Xerox Dielectric Coating and Printing Inksxrcc.external.xerox.com/edit/files/xerox-dielectric-coating-and... · Thickness After Cure 400 – 700 nm Surface Roughness < 10 nm Xerox

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Dielectric Solution Characteristics

Materials PerformanceCapacitance 7 – 8 nF/cm2

Thickness After Cure 400 – 700 nmSurface Roughness < 10 nm

Xerox dielectric material is a solution processable dielectric ink which yields uniform thin films exhibiting high capacitance.

Technology • Solution coatable and printable dielectric with

demonstrated performance in bottom-gateorganic thin film transistors

• High on/off ratio and low hysteresis observed whenpaired with a CNT or polymer semiconductor in TFTs

• Low surface roughness, pinhole free filims formed• Compatibile with Xerox silver nanoparticle inks

(xcm-nsIJ-RS1, xcm-nsPA-RS1)

Test samples were prepared by spin coating xdi-dcs (2000 rpm, 60 s) onto a conductive substrate. The sample was dried at 80 °C for 10 minutes, and cured at 140 °C for 30 minutes. 60 nm gold electrodes were evaporated onto the cured dielectric.

Xerox Dielectric Coating & Printing Inks Product Code: xdi-dcs; xdi-d1.2

Engage Us Michelle Chrétien, PhDElectronic Materials Business Manager

Xerox Research Centre of Canada2660 Speakman DriveMississauga, ONCanada L5K 2L1

[email protected]

www.xerox.ca/xrcc

Printing ConditionsAerosol Jet: Traces were printed on PC substrates using an Optomec Sprint system with a pneumatic atomizer. Stablemass output was achieved using the following conditions: 250 µm nozzle, 150 sccm sheath gas, 75 sccm push gas (N2).

Inkjet: Traces were printed using a Dimatix DMP 2800printer. 5 ng drops with drop velocity of 3 m/s at avoltage of 23 V with a 40 µm drop spacing were deposited on glass subtrate.

Viscosity (at 25 °C) 8 – 9 cpsSurface Tension 24 – 25 mN/mSolids Loading 12 – 13%Solvent System organicCure (thermal, in air) 140 °C / 30 minutesShelf-life up to two months