Side 1 Component Cover) and below (Side 2 Component Cover) the AMC configuration provides the additional strength and rigidity needed, as well as support for AMC Guide Rails (see Figure 1-1.) These plates are required for both Conventional and Cutaway Carrier configurations wherever AMC Bays are located.

1.2.4.8 Module management

Module management is optimized for an ATCA environment. Other platforms may require extensions to accommodate the AMC Modules. A management controller is located on every mezzanine which supports a minimal subset of IPMI commands. The intent of this subset of commands is to minimize both the size and the cost of the on-board controller. This specification also provides unique geographical address lines for each Module’s IPMI address. The Module’s management controller communicates with the Carrier board using IPMB.

1.3 ConformanceDo not specify or claim compliance with this Short Form version of the AMC.0 D0.9a Specification. See the complete specification for guidelines regarding any statement of compliance.

1.4 Unit measurements

1.4.1 DimensionsAll dimensions in this standard are in millimeters (mm) unless otherwise specified. Drawings are not to scale.

1.4.2 Pressures and airflowsPressures and airflows are in English units

AB/A+B+Connector

Component Side B1

Component Side A2

Mod

ules

A

B

Cutaway CarrierComponent Side B1

Component Side B2

Component Side A1A

B

Cutaway Carrier

ConnectorAB/A+B+Component Side B2

Component Side B1

Mod

ule

B

Component Side B1


1.5 Reference specificationsThe following publications are used in conjunction with this standard. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.

• AdvancedTCA Base Specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001

• ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001

• IPMI – Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document Revision 1.0, November 15, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

• IPMI – Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 20, 2002. Copyright © 1999,2000, 2001, 2002 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

• IPMI – Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998 Copyright © 1998, Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

• IPMI – Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, September 27, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

• IPMI – Wired for Management Baseline, Version 2.0.

• PICMG® Policies and Procedures for Specification Development, Revision 1.5, October 5, 2001, PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880 USA, Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org

1.6 Special word usageThis document uses the following key words:may:Indicates the flexibility of choice with no implied preference.should:Indicates flexibility of choice with a strongly preferred implementation. The use of should not (in bold text) indicates flexibility of choice with a strong preference that the choice or implementation be prohibited.shall:Indicates a mandatory requirement. Designers shall implement such mandatory requirements to ensure interoperability and to claim conformance with this specification. The use of shall not (in bold text) indicates an action or implementation that is prohibited.

1.7 Intellectual propertyLucent Technologies has a patent, US #6646890, referring to “Mounting of mezzanine circuit boards to a base board.” This patent, filed on 9/4/02 and issued on 11/11/03, may cover aspects of the guide mechanisms that are detailed in the AMC.0 specification.

1.8 GlossaryDefinitions of terms and acronyms as they are used in this document have been grouped as follows:

• Table 1-3, “AMC Carrier specific terms”

• Table 1-4, “AMC Module specific terms”


• Table 1-5, “AMC Connector or Interface specific terms”

.

Table 1-3 AMC Carrier specific terms

Term or acronym Description

AMC Carrier or Carrier

“AMC Carrier” is used to describe Carrier boards that support AMC Modules. The abbreviated “Carrier” may optionally be used when the context of AMC is well understood.

AMC Bay or Bay An AMC Bay is a single AMC site on an AMC Carrier and can support either Stacked or Single-Layer Modules.

Component Cover

Board Covers provide mechanical rigidity for the Carrier boards as well as a place to mount the Module Guide Rails and the AMC connector body. Conductive board covers are required on both sides of all AMC Carrier board configurations and are referred to as Side 1 Component Cover and Side 2 Component Cover.


The term Conventional Carrier refers to a full Carrier board without any required cutouts and allows components to be placed on the Carrier below AMC Modules. Conventional Carriers support both Full-Height and Half-Height Modules (see Figure 1-5 and Figure 1-6). Conventional Carriers also support up to four Single-Width or two Double-Width Modules across an ATCA Carrier board.

Cutaway Carrier

The term Cutaway Carrier is derived from the fact that the Carrier board below the AMC Modules must be cut away to support Stacked Modules (see Figure 1-4). Cutting the Carrier Board permits the maximum component height possible for Half-Height Modules and ensures the needed space for I/O interfaces on the Face Plate (see Figure 1-7). Full-height Modules can be inserted into the upper Bay of a Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-8). Cutaway Carriers can support up to eight Single-Width, Half-Height Modules (as shown in Figure 1-4) or four Double-Width, Half-Height Modules across an ATCA Carrier board. A maximum stacking of two Modules is permitted.

Hybrid CarrierAn AMC Carrier that has both Conventional and Cutaway sites and includes both B/B+ and AB/A+B+ connector types. Assumes the Carrier board is fully populated with AMC Modules. (Also, see <Link>Partial Carrier.)

Partial CarrierAny AMC Carrier that is not fully populated with AMC Modules (e.g., a Carrier that includes only two AMC Bays). The following Partial Carrier types are possible: Partial Conventional Carrier, Partial Cutaway Carrier, and Partial Hybrid Carrier.

Table 1-4 AMC Module specific terms


AMC Module or Module

An AMC Module (or Module) is a modular add-on or “child” card that extends the functionality of a Carrier board. An AMC Module can also be referred to as a mezzanine. The term is also used to generically refer to the different varieties of Multi-Width and Multi-Height Modules.

Double-Width Module

A Module that is roughly twice the width of a Single-Width AMC Module and requires two AMC Bays. A maximum of two Double-Width Modules are designed to fit across an ATCA Carrier.

Full-Height Module

Full-Height Modules allow for taller components on Component Side 1 of the Module but otherwise are identical to Half-Height Modules.

Half-Height Module

The component height on Component Side 1 of Half-Height Modules is optimized to allow for two Stacked Modules to equally split the maximum height (ATCA pitch) available. The term Half-Height should not be taken literally as being half of a Full-Height Module.

Module Guide Rail Guide Rail utilized by AMC Modules to facilitate insertion into the AMC Bay and to help facilitate Hot Swap of Modules.

Single-Layer Module

Used to describe the presence of a single AMC Module in an AMC Bay and is always used in connection with Full-Height Modules.


.

Single-Width Module The standard (1x) width of an AMC Module that fits into a single AMC Bay.

StackedModules

Used to describe two Half-Height Modules that are “stacked” one above another using an AB/A+B+ Connector.

Table 1-5 AMC Connector or Interface specific terms


A LayerModule orientation when inserted into the lower Bay of an AB/A+B+ Connector. It is located in the cutout section of a Cutaway Carrier and is utilized by Half-Height Modules only.

AB/A+B+ Connector

An AMC Connector that supports two AMC Bays. The AB designation indicates support as Basic Connectors. The “+” designation indicates support as Extended Connectors.

AMC Connector or Connector Used to generically refer to AMC defined connectors including B/B+ and AB/A+B+.

B Layer Module orientation when inserted into B/B+ Connector or into the upper Bay of an AB/A+B+ Connector.

Basic Connector

Requires conductive traces on only one side of the connector and supports all the mandatory aspects of the connector definition including AMC power and management. The mating connector for the single-sided design contains 85 contacts per Bay and is designated simply as B or AB. The Basic Connector supports 8 ports.

Basic Side Refers to the side of the AMC Connector that supports a Basic Connector.

B/B+ ConnectorAn AMC Connector that supports a single AMC Bay. The B designation indicates support as a Basic Connector. The “+” designation indicates support as an Extended Connector.

Contact List Defines the use of each contact and is identical for both the AMC Module and Connector.

Connector Brace A stiffener that is mounted on Component Side 2 of the Carrier board, opposite the AMC Connector and used to help prevent the Carrier board from bending.

Extended Connector

Requires conductive traces on each side of the Connector and includes the Basic Connector definition. The mating connector for the two-sided design contains 170 contacts per Bay and is designated with the “+” designation (i.e., B+ and A+B+).

Extended Side Refers to the side of the AMC Connector associated with the additional support provided by an Extended Connector.

LVDS orHigh-Speed LVDS Refers to Low Voltage Differential Signaling and defined in ANSI/EIA-644-A.

LinkOne or more Ports aggregated under a common protocol. Links are groups of Ports that are enabled and disabled by Electronic Keying operations. A xN Link (pronounced “by-N link”) is composed of N Ports.

M-LVDS A later development of LVDS defined in ANSI/TIA/EIA-644. It is specifically designed for multi-drop and multi-sourced signaling.

Port A set of differential signal pairs, one pair for transmission and one pair for reception. (Note: The PCI Express term “Lane” is equivalent to the AMC.0 term “Port”.)

Table 1-4 AMC Module specific terms (Continued)



Mechanical 2

2.1 Modules

2.1.1 Module PCB dimensionsModules shall have all 170 gold plated pads and pre-pads regardless of whether they are electrically required or not in order to protect the contacts of the connectors.The Module contacts shall be electroplated 0.4 µm hard gold over 1.3 µm nickel.The Module keepout areas shall exclude all components, traces, test points, vias, and features that can form a mechanical impediment or provide an electrical conduction including traces protected by solder mask.

2.1.1.1 Single-Width Module PCB dimensions

Figure 2-1 Single-Width Module PCB dimensions


2.1.1.2 Double-Width Module PCB dimensions

Figure 2-2 Double-Width Module PCB dimensions


2.1.1.3 Module Connector interface dimensions

Figure 2-3 Module Connector interface dimensions


Figure 2-4 Module edge contact detail

2.1.2 Module component height requirementsThe maximum Module component heights shall not exceed those shown in the profiles in Figure 2-5 and Figure 2-6; these show Half-Height Modules with a total component envelope of 11.58 mm and Full-Height Modules with a total component envelope of 17.91 mm for the front 100 mm and 15.85 mm for the rear 73 mm.Full-Height Modules shall be supported in the B-Layer only.


2.1.3 Module Face PlateModule Face Plates fulfill a series of tasks:

• Support for the latch mechanism

• Mounting surface for I/O connectors

• EMC containment

• Mounting and mating of EMC gasket surfaces

• Mechanical interface to the AMC PCB

• ESD shield

• Mounting for LED displays

• Mounting and display of product information

2.1.4 Module Face Plate labelsFigure 2-5 Vendor and PICMG label dimensioning and positioning


2.1.5 Carrier PCB dimensions

2.1.5.1 Cutaway Carrier board dimensions

Figure 2-6 Cutaway Carrier using AB Connector dimensions


2.1.5.2 Conventional Carrier board dimensions

Figure 2-7 Conventional Carrier board dimensions

2.1.6 Carrier component height requirementsAll component heights that are not below the Module, with the exception of the AMC Connector, shall conform to all PICMG 3.0 specifications or the relevant requirements for other form factors.


2.1.6.1 Conventional Carriers

These dimensions are also applicable to the Conventional Carrier portion of Hybrid Carriers. See relevant requirements for other form factors.

Figure 2-8 Conventional Carrier component heights

2.1.6.2 Cutaway Carriers

Cutaway Carriers mandate that the Carrier board PCB be removed below the AMC Module sites. Therefore, there are no AMC-controlled Carrier board component heights.

2.1.7 Card guides and strutsThe component covers provide a means of mounting removable and non-removable channels on which the edges of Module PCB boards ride in or ride out. These are known as AMC card guides.


2.1.7.1 A Layer

Figure 2-9 Card guide A Layer assembly dimensions


Figure 2-10 A Layer card guide and strut parts dimensions


2.1.7.2 B Layer

Figure 2-11 Card guide B Layer assembly dimensions


Figure 2-12 B Layer card guide and strut parts dimensions


Module management 3

3.1 OverviewThe management aspects of Modules are intended to be platform agnostic. Although the Module specification is developed with ATCA in mind, it is the intent of the management architecture to support Modules in ATCA-based Carrier cards as well as platforms that might be exclusively Module-based or platforms that mix Modules with other form factors. In defining the role of the Module in system management it has been the intent of this section to minimize the management burden on the Module where space is a premium. Modules are controlled by a management controller with minimal functionality called the Module Management Controller or MMC. The commands that the MMC must support are intended to be a bare minimum in order to lower the cost of the MMC and save space on the Module. The Carrier IPMC communicates with a Module’s MMC using IPMI messages over IPMB. This specification provides unique geographical address lines for each Module’s IPMB-L address.

Figure 3-1 Module Management Infrastructure

3.1.1 IPMI and IPMB architecture overviewThe Carrier and Module communicate through a limited set of IPMI commands. The intent is to allow the use of inexpensive single chip microcontrollers on the Module. This specification requires that the Carrier provide ways to isolate the IPMB to each Module. This was done to prevent a Module from bringing down the IPMB. The specification also envisions that the Carrier might have multiple IPMBs. For clarity, the term IPMB-0 refers to the AdvancedTCA IPMB and the term IPMB-L refers to the IPMB between the Carrier and Module. The IPMB-L could either be radial or bussed as desired by the Carrier board designer. The IPMB-0 and IPMB-L are physically separate busses and in general the Carrier is responsible for bridging the two as necessary.

ShelfManager

Active

ShelfManagerStandby

Shelf External SystemManager

ShMC ShMC

IPMC

2x Redundant, Bussed or Radial, IPMB-0

ATCA Board

MMC

ATCA Carrier Board

Bussed or Radial, IP

MB

-L

AMC

AMC

AMC

AMC

isolator

MMC

MMC

MMC

isolator

isolator

isolator

IPMC


Note: Intelligent controllers are referred to as an MMC on an AMC and as an IPMC on Carriers.

3.1.2 Module and Carrier power architecture overviewThe Carrier provides management and payload power to a Module. Management power is used to power the management circuitry in the Module. The management circuitry includes the MMC, and pullups for IPMB-L and ENABLE#. Management power is current-limited by the Carrier. An MMC reset is provided from the Carrier. The Carrier will hold the MMC in reset until the Module is fully inserted. The MMC reset can also be controlled by the Carrier in the event that it becomes necessary to reset the MMC. Payload power (PWR) is the power provided to the Module from the Carrier for the main function of the Module. The Module FRU information contains records that define the PWR requirements for the payload. A Carrier will enable PWR if it determines that enough power and cooling exist to support the Module.

3.2 Module management interconnectsFigure 3-2 shows the interconnections between the Module and Carrier. Note that active low signals are denoted with a trailing #. All logic levels are assumed to be 3.3 V compatible unless noted.

Figure 3-2 Interconnections between Carrier and Module

3.2.1 Geographic address [2..0] (GA[2..0])There are three geographic address pins which are used to assign the address of the Module on the local IPMB-L. Each of the GA pins can encode three different levels. The GA (Geographic Address) lines can be connected to ground, to management power, or left unconnected on the Carrier to define the geographic address of the Module. This scheme requires that the Module be able to distinguish between the three states. The states of the GA bits can be G (grounded), U (unconnected), and P (pulled up to management power).

Module

GA[2..0]

IPMB-L

GA_PULLUP

MP

ENABLE# Reset_MMC#From IPMC

IPMB-L_Isolator

Carrier

10K3.3K 33K

PS1#

PS0#

MMC

RESET#

2.2K

ModuleManagementPow er


3.2.2 PS0# and PS1#PS0# and PS1# pins are used to detect the presence of a Module in a Carrier. The PS pins are last mate pins located on opposite sides of the connector. These pins are used to de-skew the connector and provide an indication that all pins on the Module connector have mated. The Carrier connects PS0# to GND and PS1# to a management power pullup resistor. The Module provides a low resistance path between PS0# and PS1#. The Carrier can detect the presence of a Module by a low on PS1#.The Module can determine insertion into a Carrier by the Carrier’s feedback of PS0# and PS1# on ENABLE# as well as current flowing through the PS0# - PS1# connection.

3.2.3 ENABLE#The Enable pin is an active low input to the Module pulled up on the Module to management power. This signal is inverted on the Module to create an MMC RESET# signal. This input indicates to the Module that the Module is fully inserted and valid states exist on all inputs to the Module. The MMC is not allowed to read the GA inputs or use the IPMB-L while ENABLE# is inactive. Note that the payload power decisions are made by the higher level entity and the Carrier executes that decision.

3.2.4 IPMB-LThe IPMB-L is made up of clock (SCL_L) and data (SDA_L) signals. These signals are to be considered valid by the Module when ENABLE# is active. Each Module receives an isolated copy of the IPMB-L. This isolated IPMB can be provided using FET type switches or I2C buffers.

3.2.5 BLUE LEDThe BLUE LED is local to the Module. The BLUE LED is mounted on the front of the Module and is used to provide basic feedback to the user on the Hot Swap state of the Module. The BLUE LED states are off, short blink, long blink, and on. Once management power is available to the Module, the BLUE LED is turned 100% on as soon as possible.

3.2.6 LED 1 (mandatory)LED 1 typically provides basic feedback about failures and out of service.

3.2.7 Hot Swap switchThe Hot Swap switch input connects to the mechanical latching mechanism. This switch is used to indicate a request for a pending extraction. This switch is pulled up to management power so that it can be read when payload power is not applied. The Module sends an IPMI platform event message to the Carrier when the Hot Swap switch changes state.

3.2.8 Payload resetThe payload reset is local to the Module. This signal is used by the MMC to reset the payload when a FRU Control command is issued by the Carrier IPMC.

3.2.9 Watchdog timerA watchdog timer is provided to reset the MMC in the event that the MMC is unresponsive. The watchdog could be integrated into the MMC. This specification does not mandate what the watchdog checks; just that a watchdog be provided to reset an unresponsive MMC. Note that the state of the payload cannot be impacted if an MMC watchdog timer reset occurs.


3.3 Module management-hardware requirementsThis section defines the requirements for the interconnects as seen by the Module. Figure 3-3 presents a simplified block diagram showing the Module interconnects for clarity.

Figure 3-3 Module to Carrier hardware

3.4 Carrier management-hardware requirementsThis section defines the interconnect requirements for the Carrier. Figure 3-4 shows a simplified version of the interconnects on a Carrier for clarity.

Figure 3-4 Carrier and Module interconnects

MMC

Module Carrier

GA[2..0]

IPMB-L

10 K3.3 K

GA_PULLUP

33 K

RESET#

MP

PS1#

PS0#

Blue LED

Hot Swap Switch

ENABLE#

300 Ohm 10 K

Carrier

2.2K

MP

GA[2..0]

IPMB-L

PS1#

PS0#

ENABLE#

3.3K

IPMB-LIPMBIsolator

IPMB-L Enable

Reset_MMC#

Module

IPMC

ModuleManagement

Power Control 3.3 V


3.5 Power managementThis specification insists that the power needs of the Module are not part of the Carrier’s power budget and that the Modules be treated as separate FRUs and represent their power budget as such. The intelligent power management decisions for the Modules are made by the Shelf Manager and the Carrier plays the role of a facilitator cum executor of that decision. A converter is viewed as part of the Carrier’s power budget. An additional criteria is the amount of power that can be delivered to an AMC site. This is typically limited by the trace width.The final criteria in power management is the amount of power that the Module can consume. As explained in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001, in order to make intelligent decisions about when the FRUs (in this case, AMCs) are powered up or down and what power levels to assign for each FRU (in this case, AMC), the Shelf Manager must collect several pieces of data.

• The Carrier data (provided by the Carrier manufacturer)

–Maximum PWR Current (number in Figure 3-5) that could be that can be delivered to all of the AMC sites. This is typically the power rating of the DC-DC converter that generates PWR.

–Maximum FRU Current (number in Figure 3-5) that could be delivered to a particular Module. This is the maximum amount of current that can be delivered to an AMC site in Amps at 12 V.

• The Module power consumption (provided by the Module manufacturer).

–The Power consumed by a Module in Amps (number in Figure 3-5).

Figure 3-5 Power distribution management architecture

3.6 Cooling managementTo support a higher level managing entity to appropriately manage the cooling resources, the Module has to provide reports of abnormal temperature in its environment. Every Module has to have a temperature sensor to enable the Module to report the temperature and this temperature sensor is monitored by the MMC. When an MMC detects that

5

6

7

4

5

7

1

Defined inATCA Spec.

ATCA Board

Shelf

AMC

1 Power supplied to the Shelf Power Feed; entered during Shelf installation2 Power that can be handled by this Feed; entered by Shelf manufacturer3 Max. Power that can be routed to an ATCA Board; entered by Shelf manufacturer4 Power required by the ATCA Board; entered by ATCA Board manufacturer5 Power available to all AMC sites; entered by ATCA Board manufacturer6 Max. Current that can be routed to an AMC site; entered by ATCA Board manufacturer

7 Power required by the AMC; entered by AMC Board manufacturer

6

3

3

2

Defined inAMC Spec.


a monitored temperature sensor exceeds one or more thresholds or returns to normal, The MMC raises a standard IPMI temperature event message and sends it to the event receiver (the Carrier). The Carrier, or a higher level managing entity, uses this information to manage the cooling.Every Module must contain at least one temperature sensor and an appropriate Sensor Data Record (SDR) to describe the sensor.

3.7 E-KeyingElectronic Keying is the mechanism by which the mandatory AMC.0 Management infrastructure is used to dynamically satisfy the needs that had traditionally been satisfied by various mechanical connector keying solutions:

• Prevent mis-operation

• Verify fabric compatibilitySince the AMC.0 specification does not allow a direct connection between Modules and the Carrier backplane, the Carrier must provide one or more switch(es) between the Carrier backplane and the Modules. The IPMC on the Carrier is responsible for E-Keying between the Modules and switch(es). E-Keying between switch(es) and the Carrier backplane is out of scope of the AMC.0 specification and is covered by PICMG 3.0.This section uses the terms Control Interface and Data Fabric Interface. These interfaces are made up of a number of ports. The ports allocated to the Control Interface on a Module or Carrier are typically connected to the ATCA base interface through an on-Carrier switch. The ports allocated for the Data Fabric Interface would typically connect to the ATCA fabric.

3.7.1 E-Keying processThe basis for the E-Keying process is the E-Keying entries present as FRU information in the Carrier and all Modules. Those E-Keying entries describe the Control Interface, and the Data Fabric Interface implemented by the Carrier and Modules.

3.7.2 Point-to-point E-KeyingPoint-to-point E-Keying covers the Control Interface and Data Fabric Interface. In the Data Fabric, the primary unit of point-to-point connectivity is a Port. A Port is two differential pairs (one transmit and one receive). One to four Ports can be grouped into a logical AMC Channel that is similar to an AdvancedTCA Channel. An AMC Channel is composed of an arbitrary (not necessarily numerically or physically contiguous) set of up to four Ports. In contrast, any given AdvancedTCA Channel involves a specific set of contiguous zone 2 connector pins.AMC Channels are identified by AMC Channel IDs. In the data structures and commands defined in this section, AMC Channel IDs play essentially the same role as Channel numbers in AdvancedTCA E-Keying. AMC Channel IDs start at 0 and are numbered sequentially on a given Carrier or Module. In this specification, each Link is mapped to a specific AMC Channel and an associated protocol. As in AdvancedTCA, a Link can be composed of several AMC Channels (say, to create a x16 PCI Express Link that combines four AMC Channels, each representing a x4 connection).Point-to-Point E-Keying supports two Data Fabric AMC Carrier routing models: the centralized AMC switch model and the AMC direct connectivity model. The point-to-point connectivity provided in a Carrier is described in the Carrier FRU information. The capabilities of an AMC Module to communicate over point-to-point connections are described in the Module’s FRU information. Similar information for the links supported by the on-Carrier switch(es) is provided in the Carrier FRU information. In this topic there are references to Switch ID; these refer to the ID (number) assigned to an on-Carrier switch. The assignment of the number is arbitrary.


3.7.2.1 AMC point-to-point interface information

One or more AMC point-to-point connectivity records are included in the AMC FRU information and describe the connections to the Control and Data Fabric Interfaces that are implemented on the AMC Module. Similarly, one or more such records are included in the Carrier FRU information to describe the connections to the Control and Data Fabric Interfaces that are implemented by on-Carrier switch(es). These connections, each consisting of some subset of the Ports associated with one or more AMC Channels, are generically referred to as “Links”.Each AMC point-to-point connectivity record contains AMC Link Descriptors, each of which identifies a Link and an associated protocol.

3.8 Module payload controlThe “FRU Control” command provides base level control over the Module’s payload to the Carrier IPMC. Through this command, the Module’s payload can be reset, rebooted, instructed to attain quiescence, or have its diagnostics initiated. The exact implementation of these commands will vary according to individual requirements, and all command variants with the exception of the “FRU Control (Cold Reset)” and “FRU Control (Attain Quiescence” are optional. The “FRU Control” command does not directly change the operational state of the Module as represented by the Carrier IPMC (which is typically M4 or FRU Active).

3.9 Module sensor managementMMCs have the capability of supporting any of the IPMI or OEM sensor types (analogous to an IPMC on an ATCA board). The MMC’s sensors on IPMB-L are visible to the ShMC through the IPMC over IPMB-0. Since the IPMC must present unique sensor numbers and sensor LUNs over IPMB-0, it is necessary for the IPMC to translate the MMC’s sensor number and sensor LUN to IPMC-wide unique numbers. The IPMC device SDR repository holds a combination of its own SDRs and SDRs from MMCs installed on the Carrier. The IPMC adds the MMC’s SDRs into its SDR Repository after management power has been enabled to the MMC. Conversely, the MMC’s SDRs are removed from the IPMC’s SDR repository after management power has been removed from an MMC. As mentioned previously, when an IPMC adds the MMC’s SDRs into its SDR repository, it needs to ensure that the sensor number and sensor LUN assigned are unique for the IPMC.The IPMC will also need to provide unique FRU IDs for all MMCs on a Carrier. The local FRU ID for an MMC is always 0; the IPMC will need to assign unique FRU IDs to all MMCs. MMC SDRs are linked with a Module using the entity fields of the SDR; the entity ID identifies that SDR as coming from a Module FRU and the entity instance is set to the Module site number to identify the Module on the Carrier. Also refer to Section 3.4.3 in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001 and to IPMI 1.5 Chapter 33.1 for more information on IPMI entities.The IPMC will need to maintain a table that would be used to translate the IPMC-wide unique sensor number, sensor LUN, and FRU ID to the MMC’s sensor number, sensor LUN, and FRU ID. When an IPMC receives a request over IPMB-0 for an MMC’s sensor or FRU data, the IPMC substitutes the received sensor number, sensor LUN, or FRU ID with the target MMC’s sensor number, sensor LUN, or FRU ID and sends the request over the IPMB-L to the MMC. The IPMC then returns the requested data substituting the MMC’s identifying data with the IPMC’s identifying data. The IPMC is also responsible for redirecting events generated on IPMB-L to the system event receiver on IPMB-0. In doing so, the IPMC substitutes the event generator ID with its own ID and substitutes the sensor number and sensor LUN from the received message with the IPMC-wide unique sensor number and sensor LUN. The message is then transmitted over IPMB-0.


3.10 FRU informationAll Carriers and Modules must contain a FRU information storage device (for instance, an SEEPROM) that contains basic information about them. The format of the FRU information follows the requirements set forth in Section 3.6.3, IPM Controller FRU Information, in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001. In addition to this basic information, additional fields are required to support functions unique to the Modules.An early and important feature of system management is its inventory management capability. Sections 1.6.11 through 1.6.14 of the IPMI specification provide an overview of FRU information principles and implementations. While the IPMI specification highly recommends that each IPMC implement the “FRU Inventory Device” commands, this document makes that a requirement of each MMC.The term Field Replaceable Unit (FRU) is used to reference a unit that can be replaced by customers in the field. All Modules are FRUs.The term FRU information refers to information stored within the Module in some non-volatile storage location. For instance, it could be contained in a SEEPROM within the unit. In all cases, the FRU information is accessed through a controller that knows how to talk to the non-volatile storage within the Module.

3.10.1 FRU information access commandsAccess to read or write the FRU information is provided by three IPMI commands directed at the MMC that hosts the FRU information. FRU device IDs corresponding to particular Module sites can be identified by scanning the Carrier IPMC device SDR repository for device locator records (Type 11h) with entity ID fields set to C1h (Advanced Mezzanine Carrier [AMC]). These records represent Modules and their entity instance fields identify the site number in which they are installed.

3.11 BridgingThe Carrier IPMC manages the Module using a minimal set of IPMI commands. This minimal set of commands are the mandatory ones that the Module must support. For Module management purposes, there is no means and no need for an external entity (application in the Carrier, or Shelf Manager) to execute an IPMI command directly on the MMC. But if there are proprietary IPMI-based commands or optional IPMI 1.5 commands implemented in the MMC that the applications in the Carrier (or other entity that can talk to the IPMC on the Carrier) have to execute, the way to do it is by utilizing the Send Message command in the IPMC. For this reason all Carriers that host one or more Modules must support the Send Message IPMI command.


Power distribution 4

The purpose of this section is to describe the specifications for features and components required to support the Advanced Mezzanine Card (AMC), such as:

• Payload current limiting

• Payload power

• Management power

• AMC Module power interface

• AMC Connector

• AMC Module power distribution

• Fault tolerant payload operationStandard Carrier board features outside the scope of this document include power source isolation, safety grounding, backplane interface, limiting inrush current, providing over-current protection, and steady state operational current.

4.1 OverviewThe power distribution required to support AMCs on the Carrier includes power sources for both payload power and management power. Hence, AMC power distribution requirements include both payload and management power. Figure 4-1 shows the major components comprising the power distribution system.

Figure 4-1 Power distribution block diagram

The AMC payload power source can be at any voltage derived from the supplied and specified 12 V and a single payload power voltage helps minimize the number of power pins. This also accounts for the supply voltages changing constantly, as they migrate to lower and lower voltages. This approach has the additional advantage of lending itself

AMC Module(s)Power

Distribution

AMC ModulePower

Interface(s)AMC

Connector(s)

GND (27)Extended side

GND (28)

MP (1)

PWR (8)

Ground

ManagementPower

PayloadPowerAMC Payload

Power Source

Carrier side Module side

Car

rier/

Mod

ule

Bou

ndar

y

Ground

Basic side


to a point of load (POL) regulated power distribution strategy (to all payload circuits on the Module), which is believed to be a superior design technique. AMC payload power distribution is variable and determined by the Module design, as long as it conforms to the requirements of this section.The AMC management power source can be at any voltage that is convenient to the design and is derived from the specified Carrier. The Module management source can either be Carrier management power or Carrier payload power. The AMC Module power distribution will mostly provide isolated management power for the Module Management Controller (MMC).

4.1.1 Power interfaceModule power interface presented in Figure 4-2 includes management and payload power current limiters; these two supply voltages need to have power-good indicators so that the system management can detect boot sequence events and nominal operating conditions.PS0# and PS1# provide for AMC presence detection. Two signals are used to ensure that the Module is fully seated even if rotated slightly. Also, the interface circuitry presented in Figure 4-2 recurs for every Module-Carrier combination. The power interface also provides an ENABLE# signal which is an open drain signal, driven by the Carrier and pulled up to MP on the Module. This signal is asserted when the Carrier detects that the Module is not fully inserted. The Carrier may additionally assert ENABLE# to restart the MMC if needed. The MMC is supposed to not execute a payload reset on the Module in this case.The CMC can sense the actual amount of Module current flow for any given site. This will allow the CMC to dynamically respond to any Module site if the site begins to draw more current than the stored value on the FRU ROM. The response of the CMC could be to inform the Shelf Manager of this condition or to immediately shut down the offending Module site’s power supply.

Figure 4-2 Module power interface

MMC

CurrentLimit

PayloadPower Source

ENABLE#

PS0#

PS1#

PWR

CarrierManagement

Power

ModulePayloadPower

ModuleManagement Power

Current Limit

MPModule

ManagementPowerSource

ModuleManagement

Power

PG

Presence

MP Good

PayloadPwr Good

PP Enable

AMC Power Interface(recurring circuit for each bay)

AMCConnector

AMC Module PowerDistribution

Carrier side Module side

Carrier(non-recurring circuit)

IPMC

470

10K

220

2.7K

2.2K

2.7K

MPPEnable

Note 1Option surprise extraction

detection circuit

Note 1 - If surprise extraction circuitnot used replace 470 with 0 ohms


Thermal 5

Thermal design requirements of this sort are relatively new to specifications such as PICMG 3.0 and PICMG.AMC. They are included here because of the experiences of the committee members in the market. Printed circuit board manufacturers have not been able to create designs with clearly defined capabilities, to dissipate heat. And system integrators have not had the necessary thermal data to design a system, mandated by the specifications. This portion of this specification is an attempt to bring a new level of understanding and information exchange to meet this market need.Being in compliance with the “shall” requirements in this section will not guarantee complete compatibility of Modules and Carriers. The system integrator will be required to evaluate the compatibility/ interoperability of Modules and Carriers involved. Also, in this section alone, compliance with the “should” provisions is intended to provide good evidence of interoperability, but not a guarantee. The committee felt that it was too restrictive of a Module originally designed for unique specific applications to match the features of a general-purpose Module.Carriers with mezzanine cards are in fact the most challenging thermal design applications and some issues that cause them to be so are:

• Multiple Carrier form factors

• Wide range of Module types

• Higher airflow resistance

• Varying power levelsThere are at least two approaches to obtaining the thermal data required in this section: 1) Thermal analysis using Computational Fluid Dynamics modeling tools such as ICEPAK from Fluent or Flotherm from Flomerics, and 2) Empirical measurement using a wind tunnel. The analysis approach requires specified pressure gradients across Modules or Carriers. Knowing the design pressure will enable the ability to calculate volumetric airflow based on impedance curves of the individual components. Then having determined airflow, heat dissipation and temperature rise can be calculated.


Interconnect 6

The AMC.0 interconnect framework comprises the physical Connector used to mate the AMC with its Carrier board, the mapping of signals to that Connector, and the routing of those signals among the AMCs across the Carrier, and also to the Carrier based switching elements. The performance headroom in the Connector will allow future interconnect technologies with higher signal rates to be accommodated within the framework. The generic signal mapping across the AMC Connector supports a variety of system fabric topologies for connecting AMCs together. The Interconnect interfaces are divided into six functional groups:

• Fabric Interface

• Control Interface

• System Management Interface

• Synchronization Clock Interface

• JTAG Test Interface

• PowerThese interfaces are connected between each AMC Carrier and the AMC Module across the Connector.AMC Carrier and Module compatibility guidelines are defined within this section for the following functional groups: Fabric Interface, Control Interface, Synchronization Clocks and JTAG. System Management and Power Interconnect specifics are covered in Sections 3 and 4 respectively. The AMC.0 base specification provides a physical framework for the Fabric Interface. AMC.0 subsidiary specifications define how to overlay a specific switching interconnect technology onto the AMC.0 Fabric Interface physical framework.Governance of AMC Module and Carrier board compatibility for the Interconnect interfaces, including the Fabric Interface, is provided by an Electronic Keying mechanism that is an integral part of the AMC.0 Module Management architecture.The ability to deploy interconnect technologies to the Fabric Interface (through subsidiary specifications) is limited by the number of assigned Fabric ports on the AMC Connector and the signal rate capacity defined by that Connector.

6.1 Connector pin allocationThe AMC Connector supports 170 pins, the Connector and pin definition are optimized around supporting high speed interconnects. The AMC Carrier can be optionally fitted with either a full connectivity 170 pin Connector, or with an 85 pin version to reduce cost where less Fabric connectivity can be accepted.The AMC Connector array optimally supports five separate interfaces to the AMC Carrier to utilize:

• 2 pins allocated to the Control Interface

• 42 signal pairs allocated to the Fabric Interface

• 3 pin pairs allocated to the Synchronization Clock Interface

• 5 pins allocated to the JTAG Test Interface

• 9 pins allocated to the System Management InterfaceFour levels of sequential mating (first mate, second mate, third mate, and last mate) are provided to ensure a correct electrical connection sequence is followed during insertion and extraction of the Module.


Table 6-1 AMC Connector A+B+ footprint pin assignments

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. SignalA85 GND A86 GND B85 GND B86 GNDA84 MA_PWR A87 MA_Tx8- B84 MB_PWR B87 MB_Tx8-A83 MA_PS0# A88 MA_Tx8+ B83 MB_PS0# B88 MB_Tx8+A82 GND A89 GND B82 GND B89 GNDA81 MA_CLK3- A90 MA_Rx8- B81 MB_CLK3- B90 MB_Rx8-A80 MA_CLK3+ A91 MA_Rx8+ B80 MB_CLK3+ B91 MB_Rx8+A79 GND A92 GND B79 GND B92 GNDA78 MA_CLK2- A93 MA_Tx9- B78 MB_CLK2- B93 MB_Tx9-A77 MA_CLK2+ A94 MA_Tx9+ B77 MB_CLK2+ B94 MB_Tx9+A76 GND A95 GND B76 GND B95 GNDA75 MA_CLK1- A96 MA_Rx9- B75 MB_CLK1- B96 MB_Rx9-A74 MA_CLK1+ A97 MA_Rx9+ B74 MB_CLK1+ B97 MB_Rx9+A73 GND A98 GND B73 GND B98 GNDA72 MA_PWR A99 MA_Tx10- B72 MB_PWR B99 MB_Tx10-A71 MA_SDA_L A100 MA_Tx10+ B71 MB_SDA_L B100 MB_Tx10+A70 GND A101 GND B70 GND B101 GNDA69 MA_Tx7- A102 MA_Rx10- B69 MB_Tx7- B102 MB_Rx10-A68 MA_Tx7+ A103 MA_Rx10+ B68 MB_Tx7+ B103 MB_Rx10+A67 GND A104 GND B67 GND B104 GNDA66 MA_Rx7- A105 MA_Tx11- B66 MB_Rx7- B105 MB_Tx11-A65 MA_Rx7+ A106 MA_Tx11+ B65 MB_Rx7+ B106 MB_Tx11+A64 GND A107 GND B64 GND B107 GNDA63 MA_Tx6- A108 MA_Rx11- B63 MB_Tx6- B108 MB_Rx11-A62 MA_Tx6+ A109 MA_Rx11+ B62 MB_Tx6+ B109 MB_Rx11+A61 GND A110 GND B61 GND B110 GNDA60 MA_Rx6- A111 MA_Tx12- B60 MB_Rx6- B111 MB_Tx12-A59 MA_Rx6+ A112 MA_Tx12+ B59 MB_Rx6+ B112 MB_Tx12+A58 GND A113 GND B58 GND B113 GNDA57 MA_PWR A114 MA_Rx12- B57 MB_PWR B114 MB_Rx12-A56 MA_SCL_L A115 MA_Rx12+ B56 MB_SCL_L B115 MB_Rx12+A55 GND A116 GND B55 GND B116 GNDA54 MA_Tx5- A117 MA_Tx13- B54 MB_Tx5- B117 MB_Tx13-A53 MA_Tx5+ A118 MA_Tx13+ B53 MB_Tx5+ B118 MB_Tx13+A52 GND A119 GND B52 GND B119 GNDA51 MA_Rx5- A120 MA_Rx13- B51 MB_Rx5- B120 MB_Rx13-A50 MA_Rx5+ A121 MA_Rx13+ B50 MB_Rx5+ B121 MB_Rx13+A49 GND A122 GND B49 GND B122 GNDA48 MA_Tx4- A123 MA_Tx14- B48 MB_Tx4- B123 MB_Tx14-A47 MA_Tx4+ A124 MA_Tx14+ B47 MB_Tx4+ B124 MB_Tx14+A46 GND A125 GND B46 GND B125 GNDA45 MA_Rx4- A126 MA_Rx14- B45 MB_Rx4- B126 MB_Rx14-A44 MA_Rx4+ A127 MA_Rx14+ B44 MB_Rx4+ B127 MB_Rx14+A43 GND A128 GND B43 GND B128 GNDA42 MA_PWR A129 MA_Tx15- B42 MB_PWR B129 MB_Tx15-A41 MA_ENABLE# A130 MA_Tx15+ B41 MB_ENABLE# B130 MB_Tx15+A40 GND A131 GND B40 GND B131 GND

Slot Layer A Slot Layer B


Table 6-2 Table 6-4. AMC Connector A+B+ footprint pin assignments (continued)

6.2 Fabric InterfaceThe Fabric Interface is comprised of up to 21 ports providing point-to-point connectivity for Module-to-Carrier and Module-to-Module implementations. The Fabric Interface can be used in a variety of ways by AMCs and AMC Carrier boards to meet the needs of many applications. There are two usage models:

• Transport types covered by the AMC subsidiary specifications, i.e., Ethernet, PCI-Express, etc.

• Vendor-specific mappings named within this specification as General Purpose Input/ Output. GPIO still adheres to the Fabric Interface electrical specifications.

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal

Slot Layer A Slot Layer B

A39 MA_Tx3- A132 MA_Rx15- B39 MB_Tx3- B132 MB_Rx15-A38 MA_Tx3+ A133 MA_Rx15+ B38 MB_Tx3+ B133 MB_Rx15+A37 GND A134 GND B37 GND B134 GNDA36 MA_Rx3- A135 MA_Tx16- B36 MB_Rx3- B135 MB_Tx16-A35 MA_Rx3+ A136 MA_Tx16+ B35 MB_Rx3+ B136 MB_Tx16+A34 GND A137 GND B34 GND B137 GNDA33 MA_Tx2- A138 MA_Rx16- B33 MB_Tx2- B138 MB_Rx16-A32 MA_Tx2+ A139 MA_Rx16+ B32 MB_Tx2+ B139 MB_Rx16+A31 GND A140 GND B31 GND B140 GNDA30 MA_Rx2- A141 MA_Tx17- B30 MB_Rx2- B141 MB_Tx17-A29 MA_Rx2+ A142 MA_Tx17+ B29 MB_Rx2+ B142 MB_Tx17+A28 GND A143 GND B28 GND B143 GNDA27 MA_PWR A144 MA_Rx17- B27 MB_PWR B144 MB_Rx17-A26 MA_GA2 A145 MA_Rx17+ B26 MB_GA2 B145 MB_Rx17+A25 GND A146 GND B25 GND B146 GNDA24 MA_Tx1- A147 MA_Tx18- B24 MB_Tx1- B147 MB_Tx18-A23 MA_Tx1+ A148 MA_Tx18+ B23 MB_Tx1+ B148 MB_Tx18+A22 GND A149 GND B22 GND B149 GNDA21 MA_Rx1- A150 MA_Rx18- B21 MB_Rx1- B150 MB_Rx18-A20 MA_Rx1+ A151 MA_Rx18+ B20 MB_Rx1+ B151 MB_Rx18+A19 GND A152 GND B19 GND B152 GNDA18 MA_PWR A153 MA_Tx19- B18 MB_PWR B153 MB_Tx19-A17 MA_GA1 A154 MA_Tx19+ B17 MB_GA1 B154 MB_Tx19+A16 GND A155 GND B16 GND B155 GNDA15 MA_Tx0- A156 MA_Rx19- B15 MB_Tx0- B156 MB_Rx19-A14 MA_Tx0+ A157 MA_Rx19+ B14 MB_Tx0+ B157 MB_Rx19+A13 GND A158 GND B13 GND B158 GNDA12 MA_Rx0- A159 MA_Tx20- B12 MB_Rx0- B159 MB_Tx20-A11 MA_Rx0+ A160 MA_Tx20+ B11 MB_Rx0+ B160 MB_Tx20+A10 GND A161 GND B10 GND B161 GNDA9 MA_PWR A162 MA_Rx20- B9 MB_PWR B162 MB_Rx20-A8 MA_ETH100T A163 MA_Rx20+ B8 MB_ETH100T B163 MB_Rx20+A7 GND A164 GND B7 GND B164 GNDA6 MA_ETH100R A165 MB_TCLK B6 MB_ETH100R B165 MB_TCLKA5 MA_GA0 A166 MB_TMS B5 MB_GA0 B166 MB_TMSA4 MA_MP A167 MB_TRST# B4 MB_MP B167 MB_TRST#A3 MA_PS1# A168 MB_TDO B3 MB_PS1# B168 MB_TDOA2 MA_PWR A169 MB_TDI B2 MB_PWR B169 MB_TDIA1 GND A170 GND B1 GND B170 GND


6.2.1 Fabric Interface electrical requirements for LVDSIndependent of Electronic Keying (E-Keying), the receiver hardware must not be damaged during inadvertent interconnects of incompatible interfaces; therefore, the following requirements have to be followed. Figure 6-1 shows one mode of operation where two Modules are directly connected via a passive AMC Carrier. The example shows the case where optional receive interface capacitors are required.

Figure 6-1 Channel test points - Module to Module routing model

6.2.2 Fabric Interface electrical requirements for non-LVDSDue to the fine pitch of the connector and the 0.1 mm isolation distances between conductive areas in the connector area, the voltage range of the signaling needs to be restricted. The potential difference between adjacent connection areas is limited accordingly by the following requirements:

6.3 Control InterfaceA dedicated control Port is provided to allow for the initialization and Control of the AMC Module before Fabric ports are enabled. This allows for components on the Module to be initialized at startup. This also allows software uploads which may include FPGA code to initialize programmable logic devices, or runtime images to be retrieved from networked storage devices for example. This provides the ability to see the AMC as a logical IP endpoint for control purposes. AMC Modules supporting the Control Interface may also support the Fabric Interface. The Control Interface supports 100 Mbit Ethernet operating in a single ended mode. Figure 6-2 shows the interconnect detail for this interface.

AMC Module

AMC Connectors

Tx Rx

TP-1(BGA Pads)

TP-4(BGA Pads)

AMC ModuleAMC Carrier


Figure 6-2 Control Interface

6.3.1 Control Interface modelThe Control Interface is based on a single ended Ethernet model capable of supporting 100 Mbps. Control Interface support is governed by the system management Electronic Keying mechanism; however, only a subset of requirements apply due to the deterministic nature of the interface. In particular, the Control Interface drivers do not need to be electrically isolated either from the AMC Module or the Carrier perspective.

6.3.2 Control Interface E-Keying requirementsBecause the Control Interface signaling has only one configuration, Electronic Keying is not required to resolve potential signaling conflicts. However, boards are required to support E-Keying entries in the AMC FRU information.

6.4 Synchronization Clock InterfaceThis section defines the clock interface requirements to ensure interoperability between the AMC Module and the Carrier card that may be supplied by multiple vendors.Many telecommunications applications using the AdvancedTCA and Advanced Mezzanine Card architectures need to interface to external networks that require strict timing relationships between multiple interfaces and the external network, such as PDH networks and SONET/SDH networks.Such Interfaces typically require the AMC Module to receive frame and bit rate clocks from the Carrier, also to transmit a bit rate clock to the Carrier.The Synchronization Clock Interface provides three differential pairs for clock distribution to enable applications that require the exchange of synchronous timing information among Modules and consequently multiple boards in a Shelf. This allows Modules to source clock(s) to the system in the case where it provides a Network Interface function, or conversely to receive timing information from another Carrier board or Module within the system.

PHY-Transmit(100Base-FX)

PHY-Receive(100Base-FX)

Tx+

Tx-

Rx+

Rx-

3V3

1V83V3

49.9 R

0.1uF

49.9 R49.9 R

49.9 R

49.9 R

Transmitter Portion Receiver Portion


6.5 JTAG InterfaceJTAG IEEE 1149.1 support is provided on the AMC Connector. This provides an industry standard method of performing manufacturing test and verification and is critical to the test of today's complex and often exclusively BGA device products. The JTAG Interface is supported for vendor product test primarily to increase product test throughput and hence reduce manufacturing cost. The optional JTAG support is provided via the extended half of the Connector, which is available in the B+ or A+B+ Connectors.The Module may support JTAG as required by the vendor. The Carrier may provide JTAG chain support for Modules and should allow the chain to be kept intact in the absence of an empty Module site. The JTAG capable Module shall function correctly on a non-JTAG supporting Carrier by providing applicable pullup/pulldown resistors.

6.6 System integration guidelinesThe design flexibility offered by the Fabric Interface requires some guidelines to ensure proper interoperability between compatible AMC Modules and their Carrier boards. This section describes the minimum compatibility requirements for Carrier boards and Modules to ensure interoperability.The AMC Electronic Keying mechanism will confirm compatible connections exist prior to interface drivers being enabled. This ensures incompatible Module/Carrier combinations do not damage one another; however, interoperability of compatible boards can only be obtained when they are installed correctly. The AMC subsidiary specifications detail the Fabric Port usage specific requirements to ensure interoperability.

6.7 AMC Carrier fabric topologiesThe AMC Connector provides up to 21 ports of fabric connectivity. This gives the flexibility to support a variety of fabric topologies. The following sections describe two fabric topologies that are expected to cover many of the application requirements and can be supported with AMC Carrier applications.Supporting multiple fabrics and/or topologies within a single system environment can be advantageous both for:

• Communications applications that require high speed, low latency data-plane interconnects.

• Control-plane interconnects with less stringent latency and jitter requirements.


AMC Connector 7

AMC Connector manufacturers shall comply with Performance Level 3, System Quality Requirements Level III and Quality Level III according to GR-1217-CORE.AMC Connector manufacturers shall state the Performance Level, the System Quality Requirements, Level, and the Quality Level according to GR-1217-CORE of their products.The AMC Connector is a single-part Z-Pluggable Connector. It contains groups of contacts for power, for general purpose connections, and for very high speed transmissions.The general contact pitch is 0.75 mm at the Module side and at the Carrier side.The AMC Connector makes pluggable card edge connections to the contact fingers on the AMC Module PCB and solderless compression connections to the conductive pads on the Carrier board. It is mounted on the Carrier by means of two screws through the Carrier board onto a steel Connector Brace.

7.1 AMC Connectors - Basic and ExtendedThe Basic Connector only connects to contact fingers on Component Side 1; the Extended AMC Connector connects to both sides of the AMC Module PCB. Compared to the Extended Connector, the Basic Connector provides a cost advantage for the connector and saves real estate on the Carrier board.AMC Connector contact definitions have been made such that the indispensable connections are implemented in the Basic Side. Connections for additional differential pair signals have been implemented in the Extended Side, they are only available in the Extended Connectors.The Basic Connectors have been designated as B and AB, while the Extended Connectors have been designated as B+ and A+B+.

Table 7-1 Functional contact list: Basic Side

Table 7-2 Functional contact list: Extended Side

Basic Side (AMC Module Component Side 1)

Power 2, 9, 18, 27, 42, 57, 72, 84

Ground 1, 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, 40, 43, 46, 49, 52, 55, 58, 61, 64, 67, 70, 73, 76, 79, 82, 85

General purpose 3, 4, 5, 6, 8, 17, 26, 41, 56, 71, 83

Differential pairs 11/12, 14/15, 20/21, 23/24, 29/30, 32/33, 35/36, 38/39, 44/45, 47/48, 50/51, 53/54, 59/60, 62/63, 65/66, 68/69, 74/75, 77/78, 80/81

Extended Side (AMC Module Component Side 2)

Power none

Ground 86, 89, 92, 95, 98, 101, 104, 107, 110, 113, 116, 119, 122, 125, 128, 131, 134, 137, 140, 143, 146, 149, 152, 155, 158, 161, 164, 170

General purpose 165, 166, 167, 168, 169

Differential pairs87/88, 90/91, 93/94, 96/97, 99/100, 102/103, 105/106, 108/109, 111/112, 114/115, 117/118, 120/121, 123/124, 126/127, 129/130, 132/133, 135/136, 138/139, 141/142, 144/145, 147/148, 150/151, 153/154, 156/157, 159/160, 162/163


7.1.1 Family of AMC Connector stylesThe AMC Connector family consists of four different connector styles, with three different housings.

Table 7-3 Number of contacts in the fixed connector

Figure 7-1 Overview of AMC Connector housings

When the Carrier is equipped with a Cutaway Carrier board, two layers of Half-Height AMC Modules may be used. AMC Connectors AB and A+B+ provide the interconnections between both AMC Module layers and the Cutaway Carrier board.When the Carrier is equipped with a Conventional Carrier board (no cut-out), only AMC Module Layer B can be used. AMC Connectors B and B+ provide the connections between Module Layer B and the Conventional Carrier board.The AMC Connector styles shall provide alignment posts, distance pillars, and passages for mounting screws to assure proper alignment of the Carrier Component Covers.The lead-in chamfers of the plug-in slots of the AMC Connector shall be able to correct a maximum misalignment of the AMC Module PCB of ± 1 mm in the height and width directions, taking the lead-in features of the AMC Module PCB into account.

7.1.2 Contact protection mechanism (optional)The AMC Connector may contain an optional feature to protect the contact beams from damage during insertion over the card edge. The mechanism prevents the contacts from scraping over the milled chamfers, where potentially exposed copper layers and glass fibers cause wear and eventual contamination to the contact surface.A mechanical device hovers the contacts over the AMC Module PCB edge, and lets them land on auxiliary pads in front of the actual contact pads.

Connector Style

Interface to AMC Module

Number of Module

Slots

Number of contact positions to Carrier

Number of contact rows on Carrier

Differential pairs

General purpose contacts

Power contacts

Ground contacts

B Basic 1 85 1 19 11 8 28

B+ Extended 1 170 2 45 16 8 56

AB Basic 2 170 2 38 22 16 56

A+B+ Extended 2 340 4 90 32 16 112

Style A+B+

Style AB

Style B/B+

Slot B

Slot A

86

86

85

85

85

85

1701

1701

1

1

86

85

1701


7.2 Dimensions

7.2.1 Dimensions of AMC ConnectorsFor dimensional drawings of other connector styles see the full AMC Specification.

Figure 7-2 Overall dimensions of AMC Connector style A+B+


Figure 7-3 View on compression mounted bottom of AMC Connector style A+B+

7.2.2 Connector Braces for the Carrier boardOn Component Side 2 of the Carrier board, opposite the AMC Connector, a Connector Brace shall be mounted to exert a homogeneously spread force of 0.5 N per contact, to compensate for the compression force and prevent the Carrier board from bending after time and temperature exposure.


7.3 Electrical characteristics

7.3.1 Current carrying capacityAll power and ground conductors inside the AMC Connector shall be able to carry 1.0 A minimum, simultaneously driven, at an ambient temperature of 70 C.

7.3.2 Line resistanceTable 7-4 Maximum line resistances

In order to avoid excessive current in the lower resistance lines, the difference in line resistance between conductors belonging to the same group of power conductors shall not exceed ± 20% of the average line resistance in the group during all test sequences.

7.4 High-speed characteristicsConditions:Specimen environment impedance = 100 Ω differentialMeasured step rise time (10% – 90%) throughout the AMC Connector 30 ps maximumAdjacent lines terminated at both ends

7.4.1 Differential impedanceUnder the conditions stated above, the impedance profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall show an average value of 100 Ω ± 5 Ω.Under the conditions stated above, the differential impedance peak values of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall stay within a tolerance band of 100 Ω ± 10 Ω.

7.4.2 Differential return lossUnder the conditions stated above, the differential loss profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall be better than 20 dB at 5 GHz, better than 15 dB at 8 GHz, and better than 8 dB at 18 GHz.

Maximum initial line resistance

Maximum change in relation to initial value

Differential pair conductors 375 mΩ max ±15 mΩ

Ground conductors 60 mΩ max ±15 mΩ

General purpose conductors 90 mΩ max ±15 mΩ

Power conductors 90 mΩ max ±15 mΩ


7.4.3 Differential attenuationUnder the conditions stated above, the differential attenuation profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall be less than 1 dB at 8 GHz, less than 2 dB at 12 GHz, and less than 4 dB at 18 GHz.

7.4.4 Differential pair cross talkUnder the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair by two driven adjacent differential pairs in the AMC Connector, together with their connections to the AMC Module PCB and the Carrier board, shall be less than 2%.Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair on the Extended Side by an opposite differential pair on the Basic Side in the AMC Connector, together with their connections to the AMC Module PCB and the Carrier board, shall be less than 2%.

7.4.5 Propagation characteristicsThe propagation characteristics are measured in transmission lines including traces and contact pads on the AMC Module PCB and the Carrier board.Transmission lines coming from the Basic Side have a shorter propagation time compared to the lines coming from the Extended Side. The time difference between Basic and Extended Side is identical for connectors coming from different sources. This difference can be compensated by adding 30 ps of propagation time in the layout of the traces on the Carrier board for the lines coming from the Basic Side.The propagation delay skew within each differential pair including traces and contact pads on the AMC Module PCB and the Carrier board shall be 2 ps maximum.The propagation delay skew between differential pairs including traces and contact pads on the AMC Module PCB and the Carrier board and belonging to the same side of the Module interface shall be 20 ps maximum.The average propagation delay shall be 30 ps greater on the Extended side of the connector than on the Basic side.

7.5 Mechanical characteristics

7.5.1 Mechanical operationThe AMC Module PCB shall withstand 50 mating cycles with one AMC Connector under the above stated conditions, without damage that would impair normal operation.The AMC Connector shall withstand 250 mating cycles with five AMC Module PCBs in sequence, each of them serving 50 cycles under the above stated conditions, without damage that would impair normal operation.

7.5.2 Engaging and separating forcesTable 7-5 Engaging and separating forces

Mating sides Single-sided Double-sided

Maximum engaging force 100 N 100 N

Maximum separating force 65 N 65 N

Maximum bottoming force 200 N 200 N


7.5.3 Compression connection - remounting operationConditions:Use three times the same connector and the same connector location on the same Carrier boardAfter successfully mounting and connecting the AMC Connector, it shall be possible to perform at least three remounting operations without damaging the AMC Carrier board in a way that would impair normal operation.


AMC mating conditions A

A.1 Alignment in width direction (parallel to the plane of the Module PCB)

Table A-1 Width dimensions and tolerances

Figure A-1 Dimensions in width direction

Nominaldimension

Tolerance±

Position tolerance

Guide Rail width (from pitch-line) Gw 0,50 0,030 0,08

Guide Rail slot depth Sd 1,70 0,08

Connector slot width Cw 65,15 0,05 0,03

Connector centering holes Cc 0,03

Module PCB width Bw 73,50 0,10

Module PCB interface width Bi 65,00 0,10

Width of non-insulated components CNw 70,10 max.

Milling symmetry on Module PCB Msym 0,03

Etching symmetry on Module PCB Esym 0.05

Pitch on cover plates P 75,00 0.08


The given dimensions assure that in mated condition there is no constraint in width direction between the Connector and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by the Guide Rails.The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of ± 1 mm in width direction, taking the chamfers of the Module PCB into account.In worst case conditions the Module PCB keeps an overlap with the Guide Rails of at least 0.7 mm under all insertion/withdrawal and mating circumstances.The space between the Guide Rails permits the use of non-insulated components with a maximum width of 70.10 mm without interference with the Guide Rails.During insertion of the AMC Module the inclination in width direction is limited to ± 1° by the Guide Rails of the Carrier, in mated and locked condition it is reduced to ± 0°20'.

A.2 Alignment in height direction (perpendicular to the plane of the Module PCB)

Figure A-2 Dimensions in height direction

The given dimensions assure that in mated condition there is no constraint in height direction between the Connector and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by the Guide Rails.The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of ± 1 mm in height direction, taking the chamfers of the Module PCB into account.

Table A-2 Height dimensions and tolerances

Module Layer A Module Layer B

Nominal dimension

Tolerance ±

Nominal dimension

Tolerance ±

Centre of Guide Rail slot/cover plate Ga 8.68 00.8 Gb 3.90 00.8

Guide Rail slot height Sh 2.10 00.8

Module PCB thickness Bt 1.60 0.16

Centre of Connector slot/cover plate Ca 8.68 00.8 Cb 3.90 00.8

Connector slot height Co 1.90 00.8


A.3 Mating depth conditionsThe Module Locking Latch mechanism applies a constant force on the Module PCB in engaging direction, to keep it bottomed to the Connector slot, at all times and under all possible operating conditions.


AMC Module Face Plates - implementation example B

B.1 PurposeIn Section 2 of the AMC Specification some features concerning the Module Face Plate assembly are left open for various design solutions:

• The shape and manufacturing technology of the Face Plate may be different from the sheet metal construction.

• The fixation of the Face Plate to the Module PCB is implementation dependent.

• The location of the LED’s may vary in a small range at the top of the Face Plate.

• The extraction lever and the locking mechanism may adopt different solutions.

• The location and choice of the Hot Swap microswitch depends on the choice of the locking mechanism.

• The purpose of Appendix B is to show different examples of mechanical implementations, including specific board layouts and keepout areas.

B.2 Schroff’s implementationSchroff’s example is a AMC Module Face Plate unit, consisting of a U-shaped profile with two die-cast flanges and a rotating locking latch.


Figure B-1 Overview of Schroff’s Implementation

B.3 Front of the Face Plate unitSchroff’s implementation specifies fixed dimesnions for:

• The location of the LEDs

• The location and front dimensions of the extraction lever

• The available area for Cable Connector arrangements


B.4 Fixation to the Module PCBThe following figure shows the specific method of mounting and the layout of the Module PCB with the milled contours, the mounting holes and the keepout areas.

Figure B-2 Layout of the mounting features on a Single-Width Module PCB

B.5 Cross section through the Face Plate unitSchroff's implementation also specifies the space for components inside the faceplate unit, on both sides of the Module PCB. It defines how the return flanges of the Faceplate Unit fit into the cutouts of the Carrier Board and their position versus the Carrier Struts and Card Guides. It clarifies the maximum dimensions of a faceplate cutout for the implementation of Cable Connectors.

View on Component Side 1View on Component Side 2


B.6 Locking mechanismFigure B-3 AMC Module in position for normal operation

B.7 Locking latch and its catch in the Carrier strutFigure B-4 Compensation for 1 mm insertion depth tolerance

Three situations in case the Module PCB bottoms in the AMC Connector 0.5 mm before it reaches its nominal position, in its nominal position, and 0.5 mm beyond its nominal position

B.8 Extraction leverShape and dimensions of the Knob and the Extraction Lever, including hole for extraction tool.Travel of the Extraction Lever during the unlocking sequence.Actuating forces during the unlocking and extraction sequence.

Figure B-5 Dimensions of extraction lever

Module Face Plate

Rotating locking latch

Hot Swap microswitch

Carrier Card Guide

Carrier strut with catch


Under preparation

B.9 Other implementations


AMC Short Spec

Documents

picmg amc

base specification

amc modules

amc connector

draft specification

pci express

warranty of fitness

warranty of title