30 nm © 2005 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice Atomic Switch ITRS Emerging Research Devices Philip Kuekes Hewlett-Packard Labs
Mar 27, 2015
30 nm
© 2005 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice
Atomic SwitchITRS
Emerging Research Devices
Philip Kuekes Hewlett-Packard Labs
2
Ionic and electronic switching • thermal, electrical or ion-migration-induced
switching mechanisms• Nanoionics-based resistive switching
memories
Rainer Waser & Masakazu Aono
Nat Mater. 2007 Nov ;6 (11):833-40
3
Ionic and electronic switching
• cation-migration • electrochemical growth and dissolution of
metallic filaments
4
Ionic and electronic switching
• anion-migration • transition metal oxides• electronically conducting paths of sub-
oxides• Schottky barrier
5
Pt PtTiO2 TiO2-x
3 nm
2 n
mIonic and electronic switching
We used to think about fixed semiconductor structure and only electronic motion.
Now we have ionic motion that dynamically modulates the semiconductor structure that controls the electronic current.
Diodes needed in ON state!
6
1. Nano-device switching is due to TiOx
2. TiOx switching is controlled by oxygen vacancy distribution- TiOx is a semiconductor doped by oxygen vacancies- charged oxygen vacancies drift under high field- deliberate placement of oxygen vacancies can engineer the switching- electroforming is a critical device step
3. Dynamic theory of oxygen vacancy drift fits experiment- oxygen vacancy distribution controls electron conductivity- vacancy drift modulates junction conductance- fundamental memristor theory matches experiment- detailed dynamics are highly nonlinear
4. New circuits enabled by these nano-switches- NVRAM- adaptive signal conditioning- adaptive intelligent machines
Metal/TiOx/Metal Device Physics
7
50 nanometer Pt/TiOx/Pt devices
-200
-100
0
100
200
Cur
rent
( u
A )
-2 -1 0 1 2Voltage ( V )
4
2
0Cur
rent
( n
A )
-2 -1 0 1 2Voltage ( V )
a
b
Virgin I-V
c
50 nm hp
+V pushOV vacancies
-V attractOV vacancies
10-3
10-6
10-9
-1 0 1
Pt
Pt
TiO2
TiOxV+
-
Switching I-V
TiOx
Pt
TiO2
Pt
page 8
< 50 nanosecond Pt/TiOx/Pt devices
-15
-10
-5
0
5
10
15
Curre
nt (1
0-3
A)
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0Junction Voltage (V)
t = 36 ns
t = 1 us
9
What is TiO2-x ?2 – TiOx controlled by oxygen vacancies
rutile TiO2
3.0/3.2 eV semiconductor
TiO2-x : x ~ 10-3 – 10-2
dopants all ionized Ei < 0.1 eV
oxygen vacancies VO2+ @ low T < 800C & high P(O2)
and Ti interstitials Tii4+ @ high T > 1000C & low P(O2):
creation ~ 3-5 eVdiffusion ~ 0.7 - 1.1 eVmobility ~ 10-10 – 10-14 cm2/Vs
10
Voltage (V)Voltage (V)
Vacancies control electrical symmetry!
30
20
10
x10-9
-1.0 -0.5 0.0 0.5 1.0
15
10
5
0
-5
x10
-3
-2.0 -1.0 0.0 1.0
I
Cu
rre
nt
(nA
)C
urr
en
t (m
A) I’
b
a
-30
-25
-20
-15
-10
-5
0
x10-9
1.00.50.0-0.5-1.0
-20
-10
0
10
x10
-3
2.01.00.0-1.0
IIC
urr
en
t (n
A)
Cu
rre
nt
(mA
) II’
e
d
TiOx
Pt
TiO2
Pt
TiO2
Pt
TiOx
Pt
7 n
m7
nm
11
-1.0
-0.5
0.0
0.5
1.0
x10
-3
1.00.50.0-0.5-1.0
15
10
5
0
-5
x10
-3
-2.0 -1.0 0.0 1.0-20
-10
0
10
x10
-3
2.01.00.0-1.0
-60
-40
-20
0
x10-6
-1.0 -0.5 0.0 0.5 1.0
Vacancies control electrical symmetry!
30
20
10
x10-9
-1.0 -0.5 0.0 0.5 1.0
I
Cu
rre
nt
(nA
)C
urr
en
t (m
A)
Voltage (V)
Cu
rre
nt
(mA
)
I’
IB
b
c
a
TiO2Ti
TiOxPt
Pt
-30
-25
-20
-15
-10
-5
0
x10-9
1.00.50.0-0.5-1.0
IIC
urr
en
t (n
A)
Cu
rre
nt
(mA
)
Voltage (V)
Cu
rre
nt
(uA
)
II’
IIB
TiOxTi
TiO2Pt
Pt
e
f
d
TiOx
Pt
TiO2
Pt
TiO2
Pt
TiOx
Pt
7 n
m7
nm
5 n
m
12
Schottky barrier switching via oxygen vacancy drift
TiOx
Pt
TiO2
Pt
7 n
m7
nm
TiO
2P
t
w
Φb
TiO
2P
t
w
Φb
TiO
X
-20
-10
0
10
x10
-3
2.01.00.0-1.0
Cu
rre
nt
(mA
)
II’
-20
-10
0
10
x10
-3
2.01.00.0-1.0
Cu
rre
nt
(mA
)
II’
page 13
Pt PtTiO2 TiO2-x
3 nm
2 n
m
O vacancy drift model for TiOx switch
Pt PtTiO2 TiO2-x
oxidizedreduced
As fabricated, the oxide has a highly resistive TiO2 region and a conductive TiO2-x region that is highly doped with O vacancies, which are positively charged.
When a positive bias voltage is applied to electrode 2, the positively charged O vacancies drift to the left, which narrows the tunneling gap.
3 – Theory of vacancy drift fits experiment
page 14
O vacancy drift model for TiOx switch
page 15
O vacancy drift model for TiOx switch
L
undoped
wV
doped
A
-4
-2
0
2
4
Curre
nt (m
A)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5Voltage (V)
-1
0
1
volta
ge
1.61.20.80.40.0 x101
1.0
0.5
0.0
w/L
1.61.20.80.40.0time (×10
3)
-1.0
-0.5
0.0
0.5
1.0
curre
nt
-1.0 -0.5 0.0 0.5 1.0voltage
ROFF/RON = 50v0 = 4 V
-4
-2
0
2
4
Curre
nt (m
A)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5Voltage (V)
123
45
6
7
8
9
10
17
PtTiPt
PtTiPt
Expt Expt
16
1. Nano-device switching is due to TiOx
2. TiOx switching is controlled by oxygen vacancy distribution- TiOx is a semiconductor doped by oxygen vacancies- charged oxygen vacancies drift under high field- deliberate placement of oxygen vacancies can engineer the switching-> electroforming is a critical device step
3. Dynamic theory of oxygen vacancy drift fits experiment- oxygen vacancy distribution controls electron conductivity- vacancy drift modulates junction conductance- fundamental memristor theory matches experiment-> detailed dynamics are highly nonlinear
4. New nano-circuits enabled by these nano-switches- NVRAM- latch circuits- adaptive signal conditioning
Metal/TiOx/Metal Device Physics
17
3D - No Transistors
• In ultra-dense nanoelectronic memory arrays, instead of the transistor “T.” a two terminal non-linear diode-like element may be used with a resistive memory element. Such structure is represented as 1D1R technology.
18
Where Silicon can’t go
•3D•Nonvolatile
19
Vision for Future Hybrid Chip:Vision for Future Hybrid Chip:CMOS/NanoElectronicsCMOS/NanoElectronics
Si CMOS
Multi-layers
Atomic SwitchCrossbar