eBEAM TECHNOLOGY 101 - Applied Materials€¦ · IMAGING TECHNOLOGY Employs electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes.

CORE eBEAM CAPABILITIES

PRODUCTIVITYDefined by the throughput,

a key criterion for volume production.

IMAGING TECHNOLOGYEmploys electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes.

PERFORMANCEThe product of resolution, sensitivity, accuracy, and precision.

eBEAM TECHNOLOGY 101

WHY is eBeam needed?

eBeamOptical

1xnm

WHAT is eBeam used for in semiconductor manufacturing?

MetrologyDefect review and analysis Defect inspection

HOW does eBeam work?

Magnetic LensElectrostatic Lens

Electron source is shaped by lenses to a beam

Beam scans the wafer

Detector captures emitted electrons

Image generated for application- specific processing

Sub-nanometer resolution, imaging to expedite ramp, optimize yield

New materials

Greater process complexity

Tighter process windows

Anode

Emitted ElectronsBeam Direction

Condenser

Aperture

Objective

Wafer

In-ColumnDetector

eBeam Image of Line Cut Defect