The Most Complete Provider of Advanced Microelectronic ...

www.micross.com

The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions

• Largest global Die Distributor

• Die Express Quick Turn Service

• Turnkey Wafer Processing

• Vendor Managed Inventory (VMI)

• Next-Gen Wafer-Level Packaging

• 2.5/3D Heterogeneous Integration

• Flip Chip / MCM

• Original Qualified Product • Form-Fit-Function Recreation • Program Sustainment Management

• Hermetic, Plastic (CSP/BGA/QFN)

• QML Level Packaging

• Multi-chip SiP

• Precision Die Attach

• Optoelectronic Assembly

• Marking Labelig / Kitting

• PCB Assembly

• Robotic Hot Solder Dip

• BGA Reballing

• Lead Attach / Trim & Form

• Component Harvesting

• IC Programming

• Device Characterization: FPGA, ASIC, RF Test

• PEMs / COTS Upscreening & Qualification

• Adv. Chamberless Burn-in / HTOL / LTOL

• Counterfeit Detection & Test Services

Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.

• SMD/5962

• Hi-Rel Memory, Analog & Power

• COTS / Retail+

Bare Die & Wafer Processing

One Source Sustainment Solutions - keeping mission-critical systems & platforms operational

Advanced Interconnect

Packaging & Assembly

Component Modification

Advanced Electrical & Environmental Testing

Hi-Rel Products

Apopka, FloridaWafer Processing, QML Level Packaging, Assembly, Test, Products, and Die Sales

Los Alamitos, California Wafer Processing & test, Die Distribution & Sales

Woburn, Massachusetts Die Distribution & Sales, Passive Components, Same-day Service, & VMI

Portchester, United Kingdom MCM / Hybrid Packaging & Assembly, Test, and Hi-Rel products

Manchester, New HampshireRobotic Hot Solder Dip (RHSD, & Lead Attach / Trim & Form

Milpitas, CaliforniaElectrical and Reliability Test, PEMs Upscreening, & Qualification

Round Rock, TexasBGA Reballing, Components Harvesting & Reconditioning, and Solderability

Raleigh, North CarolinaWafer Level Packaging (WLP), & 3D Heterogeneous Integration

Clearwater, FloridaCounterfeit Detection testing, Upscreening, and IC Programming

Norwich, United KingdomWafer Processing, QML Level Packaging, Assembly, Test, Products, and Die Sales

Crewe, United KingdomRobotic Hot Solder Dip (RHSD), TCE, BGA Reballing, CGA, and Plating

Die, Wafer & Hi-Rel Components

Advanced Microelectronic Solutions

Component Modification Services

Corporate Headquarters

Melville, New YorkMicross Holdings Inc. HQ

Facilities & Locations

Engineering, Applications Support & program Management

Micross Heritage

Micross’ next-gen facilities provide over 400,000 sq. ft. of manufacturing and processing capacity across nine AS9100 & ISO9001 certified facilities worldwide, driven by industry-leading proprietary processes & technical innovation.

@microsscomps

company/micross-components

sales@micross.com

www.micross.com

America: 1.855.426.6766

EMEA & ROW: +44 (0) 1603.788967

China: +85 21.5459.1970

India: +91 7760.990.545

04.22 | Rev 8 Micross Overview

Micross’ highly experienced global field sales team, and expert engineering team provide complete application support from program specification to post production sustainment & program management.

Contact us to see how we could help you with your specific requirement www.micross.com/support

With over 40+ years experience, Micross has strengthened its’ capabilities to offer the broadest microelectronic solutions available from One Source.