Lecture 22
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Lecture 22
OUTLINE
The MOSFET (cont’d) • Velocity saturation• Short channel effect• MOSFET scaling approaches
Reading: Pierret 19.1; Hu 7.1, 7.3
MOSFET Scaling• MOSFETs have been steadily miniaturized over time
– 1970s: ~ 10 m– Today: ~30 nm
• Reasons:– Improved circuit operating speed– Increased device density --> lower cost per function
EE130/230M Spring 2013 Lecture 22, Slide 2
Benefit of Transistor ScalingAs MOSFET lateral dimensions (e.g. channel length L) are reduced:
• IDsat increases decreased effective “R”
• gate and junction areas decrease decreased load “C” faster charging/discharging (i.e. d is decreased)
EE130/230M Spring 2013 Lecture 22, Slide 3
Velocity SaturationVelocity saturation limits IDsat in sub-micron MOSFETS
Simple model:
Esat is the electric field at velocity saturation:
sat
sat
vv
v
1
sat
sat
v2
for sat
for < sat
Siin holesfor cm/s 106
Siin sonfor electr cm/s 1086
6
satv
EE130/230M Spring 2013 Lecture 22, Slide 4
MOSFET I-V with Velocity Saturation
LV
VVm
VVCL
W
I
sat
DS
DSDSTGSeffoxe
D
1
2
L
VI channellong
I
sat
DS
DD
1
In the linear region:
EE130/230M Spring 2013 Lecture 22, Slide 5
Drain Saturation Voltage, VDsat
• If satL >> VGS-VT then the MOSFET is considered “long-channel”. This condition can be satisfied when– L is large, or – VGS is close to VT
LVV
m
V satTGSDsat 11
satsat
v2
EE130/230M Spring 2013 Lecture 22, Slide 6
Example: Drain Saturation VoltageQuestion: For VGS = 1.8 V, find VDsat for an NMOSFET with Toxe = 3 nm, VT = 0.25 V, and WT = 45 nm, if L = (a) 10 m, (b) 1 m, (c) 0.1 m (d) 0.05 m
Solution: From VGS , VT and Toxe, eff is 200 cm2V-1s-1. Esat= 2vsat / eff = 8 104 V/cm
m = 1 + 3Toxe/WT = 1.21
1
LVV
mV
satTGSDsat
EE130/230M Spring 2013 Lecture 22, Slide 7
(a) L = 10 m: VDsat= (1/1.3V + 1/80V)-1 = 1.3 V
(b) L = 1 m: VDsat= (1/1.3V + 1/8V)-1 = 1.1 V
(c) L = 0.1 m: VDsat= (1/1.3V + 1/.8V)-1 = 0.5 V
(d) L = 0.05 m: VDsat= (1/1.3V + 1/.4V)-1 = 0.3 V
11
LVV
mV
satTGSDsat
EE130/230M Spring 2013 Lecture 22, Slide 8
IDsat with Velocity SaturationSubstituting VDsat for VDS in the linear-region ID equation gives
For very short channel length:
• IDsat is proportional to VGS–VT rather than (VGS – VT)2
• IDsat is not dependent on LEE130/230M Spring 2013 Lecture 22, Slide 9
LmVV
I channellong
LmVV
VVCmLW
I
sat
TGS
Dsat
sat
TGS
TGSeffoxe
Dsat
11
22
mVVL TGSsat /
TGSoxesatTGSeffoxesatDsat VVCWvVVCW
I 2
Short- vs. Long-Channel NMOSFET
Short-channel NMOSFET:• IDsat is proportional to VGS-VTn rather than (VGS-VTn)2
• VDsat is lower than for long-channel MOSFET• Channel-length modulation is apparent
0 1 2 2.5Vds (V)
0.0
0.1
0.2
0.3
0.4
I ds
(mA
/m
)
L = 0.15 mV
gs = 2.5V
Vgs
= 2.0V
Vgs
= 1.5V
Vgs
= 1.0V
Vds (V)
I ds
(A
/m
)
L = 2.0 m Vgs = 2.5V
Vgs = 2.0V
Vgs = 1.5V
Vgs
= 1.0V
0.0
0.01
0.02
0.03
(a)
(b)
Vt = 0.7 V
Vt = 0.4 V
0 1 2 2.5Vds (V)
0.0
0.1
0.2
0.3
0.4
I ds
(mA
/m
)
L = 0.15 mV
gs = 2.5V
Vgs
= 2.0V
Vgs
= 1.5V
Vgs
= 1.0V
Vds (V)I d
s (
A/
m)
L = 2.0 m Vgs = 2.5V
Vgs = 2.0V
Vgs = 1.5V
Vgs
= 1.0V
0.0
0.01
0.02
0.03
(a)
(b)
Vt = 0.7 V
Vt = 0.4 V
EE130/230M Spring 2013 Lecture 22, Slide 10
Velocity Overshoot• When L is comparable to or less than the mean free
path, some of the electrons travel through the channel without experiencing a single scattering event
projectile-like motion (“ballistic transport”)
The average velocity of carriers exceeds vsat
e.g. 35% for L = 0.12 m NMOSFET
Effectively, vsat and sat increase when L is very small
EE130/230M Spring 2013 Lecture 22, Slide 11
The Short Channel Effect (SCE)
• |VT| decreases with L– Effect is exacerbated by high values of |VDS|
• This effect is undesirable (i.e. we want to minimize it!) because circuit designers would like VT to be invariant with transistor dimensions and bias condition
“VT roll-off”
EE130/230M Spring 2013 Lecture 22, Slide 12
Qualitative Explanation of SCE• Before an inversion layer forms beneath the gate, the
surface of the Si underneath the gate must be depleted (to a depth WT)
• The source & drain pn junctions assist in depleting the Si underneath the gate – Portions of the depletion charge in the channel region are
balanced by charge in S/D regions, rather than by charge on the gate
Less gate charge is required to invert the semiconductor surface (i.e. |VT| decreases)
EE130/230M Spring 2013 Lecture 22, Slide 13
depletionchargesupportedby gate(simplifiedanalysis) n+ n+
VG
p depletion region
Large L:
S D
Small L:
DS
Depletion charge supported by S/D
Depletion charge supported by S/D
The smaller L is, the greater the percentage of depletion charge balanced by the S/D pn junctions:
rj
EE130/230M Spring 2013 Lecture 22, Slide 14
First-Order Analysis of SCE
1
212
j
Tj r
WrLL
L
LL
21
WT
EE130/230M Spring 2013 Lecture 22, Slide 15
• The gate supports the depletion charge in the trapezoidal region. This is smaller than the rectangular depletion region underneath the gate, by the factor
• This is the factor by which the depletion charge Qdep is reduced from the ideal
• One can deduce from simple geometric analysis that
VT Roll-Off: First-Order Model
1
21)(
j
Tj
oxe
TATchannellongTT r
W
L
r
C
WqNVVV
Minimize VT by
• reducing Toxe
• reducing rj
• increasing NA
(trade-offs: degraded eff, m) MOSFET vertical dimensions should be scaled along with horizontal dimensions!
EE130/230M Spring 2013 Lecture 22, Slide 16
MOSFET Scaling: Constant-Field Approach
• MOSFET dimensions and the operating voltage (VDD) each are scaled by the same factor >1, so that the electric field remains unchanged.
EE130/230M Spring 2013 Lecture 22, Slide 17
Constant-Field Scaling Benefits
• Circuit speed improves by
• Power dissipation per function is reduced by 2
EE130/230M Spring 2013 Lecture 22, Slide 18
• Since VT cannot be scaled down aggressively, the operating voltage (VDD) has not been scaled down in proportion to the MOSFET channel length:
EE130/230M Spring 2013 Lecture 22, Slide 19
• Electric field intensity increases by a factor >1• Nbody must be scaled up by to suppress short-channel effects
• Reliability and power density are issues
EE130/230M Spring 2013 Lecture 22, Slide 20
MOSFET Scaling: Generalized Approach
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