8GB DDR3 VLP RDIMM · Tambient= 27C 7m/s and Tambient=6 1C Vertical Orientation [Max Tc, °C] Thermal Requirement [Tcase °C] Power Dissipation W Part Comments: 1. All Components

8GB DDR3 VLP RDIMMP/N SG5721G4AH8P0PH1

512Mx4 (36)

April 2010

SMART Modular Technologies Company Confidential 2

ObjectiveObjective

• To analyze the given DIMM module at

different airflow and vertical orientation.

SMART Modular Technologies Company Confidential 3

Modeling AssumptionsModeling Assumptions

� The Icepak model for analysis are with reference to the given components data sheet.

�Thermal Conductivity of PCB:

�In Plane : K = 20W/mK

�Normal to Plane : K = 0.2W/mK

� Airflow Condition: Ducted airflow at 7m/s at 61C & 3 m/s at 27C.

�The Rjb & Rjc Values are taken from components data sheet & unknown values are assumed.

�The analysis is done for vertical orientation of DIMM with Aluminum Core.

�Radiation effect between PCB to the ambient is considered in the simulation.

� For all the heat dissipating components and PCB, emissive value of 0.8 is considered in the simulation.

�Modeling details for components:

2X3X0.9

11.6X10.1X1.2

Package Size(mm)

Rjc = 4.34C/W,Rjb = 10C/W

0.2358K4B2G0846CSamsungMemory

Rjc = 5.00C/W,Rjb = 10C/W

0.360STTS424E02STMicroelectonicsEEPROM

Thermal ResistancePower Dissipation

(W)

Mfr P/NMfrPart

SMART Modular Technologies Company Confidential 4

Components Layout [Given Model]

Icepak Model

PCB details

SMART Modular Technologies Company Confidential 5

Components Layout [Icepak Model]

PCB details

Bottom Side

Top Side

Total Power DIMM is 9.12W

Memory: 0.2358W each

EEPROM: 0.32W

SMART Modular Technologies Company Confidential 6

PCB details

Aluminum Core

PCB

PCB Components

SMART Modular Technologies Company Confidential 7

Airflow : 7m/s at 61C

Gravity

Icepak Model

Vertical Orientation

SMART Modular Technologies Company Confidential 8

Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C

PCB Surface Temperature

SMART Modular Technologies Company Confidential 9

Aluminum Core Surface Temperature

Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C

SMART Modular Technologies Company Confidential 10

Components Case temperature distributionCut Location

Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C

SMART Modular Technologies Company Confidential 11

Velocity Vectors across the enclosure Temperature contour across the enclosure

Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C

SMART Modular Technologies Company Confidential 12

Airflow : 3m/s at 27C

Gravity

Icepak Model

Vertical Orientation

SMART Modular Technologies Company Confidential 13

Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C

PCB Surface Temperature

SMART Modular Technologies Company Confidential 14

Aluminum Core Surface Temperature

Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C

SMART Modular Technologies Company Confidential 15

Components Case temperature distribution

Cut Location

Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C

SMART Modular Technologies Company Confidential 16

Velocity Vectors across the enclosure Temperature contour across the enclosure

Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C

SMART Modular Technologies Company Confidential 17

Results Summary

Maximum case Temperature of Components

61.3684.69<950.2358MEMORY

94.22116.42<1250.32EEPROM

3m/s and

Tambient=

27C

7m/s and

Tambient=6

1C

Vertical Orientation [Max

Tc, °C]

Thermal

Requirement

[Tcase °C]

Power

Dissipation

W

Part

Comments:

1. All Components case temperatures are below the spec for both air flow conditions, 7m/s at 61C & 3m/s at 27C.