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The Increasing Role of Dielectric LayersThe Increasing Role of Dielectric Layersin Flipin Flip--Chip and Wafer Level PackagingChip and Wafer Level Packaging

Keynote Address

R.L. HubbardIMAPS Device Packaging Conference 2007

Bob Hubbard

Lambda Technologies, Inc.

What; more layers?!What; more layers?!

� The “planarization” of packaging

� The drivers to add layers

� Planar package constructions

� An update on polymer dielectric layers

R.L. HubbardIMAPS Device Packaging Conference 2007

� Material characteristics and reliability

� Changing demands on flip-chip

� Alternatives and directions

The Planarization of TransistorsThe Planarization of Transistors

� From vertically assembled and wired transistors to monolithic layers of semiconductors

R.L. HubbardIMAPS Device Packaging Conference 2007

from Jack Kilby’s notebook

The Planarization of Integrated CircuitsThe Planarization of Integrated Circuits

� Cu wiring with SiO2 dielectric layers (1982!)

“fat”

metal

R.L. HubbardIMAPS Device Packaging Conference 2007

� Cu wiring with low-k dielectric layers (2000)

� Now 4 layers for DRAM, 9 layers for logic

device

W plug

The Planarization of PackagingThe Planarization of Packaging

R.L. HubbardIMAPS Device Packaging Conference 2007

� Planarization: adding dielectric and metal layers for interconnects

The Planarization of SystemsThe Planarization of Systems

� The component list is getting longer:

� passives

� sensors

� power

� connectors

� optics

� MEMS

Integration will come

with new organic and

composite materials

R.L. HubbardIMAPS Device Packaging Conference 2007

� MEMS

� thermal

� video

� RF

composite materials

( this is a much slower process

outside the silicon infrastructure)

From Passivation to Wafer Level PackagingFrom Passivation to Wafer Level Packaging

� Stress buffer / passivation layers

� Silicon nitride for moisture and halogen protection (passivation)

� Polymer layer for stress relief from encapsulation/molding

� One more re-distribution layer (RDL)

� Transition from WB to bumps

� Transition from periphery to array

R.L. HubbardIMAPS Device Packaging Conference 2007

� Transition from periphery to array

� Two – eight interconnection layers (WLP)

� Moderate (50-200) I/O devices

� Fan-out beyond IC borders

A Universal Package?A Universal Package?

� The old “chips first” re-visited

� Assemble an array of tested

dice

� Protect the die back and

sides with encapsulant

� Add layers of interconnect to

R.L. HubbardIMAPS Device Packaging Conference 2007

� Add layers of interconnect to

die faces

� Fan-out pads for high density

chips

� Bump and dicecourtesy Infinieon Technologies

The Drivers of ChangeThe Drivers of Change

� Cost

� Wafer processes are bulk

� Fewer total process steps

� Additional costly substrate not necessary

� Test at wafer or known-good-die approaches add cost

� Thickness

� Thin

R.L. HubbardIMAPS Device Packaging Conference 2007

� Thin is in! (Motorola RAZR, Motorola Q, Samsung A900)

� Stacked dice were already forcing wafer thinning to 50 um

� Reliability

� Fewer material interfaces

� Fewer separate parts to protect

� Fewer adhesive joints

The Death of WireThe Death of Wire--Bonding?Bonding?

� No.

� The majority of devices will continue to

be wire-bonded for some time

� All existing technologies fight

DIP

QFP

SOIC

BGA

Bare

CSP

Other

R.L. HubbardIMAPS Device Packaging Conference 2007

� All existing technologies fight

replacement

� Can DDR3 and DDR4 be wire-bonded?

� Two studies; two answers

time

mark

et

Dielectric Material PropertiesDielectric Material Properties

R.L. HubbardIMAPS Device Packaging Conference 2007

Changing Material Property Needs Changing Material Property Needs -- WLPWLP

� Stress buffer layer needs before 2000

� High temperature stability for reflow

� High elongation for die stresses

� Low outgassing

� Adhesion to die

� Current multilayer RDL and WLP

� High temperature stability for multiple processes and reflow

R.L. HubbardIMAPS Device Packaging Conference 2007

� High temperature stability for multiple processes and reflow

� High elongation for die and multi-layer stresses, and shock testing

� Chemical resistance to develop solvents and etchants

� Water based development for the environment

� Lower thermal budget for curing (die yield)

� Low temperature curing for sensitive devices (<200°C)

� Fast curing for mulitple layer throughput (>50 WPH)

� Adhesion to previous layer

Dielectric Material Properties Dielectric Material Properties -- PIPI

� Polyimides for stress buffer layers

� High elongation, low modulus, planarizing, “soft” coating

� High temperature stability, chemically resistant, αααα particle barrier

� Photo-sensitive, solvent based development, linear

� High temperature, long cure (350°C, 4 hrs), 2% moisture retention

O

R.L. HubbardIMAPS Device Packaging Conference 2007

C

N

O

CO

O H

ArH

C

N

O

C

O

Ar

Material Properties Material Properties -- PBOPBO

� Polybenzoxazoles for re-distribution

� High elongation, low modulus, planarizing, “soft” coating

� High temperature stability, chemically resistant, αααα particle barrier

� Photo-sensitive, water based development, cross-linked

� High temperature, long cure (380°C, 4 hrs), 2% moisture retention

OH

R.L. HubbardIMAPS Device Packaging Conference 2007

C

O

OH

H

N

C

O

N

Material Properties Material Properties -- BCBBCB

� Benzocylobutene (Cyclotene) for re-distribution

� Low elongation, low dielectric constant, planarizing, “hard” coating

� High temperature stability, oxygen sensitive, αααα particle barrier

� Photo-sensitive, solvent based

� Moderate temperature, long cure (250°C, 5 hrs)

R.L. HubbardIMAPS Device Packaging Conference 2007

Si

O Si

CH3

CH3

CH3

CH3

Si O

Si

CH3

CH3

CH3

CH3

Si

O

Si

CH3

CH3

CH3

CH3

Material Properties Material Properties -- EpoxiesEpoxies

� Epoxy “hybrids” for wafer level packaging

� Low temperature, shorter cure (175-190°C, 3 hrs)

� Low elongation, high modulus, “hard” coating

� Lower temperature stability, chemically resistant

� Photo-sensitive, solvent based, resin or film

� Cross-linked

� Thermal processing affects mechanical properties

R.L. HubbardIMAPS Device Packaging Conference 2007

� Thermal processing affects mechanical properties

Dielectric Material ComparisonsDielectric Material Comparisons

� Choices depend on number of layers, low-k dielectric layers, type of device,

device properties, type of application, throughput, size of wafers, technology

node (45 nm?), environment, etc.

Tg Cure time* Cure

Temp

Elong. Process Stability

PI 300 5 hr 350 80% Solvent >400°C

R.L. HubbardIMAPS Device Packaging Conference 2007

PBO 300 5 hr 380 100% Water >400°C

BCB 280 8 hr 250 5% Solvent >300°C

Epoxy 200 3 hr 190 4% Solvent ?

* customer variation can be significant

Is Your Dielectric Layer Really Cured?Is Your Dielectric Layer Really Cured?

� Polymer dielectrics must be highly cured to have good adhesion

� Many dielectric layers now in use are not highly cured

� Historical use of 180°C polyimide coatings

� Epoxy based microvia boards with un-cured resin may crack internally

after reflow processes

� Shifting modulus, CTE, elongation affects layer stresses

R.L. HubbardIMAPS Device Packaging Conference 2007

� Shifting modulus, CTE, elongation affects layer stresses

� “Standard” processes are not aways full cure

� DSC or FTIR will show extent of cure until about 90%

� TMA or DMA will provide Tg, which is more cure sensitive

� How cured is cured enough?

Epoxy Adhesive FilmsEpoxy Adhesive Films

� Flip-chip under-fill, CSP/BGA under-fill

� Process drivers Reliability drivers

� Fast flow ▪ low warpage

� Fast cure ▪ thermal stability

� Fine pitch ▪ adhesion

R.L. HubbardIMAPS Device Packaging Conference 2007

� Self filleting ▪ low stress

� Flux compatible ▪ large die

� Long pot-life ▪ high I/O

� Two new drivers

� Higher reflow temperatures (no-lead)

� Fragile low-k dielectric layer(s)

Material Supplier DirectionsMaterial Supplier Directions

� Wafer Dielectrics

� Faster and lower temperature cure of PI and PBO

� New chemistries and formulations

� Epoxy “hybrids” and photo-resists

� Lower temperature cure

Flip-chip underfills

R.L. HubbardIMAPS Device Packaging Conference 2007

� Flip-chip underfills

� Lower shrinkage, lower stress

� Compatibility with low-k dielectrics

� Lower Tg + lower modulus but low CTE

� New families of materials

� Packaging consortia all have chemical partners

� Focus is on mechanical properties (CTE, E’, Tg, etc.)

The Dielectric Curing ProcessThe Dielectric Curing Process

R.L. HubbardIMAPS Device Packaging Conference 2007

(for cross-linked polymers)

“Liquid State” and “Solid State” Curing“Liquid State” and “Solid State” Curing

� Low temperature cure step:

� majority of shrinkage occurs in liquid state

� size of agglomerates determined by cross-link density

� “network” extent of cure constrained by cross-link density

� gellation: change from liquid to solid state curing

� entrapment of uncured molecules in “network”

� High temperature cure step

R.L. HubbardIMAPS Device Packaging Conference 2007

� High temperature cure step

� continued growth of agglomerates

� completion of cross-linking if possible

� some cross-linking physically blocked

� curing of entraped molecules

� thermal and chemical resistance enhanced

� yield strength and adhesion enhanced

� continued shrinkage during cooling

Total shrinkage (not simply highest temperature)Total shrinkage (not simply highest temperature)

1. Liquid state shrinkage (>50%)

2. Solid state shrinkage (difference between gel and RT)

R.L. HubbardIMAPS Device Packaging Conference 2007

shri

nkag

e

shri

nkag

e

Note: The Tg of both materials is the same.

Closer Look at CrossCloser Look at Cross--linkinglinking

� PBO dielectric layers for WLP

� Epoxy dielectric layers and adhesives for flip-chip

� Example of epoxy cross-linking:

DGEBA (resin)

O O O ONH2NH2

MDA (hardener)

R.L. HubbardIMAPS Device Packaging Conference 2007

O

OH

O

DGEBAMDA

cross-linked

network

Change the Curing Process?Change the Curing Process?

� Lower the cure temperature, for example

� Change the balance of low and high temperature steps

DGEBAMDA

larger network

(mesh size)

R.L. HubbardIMAPS Device Packaging Conference 2007

� Benefits:

� increases elongation, toughness, resistance to crack propagation

� decreases shrinkage, tension and compression modulus, brittleness

Curing with MicrowavesCuring with Microwaves

� Obviously faster curing: 5 hours to 15 minutes

� Lower temperatures for PI and PBO:

VFMconvection

1 2 3 4 5 hrs

400

300

200

100Cu

re T

emp

(°C

)

VFMconvection

1 2 3 4 5 hrs

400

300

200

100Cu

re T

emp

(°C

)

Various Polyimides

1.1

Various PBOs

1.1

R.L. HubbardIMAPS Device Packaging Conference 2007

0.7

0.8

0.9

1

125 150 175 200 225

VFM Cure Temp

Tg

Ra

tio

1

2

3

4

5

6

7

8

9NPS PS- PS+

0.7

0.8

0.9

1

1.1

125 150 175 200 225 250

VFM Cure TempT

g R

ati

o

1

2

3

4

5

6

350°C – 5 hrs 175°C – 1 hr

Modified Properties with MicrowavesModified Properties with Microwaves

� Tg must remain the same (adhesion, thermal stability)

� Lower modulus with low temperature cure

Flexural test of FP4651

40.000

60.000

80.000

100.000

120.000

Str

es

s, M

Pa

Flexural test of FP4651

40.000

60.000

80.000

100.000

120.000

Str

es

s, M

Pa

R.L. HubbardIMAPS Device Packaging Conference 2007

� Raise or lower the CTE with cure profile

0.000

20.000

40.000

0.000000 0.002000 0.004000 0.006000 0.008000 0.010000 0.012000

Strain, mm/mm

0.000

20.000

40.000

0.000000 0.002000 0.004000 0.006000 0.008000 0.010000 0.012000

Strain, mm/mm

60

40

20

0

20 40 60 80 100 120 140

Temperature (C)

Dim

ensi

on

al

Ch

ang

e (u

m)

60

40

20

0

20 40 60 80 100 120 140

Temperature (C)

Dim

ensi

on

al

Ch

ang

e (u

m) Profile MW Conv MW

CTE (ppm/C) 44 68 109

SummarySummary

� As planarization continues

� dielectric materials and processes become more critical

� Material properties affect package reliability

� Material requirements continue to change

R.L. HubbardIMAPS Device Packaging Conference 2007

� Material requirements continue to change

� new chemistries and new processes

Change Grinds On!Change Grinds On!

R.L. HubbardIMAPS Device Packaging Conference 2007