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Product family data sheet

c Xlp Xm-l led

WWW.CRee.COM/XLAMP

Copyright 2010 Cr, Inc. All rights rsrd. Th information in this documnt is subjct to chang without notic.Cr, th Cr logo and XLamp ar rgistrd tradmarks of Cr, Inc.

Product descriPtionTh XLamp XM-L LeD is th

industrys highst prformanc,

singl-di whit lighting-class LeD.

Th XLamp XM-L is 20% mor

efcient than the XLamp XP-G at

th sam currnt, and can dlir

1000 lumns with 100 lumns pr

watt efcacy. The XLamp XM-L

LeD offrs Crs industry-lading

faturs: wid iwing angl,symmtrical packag, unlimitd

oor life and electrically neutral

thrmal path.

XLamp XM-L LeDs can nabl

LeD light into nw applications

that rquir tns of thousands of

lumns, such as high bay and high-

output ara lighting. Th XM-L is

also th idal choic for lightingapplications whr high light output

and maximum efcacy are required,

such as LeD light bulbs, outdoor

lighting, portabl lighting, indoor

lighting and solar-powrd lighting.

features Maximum dri currnt:

3000 mA

Low thrmal rsistanc:

2.5 C/W

Maximum junction

tmpratur: 150 C

viwing angl: 125

Aailabl in cool whit, 80-CRI

minimum nutral whit and 80-

CRI, 85-CRI and 90-CRI warm

whit

ANSI-compatibl chromaticity

bins

Unlimited oor life at

30 C/85% RH

Reow solderable -

JeDeC J-STD-020C

elctrically nutral thrmal

path

taBle of contents

Cr, Inc4600 Silicon Dri

Durham, NC 27703USA Tl: +1.919.313.5300

www.cr.com/xlamp

Copyright 2010-2012 Cr, Inc. All rights rsrd. Th information in this documnt is subjct to chang without notic.Cr, th Cr logo and XLamp ar rgistrd tradmarks of Cr, Inc.

Cr, Inc4600 Silicon Dri

Durham, NC 27703USA Tl: +1.919.313.5300

Flux Charactristics.................... 2

Charactristics .......................... 3

Rlati Spctral Powr

Distribution............................... 3

Rlati Flux s. Junction

Tmpratur ............................. 4

elctrical Charactristics ............. 4

Thrmal Dsign ......................... 5

Rlati Flux s. Currnt ............ 5

Rlati Chromaticity s. Currnt

(Cool Whit) ............................. 6

Rlati Chromaticity s.

Tmpratur (Cool Whit) ........... 6

Rlati Chromaticity s. Currnt

(Warm Whit) ........................... 7

Rlati Chromaticity s.

Tmpratur (Warm Whit) ......... 7

Typical Spatial Distribution .......... 8

Reow Soldering Characteristics .. 9

Nots ......................................10

Mchanical Dimnsions..............11

Tap and Rl ..........................12

Packaging ................................13

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Copyright 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

2

Copyright 2010-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registeredtrademarks of Cree, Inc.

2

fluX characteristics (tJ= 25 c)

Th following tabl proids sral bas ordr cods for XLamp XM-L LeDs. It is important to not that th bas ord

cods listd hr ar a subst of th total aailabl ordr cods for th product family. For mor ordr cods, as wll asa complt dscription of th ordr-cod nomnclatur, plas consult th XLamp XM-L Binning and Labling documnt

ccct rg

B o cm. l fx

@ 700 a ()

c ml fx ()*

o c

m. mx. Gp fx () 1000 a 1500 a 2000 a

Cool Whit 5,000 K 8,300 K

T5 260 360 511 643 XMLAWT-00-0000-0000T5051

T6 280 388 551 692 XMLAWT-00-0000-0000T6051

U2 300 416 590 742 XMLAWT-00-0000-0000U2051

Nutral Whit 3,700 K 5,000 KT4 240 332 472 593 XMLAWT-00-0000-000LT40e4

T5 260 360 511 643 XMLAWT-00-0000-000LT50F4

80-CRI Whit 2,600 K 4,300 KT2 200 277 393 494 XMLAWT-00-0000-000HT20E7

T3 220 305 433 544 XMLAWT-00-0000-000HT30F7

Warm Whit 2,600 K 3,700 KT2 200 277 393 494 XMLAWT-00-0000-000LT20e7

T3 220 305 433 544 XMLAWT-00-0000-000LT30F7

85-CRI Whit 2,600 K 3,200 K

S4 164 227 323 406 XMLAWT-00-0000-000PS40e7

S5 172 238 338 425 XMLAWT-00-0000-000PS50e7

S6 182 252 358 450 XMLAWT-00-0000-000PS60e7

90-CRI Whit 2,600 K 3,200 K

S4 164 227 323 406 XMLAWT-00-0000-000US40e7

S5 172 238 338 425 XMLAWT-00-0000-000US50e7

S6 182 252 358 450 XMLAWT-00-0000-000US60e7

Nots:

Cree maintains a tolerance of 7% on ux and power measurements, 0.005 on chromaticity (CCx, CCy)

masurmnts and 2 on CRI masurmnts.

Typical CRI for Cool Whit (5,000 K 8,300 K CCT) is 65.

Typical CRI for Nutral Whit (3,700 K 5,000 K CCT) is 75.

Typical CRI for Warm Whit (2,600 K 3,700 K CCT) is 80.

Minimum CRI for 80-CRI Whit is 80.



* Calculated ux values are for reference only.

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characteristics

c u m tp mx

Thrmal Rsistanc, junction to soldr point C/W 2.5

Viewing Angle (FWHM) dgrs 125

Temperature coefcient of voltage mv/C -3.0

ESD Classication (HBM per Mil-Std-883D) Class 2

DC Forward Currnt mA 3000

Rrs voltag v 5

Forward oltag (@ 700 mA) v 2.9 3.5

Forward oltag (@ 1500 mA) v 3.1

Forward oltag (@ 3000 mA) v 3.35

LeD Junction Tmpratur C 150

relative sPectral Power distriBution

Relative Spectral Power

0

20

40

60

80

100

400 450 500 550 600 650 700 750

RelativeRad

iantPower(%)

Wavelength (nm)

2600K -3700K CCT

3700K - 5000K CCT

5000K - 8300K CCT

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relative fluX vs. Junction temPerature (if= 700 ma)

electrical characteristics (tJ= 25 c)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

25 50 75 100 125 150

RelativeLuminousFlux

Junction Temperature (C)

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

2400

2600

2800

3000

2.00 2.20 2.40 2.60 2.80 3.00 3.20 3.40 3.60

ForwardCurrent(mA)

Forward Voltage (V)

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thermal desiGn

Th maximum forward currnt is dtrmind by th thrmal rsistanc btwn th LeD junction and ambint. It is

crucial for th nd product to b dsignd in a mannr that minimizs th thrmal rsistanc from th soldr point toambint in ordr to optimiz lamp lif and optical charactristics.

relative fluX vs. current (tJ

= 25 c)

esign

0

500

1000

1500

2000

2500

3000

3500

0 20 40 60 80 100 120 140

MaximumC

urrent(mA)

Ambient Temperature (C)

Rj-a = 4C/W

Rj-a = 7C/W

Rj-a = 10C/W

Rj-a = 15C/W

Typical Spatial Radiation Pattern

0%

25%

50%

75%

100%

125%

150%

175%

200%

225%

250%

275%

300%

325%

350%

0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000

RelativeLuminousFlux(%)

Forward Current (mA)

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relative chromaticity vs. current (cool white)

relative chromaticity vs. temPerature (cool white)

Cool White

-0.020-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0 500 1000 1500 2000 2500 3000

Current (mA)

CCx

CCy

Cool White

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

25 50 75 100 125 150

Tsp (C)

CCx

CCy

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relative chromaticity vs. current (warm white)

relative chromaticity vs. temPerature (warm white)

Warm White

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0 500 1000 1500 2000 2500 3000

Current (mA)

CCx

CCy

Warm White

-0.020

-0.015

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

25 50 75 100 125 150

Tsp (C)

CCx

CCy

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tyPical sPatial distriBution

0

20

40

60

80

100

120

-100 -80 -60 -40 -20 0 20 40 60 80 100

RelativeLuminousIntensity(%)

Angle ()

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reflow solderinG characteristics

In tsting, Cr has found XLamp XM-L LeDs to b compatibl with JeDeC J-STD-020C, using th paramtrs listd

below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by themanufacturr of soldr past usd.

Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.

Profle Feature l-B s l-f s

Arag Ramp-Up Rat (Tsmax to Tp) 3 C/scond max. 3 C/scond max.

Prhat: Tmpratur Min (Tsmin

) 100 C 150 C

Prhat: Tmpratur Max (Tsmax

) 150 C 200 C

Prhat: Tim (tsmin

to tsmax

) 60-120 sconds 60-180 sconds

Tim Maintaind Abo: Tmpratur (TL) 183 C 217 C

Tim Maintaind Abo: Tim (tL) 60-150 sconds 60-150 sconds

Peak/Classication Temperature (Tp) 215 C 260 C

Tim Within 5 C of Actual Pak Tmpratur (tp) 10-30 sconds 20-40 sconds

Ramp-Down Rat 6 C/scond max. 6 C/scond max.

Tim 25 C to Pak Tmpratur 6 minuts max. 8 minuts max.

Not: All tmpraturs rfr to th topsid of th packag, masurd on th packag body surfac.

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notes

Lumn Maintnanc Projctions

Cr now uss standardizd IeS LM-80-08 and TM-21-11 mthods for collcting long-trm data and xtrapolating LeDlumen maintenance. For information on the specic LM-80 data sets available for this LED, refer to the public LM-80

rsults documnt at www.cr.com/~/mdia/Fils/Cr/LeD%20Componnts%20and%20Moduls/XLamp/XLamp%20

Application%20Nots/LM80_Rsults.pdf.

Cree currently recommends a maximum drive current of 2000 mA for XLamp XM-L white in designs seeking the ENERGY

STAR* 35,000-hour lifetime rating ( 94.1% luminous ux @ 6000 hours) or 25,000-hour lifetime rating ( 91.8%

luminous ux @ 6000 hours).

Plas rad th XLamp Long-Trm Lumn Maintnanc application not for mor dtails on Crs lumn maintnanc

tsting and forcasting. Plas rad th XLamp Thrmal Managmnt application not for dtails on how thrmal dsign

ambint tmpratur, and dri currnt affct th LeD junction tmpratur.

* These lifetime ratings are based on the current ENERGY STAR Product Specication for Luminaires (Light Fixtures)

V1.0 (February 16, 2011) and ENERGY STAR Program Requirements for Integral LED Lamps V1.4 (May 13, 2011) lumen

maintnanc critria.

Moistur Snsitiity

In testing, Cree has found XLamp XM-L LEDs to have unlimited oor life in conditions 30 C/85% relative humidity

(RH). Moisture testing included a 168-hour soak at 85 C/85% RH followed by 3 reow cycles, with visual and electrica

inspctions at ach stag.

Cr rcommnds kping XLamp LeDs in thir sald moistur-barrir packaging until immdiatly prior to us. Cr

also rcommnds rturning any unusd LeDS to th rsalabl moistur-barrir bag and closing th bag immdiatly

aftr us.

vision Adisory Claim

WARNING: Do not look at exposed lamp in operation. Eye injury can result. See LED Eye Safety at www.cree.com/~/media

Fils/Cr/LeD%20Componnts%20and%20Moduls/XLamp/XLamp%20Application%20Nots/XLamp_eySafty.pdf.
http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/LM80_Results.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/LM80_Results.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/XLamp_EyeSafety.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/XLamp_EyeSafety.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/XLamp_EyeSafety.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/XLamp_EyeSafety.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/LM80_Results.pdfhttp://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/LM80_Results.pdf

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mechanical dimensions

All masurmnts ar .13 mm unlss othrwis indicatd

T T

T

T

T

T T

T

I I

I I II , I

I I I I , I . I

I I I I

I I . I I I

I .

I

.

5.00

5.00

3.02

0.5

0.5

2.8

3.8

4.8

0.73

.

. I

I

TI I

I I II , I

I I I I , I . I

I I I I

I I . I I I

I .

I

.

0.5

4.8

3.8

0.5

4.8

2.782

0.5

0.4

0.4

0.4

0.4

4.7

4.7

0.6

3.9

.

TT

.

T

.

T

T

T

T T

T

I I

-

-

.

. .

. I

tp v B vs v

r PcB s P r s P(s a i op)

Anod

Anod

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taPe and reel

All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.

All dimnsions in mm

TT

T

T

T

T

I I

-

-

, .

I I I

I , I

I I I I , I . I

I I I

I I . I I I

I .

I

330

+.25

-.75

12.4

+1.0

-.5

MEASURED AT EDGE

16.4

+0.2

.0

MEASURED AT HUB

12.4

+.2

.0

MEASURED AT HUB

.213.1

1.9.4

.421

60 60

TT

.

T

.

T

T

T

T T

T

I I

-

-

, .

I II

, I . I

I

I I

.

. .

. .

. .

. .

. .

.

.

.

Trailer160mm (min) of

empty pocketssealed with tape

(15 pockets min.)

Loaded Pockets(1000 Lamps)

Leader400mm (min.) of

empty pockets withat least 100mmsealed by tape

(40 empty pockets min.)

12

1.75

48 3.35

.

----

----

.

END START

User Feed Direction

CATHODE SIDE

ANODE SIDETT

T

.

T

T

T

T T

T

I I

-

.

.

.

.

.

2.00[.079]P2

4.00[.157]Po

Do1.50+.10-.00

.0591+.0039-.0000 [ ]

10.25[.404]

E2

12.00[.472]NOMINAL

12.30 [.484]

MAXW

1.75[.069]E1

5.50[.217]F

1.50[.059]D18.00[.315]

P

TT

.

T

.

T

T

T

T T

T

I I

-

.

-

.

.

.

5.40[.213]Ao

3.35[.1K

7.0

TT

T

.

T

T

T

T T

T

I I

-

.

-

.

.

.

.

.36[.014]T

3.0 5.40[.213]Bo

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PackaGinG

Patent Label

Label with Customer Order Code,

Qty, Reel ID, PO#

Label with Cree Bin Code,Qty, Lot #

CREE Bin Code& Barcode Label

Vacuum-SealedMoisture Barrier Bag

Label with CustomerP/N, Qty, Lot #, PO #

Label with Cree BinCode, Qty, Lot #

Label with Cree BinCode, Qty, Lot #

Vacuum-Sealed

Moisture Barrier Bag

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