VFD Production Process & QA Lead Getter Exhaust Tip Grid Glass Substrate Contact Lead Anode Wiring Insulation Layer Filament Anode VFD Construction.

VFD Production Process & QA

Lead

Getter

ExhaustTip

Grid

GlassSubstrate

ContactLead

AnodeWiring

InsulationLayer

Filament

Anode

VFD Construction

• A thin Aluminum film is sputtered on 300×300 mm base glass plate

Aluminum Wiring Process

• Wiring pattern is made by chemical photo etching

The isolation layer is printed on the wiring pattern made by etching process

Isolation Layer Carbon pad Printing Process

The carbon layer is added for el-ectrical connection improvement on the through hole made by isolation film

Terminal pad printing is added for later external lead frame connection

Phosphor Printing Process

Before printing the phosphor pattern, the sealing paste to be printed for final assembly 　　　　

Max Temp

12:15 AM　　　 Phosphor pattern is printed (one

color for one screen),12 different colours are available

Self Standing Grid

A set of grids (metal mesh) are bonded over the top of the phosphor, fixed by SSG bond paste

ＦＵＴＡＢＡ ＶＦＤ

ＣＩＧＶＦＤ ＦＥＧ

双葉電子 技術 Gr.

電子管事業部 設計 U.

CIG and Wire Bonding

IC driver is connected to base glass by aluminium wire

Using IC driver inside VFD, the number of external lead terminals is reduced significantly

Base plate, Metal frame and Front Glass are assembled

双葉電子 技術 Gr.

電子管事業部 設計 U.

双葉電子 技術 Gr.

電子管事業部 設計 U.

Final Assembly & Exhausting

The assembled VFD is sealed in oven

Exhausting air creates vacuum tube

Getter flashing removes residual gases

Aging process to equalize phosphor luminance (e.g. 60-80C, 2hrs, all segments on)

双葉電子 技術 Gr.

電子管事業部 設計 U.

Aging & Display inspection

Final inspection: short circuit, failure modes, double check QA

Lead cutting, brushing, soldering & bending process

Cleaning 300 x 300 glass

Aluminium sputtering

Cleaning

Photo-resist printing

UV exposure

Development

Etching

Photo-resist removal

Base-plate wiring continuity test

First insulation layer printing

Curing

Drilling of exhaust hole

Cleaning & Drying

Second insulation layer printing

Curing

Base-plate inspection

Carbon printing

Drying

Terminal pad printing

Drying

Sealing paste printing

Curing

Phosphor paste printing

Drying

Grid bonding paste printing

Grid bonding assembly

Curing

Manufacturing Flow Chart (1)

Substrate insulation inspection

Substrate cutting

Frame, mesh Hydrogen treatment

Terminal forming

Terminal forming

Filament anchor welding

Filament welding

Getter welding

Mount check

Final assembly

Sealing

Exhausting

Getter flashing

Baking

Aging

Lead cutting

Lead brushing

Soldering

In-process inspection

Lead forming

Labelling

External inspection

Out going inspection

Shipping

Packaging

Manufacturing Flow Chart (2)

“Phosphor” is a generic term. Chemically “Phosphor” is mainly a mixture of zinc and zinc oxides (zno:zn)

Phosphors are available in 17 different colours.

Most commonly specified is green because it has

• greatest luminance (>2000 cd/sq m)

• longest lifetime – 30,000 hours to ½ brightness

• cost – high volume reduces cost

• can be filtered to produce range of effects

• wavelength of 550nm

A word about Phosphor

Quality Management Systems

Futaba Corporation holds Certificates issued for the following systems:

ISO 9001 / ISO 9002 Quality Management

ISO 14001 Environment Management

ISO TS 16949 Extended Automotive QA Requirements

It is the quality goal of Futaba Corporation to continuously improve its product acceptance in PPM level, and finally reach the ultimate goal of:

Innovation, quality and dependability will continue to be hallmarks of our growth and Futaba‘s commitment to quality in all aspects of operations is the base for our position of market leadership

Our Quality Policy

Reliability Testing (1)

Test Item Test Conditions

Life

Vibration fatigue

High temperature operation

Temperature Cycling

Heater Cycling

Lighted for 1000 hours at room temperature, rated voltage applied.

Lighted, 4.4G acceleration, 2000 cpm vibration, applied for 4 hours in the X plane and 2 hours each in the Y and Z planes.

Lighted, for 96 hours at +85° ± 2ºC.

Lighted subject to the specified test conditions as shown, for 5 cycles.

30 mins

15 mins

30 mins

15 mins

85°C+3 -0

-30°C+0 -3

25°C+10 -5

Filament voltage at 120% of the rated voltage and 20000 cycles without voltage applied to anode and grid.

10 seconds

5 seconds

Funct

ional /

Dura

bili

ty

Reliability Testing (2)

Test Item Test ConditionsHigh temperature Storage

Thermal Shock

Humidity (Steady State)

Unlighted, for 72 hours at +85° ± 2ºC.

Unlighted subject to the specified test conditions as shown, for 5 cycles.

30 mins

5 mins30 mins 5 mins

85°C+3 -0

-55°C+0 -3

25°C+10 -5

Unlighted, subject to a relative humidity of 90 to 95%, at a temperature of 40° ± 2ºC, for 96 hours.

Envir

onm

enta

l Test Low temperature

StorageUnlighted, for 72 hours at -40° ± 3ºC.

Reliability Testing (3)

Test Item Test Conditions

Vibration (1)

Shock

Solderability

Unlighted, 1.5mm total excursion, 10 – 55Hz frequency. Sweep time cycle 1 minute. Vibration applied for 2 hours in each X, Y and Z planes.

Unlighted, 100G maximum acceleration, 6 ms duration, half sine wave 3 times in each X, X’, Y, Y’ and Z, Z’ planes (18 times in total in unlighted state).

Immerse in a 230° ± 5ºC solder pot for 5 seconds.

Physi

cal C

hara

cteri

stic

s Vibration (2)Unlighted, 4G acceleration, 55 – 200 Hz frequency. Sweep time cycle 10 minutes. Vibration applied for 2 hours in each X, Y and Z planes.

Resistance to Soldering Heat

Immerse in a 280° ± 5ºC solder pot for 30 ± 2 seconds.

Terminal Strength

Attach 250g weight to leads. Bend leads through 90° and then return to original position, 3 cycles.

Thank you for your attention!