(Nuclear Infra Construction) - img.kisti.re.krimg.kisti.re.kr/tr_img/2012204/rttrko000000140411.pdf · )의 발생이 없거나 매우 적어 친환경적이다. 빠른 경화는
Post on 31-Aug-2019
1 Views
Preview:
Transcript
( " ) ( ) : 2009-0078142
(N uclear Infra C onstruction)
EB (D e s ig n o f H ard C o a tin g R e s in s
a n d P ro c e s s O p tim iza tio n o f EB C u rin g )
.
EB (
) .
2010. 07.
:
:
:
"
- 1 -1
.
2009-0078142
2009.04.01
2010.03.31
(1)/
(1)
EB
: 2
: 2
:
: 30,000
:
: 30,000
: 2
: 2
:
: 30,000
:
: 30000
: :
( 500 ) 32
/EB
in-mold decoration(IMD) foil
EB .
IMD
Erichsen 12 mm /EB .
EB
3H , 0.31 .
EB
UV EB
.
( 5 )
IMD,
IMD, hard coating, resin, electron beam, curing, process optimization
2
.
l . : EB
n .
()
. IMD foil
. IMD foil
EB
.
EB
. /
. EB
. EB
. UV UV
gravure ink offset ink UV
prism sheet UV
. EB UV
EB
.
EB ( EB
) EB
.
m .
IMD /EB
EB
IMD .
.
EB
(FT- IR ) ( )(steel wool abrasion
)(Erichsen ) (SEM ) . EB
/UV /EB
.
- 3 -
.
IV.
IMD .
/EB Erichsen 12 mm
. 3H 0.31
. EB
. UV UV
EB .
V .
(EB)
.
. EB
(VOC) .
.
EB
. EB
. 1) /EB
2) EB EB 3)
UV EB IMD /EB
.
- 4 ~4
.
S U M M A R Y
Many companies have discovered the advantage and benefits of electron beam (EB)
curing over conventional coating systems. Some of these advantages include environmental
compliance, rapid cure, and improved physical properties and performance compared to
conventional systems. However, there are extensive difficulties in selection of resins
suitable for EB curing which will allow formation of good quality in a low-cost
commercially satisfactory manner. There are also remained a need for processing
optimization which would allow the commercial exploitation of EB curing.
It is an object of this study to develop a system of EB curing resins which will be used
as the hard coating layer of in-mold decoration (IMD ) foils. It is a further object of this
study to establish a relationship between processing conditions and coating properties. It is
an additional object of this study to provide a database for the selection of apparatus
which would allow the commercial exploitation of EB curing.
The EB curable resins and curing techniques, which will be developed for the hard
coating layer of IMD foils can be used in a variety of applications such as protective
coatings, printing inks, photoresists, adhesives, sealants and plastic parts for three
dimensional imaging because it allows many industries to exploit the EB curing cycle's
advantage to reduce the processing time and costs while meeting the demanding
requirements of high-performance products.
- 5
.
C O N T E N T S
Chapter 1. Outline of the research project................................................................................................................8
Chapter 2. Present status of technical development............................................................................................10
Chapter 3. Contents and results ....................................................................................................................................17
Chapter 4. Research achievement and contributions........................................................................................ 28
Chapter 5. Application plan of research results .....................................................................................................30
Chapter 6. International technology information in the process of development 3 1
Chapter 7. Reference..........................................................................................................................................................32
.
1. ...............................................................................................................................................8
2. ...........................................................................................................................................10
3. ................................................................................................................................17
4. .................................................................................................................28
5. .................................................................................................................................... 30
6. ................................................................................................31
7. ..................................................................................................................................................................... 32
- i -7
.
1.
In mold in mold decorationQMD) in mold labelingQML) .
IML
. die cutting
. IMD
. 3
. IMD
( 1).
1. IMD
IMD IMD foil IMD foil
. IMD foil
PET film Release layer (3) Hard coating
layer (4) Anchor layer I(5) Anchor layer II(6) Color layer (7) Anchor layer III(8)
Anchor layer IV(9) Al metalizing(10) Anchor layer V(11) Adhesive layer
. 5 ym IMD
.
in mold
. 3H
.
(dual cure) .
hydroxyl carboxyl
UV EB(electron beam)
- 8 -
.
. hydroxyl isocyanate
roll blocking
in mold 3
.
.
IMD foil . IMD foil
EB
. EB
.
/ . EB
. EB
.
leveling,
. UV UV gravure ink offset ink
UV prism sheet
UV .
EB UV
EB
. EB
( EB )
EB
.
- 9 -
.
2.
1. UV I960 80W
UV .
. 1 UV/EB 2003
. graphic art
.
kton
Segment NA Europe Japan ChinaCoatings 28 27 16 16
GA 39 23 10 4
Electronics 10 3 15Adhesives 3 2
total 80 53 43 20AGR% 4 6 7 25
1. UV/EB (2003)
ApplicationMarket (ty)
2000 2001 2002
Cotings 15,710 16,260 16,290Wood coalings 8,000 7,650 7,400PVC floor coating TOO TOO mFilm coalings 280 330 480Metal coatings 300 290 280Vac. Coatings 2.300 2,500 2,800Cpti1 disk coatings 390 0 560Cptlcal fiber coalings 2.300 2.7 2,300Ceramiccoaiings 1,200 1,300 1,500Release coatings 240 250 270
Inks 8,340 6.730 9,200Offset ink G.OOO 6,2M G,40Gravure ink 1.290 1.310 1,340Metal coatings ink 0 650 800Sikscregn ink 440 490 530Flexoinh SO 130
Photoresists 16,700 13,980 15.120Dry film resist 3,000 2.200 2,300Liquid resist 5,900 5.300 5,800Eldctro-deposition resist 320 300 320Resistfor LCD 1,800 1.600 1, 0Barrier rib lor PDF 90 160 400Ssmicorductor resist 3.600 2. 0 2,600Photo polymer plate 2,000 1,900 1,900
Others &50 960 1,460Rapid prototyping 50 60 60Adh iv 600 900 1,400
Total 41,400 , 930 42,070
2. UV/EB
10
.
2 UV/EB . UV/EB
.
( 3).
Monomers
RadicalAcrylatesVinylsOthers
Cationic
Cycloaliphatic epoxides Glydgyl ether Vinyl ether Oxetane
Oligomers
Radical
Epoxy acrylates Urethane acrylates Polyester acrylates Acrylic polymer acrylates Silicone acrylates Unsaturated polyesters
Cationic
Cycloaliphatic epoxides Glydgyl ether Vinyl ether Oxetane
Initiators
Radical
BenzophenoneAcetophenoneThioxanthoneAcyl phosphine oxideOthers
Cationiclodonium salt Sulfonium salt Others
Anionic Dithio carbamate salt
3. Photo curable
epoxy, urethane, polyester, acrylic polymer silicone
.
: isocynate
( polyester diol
)UV/EB
( 50 nm filler
)/ (/
)dual cure ( urethane
UV/EB .
) EB (EB
. EB PMMAPC 4 )
/ .
- _11
.
.
EB UV/EB 10%
. EB 100 UV (5-20
) 20-50 UV
photo initiator additives UV
.
2. EB
.
2 . 2
100 eV . 200 keV
1 2000 2 .
2 2
EB .
. (C)
12 6(Au) 197 79. 16.4
197 98.5 .
1:1.2 25% .
80% (1/1.25)
. . 2
2 2 . EB
EB .
EB .
LET(Linear Energy
Transfer) .
. EB EB EB
2 3 . PE PS EB
.
12
.
2.
3.
EB (1)
? ? (2) ?
.
.
100 Gy
. PMMA 10 kGy .
10 kGy
.
3.
UV EB
.
. EB
UV
.
.
.
(Differential Scanning Calorimery DSC)
J
en
erg
y
2e
top related