Vacuum Process Solutions for High Throughput … Lean. Create Value. Vacuum Process Solutions for High Throughput Advanced Media Manufacturing DISKCON ASIA PACIFIC …
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Think Lean. Create Value.
Vacuum Process Solutions for High Throughput Advanced
Media ManufacturingDISKCON ASIA PACIFIC 2009
Presented by Michael A. Russak, Ph.D.
Intevac, Inc.3560 Bassett St.
Santa Clara, CA 95054-2704March 13, 2009
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 2
Media Technology Roadmap
Source: Semiconductor International, 5/22/2008
10000Current State of the Art
380 Gb/in2 = 500 GB/Platter 3.5 Inch Disk
1000
100
10
12001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Are
al D
ensi
ty (G
bit/i
n2 )
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 3
Extending Continuous Media Capacity
Media Strategy: – Higher Anisotropy (Coercivity) Smaller Grains Higher Storage Density– Higher Anisotropy Alloys Stronger Writer, or Softening Magnetic
Material at Moment of Writing HAMR– Advanced ECC/Spring Media
Material Choices: CoPtand/or FePt-L10
Media Process: 350°C-800°C
Anisotropy
5Tb/in2
1Tb/in2
245Gb/in2
FePt(MLS)
Dieter Weller et. al IEEE Trans. Magn. 36, 10 (2000)
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 4
Enabling Technology for Advanced Media
Sources for High Coercivity Media – Multi-Layer Thin Films – Production Multi-Layer Source (MLS) – Triatron Source for alloy development
Sources for Discrete Track Recording (DTR) / Bit Patterned Media (BPM)– Sputter Etch – ICP Source
Integrated DTR / BPM Tool Based on 200 Lean Platform– DTR media manufacturing at >500 disks per hour
AccuLuber – Vacuum Vapor Lubrication
LithoPrime – Surface Adhesion for Nano-Imprint Lithography
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 5
Multi-Layer Source (MLS)
The Only Production Compatible Multi-Layer Source
Ultra-Thin Multi-Layer Deposition Source for High Coercivity Media
Operates in “Pass-By” Mode
Deposits up to Three Different Materials in One Chamber
Excellent Uniformity
Source Mounted on 200 Lean System
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 6
Granular PMR1. Epitaxy to force orientation in CoPtCr
alloy systems– Epitaxial growth Perpendicular
orientation:(NiP-Al/ CoZrTa/Ru/CoZrTa/ Ta/Ru/CoPtCrO/Co-alloy)
– Grain orientation critical (half angle θ<2.5o)
2. SUL to stabilize perpendicular orientation by reducing surface charge density at bottom of Magnetic Layers
3. Main limitation is vertical anisotropy (Ms: 400emu/cm3 for CoPtCr alloys)
Multi-Layer PMR (Super-Lattices)1. High anisotropy material: FePt, CoPt,
FePd, CoPd; (Ms: 800emu/cm3 ; Ku ~ 7x107 erg/cm3)
2. Crystallization temperature for L10 phase typically at 600-700oC;
3. Super-lattice structure (alternating layers of Fe and Pt, at >2 nm each) reduces crystallization temperature to <150oC;
High Vertical Anisotropy in Multilayers
Seed Layer
Oxide Layer
MagL 1
SUL2
Ru
Ms/Hc
SUL1
Under Layer
Inter Layer
MagL 2MagL 3
Substrate
MagL 1 Fe, CoPt, Pd
Seed Layer
Oxide Layer
Inter Layer
SUL
Under LayerSubstrate
(Fe, Co)/(Pt, Pd) super lattices, each layer ~4 - 5 unit cell, 2 nm
FCCFe/Pt
FCTL10
Fe, CoPt, Pd
e.g. S. Yamamoto et. al, J. Appl. Phys., 95, 7285, (2004)
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 7
Rates, Uniformity
Non-mag target rate stays relatively flat through pressure range.
Mag target rate drops linearly with pressure.
Circumferential thickness uniformity is very good for 65mm disks: std. dev.<2%.
y = -0.1094x + 14.352R2 = 0.9992
0
5
10
15
20
0 20 40 60 80 100
pressure (mT)
depo
sitio
n ra
te (A
/pas
s_ Non-magnetic target
Magnetic target
Cell Angle Radius Thickness0.9 188.81.1 188.40.9 190.21.1 188.40.9 187.61.1 188.00.9 188.71.1 189.9
B18A
0
90
180
270
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 8
Rate Control: Magnetic Target
Deposition rate is proportional to power density, layer number, and inversely to carrier speed.
0
50
100
150
200
250
300
350
400
450
0 100 200 300 400 500 600
Power (W)
Thic
knes
s (A
)
50mm/s100mm/s200mm/s
0
50
100
150
200
250
300
350
400
450
0 50 100 150 200 250
Speed (mm/s)
Thic
knes
s (A
)
100W300W500W
0
50
100
150
200
250
300
350
0 20 40 60 80
Number of Pass
Thic
knes
s (A
)
100mm/s, 500W
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 9
Rate Control: Non-magnetic
Non-magnetic material thickness shows the same dependency of rate on target power, pass-by speed, and number of passes. Generally higher rates than magnetic targets.
0
100
200
300
400
500
600
700
0 100 200 300 400 500 600
Power (W)
Thic
knes
s (A
)
50mm/s100mm/s200mm/s
0
100
200
300
400
500
600
700
0 50 100 150 200 250
Speed (mm/s)
Thic
knes
s (A
)
100W300W500W
0
100
200
300
400
500
600
0 20 40 60 80
Number of Pass
Thic
knes
s (A
)
100mm/s, 500W
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 10
Uniformity
Reasonable circumferential uniformity in magnetic properties.
Consistent side-by-side data.
Disc# Side Hc dHc (%) Mrt dMrt (%)4 A 6099 4.3 0.774 3.34 B 6071 2.3 0.744 2
10 A 3303 3 0.586 4.710 B 3273 3.2 0.548 4.618 A 5114 1.1 0.895 3.618 B 5178 2.8 0.887 2.119 A 4804 2.2 0.918 2.219 B 4879 1.6 0.925 2.4
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 11
Triatron Source
Effective Magnetic Alloy Research and Development Tool
Development of New Alloys – Optimization of alloy composition– Adding new components in an alloy
Three Independent Concentric Targets
Separate Power Control for ID, MD & OD Target
RF Power for ID Target (MD Target) Available
Source Mounted on 200 Lean System
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 12
Patterned Media ManufacturingCleanClean
Intevac 200 Lean® (Deposition)
Magnetic Media DepositionMagnetic Media Deposition
Prime Media SurfacePrime Media Surface
Apply Pattern to MediaApply Pattern to Media
Intevac 200 Lean (Etch)
Etch Pattern into MediaEtch Pattern into Media
Intevac AccuLuber™
Lube DiskLube DiskBurnishBurnish
TestTest
New ManufacturingNew Manufacturing
Intevac LithoPrime™Steps for Steps for
Patterned MediaPatterned Media
Imprint Lithography
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 13
DTR / BPM Tool Placement in Media LineDTR / BPM Tool Placement in Media Line
Clean Substrate
Recording Layer
(200 Lean)SeedL
ULIL
Multiple MagLCOC
Lubrication(AccuLuber)Lubrication
Glide Test(BurnishingPass, Glide
Test)
UV Bonding Certification
Cert Test
Shipment
Tape BurnishNano Imprint
Lithography(LithoPrime
Imprio)
QA
Media Pattern(Lean_
DTR/BPM)De-Scum/TrimC-Hard MaskResist Strip
Mag Stack EtchPlanarization
Continuous Media Proc/Eqpt Nano Imprint Lithography Bit Patterned Media
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 14
DTR / BPM Process Example
Full Mag-Stack
NILPatterned
Resist
Etch HardMask
Mag-StackEtch
Refill/ Etch-Back/
Planarization
NCTCarbon
SubstrateSUL
MagLayerSeedL: Ru
C-HM
Resist
Sequential Process
Side 1 Side 2
Sequential Process
Side 1 Side 2
Sche
mat
icPr
oces
sC
ritic
alTh
ickn
ess
500-1000Å 500-1000Å 200-500Å <10Å~200Å <10Å
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 15
High Throughput DTR Manufacturing System
Integrated Process Overview– De-scum / resist trim – Hard mask etch– Magnetic stack etch– Planarization
200 Lean Gen II Platform
Throughput: >500DPH, Goal is 1000DPH (~3 Sec Process)
System Concept for 2-Sided Disk Process
Station No.200L Front
Module 1 2 3 4 5 6 7 8200L Rear
Module
Process Step DescumSide 1
DescumSide 2
HM EtchSide 1
HM EtchSide 2
Mag EtchSide 1
Mag EtchSide 1
Mag EtchSide 2
Mag EtchSide 2
Station No.Disk Load/
Unload 16 15 14 13 12 11 10 9200L Rear
Module
Process Step Flash Carbon DLC Etch Back
Side 2Etch Back
Side 1 Refil PR StripSide 2
PR StripSide 1
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 16
DTR Etch Source
Proprietary Etch Technology
Highest Etch Rate– >10X higher than competitor– Capable of high throughput >500 disks
per hour
Source Mounted on 200 Lean System
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 17
AccuLuber
Provides Improved Process Control
Superior Lube Uniformity
High Throughput of 1300 Disks Per Hour in Parallel Operation Mode
Eliminates the Use of Costly and Hazardous Solvents in the Lubrication Process
Tools in Volume Production
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 18
Traditional Gravity-Drain Lubrication Process
At the design point of 16A total lubricant thickness, typical non-uniformity causes on a traditionally lubricated disk:
ID mandrel holding point lubricant droplet (~20A)
Top of mandrel breaking lube solution surface causing ripple and subsequently resulting in disk surface ripple mark (~6A)
Bottom of disk at OD retaining lubricant puddle and causing lubricant thickness non-uniformity (~16A)
These non-uniformities are causes for head lube pick up, high fly write, head instability, and head degraded-lube buildup
Disk surface ripple mark
ID mandrel holding mark
OD bottom puddle
Lubricant film
Draining meniscus
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 19
AccuLuber
Improved Process Control and Defect Reduction
Eliminates the Use of Costly and Hazardous Solvents in the Lubrication Process
– ~$150K USD savings in solvent usage per luber per year
High Throughput: 1200 Disk Per Hour in Parallel Mode
System Has Shipped to Customer
40mm
-40mm
-40mm
40mm
13.2
13.8
14.0
13.5
13.7
13.8
13.6
13.214.7
15.1
15.1
15.2
15.3
15.3
15.2
14.8 14.314.3
14.4
14.514.5
14.5
14.4
14.3
Uniformity ± 1Å
Zone 1:Evaporator
Zone 2:Wall
Zone 3:Diffuser Plate
Disk to be lifted tovapor zone for deposition
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 20
LithoPrime
Nano Imprint Lithography Priming Layer Critical for Substrate Resist Adhesion
Fully Automated Process and Control
Low Defect Disk Handling
Batch Processing
Compact Footprint
Tools Shipped to Development Fabs
23”w x 56h x 56d
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 21
LithoPrime Overview
NIL Priming Layer Critical for Substrate Resist Adhesion
Developed In Partnership with A NIL Tool Manufacturer
Batch Loading into Process Chamber (25 Disks)
Single Cassette, 65mm (95, 54 & 48mm Future)
Single Reaction Chamber, Heated, Shielded
Controllable Gas / Liquid Delivery– N2, O2 or O3, ValmatTM (Molecular Imprints Inc.), DI water
Ozone Pre-Clean
Dimensions: 23”w x 56h x 56d
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 22
LIthoPrime Performance
Precursor: ValMat, DI Water
Process Pressure: 50mTorr-700Torr
Process Mode: Batch process at cassette level
Throughput:– Optimized to run in parallel with NIL Tool
Bonding Force:– >30Lb (Molecular Imprint De-bonding Test)
Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 23
Summary
The media industry will undergo a major transition in the next few years from planar, granular media to patterned media
Additionally, while not as radical a transition; the nature of the recording layer may move from tradition multi-elemental CoPtXYalloy based systems to a new class of alloys based on high Ku binary alloy multilayer systems
These transitions will be driven by capital equipment availability and costs. This is a new era for the HDD industry.
High throughput, reliable, cost effective manufacturing solutions will be required to reduce these emerging technology elements topractice.
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