Documents Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam...

Slide 1 Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam Department of Electrical and Computer Engineering Auburn University,…

Documents Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam

Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam. Thesis Advisor: Dr . Vishwani Agrawal Thesis Committee : Dr. Victor Nelson Dr.…