www.smthelp.com ✦ Advanced Packaging Assembly Solution
Aug 17, 2015
www.smthelp.com
✦Advanced Packaging Assembly Solution
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Solutions for Advanced Packaging Assembly
Flip Chip die
PCB
Flux
High Accuracy Placement: Embedded Device WLCSP Power QFN
Flip Chip Die Attach
SIP/MCM Assembly: Die Attach Flip Chip & Component Placement
Chip
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Growth In Advanced Packaging
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The closest Package format to a Flip Chip or WLCSP Package
What’s new?QFN (Quad Flatpack No Lead)
Flip Chip die
PCB
Flux
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QFN Market AssessmentAPAS Opportunity
Tota
l QFN
& P
QFN
Pac
kage
s
0
12.5
25
37.5
50
Year2009 2010 2011 2012 2013 2014 2015
12.410.3
8.67.2
5.443.6
41.4
34.5
28.7
24
21.819.8
18
QFN Units PQFN Units
Market in Transition Price of Gold Thermal Performance Electrical Performance
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PQFN Market AssessmentPackaging Units, Lines and Capacity Needs
Incr
emen
tal
Cap
acity
(m/c
's &
$M
)
0
32.5
65
97.5
130
Tota
l PQ
FN P
acka
ges
(B)
0
3.25
6.5
9.75
13
Year2009 2010 2011 2012 2013 2014 2015
PQFN Units Incremental PQFN m/c's Incr CAPEX $ M
90.97
75.81
63.17
129.96
108.3
90.25
12.4
10.3
8.6
7.2
5.4
43.6
63.17
75.81
90.9790.25
108.3
129.96
Incremental CAPEX $
Incremental Lines needed
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Annual Savings from no Taping = $300,000 / Year PER COMPONENT!
Wafer Re-constitution - WLCSP
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OSAT’s Strategic Value
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