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1 MICSSA 2003 MICSSA 2003 Bluetooth in the Bluetooth in the defence defence industry industry The quest for single chip point to multipoint The quest for single chip point to multipoint Presented by David Johnson Presented by David Johnson TFA leader – Mobile Platform Technologies TFA leader – Mobile Platform Technologies Icomtek Icomtek CSIR CSIR
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1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

Dec 15, 2015

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Page 1: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

1

MICSSA 2003MICSSA 2003MICSSA 2003MICSSA 2003

Bluetooth in the Bluetooth in the defencedefence industry industryThe quest for single chip point to multipointThe quest for single chip point to multipoint

Presented by David JohnsonPresented by David JohnsonTFA leader – Mobile Platform TechnologiesTFA leader – Mobile Platform TechnologiesIcomtekIcomtekCSIRCSIR

Page 2: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

2Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 3: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

3Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 4: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

4Author: D L Johnson

Overview of Bluetooth - historyOverview of Bluetooth - history

In 1994 Ericsson initiated a study to investigate the In 1994 Ericsson initiated a study to investigate the feasibility of a low-power low-cost radio interface feasibility of a low-power low-cost radio interface between mobile phones and their accessoriesbetween mobile phones and their accessories

In Feb 1998, five companies Ericsson, Nokia, IBM, In Feb 1998, five companies Ericsson, Nokia, IBM, Toshiba and Intel formed a Special Interest Group (SIG)Toshiba and Intel formed a Special Interest Group (SIG)

In July 1999 the first bluetooth specification 1.0 was In July 1999 the first bluetooth specification 1.0 was releasedreleased

The bluetooth consortium today is comprised of 9 The bluetooth consortium today is comprised of 9 promoter companies who are leaders in telecomms, promoter companies who are leaders in telecomms, computing and networking and more than 2000 adopter computing and networking and more than 2000 adopter companiescompanies

Bluetooth is the fastest growing technology since the Bluetooth is the fastest growing technology since the internet or the cellular phone, incredible considering that internet or the cellular phone, incredible considering that its first public outing was in mid 1998.its first public outing was in mid 1998.

Page 5: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

5Author: D L Johnson

Overview of bluetooth - definitionOverview of bluetooth - definition

Bluetooth is a low-power, low-cost short range Bluetooth is a low-power, low-cost short range radio system intended to replace cables between radio system intended to replace cables between fixed and portable devices. It is intended to fixed and portable devices. It is intended to replace many propriety cables with one replace many propriety cables with one universal radio link.universal radio link.

Page 6: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

6Author: D L Johnson

Overview of Bluetooth - domainsOverview of Bluetooth - domains

Landline

Data/Voice Data/Voice Access PointsAccess Points

Cable Cable ReplacementReplacement

Personal Ad-hoc Personal Ad-hoc ConnectivityConnectivity

Page 7: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

7Author: D L Johnson

Overview of Bluetooth – technical levelOverview of Bluetooth – technical level

Data links: Can establish up to 7 simultaneous data Data links: Can establish up to 7 simultaneous data connections between a master and it’s slaves (piconet)connections between a master and it’s slaves (piconet)

Voice links: Can establish up to 3 simultaneous voice Voice links: Can establish up to 3 simultaneous voice connections between a master it’s slaves (piconet)connections between a master it’s slaves (piconet)

Maximum asymmetrical data rate of 723 kbps (57.6 kbps Maximum asymmetrical data rate of 723 kbps (57.6 kbps return channel)return channel)

Maximum Symmetrical data rate of 432.6 kbpsMaximum Symmetrical data rate of 432.6 kbps Can have up to ten multiple self contained networks Can have up to ten multiple self contained networks

(piconets) sharing spectrum in the same area (scatternet)(piconets) sharing spectrum in the same area (scatternet) Range can be up to 10m for 10mw bluetooth devices and Range can be up to 10m for 10mw bluetooth devices and

up to 100m for 100mw bluetooth devicesup to 100m for 100mw bluetooth devices Very low power consumptionVery low power consumption Ability to discover available services on another deviceAbility to discover available services on another device

Page 8: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

8Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 9: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

9Author: D L Johnson

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning

processor IC

Radio IC

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Radio +Processor ICSingle Chip

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Single Chip

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Single Chip

PC

Host controller(PC or MCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Radio +Processor IC

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Host controller(PC or MCU)

Ethernet

Hostcontroller

(PC orMCU)

Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

processor IC

Radio IC

Page 10: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

10Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 11: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

11Author: D L Johnson

Microprocessor considerations – Speed Microprocessor considerations – Speed requirementsrequirements

Bluetooth IC vendors embed small, low-power Bluetooth IC vendors embed small, low-power ±± 20 MIPS 20 MIPS processors (ARM7, Hitachi H8, Motorolla Dragonball)processors (ARM7, Hitachi H8, Motorolla Dragonball)

MIPS requirements of Bluetooth stackMIPS requirements of Bluetooth stack+ Baseband Layer (LC, LM and HCI): 8-12MIPS

+ Host Protocol Layer (HCI, L2CAP, RFCOMM, SDP):1-2 MIPS

+ Application layer and profiles: 1-20MIPS

+ High speed point to multipoint with 7 connections 20MIPS

Page 12: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

12Author: D L Johnson

Microprocessor considerations – The challengeMicroprocessor considerations – The challenge

What drives Bluetooth developmentWhat drives Bluetooth development+Drive towards <$5 per IC+Low power IC’s+Majority applications in cell phone market+Majority of uses are point to point voice or data

Why single chip point to multipoint not availableWhy single chip point to multipoint not available+Multipoint needs more powerful embedded link control

processor but this drives up the cost of the IC+More powerful embedded processor normally requires

more power+Applications are not demanding it yet

Page 13: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

13Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 14: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

14Author: D L Johnson

Example projects – grenade launcherExample projects – grenade launcher

Radio +Processor IC

PSION Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Point to point linkPoint to point link

Page 15: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

15Author: D L Johnson

Example project – mortar sightExample project – mortar sight

Radio +Processor IC

PSION Link controlprocessor

Basbandcontroller

(logic)

RFtransceiver

RF font end(LNA, PA,

T/R)Antenna

ApplicationBT stack upper layer

(RFCOMM, PPP,SDP, profiles)

BT stack lowerlayer (LM, LC)

API HCI

Hardware

Software

Host controller(PC or MCU)

Point to multipoint linkPoint to multipoint link

Page 16: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

16Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 17: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

17Author: D L Johnson

The ultimate goal – smart rocksThe ultimate goal – smart rocks

Video surveillanceVideo surveillance

Audio surveillanceAudio surveillance

Motion sensingMotion sensing

Neural networkingNeural networking

Extremely low Extremely low powerpower

Ad-hoc networkingAd-hoc networking

Page 18: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

18Author: D L Johnson

Contents of lectureContents of lecture

Overview of BluetoothOverview of Bluetooth Bluetooth Architecture and stack partitioningBluetooth Architecture and stack partitioning Microprocessor considerationsMicroprocessor considerations Example Example defencedefence projects projects The ultimate goalThe ultimate goal The future of BluetoothThe future of Bluetooth

Page 19: 1 MICSSA 2003 Bluetooth in the defence industry The quest for single chip point to multipoint Presented by David Johnson TFA leader – Mobile Platform Technologies.

19Author: D L Johnson

The Future of BluetoothThe Future of Bluetooth

Current version 2.0 working groupCurrent version 2.0 working group+ High rate bluetooth 10 Mb/s+ HI_FI quality non-compressed audio+ Video suitable for video conferencing+ Local positioning for indoor and built-up areas

More powerful embedded microprocessors which will make low More powerful embedded microprocessors which will make low power, single chip point to multipoint possiblepower, single chip point to multipoint possible

Possibility of creating ad-hoc data/voice networks using off the shelf Possibility of creating ad-hoc data/voice networks using off the shelf PDA’s or headsetsPDA’s or headsets

UWB possibly a future threat to Bluetooth due to its high bandwidth, UWB possibly a future threat to Bluetooth due to its high bandwidth, low power ad-hoc networking featureslow power ad-hoc networking features