VFD Production Process & QA Lead Getter Exhaust Tip Grid Glass Substrate Contact Lead Anode Wiring Insulation Layer Filament Anode VFD Construction.
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VFD Production Process & QA
Lead
Getter
ExhaustTip
Grid
GlassSubstrate
ContactLead
AnodeWiring
InsulationLayer
Filament
Anode
VFD Construction
• A thin Aluminum film is sputtered on 300×300 mm base glass plate
Aluminum Wiring Process
• Wiring pattern is made by chemical photo etching
The isolation layer is printed on the wiring pattern made by etching process
Isolation Layer Carbon pad Printing Process
The carbon layer is added for el-ectrical connection improvement on the through hole made by isolation film
Terminal pad printing is added for later external lead frame connection
Phosphor Printing Process
Before printing the phosphor pattern, the sealing paste to be printed for final assembly
Max Temp
12:15 AM Phosphor pattern is printed (one
color for one screen),12 different colours are available
Self Standing Grid
A set of grids (metal mesh) are bonded over the top of the phosphor, fixed by SSG bond paste
FUTABA VFD
CIGVFD FEG
双葉電子 技術 Gr.
電子管事業部 設計 U.
CIG and Wire Bonding
IC driver is connected to base glass by aluminium wire
Using IC driver inside VFD, the number of external lead terminals is reduced significantly
Base plate, Metal frame and Front Glass are assembled
双葉電子 技術 Gr.
電子管事業部 設計 U.
双葉電子 技術 Gr.
電子管事業部 設計 U.
Final Assembly & Exhausting
The assembled VFD is sealed in oven
Exhausting air creates vacuum tube
Getter flashing removes residual gases
Aging process to equalize phosphor luminance (e.g. 60-80C, 2hrs, all segments on)
双葉電子 技術 Gr.
電子管事業部 設計 U.
Aging & Display inspection
Final inspection: short circuit, failure modes, double check QA
Lead cutting, brushing, soldering & bending process
Cleaning 300 x 300 glass
Aluminium sputtering
Cleaning
Photo-resist printing
UV exposure
Development
Etching
Photo-resist removal
Base-plate wiring continuity test
First insulation layer printing
Curing
Drilling of exhaust hole
Cleaning & Drying
Second insulation layer printing
Curing
Base-plate inspection
Carbon printing
Drying
Terminal pad printing
Drying
Sealing paste printing
Curing
Phosphor paste printing
Drying
Grid bonding paste printing
Grid bonding assembly
Curing
Manufacturing Flow Chart (1)
Substrate insulation inspection
Substrate cutting
Frame, mesh Hydrogen treatment
Terminal forming
Terminal forming
Filament anchor welding
Filament welding
Getter welding
Mount check
Final assembly
Sealing
Exhausting
Getter flashing
Baking
Aging
Lead cutting
Lead brushing
Soldering
In-process inspection
Lead forming
Labelling
External inspection
Out going inspection
Shipping
Packaging
Manufacturing Flow Chart (2)
“Phosphor” is a generic term. Chemically “Phosphor” is mainly a mixture of zinc and zinc oxides (zno:zn)
Phosphors are available in 17 different colours.
Most commonly specified is green because it has
• greatest luminance (>2000 cd/sq m)
• longest lifetime – 30,000 hours to ½ brightness
• cost – high volume reduces cost
• can be filtered to produce range of effects
• wavelength of 550nm
A word about Phosphor
Quality Management Systems
Futaba Corporation holds Certificates issued for the following systems:
ISO 9001 / ISO 9002 Quality Management
ISO 14001 Environment Management
ISO TS 16949 Extended Automotive QA Requirements
It is the quality goal of Futaba Corporation to continuously improve its product acceptance in PPM level, and finally reach the ultimate goal of:
Innovation, quality and dependability will continue to be hallmarks of our growth and Futaba‘s commitment to quality in all aspects of operations is the base for our position of market leadership
Our Quality Policy
Reliability Testing (1)
Test Item Test Conditions
Life
Vibration fatigue
High temperature operation
Temperature Cycling
Heater Cycling
Lighted for 1000 hours at room temperature, rated voltage applied.
Lighted, 4.4G acceleration, 2000 cpm vibration, applied for 4 hours in the X plane and 2 hours each in the Y and Z planes.
Lighted, for 96 hours at +85° ± 2ºC.
Lighted subject to the specified test conditions as shown, for 5 cycles.
30 mins
15 mins
30 mins
15 mins
85°C+3 -0
-30°C+0 -3
25°C+10 -5
Filament voltage at 120% of the rated voltage and 20000 cycles without voltage applied to anode and grid.
10 seconds
5 seconds
Funct
ional /
Dura
bili
ty
Reliability Testing (2)
Test Item Test ConditionsHigh temperature Storage
Thermal Shock
Humidity (Steady State)
Unlighted, for 72 hours at +85° ± 2ºC.
Unlighted subject to the specified test conditions as shown, for 5 cycles.
30 mins
5 mins30 mins 5 mins
85°C+3 -0
-55°C+0 -3
25°C+10 -5
Unlighted, subject to a relative humidity of 90 to 95%, at a temperature of 40° ± 2ºC, for 96 hours.
Envir
onm
enta
l Test Low temperature
StorageUnlighted, for 72 hours at -40° ± 3ºC.
Reliability Testing (3)
Test Item Test Conditions
Vibration (1)
Shock
Solderability
Unlighted, 1.5mm total excursion, 10 – 55Hz frequency. Sweep time cycle 1 minute. Vibration applied for 2 hours in each X, Y and Z planes.
Unlighted, 100G maximum acceleration, 6 ms duration, half sine wave 3 times in each X, X’, Y, Y’ and Z, Z’ planes (18 times in total in unlighted state).
Immerse in a 230° ± 5ºC solder pot for 5 seconds.
Physi
cal C
hara
cteri
stic
s Vibration (2)Unlighted, 4G acceleration, 55 – 200 Hz frequency. Sweep time cycle 10 minutes. Vibration applied for 2 hours in each X, Y and Z planes.
Resistance to Soldering Heat
Immerse in a 280° ± 5ºC solder pot for 30 ± 2 seconds.
Terminal Strength
Attach 250g weight to leads. Bend leads through 90° and then return to original position, 3 cycles.
Thank you for your attention!
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