Slide 1 Noise Model for Multiple Segmented Coupled RC Interconnects Andrew B. Kahng, Sudhakar Muddu †, Niranjan A. Pol ‡ and Devendra Vidhani* UCSD CSE and ECE Department,…
D A TA S H E E T (timing, area, and power with wires), accurate verification, signal-integrity— aware routing, and the latest yield and low-power design capabilities that…
MinRazor A New Methodology for Reduced Cost of ResilienceAndrew B. Kahng, Seokhyeong Kang and Jiajia LiUC San Diego VLSI CAD Laboratory UCSD VLSI CAD Laboratory # 1 OutlineBackground…
On-chip power distribution in deep submicron technologies Aida Todri Electrical and Computer Engineering Department University of California Santa Barbara * Outline Introduction…
A New Methodology for Reduced Cost of Resilience. Andrew B. Kahng , Seokhyeong Kang and Jiajia Li UC San Diego VLSI CAD Laboratory. Outline. Background and Motivation Problem…
ELECTROGRAVIMETRIC DETERMINATION OF CU2+, CO2+ and Ni 2+ Volume No. 3 Issue No. 2 ELECTROGRAVIMETRIC DETERMINATION OF CU2+, CO2+ and Ni 2+ Dr. Kathlia De-Castro Cruza ; Elijah…
Backend physical design Interview Questions I have listed below a set of common interview questions asked mainly in interviews related to physical design or backend activities…