Winstar Display Co., LTD
SPECIFICATION CUSTOMER : MODULE NO.: WH1602A-YYH-JTK#
APPROVED BY:( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA:
Praa Oswaldo Cruz, 15 conjunto 505 5 andar 90038-900 Porto
Alegre RS Brasil Fone: (51) 3227.1166 Fax: (51) 3228.8448
[email protected]
www.clcomercial.com.br 1 1
Winstar Display Co., LTD MODLE NO
DOC. FIRST ISSUE
RECORDS OF REVISIONREVISED PAGE NO. SUMMARY
VERSION
DATE
0
2007.07.03
First issue
2 2
Contents1.Module Classification Information 2.Precautions in use
of LCD Modules 3.General Specification 4.Absolute Maximum Ratings
5.Electrical Characteristics 6.Optical Characteristics 7.Interface
Pin Function 8.Contour Drawing & Block Diagram 9.Function
Description 10.Character Generator ROM Pattern 11.Instruction Table
12.Timing Characteristics 13.Initializing of LCM 14.Reliability
15.Backlight Information 16. Inspection specification 17. Material
List of Components for RoHs
3 3
1.Module 1.Module Classification InformationWH 1602 AY Y H
JTK#
BrandWINSTAR DISPLAY CORPORATION Display TypeHCharacter Type,
GGraphic Type Display FontCharacter 16 words, 2Lines. Model serials
no. Backlight Type NWithout backlight TLED, White BEL, Blue green
ALED, Amber DEL, Green RLED, Red WEL, White OLED, Orange FCCFL,
White GLED, Green YLED, Yellow Green LCD Mode BTN Positive, Gray
TFSTN Negative NTN Negative, GSTN Positive, Gray YSTN Positive,
Yellow Green MSTN Negative, Blue FFSTN Positive LCD Polarize
AReflective, N.T, 6:00 HTransflective, W.T,6:00 Type/ Temperature
DReflective, N.T, 12:00 KTransflective, W.T,12:00 range/ View
GReflective, W. T, 6:00 CTransmissive, N.T,6:00 direction
JReflective, W. T, 12:00 FTransmissive, N.T,12:00 BTransflective,
N.T,6:00 ITransmissive, W. T, 6:00 ETransflective, N.T.12:00
LTransmissive, W.T,12:00 Special Code JT : English and Japanese
standard font ; #:Fit in with the ROHS Directions and regulations
K: LED 20 Dice
4 4
2.Precautions in use of LCD Modules(1)Avoid applying excessive
shocks to the module or making any alterations or modifications to
it. (2)Dont make extra holes on the printed circuit board, modify
its shape or change the components of LCD module. (3)Dont
disassemble the LCM. (4)Dont operate it above the absolute maximum
rating. (5)Dont drop, bend or twist LCM. (6)Soldering: only to the
I/O terminals. (7)Storage: please storage in anti-static
electricity container and clean environment.
3.General SpecificationItem Number of Characters Module
dimension View area Active area Dot size Dot pitch Character size
Character pitch LCD type Duty View direction Backlight Type
Dimension 16 characters x 2 Lines 84.0 x 44.0 x 13.2(MAX) 66.0 x
16.0 56.20 x 11.5 0.55 x 0.65 0.60 x 0.70 2.95 x 5.55 3.55 x 5.95
STN, Positive, Transflective, Yellow Green 1/16 6 oclock LED Yellow
green Unit mm mm mm mm mm mm mm
5 5
4.Absolute Maximum RatingsItem Operating Temperature Storage
Temperature Input Voltage Supply Voltage For Logic Supply Voltage
For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0.3 -0.3
Typ Max +70 +80 VDD 7 13 Unit V V V
5.Electrical CharacteristicsItem Supply Voltage For Logic Supply
Voltage For LCD Input High Volt. Input Low Volt. Output High Volt.
Output Low Volt. Supply Current Symbol VDD-VSS Condition Ta=-20
VDD-V0 Ta=25 Ta=70 VIH VIL VOH VOL IDD VDD=5.0V Min 4.5 3.2 0.7 VDD
VSS 3.9 1.0 Typ 5.0 3.8 1.2 Max 5.5 5.2 VDD 0.6 0.4 1.5 Unit V V V
V V V V V mA
6 6
6.Optical CharacteristicsItem View Angle (H) Contrast Ratio
Response Time T fall CR T rise CR2 -30 Symbol (V) Condition CR2 Min
20 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms
Definition of Operation Voltage (Vop)
Definition of Response Time ( Tr , Tf )
Intensity 100
Selected Wave Non-selected Wave
Non-selected Conition Intensity
Selected Conition
Non-selected Conition
10
Cr Max Cr = Lon / Loff100 90
Vop
Driving Voltage(V)
Tr
Tf
[positive type]
[positive type]
Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ
Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias
Definition of viewing angle(CR2) b f = 180
l
r
= 270
= 90
= 0 7 7
7.Interface Pin FunctionPin No. Symbol 1 2 3 4 5 6 7 8 9 10 11
12 13 14 15 16 VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7
A K Level 0V 5.0V Ground Supply Voltage for logic Description
(Variable) Operating voltage for LCD H/L H/L H,HL H/L H/L H/L
H/L H/L H/L H/L H/L H: DATA, L: Instruction code H: Read(MPUModule)
L: Write(MPUModule) Chip enable signal Data bus line Data bus line
Data bus line Data bus line Data bus line Data bus line Data bus
line Data bus line LED + LED
8 8
9 9
8.Contour Drawing &Block Diagram
10 10
9.Function DescriptionThe LCD display Module is built in a LSI
controller, the controller has two 8-bit registers, an instruction
register (IR) and a data register (DR). The IR stores instruction
codes, such as display clear and cursor shift, and address
information for display data RAM (DDRAM) and character generator
(CGRAM). The IR can only be written from the MPU. The DR
temporarily stores data to be written or read from DDRAM or CGRAM.
When address information is written into the IR, then data is
stored into the DR from DDRAM or CGRAM. By the register selector
(RS) signal, these two registers can be selected. RS 0 0 1 1 R/W 0
1 0 1 Operation IR write as an internal operation (display clear,
etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write
data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM
or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF) When the busy flag is 1, the controller LSI is in
the internal operation mode, and the next instruction will not be
accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The
next instruction must be written after ensuring that the busy flag
is 0. Address Counter (AC) The address counter (AC) assigns
addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This
DDRAM is used to store the display data represented in 8-bit
character codes. Its extended capacity is 808 bits or 80
characters. Below figure is the relationships between DDRAM
addresses and positions on the liquid crystal display. High bits
Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4
AC3 AC2 AC1 AC0 1 0 0 1 1 1 0
11 11
Display position DDRAM address 1 2 3 4 5 6 7 8 9 10 11 12 13 14
15 16
00 01 40 41
02 03 42 43
04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 44 45 46 47 48 49 4A 4B 4C
4D 4E 4F 2-Line by 16-Character Display
Character Generator ROM (CGROM) The CGROM generate 58 dot or 510
dot character patterns from 8-bit character codes. See Table 2.
Character Generator RAM (CGRAM) In CGRAM, the user can rewrite
character by program. For 58 dots, eight character patterns can be
written, and for 510 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the
left column of table 1. To show the character patterns stored in
CGRAM.
12 12
Relationship between CGRAM Addresses, Character Codes (DDRAM)
and Character patterns Table 1.F o r 5 * 8 d o t c h a ra c te r p
a tte r n s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4
3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0
1 0 1 0 1 0 1 0 1 0 1 0 1 C h a r a c te r P a tte r n s ( C G R A
M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0 C h a r a c te r p a tte r n ( 2 ) C h a r a c te r p a tte r n (
1 )
H ig h
Low
0
0
0
0
* 0
0
0
0
0
0
0
* 0
0
1
Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 0
0 1 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1
H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* * * * *
Low
0 0 0 0 0 0
C u r s o r p a tte r n
0
C u r s o r p a tte r n
0
0
0
0
*
1
1
1
*
*
*
F o r 5 * 1 0 d o t c h a r a c te r p a tte rn s C h a ra c te
r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re
ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1
0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a r a c te r
P a tte r n s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * *
* * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0
0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * C h a r a c te r p a tte r n 0
0 0 1 0
H ig h
Low
Low
H ig h * 0 * 0 * * * * * * * * * 0 * *
0
0
0
0
* 0
0
0
0
0
C u r s o r p a tte r n
: " H ig h "
13 13
10.Character 10.Character Generator ROM Pattern .CTable.2Upper 4
bit Lower 4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL
HHLH HHHL HHHHCG RAM (1)
LLLL
LLLH
(2)
LLHL
(3)
LLHH
(4)
LHLL
(5)
LHLH
(6)
LHHL
(7)
LHHH
(8)
HLLL
(1)
HLLH
(2)
HLHL
(3)
HLHH
(4)
HHLL
(5)
HHLH
(6)
HHHL
(7)
HHHH
(8)
14 14
11.Instruction 11.Instruction TableInstruction Code Instruction
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display 0 0 0 0 0 0 0
0 0 1Write 00H to DDRAM and set DDRAM address to 00H from AC Set
DDRAM address to 00H from AC and return cursor to its original
position if shifted. The contents of DDRAM are not changed. Assign
cursor moving direction and enable the shift of entire display. Set
display (D), cursor (C), and blinking of cursor (B) on/off control
bit. Set cursor moving and display shift
Description
Execution time (fosc=270Khz)
1.53ms
Return Home
0
0
0
0
0
0
0
0
1
1.53ms
Entry Mode Set Display ON/OFF Control Cursor or Display
Shift
0
0
0
0
0
0
0
1
I/D
SH
39s
0
0
0
0
0
0
1
D
C
B
39s
0
0
0
0
0
1
S/C R/L
control bit, and the direction, withoutchanging of DDRAM data.
Set interface data length (DL:8-bit/4-bit), numbers of display line
(N:2-line/1-line)and, display font type (F:511 dots/58 dots)
39s
Function Set
0
0
0
0
1
DL
N
F
39s
Set CGRAM Address Set DDRAM Address Read Busy Flag and Address
Write Data to RAM Read Data from RAM
0 0
0 0
0 1
1
AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address
counter.
39s 39s
AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address
counter.Whether during internal operation or not
0
1
BF AC6 AC5 AC4 AC3 AC2 AC1 AC0
can be known by reading BF. The contents of address counter can
also be read. Write data into internal RAM (DDRAM/CGRAM). Read data
from internal RAM (DDRAM/CGRAM).
0s
1 1
0 1
D7 D7
D6 D6
D5 D5
D4 D4
D3 D3
D2 D2
D1 D1
D0 D0
43s 43s
dont care
15 15
12.Timing Characteristics12.1 Write Operation
Ta=25, VDD=5.0V Item Enable cycle time Enable pulse width Enable
rise/fall time Address set-up time (RS, R/W to E) Address hold time
Data set-up time Data hold time Symbol TC TPW TR,TF tAS tAH tDSW tH
Min 1200 140 0 10 40 10 Typ Max 25 Unit ns ns ns ns ns ns ns
16 16
12.2
Read Operation
Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high
level) Enable rise/fall time Address set-up time (RS, R/W to E)
Address hold time Data delay time Data hold time Symbol TC TPW
TR,TF tAS tAH tDDR tH Min 1200 140 0 10 10 Typ Max 25 100 Unit ns
ns ns ns ns ns ns
17 17
13.Initializing of LCM
Power on Wait for more than 40 ms after VDD rises to 4.5 VBF can
not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 1 1 * 0
* * * 0 Wait for more than 39usBF can not be checked before this
instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 0 * * * * 0 0 * *
* * * N F * 0 Wait for more than 39 s
Function set
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 1 0 * * * * Function
set 0 0 0 0 N F * * * * * * 0 Wait for more than 37us
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0
0 0 0 0 * * * * 0 0 1 D C B * * * * 0 Wait for more than 37 s RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 * * * *
0 0 0 0 0 1 * * * * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5
DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 * 0 * * * 0 0 1 * * *
0 I/D SH * Initialization ends
4-Bit Ineterface
18 18
Power on W for more than 40 ms after VDDrises to 4.5 V aitBF can
not be checked before this instruction.
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N
F * * W for more than 39us aitBF can not be checked before this
instruction.
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N
F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s
ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0
0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2
DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization
ends
8-Bit Ineterface
19 19
14.ReliabilityContent of Reliability Test (wide temperature,
-20~70) Environmental Test Test Item High Temperature storage Low
Temperature storage High Temperature Operation Low Temperature
Operation Content of Test Endurance test applying the high storage
temperature for a long time. Endurance test applying the high
storage temperature for a long time. Endurance test applying the
electric stress (Voltage & Current) and the thermal stress to
the element for a long time. Endurance test applying the electric
stress under low temperature for a long time. The module should be
allowed to stand at 60 ,90%RH max For 96hrs under no-load condition
excluding the polarizer, Then taking it out and drying it at normal
temperature. The sample should be allowed stand the following 10
cycles of operation -20 25 70 Test Condition 80 200hrs -30 200hrs
70 200hrs -20 200hrs Note 2 1,2 1
High Temperature/ Humidity Operation
60,90%RH 96hrs
1,2
Thermal shock resistance
-20/70 10 cycles
30min 1 cycle
5min
30min
Total fixed amplitude : 1.5mm Vibration Frequency : Endurance
test applying the vibration during 10~55Hz Vibration test 3
transportation and using. One cycle 60 seconds to 3 directions of
X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Endurance test applying
the electric stress to the Static electricity test terminal.
CS=100pF 1 time Note1: No dew condensation to be observed. Note2:
The function test shall be conducted after 4 hours storage at the
normal Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself
without putting it in a container.
20 20
15.Backlight InformationSpecificationPARAMETER Supply Current
Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life
Time Color SYMBOL MIN ILED V VR IV p 80 4.0 80 560 TYP 100 4.2 95
570 MAX 150 4.4 8 580 UNIT mA V V TEST V=4.2V CONDITION
CD/M2 ILED=100mA nm Hr. ILED=100mA ILED100mA
100000
Yellow Green
Note: The LED of B/L is drive by current onlydriving voltage is
only for reference To make driving current in safety area (waste
current between minimum and maximum).
2.Drive from pin15,pin16
R
R
A K
B/L
LCM(Will never get Vee output from pin15)
21 21
16. Inspection specificationNO Item Criterion 1.1 Missing
vertical, horizontal segment, segment contrast defect. 1.2 Missing
character , dot or icon. 1.3 Display malfunction. 1.4 No function
or no display. 1.5 Current consumption exceeds product
specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product
types. 1.8 Contrast defect. AQL
01
Electrical Testing
0.65
02
Black or white 2.1 White and black spots on display 0.25mm, no
more than spots on LCD three white or black spots present. (display
only) 2.2 Densely spaced: No more than two spots or lines within
3mm
2.5
03
LCD black spots, white spots, contamination 3.2 Line type : (As
following drawing) (non-display) Length Width --W0.02 L3.0
0.02W0.03 L2.5 0.03W0.05 --0.05W If bubbles are visible, judge
using black spot specifications, not easy to find, must check in
specify direction. Size 0.20 0.200.50 0.501.00 1.00 Total Q TY
3.1 Round type : As following drawing =( x + y ) / 2 SIZE 0.10
0.100.20 0.200.25 0.25
Acceptable Q TY Accept no dense 2 1 0
2.5
Acceptable Q TY Accept no dense 2.5 2 As round type Acceptable Q
TY Accept no dense 3 2 0 3
04
Polarizer bubbles
2.5
22 22
NO 05
Item Scratches
Criterion Follow NO.3 LCD black spots, white spots,
contamination
AQL
Symbols Define: x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length L: Electrode
pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface
and crack between panels:
06
Chipped glass
z: Chip thickness y: Chip width x: Chip length Z1/2t Not over
viewing area x1/8a 1/2tz2t Not exceed 1/3k x1/8a If there are 2 or
more chips, x is total length of each chip. 6.1.2 Corner crack:
2.5
z: Chip thickness y: Chip width x: Chip length Z1/2t Not over
viewing area x1/8a 1/2tz2t Not exceed 1/3k x1/8a If there are 2 or
more chips, x is the total length of each chip.
23 23
NO
Item
Criterion Symbols : x: Chip length y: Chip width z: Chip
thickness k: Seal width t: Glass thickness a: LCD side length L:
Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on
electrode pad :
AQL
y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive
portion:
z: Chip thickness 0 zt
06
Glass crack
2.5
y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If
the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal
specifications. If the product will be heat sealed by the customer,
the alignment mark not be damaged. 6.2.3 Substrate protuberance and
internal crack. y: width y1/3L x: length xa
24 24
NO 07
Item Cracked glass
Criterion The LCD with extensive crack is not acceptable. 8.1
Illumination source flickers when lit. 8.2 Spots or scratched that
appear when lit must be judged. Using LCD spot, lines and
contamination standards. 8.3 Backlight doesnt light or color
wrong.
AQL 2.5 0.65 2.5 0.65
08
Backlight elements
09
Bezel
9.1 Bezel may not have rust, be deformed or have fingerprints,
stains or other contamination. 9.2 Bezel must comply with job
specifications.
2.5 0.65
10
PCBCOB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination. 10.2 COB seal surface may not have pinholes through
to the IC. 10.3 The height of the COB should not exceed the height
indicated in the assembly diagram. 10.4 There may not be more than
2mm of sealant outside the seal area on the PCB. And there should
be no more than three places. 10.5 No oxidation or contamination
PCB terminals. 10.6 Parts on PCB must be the same as on the
production characteristic chart. There should be no wrong parts,
missing parts or excess parts. 10.7 The jumper on the PCB should
conform to the product characteristic chart. 10.8 If solder gets on
bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it
is smoothed down. 10.9 The Scraping testing standard for Copper
Coating of PCBX Y
2.5 2.5 0.65 2.5
2.5 0.65
0.65 2.5 2.5
X * Y