1 MICSSA 2003 MICSSA 2003 Bluetooth in the Bluetooth in the defence defence industry industry The quest for single chip point to multipoint The quest for single chip point to multipoint Presented by David Johnson Presented by David Johnson TFA leader – Mobile Platform Technologies TFA leader – Mobile Platform Technologies Icomtek Icomtek CSIR CSIR
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1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.
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MICSSA 2003MICSSA 2003MICSSA 2003MICSSA 2003
Bluetooth in the Bluetooth in the defencedefence industry industryThe quest for single chip point to multipointThe quest for single chip point to multipoint
Presented by David JohnsonPresented by David JohnsonTFA leader – Mobile Platform TechnologiesTFA leader – Mobile Platform TechnologiesIcomtekIcomtekCSIRCSIR
2Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
3Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
4Author: D L Johnson
Overview of Bluetooth - historyOverview of Bluetooth - history
In 1994 Ericsson initiated a study to investigate the In 1994 Ericsson initiated a study to investigate the feasibility of a low-power low-cost radio interface feasibility of a low-power low-cost radio interface between mobile phones and their accessoriesbetween mobile phones and their accessories
In Feb 1998, five companies Ericsson, Nokia, IBM, In Feb 1998, five companies Ericsson, Nokia, IBM, Toshiba and Intel formed a Special Interest Group (SIG)Toshiba and Intel formed a Special Interest Group (SIG)
In July 1999 the first bluetooth specification 1.0 was In July 1999 the first bluetooth specification 1.0 was releasedreleased
The bluetooth consortium today is comprised of 9 The bluetooth consortium today is comprised of 9 promoter companies who are leaders in telecomms, promoter companies who are leaders in telecomms, computing and networking and more than 2000 adopter computing and networking and more than 2000 adopter companiescompanies
Bluetooth is the fastest growing technology since the Bluetooth is the fastest growing technology since the internet or the cellular phone, incredible considering that internet or the cellular phone, incredible considering that its first public outing was in mid 1998.its first public outing was in mid 1998.
5Author: D L Johnson
Overview of bluetooth - definitionOverview of bluetooth - definition
Bluetooth is a low-power, low-cost short range Bluetooth is a low-power, low-cost short range radio system intended to replace cables between radio system intended to replace cables between fixed and portable devices. It is intended to fixed and portable devices. It is intended to replace many propriety cables with one replace many propriety cables with one universal radio link.universal radio link.
6Author: D L Johnson
Overview of Bluetooth - domainsOverview of Bluetooth - domains
Landline
Data/Voice Data/Voice Access PointsAccess Points
Cable Cable ReplacementReplacement
Personal Ad-hoc Personal Ad-hoc ConnectivityConnectivity
7Author: D L Johnson
Overview of Bluetooth – technical levelOverview of Bluetooth – technical level
Data links: Can establish up to 7 simultaneous data Data links: Can establish up to 7 simultaneous data connections between a master and it’s slaves (piconet)connections between a master and it’s slaves (piconet)
Voice links: Can establish up to 3 simultaneous voice Voice links: Can establish up to 3 simultaneous voice connections between a master it’s slaves (piconet)connections between a master it’s slaves (piconet)
Maximum asymmetrical data rate of 723 kbps (57.6 kbps Maximum asymmetrical data rate of 723 kbps (57.6 kbps return channel)return channel)
Maximum Symmetrical data rate of 432.6 kbpsMaximum Symmetrical data rate of 432.6 kbps Can have up to ten multiple self contained networks Can have up to ten multiple self contained networks
(piconets) sharing spectrum in the same area (scatternet)(piconets) sharing spectrum in the same area (scatternet) Range can be up to 10m for 10mw bluetooth devices and Range can be up to 10m for 10mw bluetooth devices and
up to 100m for 100mw bluetooth devicesup to 100m for 100mw bluetooth devices Very low power consumptionVery low power consumption Ability to discover available services on another deviceAbility to discover available services on another device
8Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
9Author: D L Johnson
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning
processor IC
Radio IC
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Radio +Processor ICSingle Chip
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Single Chip
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Single Chip
PC
Host controller(PC or MCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Radio +Processor IC
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Host controller(PC or MCU)
Ethernet
Hostcontroller
(PC orMCU)
Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
processor IC
Radio IC
10Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
+ High speed point to multipoint with 7 connections 20MIPS
12Author: D L Johnson
Microprocessor considerations – The challengeMicroprocessor considerations – The challenge
What drives Bluetooth developmentWhat drives Bluetooth development+Drive towards <$5 per IC+Low power IC’s+Majority applications in cell phone market+Majority of uses are point to point voice or data
Why single chip point to multipoint not availableWhy single chip point to multipoint not available+Multipoint needs more powerful embedded link control
processor but this drives up the cost of the IC+More powerful embedded processor normally requires
more power+Applications are not demanding it yet
13Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
14Author: D L Johnson
Example projects – grenade launcherExample projects – grenade launcher
Radio +Processor IC
PSION Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Point to point linkPoint to point link
15Author: D L Johnson
Example project – mortar sightExample project – mortar sight
Radio +Processor IC
PSION Link controlprocessor
Basbandcontroller
(logic)
RFtransceiver
RF font end(LNA, PA,
T/R)Antenna
ApplicationBT stack upper layer
(RFCOMM, PPP,SDP, profiles)
BT stack lowerlayer (LM, LC)
API HCI
Hardware
Software
Host controller(PC or MCU)
Point to multipoint linkPoint to multipoint link
16Author: D L Johnson
Contents of lectureContents of lecture
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth
19Author: D L Johnson
The Future of BluetoothThe Future of Bluetooth
Current version 2.0 working groupCurrent version 2.0 working group+ High rate bluetooth 10 Mb/s+ HI_FI quality non-compressed audio+ Video suitable for video conferencing+ Local positioning for indoor and built-up areas
More powerful embedded microprocessors which will make low More powerful embedded microprocessors which will make low power, single chip point to multipoint possiblepower, single chip point to multipoint possible
Possibility of creating ad-hoc data/voice networks using off the shelf Possibility of creating ad-hoc data/voice networks using off the shelf PDA’s or headsetsPDA’s or headsets
UWB possibly a future threat to Bluetooth due to its high bandwidth, UWB possibly a future threat to Bluetooth due to its high bandwidth, low power ad-hoc networking featureslow power ad-hoc networking features