CORE eBEAM CAPABILITIES PRODUCTIVITY Defined by the throughput, a key criterion for volume production. IMAGING TECHNOLOGY Employs electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes. PERFORMANCE The product of resolution, sensitivity, accuracy, and precision. eBEAM TECHNOLOGY 101 WHY is eBeam needed? eBeam Optical 1xnm WHAT is eBeam used for in semiconductor manufacturing? Metrology Defect review and analysis Defect inspection HOW does eBeam work? Magnetic Lens Electrostatic Lens Electron source is shaped by lenses to a beam Beam scans the wafer Detector captures emitted electrons Image generated for application- specific processing Sub-nanometer resolution, imaging to expedite ramp, optimize yield New materials Greater process complexity Tighter process windows Anode Emitted Electrons Beam Direction Condenser Aperture Objective Wafer In-Column Detector eBeam Image of Line Cut Defect
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CORE eBEAM CAPABILITIES
PRODUCTIVITYDefined by the throughput,
a key criterion for volume production.
IMAGING TECHNOLOGYEmploys electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes.
PERFORMANCEThe product of resolution, sensitivity, accuracy, and precision.
eBEAM TECHNOLOGY 101
WHY is eBeam needed?
eBeamOptical
1xnm
WHAT is eBeam used for in semiconductor manufacturing?
MetrologyDefect review and analysis Defect inspection
HOW does eBeam work?
Magnetic LensElectrostatic Lens
Electron source is shaped by lenses to a beam
Beam scans the wafer
Detector captures emitted electrons
Image generated for application- specific processing
Sub-nanometer resolution, imaging to expedite ramp, optimize yield
New materials
Greater process complexity
Tighter process windows
Anode
Emitted ElectronsBeam Direction
Condenser
Aperture
Objective
Wafer
In-ColumnDetector
eBeam Image of Line Cut Defect
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