23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)Daejeon, Korea Presented by Naehyuck Chang Kiyoung Choi 2015 General.

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

Presented by Naehyuck Chang

Kiyoung Choi2015 General Co-Chairs

On Behalf of VLSI-SoC 2015 Organizing Committee

June 9, 2015

VLSI-SoC 2015Report

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

● Program Chairs○ Youngsoo Shin, KAIST, Korea○ Chi-Ying Tsui, HKUST, Hong Kong

● Vice Program Chair○ Jae-Joon Kim, POSTECH, Korea

● Analog and mixed-signal IC design○ Jaeha Kim, Seoul National University, Korea○ Tai-Cheng Lee, National Taiwan University, Taiwan

● CAD: synthesis and analysis○ Minsik Cho, IBM Research, USA○ Masahiro Fujita, University of Tokyo, Japan

● Circuits and systems for signal processing and communications○ Per Larsson-Edefors, Chalmers University, Sweden○ Oscar Gustafsson, Linköping University, Sweden

● Embedded system: architecture, design, and software○ Vijaykrishnan Narayanan, Penn State University, USA○ Jason Xue, City University of Hong Kong, Hong Kong

TECHNICAL PROGRAM COMMITTEE

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

● Low-power and thermal-aware design○ Massimo Poncino, Politecnico di Torino, Italy○ Tadahiro Kuroda, Keio University, Japan

● Memory: technology, circuit, and system○ Yiran Chen, University of Pittsburg, USA○ Rahul Rao, IBM, India

● Prototyping, verification, modeling, and simulation○ Swarup Bhunia, Case Western Reserve University, USA○ Graziano Pravadelli, University of Verona, Italy

● System architectures: NoC, 3D, multi-core, and reconfigurable○ Yuan Xie, UC Santa Babara, USA○ Nam Sung Kim, University of Wisconsin-Madison, USA

● Design for variability, reliability, and test○ Chris Kim, University of Minnesota, USA○ Jing-Jia Liou, NTHU, Taiwan

● Security of SoC Systems○ Ozgur Sinanoglu, New York University Abu Dhabi, UAE○ Srinivas Katkoori, University of South Florida, USA

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

TECHNICAL PROGRAM COMMITTEE

● Total submissions Abstracts: 138, Full papers: 118

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

Submission Stats

Track Submissions

Analog and mixed-signal IC design 17

CAD: synthesis and analysis 5

Circuits and systems for signal processing and communications 17

Design for variability, reliability, and test 11

Embedded system: architecture, design, and software 8

Low-power and thermal-aware design 10

Memory: technology, circuit, and system 11

Prototyping, verification, modeling, and simulation 7

Security of SoC Systems 4

System architectures: NoC, 3D, multi-core, and reconfigurable 20

COI 8

Total 118

• No. of reviews/paper: 4

• Target acceptance rateRegular: 48/118 = 41%Regular + Poster: 66/118 = 56%

• Session schedule12 regular session

• (4 papers per session) +1 poster session

• Acceptance notificationJune 25th

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

Review Process

Track Regular Poster

Analog 7 2

CAD 2 1

Circuits & Systems 7 3

Variability 4 1

Embedded 3 1

Low-power 3 1

Memory 5 1

Prototyping 2 1

Security 1 1

System Architecture 8 4

COI 6 2

Total 48 18

• PhD Forum abstracts included in the proceedings?

• Copyright issue should be resolved between IFIP and IEEE

23rd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC) Daejeon, Korea

Issues

Look forward to seeing you in Daejeon, Korea!

Thank you!