42nd International Conference on Micro and Nano …mne2016.org/wp-content/uploads/2016/09/MNE2016_web...2016 IENNA 4 Welcome Welcome MESSAGE FROM THE CONFERENCE CHAIR Welcome to the

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FINAL PROGRAM

42nd International Conference on Micro and Nano EngineeringSeptember 19-23, 2016Reed Messe Wien, Congress CenterVienna, Austria

DISCLAIMER: Although care has been taken to ensure the accuracy, completeness and reliability of the information provided in this program booklet, The MNE 2016 organisation assumes no responsibility.

2016 VIENNA

Final Program2

2016 VIENNA

www.mne2016.org

Table of Contents 3

Notes:

Table of Contents

4 Welcome

6 Organisation & Committees

9 Important Addresses

10 Registration

11 General Congress Information

13 General Information Vienna

15 Information for Speakers and Chairpersons

16 Scientific Program Information

17 Plenary Speakers

20 Invited Speakers

21 Awards

23 Social Program

26 Program at a Glance

34 Scientific Program

95 Poster Index

173 Sponsoring/Exhibition

175 Exhibition Floor Plan

176 Authors' Index

188 Floor Plan

189 Cluster Topics Overview

194 Short Program

2016 VIENNA

Welcome4

Welcome

MESSAGE FROM THE CONFERENCE CHAIR

Welcome to the 42nd International Conference on Micro- and Nano-Engineering MNE 2016!

Electronic based systems will continue to shape our future. Micro- and Nano-Engineering is at the heart of this development enabling micro- and nano-electronics, embedded, cyber-physical as well as integrated systems. It is indispensable for applications such as automated driving, internet of things, intelligent infrastructures as well as Industry 4.0. At least ten percent of the gross dome-stic product throughout Europe depends on Micro- and Nano-Engineering.

This broad spectrum is also reflected in the selection of outstanding keynote speakers at MNE 2016. Starting from material aspects for ‘More-than-Moore’ devices (Prof. Franz Kreupl, Techni-cal University Munich) or gel-technology for microfluidics and biochips (Prof. Michiel Vellekoop, IMSAS, University of Bremen), technology and integration aspects will be highlighted in the frame of MEMS development (Prof. em. Nico de Rooij, EPFL Neuchatel, carrier of the MNE Fellow Award of 2016) and of nanoimprint technology for high throughput (Dr. Takehiko Iwanaga, Canon Inc., Japan), spreading into in developments towards novel/better devices like memory (Dr. Dave Egglestone, GLOBALFOUNDRIES, Santa Clara), biomedical chips (Prof. Peter Ertl, Vienna Univer-sity of Technology) or low-energy wearables (Prof. Veena Misra, NSF ASSIST, North Carolina State University). In addition, 17 world-Ieading invited speakers will reflect modern topics in the four MNE categories: micro- and nanopatterning, micro- and nanofabrication, micro/nano devices and systems, and micro- and nanotechnology/engineering for life sciences and biology.

Returning to Vienna, Austria, after eleven years, the conference will be hosted in a modern Con-gress Center, easy to reach from the city center, with hotels in walking distance, and sandwiched between the pleasure grounds “Prater” and the nearby Danube river – an idyllic setting that is ideal for delegates to unwind between sessions. Vienna with its 19 universities – amongst them the traditional University of Technology and Vienna University (alma mater of, e.g., physicist Erwin Schrödinger) – has more than 150.000 students today.

We hope that you spend some time and enjoy Vienna which has a lot to offer. More than 13 million tourists visited Vienna in 2015, which is ranked worldwide as the number one city in quality of living. The city center is a small universe in itself: discover historical palaces face to face with modern facades, elegant boutiques next to popular fashion stores, and antique shops lining up across from stylish designer hotspots. Art permeates Vienna’s very essence – get a feel of it during a city walking tour, or while visiting one of Vienna’s many museums. Sights not to be missed are St. Stephen’s Cathedral right in the heart of the city, Schönbrunn palace, and the Giant Ferris Wheel at the “Prater” fairground. Fans of classical music and opera lovers may jump at a chance to spend an evening at the Staatsoper, the Konzerthaus, or the Musikverein. More modern fare can be found at Vienna’s jazz bars, world music pubs, and dance clubs. When it comes to food, you should definitely try famous Austrian dishes such as “Wiener Schnitzel” (breaded escalope of veal) or “Tafelspitz” (prime boiled beef). Your stay isn’t complete without treating yourself to coffee and a slice of cake at one of Vienna’s coffeehouses, or trying some organic ice cream.

As every year, the MNE international program committee performed the important task of revie-wing all abstracts. Including the seven plenary and 17 invited presentations, the conference pro-gram comprises 163 oral and 303 poster presentations. Abstracts were submitted from 48 coun-tries with the following shares of origin: 48% from Europe, 45% from Asia, 7% from the Americas, illustrating the truly international nature of MNE community. The distribution among the MNE ca-tegories gives a snapshot of the main interests of our community and reflect long-term evolutions of our fields of activity. The topic micro- and nanopatterning covers 26% of all submissions, micro- and nanofabrication 17%, micro/nano devices and systems 37%, and micro- and nanotechnology/engineering for life sciences and biology 20%. The share has been pretty stable over the years.

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Welcome 5

Publications associated with MNE 2016 will appear after peer-reviewing in four special issues in the Elsevier Journal of Microelectronic Engineering in early 2017.

Another MNE highlight is the exhibition, an exceptional forum for all conference participants, to get in contact with providers of community-related products and services. MNE 2016 will host 34 exhibitors and is grateful to numerous sponsors which we sincerely acknowledge as the confe-rence is only made possible through their strong support.

MNE 2016 offers exciting Short Courses on “Multiscale Simulations” where you learn about how the design and development of nano- and microdevices go together with accurate computer mo-dels of materials, properties, and functions. A topic in the core of today’s engineering!

As conference attendants please enjoy and experience what MNE 2016 has to offer: an interesting scientific program, excellent plenary speakers and invited talks, diverse contests with generous prizes (poster award, micro-/nano-graph contest), short courses about ‘multiscale simulation’, and discussion opportunities with your colleagues, e.g., at the pleasant atmosphere of the “Heurigen” evening.

No MNE 2016 would exist without all of the authors, delegates, exhibitors and sponsors, program chairs, members of the international program committee, guest editors for the Microelectronic Engineering special issues, the helpers, students and staff participating in running the conference, and the members of the international steering committee. Thank you!

The members of the organizing committee of MNE 2016 wish you an instructive and stimulating conference with many fascinating presentations and exhibits, and hope that you greatly enjoy your stay in Vienna.

Hubert Brückl MNE 2016 conference chair

Bernhard Jakoby MNE 2016 conference co-chair

Thomas Schrefl MNE 2016 program co-chair

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Organisation & Committees6

Organisation & Committees

CONFERENCE & PROGRAM CHAIRS

Hubert Brückl – Conference Chair, Danube University KremsBernhard Jakoby – Conference Co-chair, Johannes -Kepler-University LinzThomas Schrefl – Program Co-chair, Danube University Krems

ORGANISING COMMITTEE

Hubert Brückl – Danube University KremsBernhard Jakoby – Johannes-Kepler-University LinzThomas Schrefl – Danube University KremsWilfried Hortschitz – Exhibition, Danube University KremsFelix Ring – Website, Danube University KremsElisabeth Schiefer – Danube University KremsUlrike Lachner – Danube University KremsIris Bergmair – Sony DADC, AnifClemens Schütte – EVGroup, St. FlorianDenise Lembäcker – Mondial Congress & EventsLiesa Wessely – Mondial Congress & EventsLarissa Vierthaler – Mondial Congress & Events

MNE INTERNATIONAL STEERING COMMITTEE

Anja Boisen – Technical University of Denmark, DenmarkHubert Brückl – Danube University Krems, AustriaMichel Despont – CSEM, SwitzerlandZahid Durrani – Imperial College London, United KingdomMassimo Gentili (Chair) – TESMEC S.p.A., ItalyEvangelos Gogolides – NCSR Demokritos Athens, GreeceGabi Grützner – micro resist technology GmbH, GermanyYoshihiko Hirai – Osaka Prefecture University, JapanJ. Alexander Liddle – NIST Gaithersburg, USAJean-Francois de Marneffe – IMEC Leuven, BelgiumFrancesc Pérez-Murano – CNM-CSIC Barcelona, SpainUrs Staufer – Delft University of Technology, NetherlandsChristophe Vieu – LAAS-CNRS Toulouse, France

MNE INTERNATIONAL PROGRAM COMMITTEE

Gabriel Abadal – Universitat Autònoma de Barcelona, Spain

Maan Alkaisi – University of Canterbury, New ZealandPaul Alkemade – Delft University of Technology, NetherlandsSternberg Andris – Institute of Solid State Physics, LatviaCarl Anthony – University of Birmingham, United KingdomPanagiotis Argitis – NCSR Demokritos, GreeceFrancisco J. Arregui – Univ. of Navarra, SpainGonçal Badenes – ICFO, SpainJoan Bausells – IMB-CNM (CSIC), SpainUwe Behringer – UBC Microelectronics, GermanyGérard Benassayag – CEMES/CNRS, FranceRuediger Berger – Max Planck Institute for Polymer Research, GermanyIris Bergmair – Sony DADC Austria AG, AustriaKirstine Berg-Sørensen – Technical University of Denmark (DTU), DenmarkMarko Blom – Micronit Microfluidics BV, NetherlandsStefan Blunier – ETH Zuerich, SwitzerlandAnja Boisen – Technical University of DK, DenmarkAgeeth Bol – Eindhoven University of Technology, NetherlandsWerner Boullart – IMEC, BelgiumMartin Brandl – Danube University Krems, AustriaHubert Brückl – Danube University Krems, AustriaJuergen Brugger – EPFL, SwitzerlandClaus J. Burkhardt – NMI, GermanyStefano Cabrini – Lawrence Berkeley National Laboratory, United StatesVictor J. Cadarso – Paul Scherrer Institut (PSI), SwitzerlandChristophe Cardinaud – CNRS, FranceBrendan Casey – Kelvin Nanotechnology, United KingdomAline Cerf – LAAS-CNRS, FranceWen-Huei Chang – National Pingtung University, TaiwanGuillaume Charras – London Centre for Nanotechno-logy United KingdomMargarita Chatzichristidi – University of Athens, GreeceHsuen-Li Chen – National Taiwan University, TaiwanLei Chen – National Institute of Standards and Technology, United States of AmericaYong Chen – CNRS/ENS, FranceRebecca Cheung – United KingdomJin-Woo Choi – Louisiana State Universit, United Sta-tes of AmericaOlga Maria Conde Portilla – Univ. of Cantabria, SpainVassilios Constantoudis – National Center for Scientific Research Demokritos, GreeceBo Cui – University of Waterloo, Canada

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Organisation & Committees 7

Neil Curson – UCL, United KingdomStefan De Gendt – Imec/kuleuven, BelgiumJean-Francois de Marneffe – imec vzw, BelgiumJose Maria De Teresa – ICMA, Facultad de CienciasMassimo De Vittorio – Istituto Italiano di Tecnologia, ItalyEmiliano Descrovi – Politecnico di Torino, ItalyMichel Despont – CSEM SAMaria Dimaki – Technical University of Denmark (DTU)Panagiotis Dimitrakis – NCSR „Demokritos“, GreeceZoran Djuric – Institute of Technical Sciences of SASA, SerbiaElizabeth Dobisz – Hitachi San Jose Research Center, United StatesAlex Domman – EMPA Swiss Federal Laboratories for Materials Science and Technology, SchweizKlaus Stefan Drese – Fraunhofer ICT-IMM, GermanyZahid Durrani – Imperial College London, United KingdomAndreas Erdmann – Fraunhofer IISB, GermanyTheodore H. Fedynyshyn – MIT Lincoln Laboratory, United StatesCésar Fernández-Sánchez – Consejo Superior de Investigaciones Científicas (CSIC), SpainMonika Fleischer – University of Tuebingen, GermanyKristel Fobelets – Imperial College London, United KingdomHiroshi Fukuda – Hitachi High-Technologies Corporation, JapanSebastian Gautsch – EPFL, SwitzerlandMassimo Gentili – FBK, ItalyAnnamaria Gerardino – CNR, ItalyGerald Gerlach – TU Dresden, GermanyJacques Gierak – LPN-CNRS, NetherlandsIoanna Giouroudi – Vienna University of Technology, AustriaJens Gobrecht – Paul Scherrer Inst., SwitzerlandEvangelos Gogolides – NCSR Demokritos, GreeceMarkus Graf – Sensirion, SwitzerlandBrian J. Grenon – Grenon Consulting, United StatesGabi Grützner – micro resist technology GmbH, GermanyVitaliy Guzenko – Paul Scherrer Institute, SwitzerlandCornelis W. Hagen – Delft University of Technology, NetherlandsAnne Marie Haghiri-Gosnet – CNRS, FrancePeter Hahmann – Vistec Electron Beam GmbH, GermanyLloyd Harriott – University of Virginia, United StatesHarry Heinzelmann – CSEM, SwitzerlandLaura Heyderman – ETH Zurich - Paul Scherrer Institute, NetherlandsBart Hoogenboom – University College London, United KingdomEjaz Huq – Queen Mary University of London, United Kingdom

Toshiro Itani – EUVL Infrastructure Development Center, JapanHiroyuki Ito – Hitachi High-Technologies Corporation, JapanSHI JIAN – Ecole Normale Supérieure de Paris, FranceMervyn Jones – Imperial College London, United KingdomGrigoris Kaltsas – Technological Educational Institute (T.E.I) of Athens, GreeceSongphol Kanjanachuchai – Chulalongkorn University, ThailandDieter Kern – Tübingen University, GermanyGyu Man Kim – Kyungpook National University, Republic OfBeomjoon Kim – The University of Tokyo, JapanSeok Kim – University of Illinois at Urbana-Champaign (UIUC), United StatesRobert Kirchner – Paul Scherrer Institut, SwitzerlandEugenie Kirk – Paul Scherrer Institut, SwitzerlandHarm Knoops – Oxford Instruments Plasma Technology, NetherlandsFu-Hsiang Ko – National Chiao Tung Uni, TaiwanManfred Kohl – KIT, GermanyRichard Koops – VSL Dutch Metrology Institute, NetherlandsAnders Kristensen – Technical University of Denmark, DenmarkPieter Kruit – TUDelft, NetherlandsJosiane P. Lafleur – University of Copenhagen, DenmarkLaura Lechuga – ICN2, SpainJaeJong Lee – Korea Institute of Machinery and Materials, Republic OfJ. Alexander Liddle – National Institute of Standards and Technology, United StatesChun-Hung Lin – National Cheng Kung University, TaiwanRan Liu – Fudan Universty, ChinaAndreu Llobera – Institut de Microelectronica de Barcelona (IMB-CNM, SpainHans Loeschner – IMS Nanofabrication AG, AustriaLeandro Lorenzelli – Fondazione Bruno Kessler, ItalyRegina Luttge – Eindhoven University of Technology, NetherlandsEleni Makarona – NCSR Demokritos, GreeceLaurent Malaquin – LAAS CNRS, FranceMaria-Pilar Marco – CID-CSIC, SpainAdrian Martinez-Rivas – Instituto Politécnico Nacional (IPN), MexicoCristina Martin-Olmos – CSEM, SwitzerlandIgnacio R. Matias – Univ. of Navarra, SpainShinji Matsui – University of Hyogo, JapanMarco Matteucci – Technical University of Denmark (DTU), DenmarkJun Mizuno – Waseda University, JapanFaisal Mohd-Yasin – Griffith University, Australia

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Organisation & Committees8

Isabella Moser – Jobst technologies, GermanyMiha Mraz – University of Ljubljana, SloveniaXavier Munoz-Berbel – IMB-CNM, SpainPascal Normand – NCSR „Demokritos“, GreeceShunri Oda – Tokyo Institute of Technology, JapanJe Hoon Oh – Hanyang University, Republic OfHeidi Ottevaere – Vrije Universiteit Brussel, BelgiumJames Owen – Zyvex Labs, United StatesCelestino Padeste – Paul Scherrer Institute, SwitzerlandTung-Ming Pan – Chang Gung University, TaiwanStella Pang – City University of Hong Kong, Hong KongAthanasios Papathanasiou – NTUA, GreeceInkyu Park – Advanced Institute of Science and Technology KAIST, Republic OfFrancesc Perez-Murano – IMB-CNM, SpainDavid Peyrade – LTM-CNRS c/o CEA-Minatec, FranceFrancesco Pieri – Università di Pisa ItalyPasqualantonio Pingue – Scuola Normale Superiore, ItalyPhil Prewett – University of Birmingham, NetherlandsChristelle Prinz – Lund University, SwedenRomain Quidant – Institute of Photonic Sciences (ICFO), SpainMuhammad Aftab Rafiq – Pakistan Institute of Engineering and Applied Sciences, PakistanJohn Randall – Zyvex Labs., United StatesIoannis Raptis – NCSR „Demokritos‘, GreeceMoh‘d Rezeq – Khalifa University, Abu DhabiHeike Riel – IBM Research GmbH, SwitzerlandAlex Robinson – University of Birmingham, United KingdomMathias Rommel – Fraunhofer IISB, GermanyFrancois Rossi – European Commission, ItalyGünter Roth – Center for Biological Systems Analysis, GermanyXavier Rottenberg – IMEC, BelgiumLuigi Sasso – Delft University of Technology, NetherlandsVeronica Savu – Ecole Polytechnique Fédérale de Lausanne (EPFL), SwitzerlandSteven Schofield – University College London, United KingdomJoerg Schotter – AIT Austrian Institute of Technology

GmbH, AustriaHerbert Shea – Ecole Polytechnique Fédérale de Laus-anne (EPFL), SwitzerlandUrs Staufer – Delft University of Technology, NetherlandsRalf Steingrueber – Fraunhofer Heinrich-Hertz- Institute, GermanyMartin Stelzle – NMI Naturwissenschaftliches und Medizinisches Institut an der Universität Tübingen, GermanyRichard Syms – Imperial College London, United KingdomRafael Taboryski – Technical University of Denmark, DenmarkYuzuru Takamura – Japan Advanced Inst. of Science and Technology, JapanMaria Tenje – Lund University, SwedenHarrie Tilmans – IMEC, BelgiumChristos Tsamis – NCSR Demokritos, GreeceAngeliki Tserepi – NCSR Demokritos, GreeceKaterina Tsougeni – NCSR Demokritos, GreeceDimitris Tsoukalas – National Technial University of Athens, GreeceIvo Utke – EMPA Swiss Federal Laboratories for Materials Science and Technology, SwitzerlandFalco van Delft – Molecular Sense Ltd., NetherlandsPol van Dorpe – IMEC, BelgiumJeroen A van Kan – National University Singapore, SingaporeNiels Verellen – IMEC, BelgiumChristophe Vieu – University of Toulouse, FranceGuillermo Villanueva – Ecole Polytechnique Fédérale de Lausanne (EPFL), SwitzerlandKatia Vutova – Institute of electronics, BulgariaMichael Ward – Birmingham City University, United KingdomRemco Wiegerink – University of Twente, NetherlandsShalom Wind – Columbia University, United StatesSandra Wolff – TU Kaiserslautern, GermanyStefan Wurm – Advanced Micro Devices / SEMATECH, United StatesIoanna Zergioti – National Technical University of Athens, Greece

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Important Addresses 9

Important Addresses

PROFESSIONAL CONGRESS ORGANISER, SCIENTIFIC SECRETARIAT, HOUSING

Mondial Congress & EventsOperngasse 20b, 1040 Vienna, AustriaTel.: +43 1 58804 0, Fax: + 43 1 58804 185E-mail: [email protected]

SPONSORSHIP & EXHIBITION

Danube University KremsCenter for Integrated Sensor SystemsDr. Wilfried HortschitzViktor Kaplan Straße 2, 2700 Wr. Neustadt, AustriaTel.: +43 2622 23420-25E-mail: [email protected]

CONGRESS VENUE

Reed Messe WienCongress CenterMesseplatz 11021 Vienna, AustriaHomepage: www.messecongress.at

How to reach the venue BY TRAINReed Messe Wien - Congress Center has its own stati-on, Messe-Prater, which is located directly at the Reed Messe complex and is easy to reach from anywhere in Vienna by Underground line U2. When you leave the

station, follow the signs for Reed Messe Wien (Con-gress Center).

BY TRAM, METRO OR BUSU2 Underground Line “Karlsplatz – Seestadt”The ideal exit to entrance Congress Center: station “Messe-Prater”

Bus line 11A “Heiligenstadt – Seestadt”Exit to Congress Center: “Krieau”

Bus line 80B “Kaiserebersdorf – Seestadt”Exit to Congress Center: “Krieau”

BY CARGPS: 1020 Vienna, Ausstellungsstraße or Trabrennstraße

South: Südautobahn A2 – Südosttangente A23 in the direction of Praha/Brno – exit Handelskai/ Messezentrum

East (Vienna Airport): Ostautobahn A4 – Südost-tangente A23 in the direction of Praha/Brno – exit Handelskai/Messezentrum

North: Donauuferautobahn A22 until the exit of Reichsbrücke (direction Zentrum) – after the bridge turn left at the first traffic light into Vorgartenstraße and drive to the junction to Ausstellungsstraße

West: Westautobahn A1 until the motorway junction at Steinhäusl – Außenringautobahn A21 until the motor-way junction at Vösendorf – Südosttangente A23 in the direction of Praha/Brno – exit Handelskai/Messe-zentrum

mailto:mne2016%40mondial-congress.com?subject=mailto:exhibition%40mne2016.org?subject=http://www.messecongress.at

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Registration10

RegistrationThe registration area is located in the entrance level on the left hand side. The Mondial Congress & Events team as well as the congress hostesses will be pleased to help you with all inquiries regarding registration, congress materials and the social program. Please do not hesitate to approach the team members if there is anything they can do to make your stay more en-joyable.

OPENING HOURS

Monday, September 19, 2016 .....................17:00 – 19:00Tuesday, September 20, 2016 ................... 08:00 – 18:00Wednesday, September 21, 2016 ............. 08:00 – 18:00Thursday, September 22, 2016.................. 07:45 – 18:00Friday, September 23, 2016 ........................ 08:00 – 12:00

Registration CounterThe registration counter can be reached onsite through the following telephone number: +43 676 845 880 703

PRE-REGISTRATION COUNTER

For participants who are already registered. Please have the confirmation letters sent by Mondial Con-gress & Events close at hand. If you still have an out-standing payment you may settle your account in cash or by credit card (Visa, Mastercard, American Express, and Diners Club will be accepted). Please note, that payments will be accepted in EURO (€) only.

ON-SITE REGISTRATION COUNTER

For participants registering and paying their registration fees onsite: You will need to fill out an onsite regist-ration form. Payments will be accepted in cash or by credit card (Visa, Mastercard, American Express and Diners Club will be accepted). EURO (€) only.

ON-SITE REGISTRATION FEES

Standard attendee € 960,00

Student attendee* € 660,00

One day pass** € 410,00

Short Courses standard € 145,00

Short Courses student* € 95,00

Accompanying guest € 190,00

* Please note: This fee applies to undergraduate and graduate students (BSc, MSc and similar) and PhDs only (not Postdocs). Registrants must provide a copy of their student ID card when registering.

** one day pass does not include conference dinner on Wednesday, 21 September 2016

THE PARTICIPANTS‘ REGISTRATION FEE INCLUDES

\ the admission to all technical sessions and exhibition, \ conference program, \ the abstract booklet (and digital download), \ on-site lunches, refreshments and all social

events (including conference dinner)

Accompanying guest registration fee includes all social events (including the welcome reception at the conference venue on September 19 and conference dinner on September 21, 2016). Accompanying guest registration fee excludes the admission to all technical sessions and exhibition.

CONGRESS MATERIAL

Upon registration you will receive your registration documents and your congress bag.

Name BadgesParticipants will receive their name badges when collecting their congress materials. You are kindly requested to wear your name badge during all con-gress events. Please note that admission to scientific sessions is strictly restricted to participants wearing their badges. Accompanying persons are not entitled to attend the scientific sessions.

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General Congress Information 11

General Congress Information

CAR PARK

It is highly recommended to use public transportation. In case you wish to travel with your own car, please use garage A which cost EUR 3 for the first hour, and EUR 1,50 for each additional ½ hour. Parking tickets can be bought at the vending machine in the garage directly.

The surrounding area of Reed Messe Wien is charge-able parking zone from Monday – Friday, 9 a.m. – 10 p.m.

CAMERA AND FILMING POLICY

Please refrain from taking any photos or videos during any of the conference sessions and poster presenta-tions.

CELL PHONES AND ALARMS

As a courtesy to all participants, please ensure that all cell phones and other alarms (watches, pagers) are turned off during all presentations.

CERTIFICATE OF ATTENDANCE

Your Certificate of Attendance will be included in your congress materials available at the registration desk.

CLOAKROOM

A cloakroom and luggage storage facilities are availab-

le in the lower level of the conference center.

COFFEE BREAKS

Coffee during the indicated coffee breaks is included in the registration fee and will be served in the Exhibiti-on Area on the ground floor.

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General Congress Information12

CONGRESS LANGUAGE

The official language of the Congress is English. No simultaneous translation will be provided.

CONGRESS STAFF

The Mondial Congress & Events team members are present at the registration counter and congress hostesses are present in all lecture rooms as well as at the preview center and as badge monitors. Do not hesitate to approach them with queries – they will gladly assist you.

FIRST AID

In case of need, please contact the staff at the regist-ration desk.

LUNCH

A buffet lunch is included in the registration fee and will be served in the Exhibition Area on the ground floor. Lunch will be served from 12:30 – 13:30 from Tuesday to Thursday.

PAYMENT

Please note that all onsite payments should be made in cash or by credit card (Visa, Mastercard, American Express and Diners Club will be accepted). EURO (€) only.

Unfortunately, we cannot accept traveller’s cheques, other credit cards, Euro cheques or other currencies.

SMOKING

Thank you for not smoking inside the congress venue. Smoking areas are available outside the main entrance.

WIFI

WIFI is available in the congress center. Please use the following log-in:

\ Network: MNE2016 \ Password: to be provided at the conference

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General Information Vienna 13

General Information ViennaArt permeates Vienna’s very essence – get a feel of it during a city walking tour, or while visiting one of Vien-na’s many museums. Must-sees include the Kunsthis-torisches Museum, Albertina and the museums loca-ted in the trendy Museumsquartier (MQ). Sights not to be missed are St. Stephen’s Cathedral right in the heart of the city, Schönbrunn palace, and the Giant Ferris Wheel at the “Prater” fairground.

Fans of classical music and opera lovers may jump at a chance to spend an evening at the Staatsoper or the Musikverein. More modern fare can be found at Vien-na‘s jazz bars, world music pubs and dance clubs.

When it comes to food, you should definitely try famous Austrian dishes such as “Wiener Schnitzel” (breaded escalope of veal) or “Tafelspitz” (prime boiled beef). Your stay isn‘t complete without treating yourself to coffee and a slice of cake at one of Vienna’s many coffeehouses, or tasting some organic ice cream.

Some of the endless possibilities available to you in Vienna:

\ Find out if Lippizaners really are white \ Find out if the Danube really is blue \ Feel like a Royal on a “Fiaker” carriage tour \ Taste your way through the wide range of Viennese

pastries \ Test your nerves at one of the Prater’s many

attractions

Some of the few things you can‘t do in Vienna (but there really only are a few):

\ Go deep-sea diving \ Get an appointment at Sigmund Freud‘s (at least not

anymore) \ Get seriously bored

Useful information on Vienna as well as an event ca-lendar to be found online at http://www.wien.info/en.

CURRENCY/WEATHER/TIME ZONE

The official currency in Austria is EURO (€).Temperatures in Vienna in September usually range between 12 - 20°C by day, nights might be cool. Vienna is in the Central European Time Zone, one hour ahead of Greenwich Mean Time (GMT).

ELECTRICITY

The main voltage in Austria is 230V.Please do not forget to bring a travel adapter for the Austrian socket outlet. (230 V, 50 Hz)

PUBLIC TRANSPORTATION

The Viennese public transport network provides modern and efficient accessibility within the city limits, making it easy for the delegates to explore Vienna by bus, tram or metro. On weekends the metro operates the entire night with 7- to 15-minutes intervals.

The following tickets are available in Vienna:

1 direction EUR 2,20

24 Hours EUR 7,60

48 Hours EUR 13,30

72 Hours EUR 16,50

1 week EUR 16,20

EASY City Pass costs between EUR 14,90 to EUR 26,90 (24 Hours to 1 week). This pass includes all Viennese

http://www.wien.info/en

2016 VIENNA

General Information Vienna14

transportation services and authorizes you to visit mu-seums, theaters, restaurants and recreational facilities with discounted tickets.

For detailed information please have a look at the website: www.wienerlinien.at

MEDICAL SUPPORT

In case of need please call the emergency attendant at any registration desk in the entrance hall or alert the nearest staff.

PASSPORT AND VISA

Some delegates travelling to Austria may require a Visa. We suggest that applications for a Visa are made as early as possible, as waiting times can be several weeks. Special letters of invitation can be obtained from the Conference Organisers upon request by e-mail to [email protected] The Congress Secretariat is authorised to only issue Letters of Invitation to participants who have registered for the meeting and paid in full.

SHOPS

General Opening hours: Monday – Friday 09:00 – 19:00, Saturday 09:00 – 17:00.Please note that in Austria, most shops are closed on Sunday.

BANK AND EXCHANGE

Banking hours in general are Monday, Tuesday, Wednesday, Friday 08:00 – 12:30 and 13:30 – 15:00; Thursday 08:00-12:30 and 13:30-17:30.ATMs are located outside most banks, cash can be withdrawn there 24/7. National and foreign Maestro cards (cash cards) as well as Mastercard, AMEX, Visa and Diners are accepted.

TIPPING

Service is usually included in the prices in bars and restaurants. Tips are always welcome and usually 10% of the total amount.

USEFUL TELEPHONE NUMBERS

Ambulance: 144Fire Brigade:122Police: 133Taxi: +43 (0)1 31300 or +43 (0)1 40100 or +43 (0)1 60160

INSURANCE AND LIABILITY

The organisers cannot be held responsible for any personal injury, loss, damage or accident to private property, or for additional expenses incurred as a result of delays or changes in air, rail, road or other services, strikes, sickness, weather and other causes. All parti-cipants are encouraged to make their own arrange-ments for health and travel insurance.

http://www.wienerlinien.atmailto:mne2016%40mondial-congress.com?subject=

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Information for Speakers and Chairpersons 15

Notes:

Information for Speakers and Chairpersons

OPENING HOURS SPEAKERS’ PREVIEW CENTER

Monday, September 19, 2016 ..................... 17:00 – 19:00Tuesday, September 20, 2016 ....................07:30 – 17:00Wednesday, September 21, 2016 ..............08:00 – 17:00Thursday, September 22, 2016...................08:00 – 17:00Friday, September 23, 2016 ........................ 08:00 – 10:30

IF YOU ARE A CHAIRPERSON

\ Please locate your session room in due time. Please be at your session room at least 15 minutes prior to the start of the session.

\ We may remind you that speakers need to strictly observe the time schedule. Panelists should not speak before they are recognized by the chair and must first clearly state their name, institution and country of origin.

\ Please fill in the questionnaire which will be handed to you after the respective session.

INSTRUCTIONS FOR ORAL PRESENTERS

Oral presentation slots have 45 minutes for plenary talks (40 + 5 min for discussion), 30 minutes for invi-ted talks (25 + 5 min for discussion) and 15 minutes for contributed papers (12 + 3 min for discussion). Session Chairs will strictly demand these times in order to allow time for members of the audience to switch sessions between presentations.

An LCD projector & computer (Windows 7, MS Pow-erpoint 2010 & Adobe Acrobat X) will be available in every session room for regular presentations. Neither overhead projectors, 35mm slides projectors, VHS videotape player nor a DVD player will be available.

\ Please locate your session room in due time. Please be at your session room at least 15 minutes prior

to the start of the session. \ Speakers should deliver and view/check their

PowerPoint presentations at the Speakers’ Preview Center (Media lounge on the ground floor) at least 3 hours prior to the start of the respective session. For sessions starting at 08:30, the PowerPoint pre-sentations should be delivered the previous day. In order to avoid any delays, speakers are kindly requested to hand in their PowerPoint presentations on USB. If you bring your own laptop, the presenta-tion will be transferred onsite in the Preview Center.

If you wish to bring your own laptop, it is crucial to make this known in the Preview Center three hours in advance for organisational reasons.

Speakers are not permitted to take PowerPoint pre-sentations directly to the technical assistant in the session rooms.

Rest assured that your files will be deleted from the congress server after your presentation.

INSTRUCTIONS FOR POSTER PRESENTERS

\ There are three poster sessions on Tuesday, Wed-nesday, and Thursday.

\ Posters should be mounted on Monday after regis-tration or on Tuesday morning. All posters will be displayed during the entire conference.

\ Poster size is A0 portrait (84 cm wide, 119 cm high). Material for mounting the posters will be supplied. The size specification must be strictly adhered to in preparation of your poster.

\ Posters should be removed by Friday, September 23, 2016, 11 am. Posters that are not removed by that time risk to be destroyed and dumped.

\ The floor plan of MNE 2016 including the poster area can be found on pages 175 & 188.

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Scientific Program Information16

Scientific Program Information

MANUSCRIPTS

Manuscripts associated with MNE 2016 can be submit-ted for publication in four Special Issues of the Journal of Microelectronic Engineering (Elsevier) to appear in 2017 (submission deadline October 14, 2016). Informa-tion for authors can be found here: http://mne2016.org/abstractspapers/publications/

PREVIEW CENTER

The Preview Center is located opposite to the registra-tion counter at the entrance level.Staff and equipment will be available for you to arran-ge and preview your PowerPoint presentation.Please find more detailed information on page 15.

SCIENTIFIC POSTER AREA

All Scientific Posters can be viewed throughout the congress in the exhibition area on the ground floor. A poster index can be found on page 95.

There are three poster sessions on Tuesday, Wednes-day, and Thursday. At the indicated day, the author should be present during the poster session for discus-sions.

SHORT COURSES

Short courses will be offered on Monday, September 19 with the following topics:

Multiscale Simulation: From nano to macro – from models to devicesThe design and development of nano- and microde-vices go together with accurate computer models of materials, properties, and functions. Simulations need to be multiscale, accurate over a range of length scales, and must take into account the appropriate physics at each scale. As new materials and new fun-ctions come into play in micro- and nanoengineering, multiscale simulation methods are essential for fast progress in the near future. Novel functionalities, novel

physical aspects can be incorporated into multiphysics models that treat the variety of physical phenomena acting at the same time.  With decreasing feature sizes, device modelling becomes more and more interwo-ven with material modelling. For the accurate predic-tion of function and performance of nano- and micro devices we need to solve problems where multiple time and length scales are coupled.

By its very nature, multiscale simulation is interdis-ciplinary. Simulation strategies for novel nano- and micro-scale based devices and circuits must com-bine methods spanning a wide range of disciplines including chemistry, material sciences, physics and engineering. The short courses bring together experts from different fields who will show how multi scale modelling approach contributes to device design in nano- and microelectronics, magnetic sensors, nanofabrication, and polymer based systems.

SPECIAL SESSION

On Thursday, September 22, 2016 the special session “Single Nanometer Manufacturing – SNM” (EU-FP7 project) will be held in parallel to the poster session and is open to all MNE attendees.

KEY TO SESSIONS/PAPER NUMBERS

The program has been divided into four clusters (A, B, C and D), and subdivided into sessions (1, 2, 3, etc.). For example: A5 means session 5 in cluster A. An oral contribution will be indicated in the program as Cluster-Session#-presentation# (eg. A7-1-3 is the 3rd contribution in Session A7-1).

The plenary sessions and keynote lectures are indica-ted in the program as such.

The posters are grouped according to the clusters A, B, C, and D. In the program a poster will be indicated as Day-Cluster-number, for instance Wed-C2-169 indicates poster number 169 which will be presented in the C2 Cluster on Wednesday.

http://mne2016.org/abstractspapers/publications/

www.mne2016.org

Plenary Speakers 17

Plenary Speakers

Tuesday, 20 September 2016 Emerging Memory: From Technology to Applications

09:00 – 09:45 Dave Egglestone STRAUSS GLOBALFOUNDRIES, Santa Clara, CA, USA

A once-in-a-generation shift in low power computing architecture is on the horizon, with the commercialization of new memory technologies. These emerging memories (MRAM, RRAM, PCRAM, 3D Xpoint) have been long awaited, because of their promise of an ideal combination of speed, endurance, persistence and energy efficiency.The speaker will lead the audience though a detailed analysis of emerging embedded memories and their application in systems. The speaker will spe-cifically focus on the promise, versatility, and nano-fabrication demands of eMRAM technology. Finally, the speaker will discuss how GLOBALFOUND-RIES is well positioned for SOC designers to capitalize on these future opportunities.

Tuesday, 20 September 2016 Carbon-based Materials as Key-Enabler for “More-than-Moore“ Devices

09:45 – 10:30 Franz Kreupl STRAUSS Technical University Munich, Faculty of Electrical Engineering and Informati-

on Technology, Department of Hybrid Electronic Systems, Munich, Germany

The talk will assess carbon-based materials like nanotubes and graphene in possible “More-than-Moore” applications. The requirements for the use in future transistor devices and interconnects is reviewed and the discussion is extended to applications which are not ultimately scaled to the smallest size. We show the application of graphenic carbon, which requires a high tempe-rature budget for the deposition, in capacitors, diodes, through-silicon vias, novel non-volatile memories and sensors. The use of graphenic carbon as a hermitically tight x-ray transmission window is facilitated by its high mecha-nical resilience and has been demonstrated recently for the first time.

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Plenary Speakers18

Wednesday, 21 September 2016 Micro Electro Mechanical Systems — Technology and Applications

08:30 – 09:15 Nico de Rooij STRAUSS Prof. em., Institute of Microengineering, EPFL, Neuchatel, and Vice-President

at CSEM SA, Switzerland

The continuous progress in micro- and nanofabrication technologies for the manufacturing of Micro Electro Mechanical Systems or MEMS has allowed the successful development of many innovative products used in our daily life. In this paper an overview will be given of various micro- and nanofab-rication process technologies, including Deep Reactive Ion Etching (DRIE), thick photo resist processing and plating. The possibilities and limits of these selected fabrication processes will be illustrated with examples of MEMS including their applications.

Wednesday, 21 September 2016 Self-Powered Health and Environmental Monitoring for Wellness

09:30 – 10:15 Veena Misra STRAUSS NSF ASSIST Nanosystems Center and Department of Electrical Engineering,

North Carolina State University, Raleigh, NC

Self-powered wearable sensor systems can enable long-term sensing and effective management of chronic conditions, sensing of personal exposure to air pollutants and toxins and provide longitudinal studies that can provide new insight into correlation of various health and environmental parame-ters. Such sensor systems can empower patients and providers to manage wellness instead of managing illness, assist in effective treatment of at-risk elderly, reinforce healthy lifestyles, and provide new tools for long-term environmental exposure health studies. Recent advances in nanomaterials, nanostructures, and nanodevices have increased efficiency of energy har-vesters, lowered energy per computational bit, increased capacitor storage density, and enhanced nanosensor efficiency making a self-powered system finally realizable. I will discuss the challenges in technology development, including energy harvesting, ultra low power radios and durability, needed to realize these sensor systems and explore the role that data will play in making these systems effective for both the patient and the provider.

Thursday, 22 September 2016 Nanoimprint System Development and Status for High Volume

08:00 – 08:45 Semiconductor Manufacturing STRAUSS Takehiko Iwanaga Canon Inc., Japan

Jet and Flash Imprint Lithography (J-FIL) has been in development for the past decade to meet the several requirements for semiconductor manu-facturing. The purpose of this presentation is to describe the technology advancements made and introduce the new imprint systems that will be applied for the fabrication of advanced devices such as NAND Flash memory and DRAM. In particular, we will announce a cluster tool designed to meet both the technical and cost of ownership requirements of semiconductor manufacturing. Finally, we will show Canon’s overlay roadmap as well as new technologies designed to address higher order distortions.

www.mne2016.org

Plenary Speakers 19

Thursday, 22 September 2016 Gel-technology in microfluidics and biochips

08:45 – 09:30 Michiel Vellekoop STRAUSS Institute for Microsensors, -Actuators and -Systems, IMSAS, University of

Bremen, Germany

In recent years, polymeric hydrogels have gained major interest for applica-tion in microfluidics devices and biochips. The availability of a range of gels and the structuring possibilities of it on the micro-level make it an attractive material for the realization of new on-chip functions such as mechanical filters, diffusive barriers, biochemical reactors, or cell biosensors. In the presentation, an introduction to the topic, general aspects of fabrication technologies, and illustrative examples will be discussed.

Friday, 23 September 2016 Chips-in-Organs & Organs-on-a-Chip

10:30 – 11:15 Peter Ertl STRAUSS Vienna University of Technology, Faculty of Chemistry, Austria

The application of biochip technology for medical research has the potential of generating new diagnostic tools to help improve our understanding of the functioning of the human body. The global trend towards more eviden-ce-based medicine, closed-meshed clinical diagnostic strategies and perso-nalized therapies has therefore pushed the development of advanced in vivo and in vitro microsystems including implantable biosensors and organ-on-a-chip technology. For instance, an important strategy of medical therapies involves repeated follow-up examination using a variety of in vivo imaging technologies and in vitro assessment of biopsies. In the presentation novel approaches and technologies are introduced that are expected to provide a deeper understanding of in vivo bone regeneration and organ transplant rejection processes using implantable titanium dioxide-coated bioimpedan-ce sensors. Additionally, three organ-on-a-chip systems are presented with the aim of studying the biological aspects of (i) the placenta barrier integrity under high blood pressure conditions, (ii) inflammatory reactions at the joing during rheumatic arthritis and (iii) neural degeneration rates in the midbrain to monitor the onset and progression Parkinson’s diseases.

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Invited Speakers20

Invited SpeakersJens Bolten, AMO GmbH, Germany Definition of sub-20nm nanowire structures featuring well-defined sidewall modulations

Wednesday, 21 September 2016 13:30 – 14:00 STOLZ

Margaret Costa, INL, Portugal Scanning magnetoresistance microscopy enabled by AFM cantilevers with integrated magnetic sensors

Tuesday, 20 September 2016 13:30 – 14:00 STRAUSS

Gioia Della Giustina, University of Padova, Italy Engineering of hydrogel materials for 3D printing

Thursday, 22 September 2016 14:30 – 15:00 SCHUBERT

Emma Desvignes, LAAS-CNRS, France Microchannels equiped with force sensors for the in-vestigation of the mechanical forces exerted by living cells during migration

Thursday, 22 September 2016 12:00 – 12:30 SCHUBERT

Scott Dhuey, Lawrence Berkeley National Lab, US Fabrication of 3 Dimensional Photonic Crystals with Waveguides for Visible Light

Friday, 23 September 2016 09:30 – 10:00 SCHUBERT

Junqing Fan, University of Southampton, UK Resistive memories using Cu nanoparticles embedded amorphous SiC

Thursday, 22 September 2016 13:30 – 14:00 STRAUSS

Ricardo Garcia, Superior de Investigaciones Científicas, Spain Advanced scanning probe lithography for nanopatter-ning and nanoelectronics

Wednesday, 21 September 2016 12:00 – 12:30 STOLZ

Elektra Gizeli, IMBB – FORTH, Greece Acoustic devices for molecular diagnostics and point-of-care applications

Tuesday, 20 September 2016 11:30 – 12:00 STOLZ

Borislav Hinkov, TU Vienna, Austria A monolithically integrated mid-infrared lab-on-a-chip

Tuesday, 20 September 2016 15:30 – 16:00 STOLZ

Anton Köck, Materials Center Leoben MCL, Austria Nanosensor devices for multi gas detection – aspects of CMOS and smart system integration

Thursday, 22 September 2016 16:00 – 16:30 SCHUBERT

Richard Koops, VSL Dutch Metrology Institute, The Netherlands Metrology for single nanometer manufacturing

Tuesday, 20 September 2016 14:30 – 15:00 SCHUBERT

Bruno Lee Sang, Université de Sherbrooke, Canada CMOS BEOL compatible process for the fabrication of single electron transistors, using TiN/Al2O3/TiN junctions

Thursday, 22 September 2016 10:30 – 11:00 STRAUSS

J. Alexander Liddle, National Institute of Standards and Technology, USA The Nanolithography Toolbox

Friday, 23 September 2016 08:30 – 09:00 STOLZ

Michael Mühlberger, PROFACTOR GmbH, Austria Nanoimprint and additive manufacturing – a vision

Thursday, 22 September 2016 14:30 – 15:00 STOLZ

Swathi Murthy, Technical University of Denmark Systematic study of high throughput fabrication of nano holes and nano pillars in polymer foils by roll-to-roll-extrusion coating

Tuesday, 20 September 2016 12:00 – 12:30 SCHUBERT

Bart Schurink, University of Twente, The Netherlands Microsieve electrode array (µSEA): fabrication and characterization

Wednesday, 21 September 2016 14:30 – 15:00 SCHUBERT

www.mne2016.org

Awards 21

Awards

MNE FELLOW AWARD 2016

To promote micro- and nano-engineering in Europe, the MNE Steering Commit-tee recognizes a researcher or engineer every year who has made outstanding contributions to fields addressed by the MNE conference. The aim is to honor a researcher or engineer who has strong research roots in Europe by having worked in Europe for an important part of his/her career. The successful candidate must have inspired the MNE community by his/her leadership or outstanding work. This could, for example, be through leadership in the successful development and commercialization of a technology, the pioneering of a method or development of a tool with significant impact on current research or manufacturing methods, or an outstanding invention.

This year’s price will be conferred to Prof. Nico de Rooij a pioneer in MEMS and sensor technology, professor emeritus at the EPFL Lausan-ne and Vice-President at CSEM SA.

The award ceremony will take place on Wednesday, September 21 at 09:15 in room Strauss.

In previous years the MNE Fellow Award was bestowed to:

\ Dr. Haroon Ahmed from University of Cambridge (founder of Microengineering conference, which became the Micro & Nanoengineering conference) at MNE 2003, Cambridge

\ Dr. Peter Vettiger from IBM Research – Zurich at MNE 2005, Vienna \ Dr. Mike Hatzakis from NCSR Demokritos Athens at MNE 2006, Barcelona \ Dr. Bruno Murari from ST Microelectronics at MNE 2010, Genoa \ Dr. Luc Van den Hove from IMEC at MNE 2011, Berlin \ Dr. Hans Löschner from IMS Nanofabrication AG in Austria at MNE 2012, Tou-

louse \ Prof. Dr. Dieter Kern from the University of Tübingen at MNE 2014, Lausanne \ Dr. Emile van der Drift from Technical University of Delft at MNE 2015, The

Hague

Sponsored by ecoplus, the Business Agency

of Lower Austria – Technopol- Program

2016 VIENNA

Awards22

YOUNG INVESTIGATOR AWARD 2016

Honoring and Promoting a Young researcher active in the fields of Nanofabricati-on and Nanotechnology for Electronics, MEMS and Life Sciences

Microelectronic Engineering (MEE)  is proud to continue the series of Young Investigator Awards and MEE Lectureships for a third year. The Lectureship will be presented on Wednesday, September 21, at 10:45 in room Strauss.

The top 5 finalists for the 2016 award are:

\ Ravinder Dahiya, Reader, School of Engineering, Glasgow University, UK\ Mario Lanza, Professor, Institute of Functional Nano & Soft Materials, Soochow

University, China\ Jacopo Franco, Researcher, IMEC, Belgium\ Alessandro Chiolerio, Researcher, Center for Space Human Robotics, IIT, Torino,

Italy\ Aline Cerf, Researcher, NanoBioSystems group, LAAS-CNRS, France

And the award winner is Professor Ravinder Dahiya, Reader, School of Engineering, Glasgow University, UK, http://rsdahiya.com/ , for outstanding contributions in the fields of flexible electronics and sensing.

Elsevier and the members of the committee warmly congratulate the finalists and the award winner for their outstanding contributions.

BEST POSTER COMPETITION

Prizes (sponsored by Raith GmbH) will be awarded to the best poster in each of the four clusters A, B, C, and D. The posters will be judged on visual impact, design and scientific content. The judges will be drawn from the international steering committee and the local program committee. The four winners will be presented with their prizes and a commemorative certificate on Thursday, September 22, 2016 at 9.30 a.m in Room Strauss.

MICRO-& NANO-GRAPH CONTEST 2016

Once again there will be a contest of the most strange and most beautiful Micro- & Nano-graphs. The graphs will be shown during the poster sessions and at-tendees can choose their favourite image. The voting ballot can be found in your registration documents. Write down the entry number of your favourite Micro- or Nano-graph and put the ballot in the ballot box at the registration desk.

On Thursday, September 22, 2016 at 9.30 a.m in Room Strauss, John Randall from Zyvex will announce the winner of the best Micro- or Nano-art work.

Sponsored by:

Sponsored by:

Sponsored by:

http://rsdahiya.com/

www.mne2016.org

Social Program 23

Social Program

WELCOME RECEPTION

Monday, 19 September 2016

On Monday, September 19 from 5 to 7 pm, we cordially invite you to the welcome reception at the conference venue. You may register to the conference and then have a free welcome drink/snack together with your colleagues or visit the exhibiti-on for the first time.

MNE NETWORKING “HEURIGEN” EVENING (CONFERENCE DINNER)

Wednesday, 21 September 2016

The conference dinner will take place at the “Heurigen” Fuhrgassl-Huber. Spend a nice evening with your colleagues at a traditional Viennese “Heurigen” wine tavern, tasting wine produced from the surrounding vineyards. In the picturesque village of “Neustift im Walde”, a district in the city of Vienna, experience a very typical Aus-trian summer evening tradition: Enjoying a glass of local wine together with rustic food in an authentic “Heurigen” atmosphere while being surrounded by vineyards.

One ticket is included in the registration fee; however pre-registration is required. A shuttle service from the congress center to Fuhrgassl-Huber will be provided.

Sponsored by:

Sponsored by:

2016 VIENNA

Social Program24

YOUNG PEOPLE PARTY TIME

Thursday, 22 September 2016

All participants are invited to the MNE party which will take place at the Praterdome, Riesenradplatz 7, 1020 Vienna, from 10:00 pm on.

Two levels with four dance floors and twelve theme bars in total offer something for everyone. The music also caters to every preference: from house, technotrance, R’n’B and soul to songs of the 70’s, 90’s as well as salsa and latino. A special highlight at Praterdome is the sensational midnight opening: Accompanied by a spectacular laser show, the moveable walls turn the two main dance floors into a huge dancing palace.

Show your name badge and you will receive free entrance and a glass of prosecco until midnight.

SIGHTSEEING OPPORTUNITIES

Whether this is your first visit to Vienna or you have been here before – this city always finds ways to surprise and delight you. Just take in its atmosphere, which is rich in history and tradition, yet also fresh and upbeat.

The Viennese city center is a small universe in itself: discover historical palaces face to face with modern facades, elegant boutiques next to popular fashion stores and antique shops lining up across from stylish designer hotspots.

The MNE registration desk offers you and your companion opportunities of sightse-eing in Vienna and provides useful hints of unique possibilities. Some of the historic and architectural highlights are:

\ Stephansdom (National Cathedral)\ Schönbrunn Palace, Gardens & Zoo\ Kunsthistorisches Museum (Art History)

Please ask for more information at our reception desk or browse the internet for more, e.g. on:

http://www.tourmycountry.com/austria/vienna.htm https://www.wien.info/en

CITY TOURS & TOURIST INFORMATION

Vienna Tourist Info Albertinaplatz/Maysedergasse 1010 Vienna, AustriaTel.: +43 1 245 55Website: www.wien.infoOpening Hours: daily 09:00 – 19:00

Available Services:\ Ticket Shop (discount for different theaters)\ General city maps, brochures\ Event tips and day trips\ Vienna Card

http://www.tourmycountry.com/austria/vienna.htmhttps://www.wien.info/enhttp://www.wien.info

www.mne2016.org

Social Program 25

2016 VIENNA

Program at a Glance26

Program at a Glance

TUESDAY MORNING 20 SEPTEMBER 2016

08:30 Opening

09:00Dave Egglestone

Emerging Memory: From Technology to Applications

09:45Franz Kreupl

Carbon-based Materials as Key-Enabler for “More-than-Moore“ Devices

10:30 10:30 – 11:00 Break / Coffee / Exhibition

STOLZ SCHUBERTSTRAUSS

C11.1 Applications 1 – sensors Chair: Victor Cadarso

D6 Applications Chair: Luigi Sasso

B1 Pattern transfer Chair: Rafael Taboryski

11:00C11-1-inv

Nanosensor Devices for Multi Gas Detection – Aspects of CMOS and

Smart System IntegrationAnton Köck et al.

D6-1-1 Light-triggered In Situ Formation of Multifunctional Silk Fibroin Hydrogel System for Synergistic Photothermal

Chemotherapy of Breast CancerLing-Chu Yang et al.

B1-1-1 High Resolution Printed Patterning by

250mm Wide Seamless Roller Mold with Sub-micron Pattern

Naoto Ito et al.

11:15

D6-1-2 Flexible electrodes for micro-

electromyographyEnrique Escobedo-Cousin et al.

B1-1-2 High aspect ratio metal gratings by casting into microstructured silicon

template Lucia Romano et al.

11:30

C11-1-1 Micro fabricated all

optical pressure sensorAndreas Havreland et al. D6-1-inv

Acoustic devices for molecular diagnostics and point-of-care

applicationsElectra Gizeli et al.

B1-1-3 A damascene process for gold

micro- and nano-structures Mouawad MERHEJ et al.

11:45

C11-1-2 Piezo- and Flexoelectricity in AlN-based Flexible MEMS for

Tactile ApplicationsVincenzo Mariano Mastronardi et al.

B1-1-4 Top-down Fabrication of (111)-Silicon Nanowire Arrays for Flexible Field-Ef-fect Transistors Achieving Large-Scale

Integrated Electronic CircuitsSangmin Lee et al.

12:00

C11-1-3 Sub-wavelength slit and plasmonic

grating integration in Ge-based metal-semiconductor-metal photo-

detectors for sensing applicationMario Lodari et al.

D6-1-3 Nanoimprinted quasi 3D

Nanosquares to Detect Low Cell Concentration

Stella Pang et al.B1-1-inv

Systematic study of high through-put fabrication of nano holes and

nano pillars in polymer foils by roll-to-roll-extrusion coating

Swathi Murthy et al.12:15

C11-1-4 Fabrication of Hollow-Gold-Nano-particle/Spin-On-Glass Composite Thin Film with Ultrahigh Broadband Absorbance for Novel Silicon-based

PhotodetectorLing-Chu Yang et al.

D6-1-4 Sample Preparation lab on-Chip for Detection of Foodborne Pathogens

Katerina Tsougeni et al.

12:30 – 13:30 Lunch

p. 35 p. 37 p. 39

p. 35 p. 39

p. 37 p. 38

p. 34

p. 34

p. 34

p. 36 p. 38 p. 40

p. 36 p. 38

p. 36 p. 38 p. 40

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www.mne2016.org

Program at a Glance 27

TUESDAY AFTERNOON 20 SEPTEMBER 2016

STRAUSS STOLZ SCHUBERT

C1.1 MEMS / NEMS 1 – actuation Chair: Andris Sternberg

A4.1 Soft lithography 1 Chair: Steve Lenk

B7 (Nano-) Metrology Chair: Monika Fleischer

13:30 C1-1-inv Scanning magnetoresistance microscopy enabled by AFM cantilevers with integrated

magnetic sensorsMargaret Costa et al.

A4-1-1 A Cost-Efficient Fabrication

Method of Dissolvable Micro-needle for Drug Delivery

Xu Wang et al.

B7-1-1 Nanometer-resolution, wide-field

optical measurement of time-varying sub-micron fluid film thicknesses for

viscosity determinationHannah Gramling et al.

13:45

A4-1-2 Nanoimprint Lithography of T-shaped

NanostructuresMichael Mühlberger et al.

B7-1-2 Quantitative DC-free Kelvin Probe

Force MicroscopyDominik Kohl et al.

14:00

C1-1-1 Cantilever array with optomechanical read-out and integrated actuation for

scanning probe microscopyThomas Michels et al.

A4-1-3 Fabrication of high aspect ratio and sub-5 µm wide patterns by capillary

force assisted printing through a thermal imprinting process

Ryohei Hokari et al.

B7-1-3 Doped nanodiamonds and their application for nanoelectronics

sensing applicationsThomas Hantschel et al.

14:15

C1-1-2 A Flexible Two Dimensional Force

Mapping Sensor Using PDMS Nanocomposite

Jin-Woo Choi et al.

A4-1-4 Nanoimprint lithography as a new

tool for cavity-resonator-integrated guided-mode resonance filter

fabricationSylvain Augé et al.

B7-1-4 Dopant profiling in the scanning

helium ion microscope Augustus Chee et al.

14:30

C1-1-3 MEMS magnetic field modulators for

ultra-low DC field detectionRosana Dias et al.

A4-1-5 Vacuum ultraviolet light assisted

nano-pattern transfer to fabricate nanostructure with heterogeneous

materialsYuki Hashimoto et al.

B7-1-inv Metrology for single nanometer

manufacturingRichard Koops et al.

14:45

C1-1-4 Toward high sensitivity of SAW

gyroscope by using floating thin piezo membraneKeekeun Lee et al.

A4-1-6 An etch-free fabrication of uniform,

ordered, micro- and nanoscale through-hole membraneHim Cheng Wong et al.

15:00 – 15:30 Break / Coffee / Exhibition

C6 Device and system modelling Chair: Thomas Schrefl

D2 Lab-on-a-Chip Chair: Silvan Schmid

B2 Plasma etching Chair: Sandra Wolff

15:30

C6-1-1 Experimental and finite element

investigations of nano metal-semi-conductor contacts Moh‘d Rezeq et al.

D2-1-inv A monolithically integrated mid-

infrared lab-on-a-chipBorislav Hinkov et al.

B2-1-1 A monolithic micro-optical

interferometer etched into fused silica Martin Hoffmann et al.

15:45

C6-1-2 Characterization of Thermal-

Piezoresistive MEMS Resonators for Sensing ApplicationsCláudia Coelho et al.

B2-1-2 Deep plasma etching of Parylene C patterns for biomedical applications

Aurélie Lecestre et al.

16:00

C6-1-3 Exploring an improvement SET-FET hybrid behavior by using different

FET typesEsteve Amat et al.

D2-1-1 Integrated hollow microneedle-

optofluidic biosensor for minimally-invasive low-volume

therapeutic drug detection Victor J. Cadarso et al.

B2-1-3 Optical emission monitoring for

optimisation of atomic layer etch (ALE) processes

Andy Goodyear et al.

16:15

C6-1-4 Performance Simulation of InP HEMTs

With 10 nm T Shape GatesJianan Deng et al.

D2-1-2 UV-NIL of a water-soluble resist for

nano-patterning of proteinsMarco Lindner et al.

B2-1-4 Process induced poling and plasma

induced damage of thin film PZTJiahui Wang et al.

16:30 – 18:00 Exhibition / Poster Session

p. 41 p. 43 p. 45

p. 42 p. 45

p. 41 p. 43 p. 45

p. 42 p. 44 p. 46

p. 42 p. 44

p. 42 p. 44 p. 46

p. 46 p. 49

p. 47 p. 48 p. 49

p. 47

p. 48

p. 50

p. 47

p. 48

p. 50

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2016 VIENNA

Program at a Glance28

WEDNESDAY MORNING 21 SEPTEMBER 2016

08:30Nico de Rooij

Micro Electro Mechanical Systems — Technology and Applications

09:15 MNE Fellow Award + MEE YI Award

09:30Veena Misra

Self-Powered Health and Environmental Monitoring for Wellness

10:15 10:15 – 10:45 Break / Coffee / Exhibition

STRAUSS STOLZ SCHUBERT

Young Investigator Award lecture Chair: Stephan Sylvest Keller

A7 Tip based patterning Chair: Jens Gobrecht

D4 Micro / Nanofluidics for bio / life sciences

Chair: Electra Gizeli

10:45

Flexible Electronics – From

Nanostructures to Large Area SystemRavinder Dahiya

A7-1-1 Devices with sub15 nm features

fabricated with thermal scanning probe lithographyMartin Spieser et al.

D4-1-1 Bumping Dynamics of

Bacteria and Blood Cells in Asymmetric Deterministic Lateral

Displacement DevicesKeith Morton et al.

11:00

A7-1-2 Fowler-Nordheim electron emission

simulations in scanning probe lithography using active cantilever

Steve Lenk et al.

D4-1-2 Cell rheology in microfluidic

perfusion: computational and experimental approach

Markus Gusenbauer et al.

11:15

A7-1-3 Thermal scanning probe lithography

on a glassy supramolecular film creates a combination of topography

and fluorescent nanostructuresSamuel Zimmermann et al.

D4-1-3 Microfluidic traps for droplet-cell

pairing and adhesion studiesJacques Fattaccioli et al.

11:30

A7-1-4 Expanding the Scale of Atomically

Precise STM LithographyJames Owen et al.

D4-1-4 Photothermal assembling of bacteria for rapid counting

Takuya Iida et al.

11:45

A7-1-5 High-aspect ratio nanopatterning

via combined thermal scanning probe lithography and dry etching

Yuliya Lisunova et al.

D4-1-5 Concentrate exosome using ion

depletion zone in microfluidic deviceKei Hayashida et al.

12:00

A7-1-inv Advanced Scanning Probe

Lithography for nanopatterning and nanoelectronics

Ricardo Garcia et al.

D4-1-6 A novel control system for

concentration of bio-substances by utilizing combination technique of ion concentration polarization and

electrophoresisKatsuo Mogi et al.

12:15

D4-1-7 Large-scale and multiplex

biopatterning combining automated microfluidic inking and micro-contact

printingJulie Foncy et al.

12:30 12:30 – 13:30 Lunch

p. 54 p. 52

p. 54 p. 52 p. 52

p. 55 p. 53

p. 55 p. 53

p. 56 p. 54

p. 56

p. 56 p. 54

p. 51

p. 51

p. 51

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