Detector module development for the CBM Silicon Tracking System Anton Lymanets for the CBM collaboration Universität Tübingen, Kiev Institute for Nuclear.

Detector module development for the CBM Silicon Tracking System

Anton Lymanetsfor the CBM collaboration

Universität Tübingen, Kiev Institute for Nuclear Research

KINR

2

STS terminology

05.03.2013

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013

station 1

station 2

station 4

station 6

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 3

Module concept05.03.2013

sensor1024 strips58 μm pitch

microcablemultilayer

Module design is driven by the material budget and noise requirements.

front-end board8 chips with 128 channels each

To be mounted support structurescarbon fibre

05.03.2013

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 4

Sensor + cable

05.03.2013

• 1024 strips• ± 7.5 stereo angle• 58 μm strip pitch• (6262) mm2 size

Multi-layer cable mock-up

Cable structure

Wide cable is to be connected to a sensor

Kapton mesh

Kapton

Al

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 5

Sensor + cable interconnection

05.03.2013

Daisy-chained sensors

Sensor-to-cable connection

Mechanical and handling studyExperience: alignment of a cable with 1024 strips is difficult!

Connection technology: TAB bonding

L-shaped legs for sensor mounting

Manufactured in Kharkiv(SE SRTIIE)Talk: M. Singla HK 35.7

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 6

Sensor + cable prototypes

05.03.2013

See: T. Balog HK 35.8 Performance evaluation of a module prototype

Compatible with current n-XYTER front-end boards with ERNI connectors

30 cm

Goal: demonstrate the cable concept, TAB bonding, long cables

•2128 channels(double-sided

readout)•Different lengths

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 7

New module assembly concept

• Many narrow cables (128 channels each)• Same multi-layer structure• Mitigate alignment, yield and testability risks

05.03.2013

8

Sensor quality assurance

•Visual inspection•Electrical characterization▫Current-voltage▫Capacitance-voltage behavior▫Interstrip parameters: resistance and capacitance▫Channel yield (coupling capacitors, PN-junctions)▫Double-metallization▫Shorts and breaks

05.03.2013

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013

1300+ double-sided sensors have to be tested: probe station, long term stability, etc…

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 9

Front-end electronics

05.03.2013

FEE prototype base on n-XYTER chip STS front-end board concept• STS-XYTER chip• 8 chips (128 channels each)• Chips are wire-bonded to the PCB

Readout chips have to be tested individually before FEB assembly.

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 10

Module assembly steps

05.03.2013

Tested chip + tested cable

Readout test only after full assembly every component has to be testedNeed quality assurance, logistics and tooling for module production

TAB bond both sensorsides using fixtures(non-reworkable)

Nest chips in a FEB,Wire bond to the PCB

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 11

Low-mass support structures

05.03.2013

Mechanical study: carbon fibre support

• ultra-light: mass 14 g/m• mechanical precision within 100 μm• maximal rigidity

A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 12

Summary

•Module hierarchy developed•Quality assurance tasks▫Sensors▫Cables▫Front-end-electronics▫Tooling and procedures are under development

•Fixtures for quality assurance and module assembly

•Quality assurance for >1000 modules will be required

•QA sites in Germany (GSI, Tuebingen) and Russia (Dubna)

05.03.2013