YDM20075Q4 Compound Semiconductor Quarterly Market … · 2020. 12. 17. · Contact: [email protected] Ezgi Dogmus -Team Lead Analyst, Compound Semiductors Ezgi Dogmus, PhD.

2020

Sample

From Technologies to Markets

Compound Semiconductor Quarterly

Market Monitor

Compound Semiconductor

Service 2020

2

ABOUT THE AUTHORS

Biographies & contacts

Ahmed Ben-Slimane -Technology & Market Analyst, Compound Semiconductor Monitors

Ahmed Ben Slimane, PhD. is a Technology & Market Analyst, specialized in Compound Semiconductors and Emerging Substrates at Yole Développement (Yole).

As part of the Power & Wireless team, Ahmed is contributing to the development of dedicated collection of compound semiconductors market & technology

reports and monitor. Previously, he worked as an epitaxy (MBE/MOCVD) & fabrication process engineer for GaAs-based photovoltaic applications at TOTAL and

IPVF (Paris-Saclay, France). Ahmed also completed his PhD in Material Engineering from KAUST (Saudi Arabia), where his mission was focused on GaN-based

microstructures for flexible solid-state lighting. During his career, Ahmed Ben Slimane proposed lot of presentations towards an international audience. He

authored/co-authored more than 20 publications in the semiconductor field and submitted a patent on the III-V hetero-structure for PV industry. Ahmed obtained

his Master Degree in Electronics Engineering from INPG (Grenoble, FR).

Contact: [email protected]

Ezgi Dogmus -Team Lead Analyst, Compound Semiductors

Ezgi Dogmus, PhD. is Team Lead Analyst in Compound Semiconductor & Emerging Substrates activity within the Power & Wireless Division at Yole

Développement (Yole). She is managing the expansion of the technical expertise and the market know-how of the company. In addition, Ezgi actively assists and

supports the development of dedicated collection of market & technology reports, monitor as well as custom consulting projects. Prior to Yole, Ezgi worked as a

process development engineer for GaN-based RF and power solutions at IEMN (Lille, France). Ezgi has authored or co-authored more than twelve papers. After

graduating from University of Augsburg (Germany) and Grenoble Institute of Technology (France), Ezgi received her PhD. in Microelectronics at IEMN (France).

Contact: [email protected]

Poshun Chiu -Technology & Market Analyst, Compound Semiconductors & Emerging Substrates

Poshun Chiu is a Technology & Market Analyst specializing in Compound Semiconductor and Emerging Substrates at Yole Développement (Yole). As a member of

the Power Electronics & Wireless division at Yole, Poshun focuses on power, RF, and opto-electronics. He is engaged in the development of technology and market

reports and is also involved in custom projects. Before joining Yole, Poshun had 9 years’ experience in R&D and product management at Epistar (TW & CHN). He

is the author or co-author of more than 10 patents in solid-state-lighting. Poshun was also engaged in the development and evaluation of novel applications of

process technology and components based on relevant semiconductor material systems Poshun received an MSc degree in Microelectronics from National Cheng

Kung University (TW) and an MBA from IESEG School of Business(FR).

Contact: [email protected] Semiconductor Quarterly Market Monitor | Sample | www.yole.fr | © 2020

http://www.yole.fr/

3

Ahmed BEN-

SLIMANE, Ph.D.,Technology & Market

Analyst


& Emerging Materials

Poshun CHIU

Technology & Market

Analyst



Ezgi DOGMUS,

Ph.D.,

Team Lead Analyst



Ivan DONALDSON

VP of Yole Finance

Claire TROADEC

Divisional Director

Power & Wireless

Jean-Christophe

ELOY

President & CEO

Experience:

9+ years in Compound

Semiconductors

Experience:


Semiconductors

Experience


Semiconductors

Experience:

14 years in Semiconductor

Industry Strategy, Business

Development and IR

Experience

20 years in Semiconductors &

Business Management

Experience

25+ years in Semiconductor

Industry Strategy

At Yole

GaN, SiC, GaAs, InP, Ga2O3,

AlN, Diamond, Technology

platform for Power Electronics,

RF and LEDs

At Yole




RF and LEDs

At Yole




RF and LEDs

At Yole:

Manages all services

and relationships

for global financial clients

At Yole

Power Elec. & Compound. Semi.,

RF Technologies and

Applications, MEMS & Sensors

Manufacturing, Fabs & Foundries.

At Yole

All technical topics

Previous companies:

TOTAL, AGRICOOL, IPVF &

CNRS

Previous companies

Epistar

Previous companies

IEMN Lab, CEA

Previous companies:

Micron Technology

Previous companies

Philips, NXP, Au Claire de la

Terre

Previous companies

Ernst & Young, CEA Marketing

Office

Education

PhD in Material Science, KAUST

Education

MBA in France, IESEG

M.Sc. Microelectronics

Education

PhD in Material Science,

University of Lille

Education

MBA in Finance, Magna Cum

Laude, Boise State University

Education

M. Business Management

M. Sc. Applied Physics

Education

MBA EM Lyon

M.Sc. Electrical Engineering

INPG/ENSERG

ABOUT THE COMPOUND SEMICONDUCTOR TEAM AT YOLE

Compound Semiconductor Quarterly Market Monitor | Sample | www.yole.fr | © 2020

http://www.yole.fr/

4

COMPANIES MONITORED IN THIS PRODUCT

AXT, Broadcom, EPC, Freiberger Compound Materials, GaN Systems, Infineon, IQE, II-VI, Mitsubishi Electric, Murata, Navitas, ON Semiconductor, Power Integrations, ROHM, Showa Denko, Skyworks, Sumitomo Electric, Sumitomo Electric Device Innovations, STMicroelectronics, Transphorm, VPEC,

Wolfspeed/Cree


http://www.yole.fr/

TABLE OF CONTENTS

▪ COMPOUND SEMI. MONITOR TIMELINE▪ TERMINOLOGY AND DEFINITIONS

▪ Acronyms▪ Explanation and methodology▪ Definition of estimated market, terminology at

substrate, epitaxy & device level▪ Supply chain & business model▪ Open and Captive market▪ Applicative power electronics market segments▪ Formulas used

▪ CHANGES SINCE PREVIOUS QUARTER AND WHAT TO LOOK OUT FOR

▪ COMPOUND SEMICONDUCTOR-BASED POWER MARKET COMPARATIVE ANALYSIS▪ Power device as a function of power & frequency

▪ Power device market revenues : SiC vs. GaN vs SI

▪ POWER SIC MARKET OVERVIEW

▪ Power SiC device market dynamics

▪ Power SiC open epiwafer market dynamics

▪ Power SiC wafer market dynamics

▪ Power SiC device market revenue

▪ Power Sic epiwafer market shipments

▪ Power SiC open epiwafer market revenue

▪ Power SiC wafer shipments

▪ Power SiC wafer market revenue

▪ Power SiC wafer pricing

▪ Power SiC epiwafer pricing

▪ Quarterly Power SiC device revenue: Near term

▪ Quarterly Power SiC device revenue: Long term

▪ Quarterly Power SiC wafer revenue: Near term

▪ Quarterly Power SiC wafer revenue: Long term

▪ Quarterly Power SiC open epiwafer revenue: Near term

▪ Quarterly Power SiC open epiwafer revenue: Long term

▪ POWER SIC MARKET FORECASTS

▪ Power SiC device market by segment

▪ Power SiC device market shares

▪ Power SiC open epiwafer market by segment

▪ Power SiC open epiwafer market share

▪ Power SiC wafer market by segment

▪ Power SiC wafer market shares

▪ POWER SIC TECHNOLOGY

▪ Power SiC device market by device type ($M)

▪ Power SiC bare die device market by device type ($M)

▪ SiC wafer development timeline

▪ Power SiC wafer market by wafer size ($M)

▪ Power SiC wafer market by wafer size (Units)

▪ Power SiC open epiwafer market by wafer size ($M)

▪ Power SiC open epiwafer market by wafer size (Units)

▪ POWER SIC MARKET PLAYERS

▪ STMicroelectronics - Power SiC device revenue

▪ Wolfspeed/CREE - Power SiC device revenue

▪ ROHM - Power SiC device revenue

▪ Infineon - Power SiC device revenue

▪ ON Semiconductor - Power SiC device revenue

▪ Mitsubishi Electric - Power SiC device revenue

▪ CREE - Power SiC epiwafer revenue

▪ Showa Denko - Power SiC epiwafer revenue

▪ CREE – Power SiC wafer revenue

▪ II-VI - Power SiC wafer revenue

(1/2)


http://www.yole.fr/

TABLE OF CONTENTS

▪ POWER GAN MARKET OVERVIEW

▪ Power GaN market dynamics

▪ Power GaN open epiwafer market dynamics

▪ Power GaN device market revenue

▪ Power GaN open epiwafer market revenue

▪ Power GaN open + captive epiwafer market shipments

▪ Power GaN open epiwafer market shipments

▪ Power GaN epiwafer pricing

▪ Quarterly Power GaN device revenue: Near term

▪ Quarterly Power GaN device revenue: Long term

▪ Quarterly Power GaN epiwafer revenue: Near term

▪ Quarterly Power GaN epiwafer revenue: Long term

▪ POWER GAN MARKET FORECASTS

▪ Power GaN device market by segment

▪ Power GaN device market share

▪ Power GaN open epiwafer market by segment

▪ Power GaN open epiwafer market share

▪ POWER GAN TECHNOLOGY

▪ Power GaN device market by device type

▪ Power GaN bare die device market by device type

▪ Power GaN device market by technology platform ($M)

▪ Power GaN open epiwafer market by wafer type (in units)

▪ Power GaN open epiwafer market by wafer size (in units)

▪ POWER GAN MARKET PLAYERS

▪ Infineon - Power GaN device revenue

▪ EPC - Power GaN device revenue

▪ Transphorm - Power GaN device revenue

▪ GaN Systems - Power GaN device revenue

▪ Power Integrations- Power GaN device revenue

▪ Navitas - Power GaN device revenue

▪ IQE - Power GaN epiwafer revenue

(2/2)


http://www.yole.fr/

TABLE OF CONTENTS

▪ COMPOUND SEMI. MONITOR TIMELINE

▪ MODULE II : TERMINOLOGY AND DEFINITIONS▪ Acronyms▪ Explanation and methodology▪ Open and Captive market▪ Formulas used ▪ Definition of estimated market, terminology at

substrate, epitaxy & device level▪ Supply chain & business model▪ Focus on Chinese ecosystem▪ Applicative RF Electronics market segments

▪ COMPOUND SEMICONDUCTOR-BASED RF MARKET COMPARATIVE ANALYSIS▪ RF device as a function of power & frequency▪ Technological requirements by application

▪ RF GaAs MARKET OVERVIEW

▪ RF GaAs die market dynamics

▪ RF GaAs open epiwafer market dynamics

▪ RF GaAs wafer market dynamics

▪ RF GaAs die market revenue

▪ RF GaAs epiwafer market shipments

▪ RF GaAs open epiwafer market revenue

▪ RF GaAs epiwafer pricing

▪ RF GaAs wafer shipments

▪ RF GaAs wafer market revenue

▪ RF GaAs wafer pricing

▪ Quarterly RF GaAs die revenue: Near term

▪ Quarterly RF GaAs die revenue: Long term

▪ Quarterly RF GaAs open epiwafer revenue: Near term

▪ Quarterly RF GaAs open epiwafer revenue: Long term

▪ Quarterly RF GaAs wafer revenue: Near term

▪ Quarterly RF GaAs wafer revenue: Long term

▪ RF GaAs MARKET FORECASTS

▪ RF GaAs die market by segment

▪ RF GaAs die market share by segment

▪ RF GaAs open epiwafer market by segment

▪ RF GaAs open epiwafer market share by segment

▪ RF GaAs wafer market by segment

▪ RF GaAs wafer market share by segment

▪ RF GaAs TECHNOLOGY

▪ RF GaAs die market by device type ($M)

▪ RF GaAs die market by functionality ($M)

▪ RF GaAs open epiwafer market by device type

▪ Rf GaAs wafer market by device type

▪ RF GaAs MARKET PLAYERS

▪ Skyworks - RF GaAs device revenue

▪ Qorvo - RF GaAs device revenue

▪ Broadcom - RF GaAs device revenue

▪ Murata - RF GaAs device revenue

▪ Fab capacities and locations

▪ IQE - RF GaAs epiwafer revenue

▪ Yole’s analysis of IQE’s activities

▪ VPEC - RF GaAs epiwafer revenue

▪ Freiberger Compound Materials - RF GaAs wafer revenue

▪ Sumitomo Electric - RF GaAs wafer revenue

▪ AXT - RF GaAs wafer revenue


http://www.yole.fr/

TABLE OF CONTENTS

▪ RF GaN MARKET OVERVIEW

▪ RF GaN market dynamics

▪ RF GaN open epiwafer market dynamics

▪ RF GaN S.I. SiC wafer market dynamics

▪ RF GaN device market revenue

▪ RF GaN open epiwafer market revenue

▪ RF GaN open + captive epiwafer market shipments

▪ RF GaN open epiwafer market shipments

▪ RF GaN S.I. SiC wafer market revenue

▪ RF GaN S.I. SiC wafer shipments

▪ RF GaN epiwafer pricing

▪ RF GaN S.I. SiC wafer pricing

▪ Quarterly RF GaN device revenue: Near term

▪ Quarterly RF GaN device revenue: Long term

▪ Quarterly RF GaN epiwafer revenue: Near term

▪ Quarterly RF GaN epiwafer revenue: Long term

▪ Quarterly RF GaN S.I. SiC wafer revenue: Near term

▪ Quarterly RF GaN S.I. SiC wafer revenue: Long term

▪ RF GaN MARKET FORECASTS

▪ RF GaN device market by segment

▪ RF GaN device market shares by segment

▪ RF GaN open epiwafer market by segment

▪ RF GaN open epiwafer market shares by segment

▪ RF GaN S.I. SiC wafer market by segment

▪ RF GaN S.I. SiC wafer market shares by segment

▪ RF GaN TECHNOLOGY

▪ RF GaN device market by device type

▪ RF GaN die device market by device type

▪ RF GaN device market by technology platform ($M)

▪ S.I. SiC wafer development timeline

▪ RF GaN S.I. SiC wafer market by wafer size (by value)

▪ RF GaN S.I. SiC wafer market by wafer size (in units)

▪ RF GaN open epiwafer market by wafer type (in units)

▪ RF GaN open epiwafer market by wafer size (in units)

▪ RF GaN MARKET PLAYERS

▪ Sumitomo Electric Device Innovations (SEDI) -RF GaN device revenue

▪ Qorvo - RF GaN device revenue

▪ Wolfspeed/Cree - RF GaN device revenue

▪ IQE - RF GaN epiwafer revenue

▪ Wolfspeed/Cree - RF GaN epiwafer revenue

▪ II-VI - RF GaN S.I. SiC wafer revenue

▪ Wolfspeed/Cree - RF GaN S.I. SiC wafer revenue


http://www.yole.fr/

9

COMPOUND SEMICONDUCTOR MONITOR - EVOLUTION

Compound Semiconductor Monitor

GaN & SiC Power

GaN & GaAs RF

GaAs & InP Photonics

(VCSELs & EELs)

Module I

Module II

Module III

2019 Q4 released

2020 Q3 released

Publication Date

Planned Q3 2021


http://www.yole.fr/

10

COMPOUND SEMICONDUCTOR MONITOR - TIMELINE

Dec

2019

March

2020

Jun

2020

Sep

2020

Dec

2020

March

2021

Jun

2021

Sep

2021

CS Monitor:

Module I

Q4 2019

CS Monitor

Module I

Q1 2020

update

CS Monitor

Module I

Q2 2020

update

CS Monitor

Module I

Module II

Q3 2020

update

CS Monitor

Module I

Module II

Q4 2020

update

CS Monitor

Module I

Module II

Q1 2021

update

CS Monitor

Module I

Module II

Q2 2021

update

CS Monitor

Module I

Module II

Module III

Q3 2021

update

Dec

2021

CS Monitor

Module I

Module II

Module III

Q4 2021

update

QUARTERLY MONITOR VERSION

PUBLICATION DATE

Each Quarterly Monitor version, labelled Qx, includes data from the former Quarter (Qx-1) as we need time to collect and

process the data from each company after their quarterly earnings release and after interviews with our analysts. For example,

this fourth release of the CS Monitor, labelled Q4 2020, is based on company data from Q3-2020.

This Monitor


http://www.yole.fr/

11

EXPLANATION OF CS MONITOR METHODOLOGY

Applicative power and RF electronics

markets

CS power and RF devices

CS epiwafer CS wafer

CS wafer CS

epiwafer

Top-down approach

Bottom-up approach

MONITOR

Consumer

Automotive

Transporta-

tion

Industrial

Telecom and

Infrastructure

Energy

Module I: SiC and GaN power devices

Module II: GaAs and GaN RF devices

Defense


http://www.yole.fr/

http://www.yole.fr/

12

• As indicated on the previous slide, there are different business models with different levels of integration in Power SiC business.• Some players are vertically integrated from module down to wafer, as is the case for Cree/Wolfspeed, ROHM and

STMicroelectronics.• Some players make epiwafer internally, such as Cree/Wolfspeed, Infineon and many others.• Some players, such as Semikron, Danfoss and others, make only module packages and buy dies from Cree, ROHM and others.

• In this context, we need to precisely define the market and the supplier revenue that we estimate:• Device level

• Device market: device market accessible by the suppliers of SiC technology. We estimate the penetration rate of SiC technology with regards to TAM* in the market size forecast.

• Device supply: we include the revenue of both the device players and module players. For example, Cree/Wolfspeed is selling their SiC dies to module packagers. Thus there is double counting. This is common in the Si semiconductor business, such as TSMC is delivering devices to numerous fabless companies. Therefore, in the Monitor, the total revenue of different device suppliers ($M) are larger than the device market ($M) estimated from a top-down approach. We are expecting that the ratio of the suppliers’ revenue over estimated market size from the top down approach will increase over the years as the module business is expected to increase in the future and there are more die business.

• Epiwafer level• Both captive and open markets are counted for the market in terms of volume (units). Only open market is counted for the

market size ($M) as the internal transfer pricing of numerous players are unknown to us. An outsourcing ratio is used to estimate the open market size ($M).

• Epiwafer market: derived from device market. • Epiwafer supply: only wafers that are sold are counted. For example, for Cree/Wolfspeed, we do not include its internal

consumption. As we do not have access to their internal transfer pricing, we assume that there is no price difference. o Wafer level:

• Both captive and open markets are counted. • Wafer market: derived from device market.• Wafer supply: includes captive market. For example, for Cree/Wolfspeed, we include its internal consumption. As we do not

have access to its internal transfer pricing, we assume that there is no price difference.

POWER SIC: CAPTIVE AND OPEN MARKETS:

Which market and which revenue do we estimate in the Monitor?

* TAM: Total Accessible MarketCompound Semiconductor Quarterly Market Monitor | Sample | www.yole.fr | © 2020

http://www.yole.fr/

13

APPLICATIVE POWER ELECTRONICS MARKET SEGMENTS

• Home appliances

• Mobile fast charging

• Wireless charging

• Audio & Image

Consumer

•EV/HEV

•LIDAR in autonomous vehicles

Automotive

•Wind

•Photovoltaics

Energy

•Rail

Transportation

•Data center, servers

•Envelope tracking

Telecom & Infrastructure

•UPS

•Motor drives

• Industrial power supply

•LIDAR

•EV charging infrastructure

Industrial

•Defense

•Aerospace applications

•Medical

Others

• For the top down approach, all end system numbers are extracted from Yole’s internal database.

• In order to highlight the different market dynamics of the Power Electronics industry, our analyses are categorized into major

applicative market segments as shown below.

• In particular, as the primary driver for SiC market and an important driver for future GaN market, automotive is an independent

segment. Photovoltaics and Wind are positioned in the energy segment. For smaller market contributors, such as Defense or

medical, we have placed them in “others”.

• At Yole Developpement, the following end-applicative markets are tracked :

Mobile &

Consumer

Automotive &

MobilityTelecom &

Infrastructure

Defense &

Aerospace

Industrial Medical


http://www.yole.fr/

14

APPLICATIVE RF ELECTRONICS MARKET SEGMENTS

• Handset RFFE

• Connectivity (handset, box, non-handset)

• RF Energy

Consumer

• Automotive radar

• Connectivity V2X

Automotive

• Military Radar

• Electronic Warfare

• Military Communication

Defense

• Macrocells RRH

• Macrocells Active Antenna Systems

• Small Cells

• Wireless Backhaul

• Wired Broadband

Telecom & Infrastructure

• Satellite Communication

• Civil Radar

Aerospace

• For the top-down approach, all end system numbers are extracted from Yole’s internal database.

• In order to highlight the different market dynamics of the RF Electronics industry, our analyses are categorized into major applicative

market segments as shown below.

• At Yole Développement, the following end-applicative markets are tracked :

Mobile &

Consumer

Automotive &

Mobility

Telecom &

InfrastructureDefense Aerospace


http://www.yole.fr/

15

FORMULA USED IN THE MONITOR

ASP: Average selling price

o ASP is the average selling price of a product across the market as a whole.

o e.g. in calculating the ASP of GaN epi-wafer: 𝐴𝑆𝑃 =𝑁𝑒𝑡 𝑟𝑒𝑣𝑒𝑛𝑢𝑒

𝑛𝑢𝑚𝑏𝑒𝑟 𝑜𝑓 𝑝𝑟𝑜𝑑𝑢𝑐𝑡𝑠 𝑠𝑜𝑙𝑑

YoY: Year-over-year growth

o The year-over-year growth rate calculates the percentage change during the past twelve months.

o e.g. the yearly growth for 2019 : 𝑌𝑜𝑌2019 =𝑌2019−𝑌2018

𝑌2018× 100 (%)

QoQ: Quarter-on-quarter

o Similar to YoY, quarter-over-quarter growth rate calculates the percentage change of one period with the same period from the previous year.

o e.g. the growth for the 3rd quarter, Q3, of 2019 : (𝑄𝑜𝑄3)2019=(𝑄3)2019−(𝑄3)2018

(𝑄3)2018× 100 (%)

Q/Q: Quarter-over-quarter

o quarter-over-quarter growth rate calculates the percentage change of one period with the previous period of the same year.

o e.g. the growth for the 3rd quarter, Q3, of 2019 : (𝑄/𝑄3)2019=(𝑄3)2019−(𝑄2)2019

(𝑄2)2019× 100 (%)

QoQ is commonly used for financial reports, while it is more relevant to report the Q/Q for SiC and GaN market which is growing very rapidly, in our opinion. We therefore report both QoQ & Q/Q in the quarter market overview forecasts and Q/Q for the rest.


http://www.yole.fr/

16

RF GAAS DIE MARKET DYNAMICS (2019-2025)


http://www.yole.fr/

17

POWER SIC DEVICE MARKET DYNAMICS


http://www.yole.fr/

18

POWER GAN DEVICE MARKET DYNAMICS AND NEAR TERM DEVICE REVENUE

Die Market Revenues

Die Market Revenues: Quarterly updated

Die Revenues (in $M) Q1-19 Q2-19 Q3-19 Q4-19 Q1-20 Q2-20 Q3-20 Q4-20 Q1-21 Q2-21 Q3-21 Q4-21 Q1-22 Q2-22 Q3-22

Skyworks x x x x x x x x x x x x x x x

Qorvo x x x x x x x x x x x x x x x

Broadcom x x x x x x x x x x x x x x x

Murata x x x x x x x x x x x x x x x

Others x x x x x x x x x x x x x x x

Forecast x x x x x x x x x x x x x x x

Total x x x x x x x x x x x x x x x

Revenue growth Q/Q (%) x x x x x x x x x x x x x x x

Revenue growth QoQ (%) x x x x x x x x x x x x x x x


http://www.yole.fr/

19

RF GAAS DEVICE MARKET DYNAMICS AND NEAR TERM DEVICE REVENUE


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20

Contact our

Sales Team

for more

information

Power SiC: Materials, Devices and

Applications 2020

Power GaN 2019: Epitaxy, Devices, Applications & Technology Trends

YOLE GROUP OF COMPANIES RELATED REPORTS

YOLE DEVELOPPEMENT

GaN RF Market: Applications, Players, Technology and Substrates 2020

GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV

Applications 2020


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https://www.i-micronews.com/products/power-sic-materials-devices-and-applications-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_Monitor_CS_Dec2020

https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_Monitor_CS_Dec2020

https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_Monitor_CS_Dec2020

https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/

https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_VCSELs_October2020

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https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/

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Sales Team

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information

SiC MOSFET Comparison 2019GaN-on-Si HEMT vs SuperjunctionMOSFET Comparison 2019

YOLE GROUP OF COMPANIES RELATED REPORTS

SYSTEM PLUS CONSULTING

SiC MOSFET Comparison 2019SiC Diode Comparison 2020 GaN Power Transistor Comparison

2020


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https://www.i-micronews.com/products/sic-mosfet-comparison-2019/

https://www.i-micronews.com/products/gan-on-si-hemt-vs-superjunction-mosfet-comparison-2019/

https://www.i-micronews.com/products/gan-on-si-hemt-vs-superjunction-mosfet-comparison-2019/



https://www.i-micronews.com/products/sic-diode-comparison-2020/

https://www.i-micronews.com/products/gan-power-transistor-comparison-2020/


https://www.i-micronews.com/products/sic-diode-comparison-2020/

https://www.i-micronews.com/products/gan-power-transistor-comparison-2020/

YDM20075Q4 Compound Semiconductor Quarterly Market … · 2020. 12. 17. · Contact: [email protected] Ezgi Dogmus -Team Lead Analyst, Compound Semiductors Ezgi Dogmus, PhD.

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