PACKAGING & ASSEMBLY SERVICES www.altertechnology-group.com Sub-contract design and assembly for optoelectronics and microelectronic devices Small batch prototypes through to volume manufacturing Design Services Optical, mechanical & thermal modelling Advanced electro / optical package design Design for manufacture MIL-STD-883 and ESCC Standards Focussed areas of excellence Wafer processing Precision placement and auto die attach Wire Bond – Au & Al, ball & wedge Hermetic sealing Optical alignment Laser packaging Photonic IC packaging Experienced end-to-end Manufacturer: wafer processing though to finished packaged product ISO7 Clean Room assembly Optoelectronic & Optical Packaging Microelectronic & MEMS Packaging Electrical and optical test QC & Inspection Die shear and wire strength tests Real-time X-RAY Placement accuracy measurements Working with our parent Alter Technology to provide fully tested & qualified product solutions EEE procurement, Test, Screening & Qualification
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PACKAGING & ASSEMBLY SERVICES
www.altertechnology-group.com
Sub-contractdesignandassemblyforoptoelectronicsandmicroelectronicdevices
Small batch prototypes through to volume manufacturing
DesignServices
Optical, mechanical & thermal modelling Advanced electro / optical package design Design for manufacture
MIL-STD-883andESCCStandardsFocussedareasofexcellence
Wafer processingPrecision placement and auto die attach Wire Bond – Au & Al, ball & wedge Hermetic sealing Optical alignment Laser packaging Photonic IC packaging
Experiencedend-to-endManufacturer:waferprocessingthoughtofinishedpackagedproduct
ISO7 Clean Room assembly Optoelectronic & Optical Packaging Microelectronic & MEMS Packaging Electrical and optical test
QC & Inspection Die shear and wire strength testsReal-time X-RAY
Placement accuracy measurements
Working with our parent Alter Technology to provide fully tested & qualified product solutions
EEE procurement, Test, Screening & Qualification
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