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XC9259 Series COT Control, 1.0A Synchronous Step-Down DC/DC
Converters
■GENERAL DESCRIPTION The XC9259 series is a group of
synchronous-rectification type DC/DC converters with a built-in
P-channel MOS driver transistor
and N-channel MOS switching transistor, designed to allow the
use of ceramic capacitors. Output voltage is internally set in a
range from 0.8V to 3.6V (accuracy: ±2.0%) increments of 0.05V. The
device provides a high efficiency, stable power supply with an
output current of 1.0A to be configured using only a coil and two
capacitors connected externally. Oscillation frequency is set to
1.2MHz or 6.0MHz can be selected for suiting to your particular
application. The operation mode is HISAT-COT (*) control, which has
an excellent transient response. PWM control or PWM/PFM auto
switching control can be selected at the MODE pin, and a
high-speed response, low ripple, and high efficiency are achieved
across the entire load range (from light loads to heavy loads).
During stand-by, all circuits are shutdown to reduce current
consumption to as low as 1.0μA or less. As for the soft-start
function
as fast as 0.3ms in typical for quick turn-on. With the built-in
UVLO (Under Voltage Lock Out) function, the internal P-channel MOS
driver transistor is forced OFF when input voltage becomes 2.00V or
lower. The B types integrate CL High Speed discharge function which
enables the electric charge at the output capacitor CL to be
discharged via the internal discharge. The package is the
ultra-small 1.2mm × 1.4mm × h0.3mm (LGA-8B01).
(*) HiSAT-COT is an original Torex term for High Speed Transient
Response.
■APPLICATIONS ●Mobile phones
●Bluetooth headsets
●Smart phones, Personal digital assistance
●Portable game consoles
●Digital still cameras, Camcorders
●Point-of-Load (POL)
●Wearable devices
■TYPICAL APPLICATION CIRCUIT
ETR05041-001
☆GreenOperation-compatible
■TYPICAL PERFORMANCE CHARACTERISTICS
■FEATURESInput Voltage Range : 2.5V~5.5V Output Voltage Range :
0.8V~3.6V (±2.0%) Oscillation Frequency : 1.2MHz, 6.0MHz Output
Current : 1A Control Methods : HiSAT-COT Control 100% Duty Cycle
PWM Control PWM/PFM Auto Protection Circuits : Thermal Shutdown
Current Limit (Pendent character) Short Circuit Protection (Type B)
Functions : Soft-Start UVLO CL High Speed Discharge (Type B)
Capacitor : Ceramic Capacitor Operating Ambient Temperature : - 40℃
~ + 105℃ Package : LGA-8B01 Environmentally Friendly : EU RoHS
Compliant, Pb Free
1.0ALx
VOUT
VIN
CE
VOUTVIN
CE
L
MODEAGND
PGND
MODECIN CL
NC
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B18C
PWM/PFM
PWM
VIN=3.7V
VIN=5.0VVIN=3.7V
VIN=5.0V
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
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XC9259 Series
■ BLOCK DIAGRAM
* Diodes inside the circuit are an ESD protection diode and a
parasitic diode.
* Diodes inside the circuit are an ESD protection diode and a
parasitic diode.
2) XC9259 Series Type B
1) XC9259 Series Type A
+
-
Vref withSoft Start
S
R
Q
MinimumOn Time
GeneratorVINVOUT
Synch.BufferDriver
Logic
High SideCurrent Limit
CE Control Logic,UVLO,
Thermal Shutdown
-
+
PhaseCompensation
Error Amp.Comparator
CFB
R2
R1
VOUT
AGND
MODE
Lx
VIN
CE PWM/PFMSelector
PGND
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3/28
XC9259Series
■PRODUCT CLASSIFICATION 1) Ordering Information XC9259①②③④⑤⑥-⑦
PWM Control ⇔PWM/PFM Automatic switching control DESIGNATOR ITEM
SYMBOL DESCRIPTION
① Type A
Refer to Selection Guide B
②③ Output Voltage 08~36
Output voltage options e.g. 1.2V → ②=1, ③=2 1.25V → ②=1, ③=C
0.05V increments : 0.05=A, 0.15=B, 0.25=C,
0.35=D, 0.45=E, 0.55=F, 0.65=H, 0.75=K, 0.85=L, 0.95=M
④ Oscillation Frequency C 1.2MHz
E 6.0MHz
⑤⑥-⑦ (*1) Package (Order Unit) 1R-G LGA-8B01 (5,000pcs/Reel) 2)
Selection Guide
TYPE OUTPUT VOLTAGE CL AUTO-DISCHARGESHORT PROTECTION
(LATCH) UVLO
A Fixed No No Yes
B Fixed Yes Yes Yes
TYPE CHIP ENABLE CURRENT LIMIT SOFT-START TIME THERMAL
SHUTDOWN
A Yes Yes Fixed Yes
B Yes Yes Fixed Yes
(*1) The “-G” suffix denotes Halogen and Antimony free as well
as being fully EU RoHS compliant.
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4/28
XC9259 Series
■PIN CONFIGURATION
* Please connect the AGND pin (No.2) and the PGND pin (No.4)
when operating.
■PIN ASSIGNMENT
PIN NUMBER PIN NAME FUNCTIONS
LGA-8B01
1 VOUT Output Voltage Monitor
2 AGND Analog Ground
3 Lx Switching Output
4 PGND Power Ground
5 VIN Power Input
6 MODE MODE
7 CE Chip Enable
8 NC No Connection
■FUNCTION 1) CE PIN Function
PIN NAME SIGNAL STATUS
CE L Stand-by
H Active Please do not leave the CE pin open. 2) MODE PIN
Function
PIN NAME SIGNAL STATUS
MODE L PWM/PFM automatic control
H PWM control Please do not leave the MODE pin open.
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5/28
XC9259Series
■ABSOLUTE MAXIMUM RATINGS Ta=25℃
PARAMETER SYMBOL RATINGS UNITS
VIN Pin Voltage VIN -0.3~+6.2 V
Lx Pin Voltage VLx -0.3~VIN+0.3 or +6.2 (*1) V
VOUT Pin Voltage VOUT -0.3~VIN+0.3 or +4.0 (*2) V
CE Pin Voltage VCE -0.3~+6.2 V
MODE Pin Voltage VMDOE -0.3~+6.2 V
Power Dissipation LGA-8B01 Pd 1000 (PCB mounted) mW
Operating Ambient Temperature Topr -40~+105 ℃
Storage Temperature Tstg -55~+125 ℃ All voltages are described
based on the GND (AGND and PGND) pin. (*1) The maximum value should
be either VIN+0.3V or +6.2V in the lowest. (*2) The maximum value
should be either VIN+0.3V or +4.0V in the lowest. .
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6/28
XC9259 Series
■ELECTRICAL CHARACTERISTICS XC9259 Series Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT
Output Voltage VOUT When connected to external components,
IOUT=30mA VMODE=VIN
V ①
Operating Voltage Range VIN - 2.5 - 5.5 V ①
Maximum Output Current IOUTMAX When connected to external
components (*1), VIN=
1000 - - mA ①
UVLO Voltage (*2) VUVLO VOUT = 0.6V,Voltage which Lx pin holding
“L” level (*5) 1.35 2.0 2.48 V ③
Quiescent Current Iq VOUT=VOUT(T) V × 1.1V fOSC=1.2MHz - 15.0
25.0
μA ② fOSC=6.0MHz - 40.0 70.0
Stand-by Current ISTB VCE=0.0V - 0.0 1.0 μA ②
Minimum ON time tONmin When connected to external components,
VIN=VCE=, IOUT=1mA
ns ①
Thermal shutdown TTSD - - 150 - ℃ ①
Thermal shutdown hysteresis THYS - - 30 ℃ ①
Lx SW”H”ON Resistance RLXH VOUT=0.6V, ILX=100mA (*3) - 0.18 0.32
Ω ④
Lx SW”L”ON Resistance RLXL VOUT=VOUT(T) V × 1.1, VMODE=5.0V
ILX=100mA (*3) - 0.12 0.24 Ω ④
Lx SW”H” Leakage Current ILeakH VIN=5.5V, VCE=0.0V, VOUT = 0.0V,
VLX=5.5V - 0.0 30.0 μA ⑤
Lx SW”L” Leakage Current IleakL VIN=5.5V, VCE=0.0V, VOUT=0.0V,
VLX=0.0V - 0.0 1.0 μA ⑤
Current Limit (*4) ILIMH VOUT=0.6V ILx until Lx pin oscillates
1.3 1.5 2.5 A ⑥
Output Voltage Temperature
Characteristics
∆VOUT/ (VOUT・∆Topr)
IOUT=30mA, -40℃≦Topr≦105℃ - ±100 - ppm/℃ ①
CE ”H” Voltage VCEH VOUT=0.6V, Applied voltage to VCE, Voltage
changes Lx to “H” level (*5)
1.40 - 5.5 V ③
CE ”L” Voltage VCEL VOUT=0.6V, Applied voltage to VCE, Voltage
changes Lx to “L” level (*5)
AGND - 0.30 V ③
CE ”H” Current ICEH VIN=5.5V, VCE=5.5V, VOUT=0.0V -0.1 - 0.1 μA
⑤
CE ”L” Current ICEL VIN=5.5V, VCE=0.0V, VOUT=0.0V -0.1 - 0.1 μA
⑤
Soft-Start Time tSS VCE=0.0V → 5.0V VOUT=VOUT(T)V × 0.9 After
"H" is fed to CE, the time by when clocks are generated at Lx
pin.
0.10 0.30 0.50 ms ③
Short Protection Threshold
Voltage (Type B) VSHORT
Sweeping VOUT, VOUT voltage which Lx becomes “L” level (*5)
0.17 0.27 0.37 V ③
CL Discharge (Type B) RDCHG VCE=0.0V, VOUT=4.0V 50 210 300 Ω
⑦
MODE ”H” Voltage VMODEH Applied voltage to VMODE, Voltage for
PWM Control 1.40 - 5.5 V ①
MODE ”L” Voltage VMODEL Applied voltage to VMODE, Voltage for
PWM/PFM automatic control
AGND - 0.30 V ①
MODE ”H” Current IMODEH VIN=5.5V, VCE=5.5V, VOUT=0.0V VMODE=5.5V
-0.1 - 0.1 μA ⑤
MODE ”L” Current IMODEL VIN=5.5V, VCE=5.5V, VOUT=0.0V VMODE=0.0V
-0.1 - 0.1 μA ⑤
Unless otherwise stated, VIN=5.0V,VCE=5.0V, VMODE=0V,
VOUT(T)=Nominal Value NOTE: (*1) When the difference between the
input and the output is small, 100% duty might come up and internal
control circuits keep P-ch driver turning
on even though the output current is not so large. If current is
further pulled from this state, output voltage will decrease
because of P-ch driver ON resistance.
(*2) Including UVLO detect voltage, hysteresis operating voltage
range for UVLO release voltage. (*3) RLXH=(VIN - Lx pin measurement
voltage) / 100mA, RLXL=Lx pin measurement voltage / 100mA (*4)
Current limit denotes the level of detection at peak of coil
current. (*5)
"H"=VIN - 1.2V ~ VIN, "L"=- 0.1V ~ + 0.1V
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7/28
XC9259Series
■ELECTRICAL CHARACTERISTICS (Continued) SPEC Table
NOMINAL OUTPUT
VOLTAGE
VOUT tONmin
fOSC = 1.2MHz fOSC = 6.0MHz
VOUT(T) MIN. TYP. MAX. VIN MIN. TYP. MAX. MIN. TYP. MAX.
0.80 0.784 0.800 0.816 2.50 173 247 321 16 53 91
0.85 0.833 0.850 0.867 2.50 184 262 341 18 57 95
0.90 0.882 0.900 0.918 2.50 194 278 361 21 60 99
0.95 0.931 0.950 0.969 2.50 205 293 381 23 63 104
1.00 0.980 1.000 1.020 2.50 216 309 401 26 67 108
1.05 1.029 1.050 1.071 2.50 227 324 421 29 70 112
1.10 1.078 1.100 1.122 2.50 238 340 441 31 73 115
1.15 1.127 1.150 1.173 2.50 248 355 461 35 77 119
1.20 1.176 1.200 1.224 2.50 259 370 481 38 80 122
1.25 1.225 1.250 1.275 2.50 270 386 502 41 83 126
1.30 1.274 1.300 1.326 2.50 281 401 522 45 87 129
1.35 1.323 1.350 1.377 2.50 292 417 542 48 90 132
1.40 1.372 1.400 1.428 2.50 302 432 562 52 93 135
1.45 1.421 1.450 1.479 2.50 313 448 582 56 97 137
1.50 1.470 1.500 1.530 2.50 324 463 602 60 100 140
1.55 1.519 1.550 1.581 2.58 335 478 622 60 100 140
1.60 1.568 1.600 1.632 2.67 346 494 642 60 100 140
1.65 1.617 1.650 1.683 2.75 350 500 650 60 100 140
1.70 1.666 1.700 1.734 2.83 350 500 650 60 100 140
1.75 1.715 1.750 1.785 2.92 350 500 650 60 100 140
1.80 1.764 1.800 1.836 3.00 350 500 650 60 100 140
1.85 1.813 1.850 1.887 3.08 350 500 650 60 100 140
1.90 1.862 1.900 1.938 3.17 350 500 650 60 100 140
1.95 1.911 1.950 1.989 3.25 350 500 650 60 100 140
2.00 1.960 2.000 2.040 3.33 350 500 650 60 100 140
2.05 2.009 2.050 2.091 3.42 350 500 650 60 100 140
2.10 2.058 2.100 2.142 3.50 350 500 650 60 100 140
2.15 2.107 2.150 2.193 3.58 350 500 650 60 100 140
2.20 2.156 2.200 2.244 3.67 350 500 650 60 100 140
2.25 2.205 2.250 2.295 3.75 350 500 650 60 100 140
2.30 2.254 2.300 2.346 3.83 350 500 650 60 100 140
2.35 2.303 2.350 2.397 3.92 350 500 650 60 100 140
2.40 2.352 2.400 2.448 4.00 350 500 650 60 100 140
2.45 2.401 2.450 2.499 4.08 350 500 650 60 100 140
2.50 2.450 2.500 2.550 4.17 350 500 650 60 100 140
2.55 2.499 2.550 2.601 4.25 350 500 650 60 100 140
2.60 2.548 2.600 2.652 4.33 350 500 650 60 100 140
2.65 2.597 2.650 2.703 4.42 350 500 650 60 100 140
2.70 2.646 2.700 2.754 4.50 350 500 650 60 100 140
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8/28
XC9259 Series
■ELECTRICAL CHARACTERISTICS (Continued) SPEC Table
NOMINAL OUTPUT
VOLTAGE
VOUT tONmin
fOSC=1.2MHz fOSC=6.0MHz
VOUT(T) MIN. TYP. MAX. VIN MIN. TYP. MAX. MIN. TYP. MAX.
2.75 2.695 2.750 2.805 4.58 350 500 650 60 100 140
2.80 2.744 2.800 2.856 4.67 350 500 650 60 100 140
2.85 2.793 2.850 2.907 4.75 350 500 650 60 100 140
2.90 2.842 2.900 2.958 4.83 350 500 650 60 100 140
2.95 2.891 2.950 3.009 4.92 350 500 650 60 100 140
3.00 2.940 3.000 3.060 5.00 350 500 650 60 100 140
3.05 2.989 3.050 3.111 5.08 350 500 650 60 100 140
3.10 3.038 3.100 3.162 5.17 350 500 650 60 100 140
3.15 3.087 3.150 3.213 5.25 350 500 650 60 100 140
3.20 3.136 3.200 3.264 5.33 350 500 650 60 100 140
3.25 3.185 3.250 3.315 5.42 350 500 650 60 100 140
3.30 3.234 3.300 3.366 5.50 350 500 650 60 100 140
3.35 3.283 3.350 3.417 5.50 355 508 660 61 102 142
3.40 3.332 3.400 3.468 5.50 361 515 670 62 103 144
3.45 3.381 3.450 3.519 5.50 366 523 680 63 105 146
3.50 3.430 3.500 3.570 5.50 371 530 689 64 106 148
3.55 3.479 3.550 3.621 5.50 377 538 699 65 108 151
3.60 3.528 3.600 3.672 5.50 382 545 709 65 109 153
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9/28
XC9259Series
■TEST CIRCUITS
< Circuit No.① > < Circuit No.② >
< Circuit No.③ > < Circuit No.④ >
A
1μF
V
< Circuit No.⑥ >< Circuit No.⑤ >
AICEH
ICEL
A
1uFRpulldown200Ω
Wave Form Measure Point
※ External ComponentsfOSC = 1.2MHz L :
4.7μH(LTF5022T-4R7N2R0-LC) CIN : 10μF(ceramic)CL :
10μF(ceramic)
A
V RLCL
L
CIN
Wave Form Measure Point
1μF
RLXH = (VIN-VLx)/ILXRLXL = VLx/ILX
ILX
VIN LX
AGND
CE VOUT
PGND
NC MODE
VIN LX
AGND
CE VOUT
PGND
NC MODE
VIN LX
AGND
CE VOUT
PGND
NC MODE
1uF
VIN LX
AGND
CE VOUT
PGND
NC MODE
VIN LX
AGND
CE VOUT
PGND
NC MODE A
IMODEH
IMODEL
ILeakH
ILeakL
1uF
VIN LX
AGND
CE VOUT
PGND
NC MODE
V
ILIML
Wave Form Measure Point
ILIMH
1uF
VIN LX
AGND
CE VOUT
PGND
NC MODE
IVOUT
A
< Circuit No.⑦ >B TYPE
※ External ComponentsfOSC = 6.0MHz L : 0.47μH(LQM2MPNR47MGH) CIN
: 10μF(ceramic)CL : 20μF(ceramic)
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10/28
XC9259 Series
■TYPICAL APPLICATION CIRCUIT
1.0ALx
VOUT
VIN
CE
VOUTVIN
CE
L
MODEAGND
PGND
MODECIN CL
NC
【Typical Examples】fOSC=1.2MHz MANUFACTURER PRODUCT NUMBER
VALUE
L murata LQH5BPN4R7NT0L 4.7μH
TDK LTF5022T-4R7N2R0-LC 4.7μH Coilcraft XFL4020-472MEC 4.7μH
【Typical Examples】fOSC=6.0MHz MANUFACTURER PRODUCT NUMBER
VALUE
L
murata LQM2MPNR47MGH 0.47μH ALPS GLCLKR4701A 0.47μH
TAIYO YUDEN MAKK2016TR47M 0.47μH TDK MLP2520HR47MT0S1 0.47μH
【Typical Examples】(*1) fOSC=1.2MHz MANUFACTURER PRODUCT NUMBER
VALUE
CIN murata GRM155R61A106M 10μF/10V murata GRM21BR71A106KE51
10μF/10V
TAIYO YUDEN LMK212AB7106MG 10μ/10V
CL murata GRM155R61A106M 10μF/10V (*2) murata GRM21BR71A106KE51
10μF/10V (*2)
TAIYO YUDEN LMK212AB7106MG 10μF/10V (*2)
【Typical Examples】(*1) fOSC=6.0MHz MANUFACTURER PRODUCT NUMBER
VALUE
CIN murata GRM155R61A106M 10μF/10V murata GRM21BR71A106KE51
10μF/10V
TAIYO YUDEN LMK212AB7106MG 10μF/10V
CL murata GRM155R61A106M 10μF/10V 2parallelmurata
GRM21BR71A226KE51 22μF/10V
TAIYO YUDEN LMK212AB7226MG 22μF/10V
(*1) Select components appropriate to the usage conditions
(ambient temperature, input & output voltage).
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11/28
XC9259Series
■OPERATIONAL EXPLANATION The XC9259 series consists of a
reference voltage source, error amplifier, comparator, phase
compensation, minimum on time
generation circuit, output voltage adjustment resistors,
P-channel MOS driver transistor, N-channel MOS switching transistor
for the synchronous switch, current limiter circuit, UVLO circuit,
thermal shutdown circuit, short protection circuit, PWM/PFM
selection circuit and others. (See the BLOCK DIAGRAM below.)
BLOCK DIAGRAM XC9259 Series Type B
The method is HiSAT-COT (High Speed circuit Architecture for
Transient with Constant On Time) control, which features on
time control method and a fast transient response that also
achieves low output voltage ripple. The on time (ton) is determined
by the input voltage and output voltage, and turns on the Pch MOS
driver Tr. for a fixed time. During the off time (toff), the
voltage that is fed back through R1 and R2 is compared to the
reference voltage by the error amp, and the error amp output is
phase compensated and sent to the comparator. The comparator
compares this signal to the reference voltage, and if the signal is
lower than the reference voltage, sets the SR latch. On time then
resumes. By doing this, PWM operation takes place with the off time
controlled to the optimum duty ratio and the output voltage is
stabilized. The phase compensation circuit optimizes the frequency
characteristics of the error amp, and generates a ramp wave similar
to the ripple voltage that occurs in the output to modulate the
output signal of the error amp. This enables a stable feedback
system to be obtained even when a low ESR capacitor such as a
ceramic capacitor is used, and a fast transient response and
stabilization of the output voltage are achieved. Generates an on
time that depends on the input voltage and output voltage (ton).
The on time is set as given by the equations
below. fOSC≒1.2MHz type ton (μs) = VOUT/VIN×0.833 fOSC≒6.0MHz
type ton (μs) = VOUT/VIN×0.167
The switching frequency can be obtained from the on time (ton),
which is determined by the input voltage and output voltage,
and the PWM controlled off time (toff) as given by the equation
below. fOSC (MHz) = VOUT(V) / (VIN(V)×ton(μs))
When the load current is heavy and the voltage difference
between input voltage and output voltage is small, 100% duty
cycle
mode is activated and it keeps the Pch MOS driver Tr. keep on.
100% duty cycle mode attains a high output voltage stability and a
high-speed response under all load conditions, from light to heavy,
even in conditions where the dropout voltage is low. The error amp
monitors the output voltage. The voltage divided by the internal R1
and R2 resistors is a feedback voltage for
Error Amp. and compared to the reference voltage. The output
voltage of the error amp becomes higher when the feedback voltage
is higher than the reference voltage. The frequency characteristics
of the error amp are optimized internally.
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12/28
XC9259 Series
■OPERATIONAL EXPLANATION (Continued) The reference voltage forms
a reference that is used to stabilize the output voltage of the
IC.
After “H” level is fed to CE pin, the reference voltage
connected to the error amp increases linearly during the soft start
interval. This allows the voltage divided by the internal R1 and R2
resistors and the reference voltage to be controlled in a balanced
manner, and the output voltage rises in proportion to the rise in
the reference voltage. This operation prevents rush input current
and enables the output voltage to rise smoothly. If the output
voltage does not reach the set output voltage within the soft start
time, such as when the load is heavy or a large
capacity output capacitor is connected, the balancing of the
voltage divided by the internal resistors R1 and R2 and the
reference voltage is lost, however, the current restriction
function activates to prevent an excessive increase of input
current, enabling a smooth rise of the output voltage. XC9259
series is selectable on the control method between PWM control and
PWM/PFM auto switching control by using MODE pin.
When “H” level is fed to MODE pin, XC9259works with PWM control,
whereas when “L” level is fed to MODE pin, it works with PWM/PFM
auto switching control. Under PWM control, XC9259 works with the
continuous conduction mode (CCM) and ON-duty is decided based on
the
relationship between the input voltage and the output voltage
regardless the output current, and the switching frequency is
stable. On the other hand, under PWM/PFM auto switching control,
XC9259 can work with the discontinuous conduction mode (DCM)
when the output current is low and the switching frequency
varies to lower frequency so that the switching loss reduces and,
as a result, the efficiency is improved. MODE pin has CMOS input
configuration and the sink current is 0μA.
Operation starts when “H” voltage is fed to the CE pin. The IC
can be put in the shutdown state by inputting “L” voltage into
the
CE pin. In the shutdown state, the supply current of the IC is
0μA (TYP.), and the Pch MOS driver Tr. and Nch MOS switch Tr. for
synchronous rectification turn off. The CE pin is a CMOS input and
the sink current is 0μA. When the VIN voltage becomes 2.00V (TYP.)
or lower, the P-ch MOS driver transistor output driver transistor
is forced OFF to
prevent false pulse output caused by unstable operation of the
internal circuitry. When the VIN pin voltage becomes 2.10V (TYP.)
or higher, switching operation takes place. By releasing the UVLO
function, the IC performs the soft start function to initiate
output startup operation. The UVLO circuit does not cause a
complete shutdown of the IC, but causes pulse output to be
suspended; therefore, the internal circuitry remains in operation.
For protection against heat damage of the ICs, thermal shutdown
function monitors chip temperature. The thermal shutdown
circuit starts operating and the P-ch MOS driver and N-ch MOS
driver transistor will be turned off when the chip’s temperature
reaches 150℃. When the temperature drops to 120℃ (TYP.) or less
after shutting of the current flow, the IC performs the soft-start
function to initiate output startup operation. The B type
short-circuit protection circuit protects the device that is
connected to this product and to the input/output in
situations such as when the output is accidentally shorted to
GND. The short-circuit protection circuit monitors the output
voltage, and when the output voltage falls below the short-circuit
protection threshold voltage, it turns off the Pch MOS driver Tr
and latches it. Once in the latched state, operation is resumed by
turning off the IC from the CE pin and then restarting, or by
re-input into the VIN pin. The B type can quickly discharge the
electric charge at the output capacitor (CL) when a low signal to
the CE pin which
enables a whole IC circuit put into OFF state, is inputted via
the N-ch MOS switch transistor located between the VOUT pin and the
GND pin. When the IC is disabled, electric charge at the output
capacitor (CL) is quickly discharged so that it may avoid
application malfunction.
V=VOUT(T)×e – t /τ t=τln (VOUT(T) / V) V: Output voltage after
discharge VOUT(T): Output voltage t: Discharge time τ: CL×RDCHG CL:
Capacitance of Output capacitor RDCHG: CL auto-discharge
resistance,
but it depends on supply voltage.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 2 4 6 8 10 12 14 16 18 20
Discharge Time: t(ms)
Output Voltage: VOUT(V)
-
--
---
Output Voltage Dischage characteristicsRDCHG = 210Ω(TYP)
CL=10μF
VOUT = 1.2VVOUT = 1.8VVOUT = 3.3V
-
13/28
XC9259Series
■OPERATIONAL EXPLANATION (Continued) The current limiter circuit
of the XC9259 series monitors the current flowing through the
P-channel MOS driver transistor connected to the Lx pin. When the
driver current is greater than a specific level, the current limit
function operates to turn off the pulses from the Lx pin at any
given timing. When the over current state is eliminated, the IC
resumes its normal operation.
■NOTE ON USE 1. For the phenomenon of temporal and transitional
voltage decrease or voltage increase, the IC may be damaged or
deteriorated if IC is used beyond the absolute MAX.
specifications. 2. Spike noise and ripple voltage arise in a
switching regulator as with a DC/DC converter. These are greatly
influenced by
external component selection, such as the coil inductance,
capacitance values, and board layout of external components. Once
the design has been completed, verification with actual components
should be done.
3. The DC/DC converter characteristics depend greatly on the
externally connected components as well as on the
characteristics of this IC, so refer to the specifications and
standard circuit examples of each component when carefully
considering which components to select. Be especially careful of
the capacitor characteristics and use B characteristics (JIS
standard) or X7R, X5R (EIA standard) ceramic capacitors.
4. Make sure that the PCB GND traces are as thick and wide as
possible. The PGND pin and AGND pin fluctuation caused by
high ground current at the time of switching may result in
instability of the IC. Therefore, the GND traces close to the PGND
pin and AGND pin are important.
5. Mount external components as close as possible to the IC.
Keep the wiring short and thick to lower the wiring impedance. 6. A
feature of HiSAT-COT control is that it controls the off time in
order to control the duty, which varies due to the effects of
power loss. In addition, changes in the on time due to 100% duty
cycle mode are allowed. For this reason, caution must be exercised
as the characteristics of the switching frequency will vary
depending on the external component characteristics, board layout,
input voltage, output voltage, load current and other
parameters.
7. Due to propagation delay inside the product, the on time
generated by the minimum on time generation circuit is not the
same
as the on time that is the ratio of the input voltage to the
output voltage. 8. With regard to the current limiting value, the
actual coil current may at times exceed the electrical
characteristics due to
propagation delay inside the product. 9. The CE pin and the Mode
pin are a CMOS input pin. Do not use with the pin open. If
connecting to the input or ground, use
the resistor not more than 1MΩ or less. To prevent
malfunctioning of the device connected to this product or the
input/output due to short circuiting between pins, it is
recommended that a resistor be connected.
10. In the B type, if the output voltage drops below the short
circuit protection threshold voltage at the end of the soft
start
interval, operation will stop. 11. Regarding PWM/PFM auto
switching control method, it works with a discontinuous conduction
mode at light loads, and in
this case where the voltage difference between input voltage and
output voltage is low or the coil inductance is higher than the
value indicated in the standard circuit example, the coil current
may reverse when the load is light, and thus pulse skipping will
not be possible and light load efficiency will worsen.
12. When the input voltage is close to the minimum input
voltage, the current limit circuit might not be able to work. 13.
When the voltage difference between input voltage and output
voltage is low, the load stability feature may deteriorate.
-
14/28
XC9259 Series ■NOTE ON USE (Continued) 14. If the capacitance
value is not sufficient by degrading CL due to the low temp.
condition and DC bias feature, 100% duty
cycle might come up for the load transient condition. Add
capacitance value for CL if necessary. (Refer to Fig14-1, Fig14-2,
Fig14-3, Fig.14-4)
15. If the capacitance value is not sufficient by degrading CL
due to the low temp. condition and DC bias feature, the duty
cycle
might not be stable. Add capacitance value for CL if necessary.
(Refer to Fig.15-1,Fig.15-2) 16. Torex places an importance on
improving our products and their reliability.We request that users
incorporate fail-safe
designs and post-aging protection treatment when using Torex
products in their systems.
Ta=-40℃,VIN=3.6V,VOUT=1.5VfOSC=1.2MHz,IOUT=1000mA→10mA
L : 4.7μH,CIN : 10μF (ceramic),CL : 10μF (ceramic)
IOUT : 1A/div
VOUT : 100mV/div
LX : 5V/div
Fig.14-1 Insufficient CL (Ta=-40℃,CL=10μF ) Fig.14-2 Sufficient
CL (Ta=-40℃,CL=20μF)
Ta=-40℃,VIN=3.6V,VOUT=1.5VfOSC=1.2MHz,IOUT=1000mA→10mA
L : 4.7μH,CIN : 10μF (ceramic),CL : 20μF (ceramic)
5μsec/div5μsec/div
IOUT : 1A/div
VOUT : 100mV/div
LX : 5V/div
Ta=-40℃,VIN=3.6V,VOUT=1.5VfOSC=1.2MHz,IOUT=10mA→1000mA
L : 4.7μH,CIN : 10μF (ceramic),CL : 10μF (ceramic)
Ta=-40℃,VIN=3.6V,VOUT=1.5VfOSC=1.2MHz,IOUT=10mA→1000mA
L : 4.7μH,CIN : 10μF (ceramic),CL : 20μF (ceramic)
Fig.14-3 Insufficient CL (Ta=-40℃,CL=10μF ) Fig.14-4 Sufficient
CL (Ta=-40℃,CL=20μF)
IOUT : 1A/div
VOUT : 100mV/div
LX : 5V/div 5μsec/div
IOUT : 1A/div
VOUT : 100mV/div
LX : 5V/div 5μsec/div
Ta=25℃,VIN=2.5V,VOUT=0.8VfOSC=6.0MHz,IOUT=300mA
L :0. 47μH,CIN : 10μF (ceramic),CL : 10μF (ceramic)
VOUT : 20mV/div
LX : 5V/div 200nsec/div 200nsec/divLX : 5V/div
VOUT : 20mV/div
Ta=25℃,VIN=2.5V,VOUT=0.8VfOSC=6.0MHz,IOUT=300mA
L :0. 47μH,CIN : 10μF (ceramic),CL : 20μF (ceramic)
-
15/28
XC9259Series
■NOTE ON USE (Continued) 17. Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag
from the output current when the wire impedance is high, please
place the input capacitor(CIN) and the output capacitor (CL) as
close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a
by-pass capacitor (CIN) be connected as close as possible to
the
VIN pin, PGND pin and AGND pin. (2) Please mount each external
component as close to the IC as possible. (3) Wire external
components as close to the IC as possible and use thick, short
connecting traces to reduce the circuit
impedance. (4) Make sure that the GND traces are as thick as
possible, as variations in ground potential caused by high ground
currents at
the time of switching may result in instability of the IC. (5)
This series’ internal driver transistors bring on heat because of
the output current and ON resistance of P-channel and
N-channel MOS driver transistors. Please consider the
countermeasures against heat if necessary. LGA-8B01 PCB mounted 1st
Layer 2nd Layer
-
16/28
XC9259 Series
■NOTE ON USE (Continued) < Estimation for the power
consumption > The power loss of a total buck DC/DC system
(P_all) is as follows. P_all (W) = VIN×IIN-VOUT×IOUT
= VOUT×IOUT/EFFI-VOUT×IOUT =-VOUT×IOUT×(1-1/EFFI)
VIN: Input voltage, VOUT: Output voltage, IIN: Input current,
IOUT: Output current, EFFI: Efficiency The power loss at a coil
(P_coil) is as follows. P_coil (W) = IOUT2×DCR DCR: The direct
current resistance of a coil The power loss at IC (P_IC) can be
calculated by subtracting the power loss at a coil from the one of
a total buck DC/DC system.
P_IC (W) = P_all – P_coil The temperature of IC (Tj) can be
calculated by the function below. Tj = Ta + R×P_IC R: Thermal
resistance The temperature resistance varies based on the power
dissipation of a PC board and so on. Please note that Tj should be
lower than 125℃ ・Calculation Example Conditions : VIN=2.5V,
VOUT=1.8V, IOUT=800mA, EFFI=81.4% R=100℃/W DCR=0.06Ω
The power loss of a total buck DC/DC system (P_all)
=-VOUT×IOUT×(1-1/EFFI) =-1.8×0.8×(1-1/0.814) ≒0.329(W)
The power loss at a coil (P_coil) = IOUT2×DCR = 0.82×0.06 ≒0.038
(W)
The power loss at IC (P_IC) = P_all - P_coil = 0.329 -0.038 =
0.290 (W)
The temperature of IC (Tj) = The ambient temperature so that Tj
becomes125℃ (Ta) =Tj-R*P_IC =125-100×0.290 =96.0℃
In this case, under the condition above, the ambient temperature
up to 96℃ is acceptable. ・Reference example Ta-IOUTMAX feature
example with LGA-8B01 recommendation PCB pattern
1. Measurement Condition Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
(Reference pattern layout of LGA-8B01: Refer to page 15)
Copper thickness: 18μm(Cu)+20μm(plating)=38μm
Material: Glass Epoxy (FR-4)
Thickness: 0.8mm
Through-hole 10 x 0.3 Diameter
2 x 0.8 Diameter
10 x 1.0 Diameter
0
200
400
600
800
1000
1200
-50 -25 0 25 50 75 100 125
Max
imum
Out
put :
I OU
TMA
X(m
A)
Ambient Temperatuer : Ta(℃)
VOUT(T)=1.8V
VIN=2.5V
VIN=3.6V
VIN=5.5V
-
17/28
XC9259Series
■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output
Current
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B08C
PWM/PFMPWM
VIN=3.7V
VIN=5.0V
VIN=3.7V
VIN=5.0V
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B08E
PWM/PFMPWM
VIN=3.7V
VIN=5.0V
VIN=3.7V
VIN=5.0V
L =GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B18E
PWM/PFMPWM
VIN=3.7V
VIN=5.0V
VIN=3.7V
VIN=5.0V
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B18C
PWM/PFMPWM
VIN=3.7V
VIN=5.0VVIN=3.7V
VIN=5.0V
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B33E
PWM/PFMPWM
VIN=5.0V
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Effi
cien
cy: E
FFI (
%)
Output Current: IOUT (mA)
XC9259B33C
PWM/PFMPWM
VIN=5.0V
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
-
18/28
XC9259 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output
Voltage vs. Output Current
1.6
1.7
1.8
1.9
2.0
0.1 1 10 100 1000
Out
put V
olta
ge: V
OU
T(V
)
Output Current: IOUT (mA)
XC9259A18E
PWM/PFM
PWM
3
3.1
3.2
3.3
3.4
3.5
3.6
0.1 1 10 100 1000
Out
put V
olta
ge: V
OU
T(V
)Output Current: IOUT (mA)
XC9259A33E
PWM/PFM
PWM
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
VIN = 5.0VVIN = 3.7V
(3) Ripple Voltage vs. Output Current
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Rip
ple
Vol
tage
: Vr(m
V)
Output Current: IOUT (mA)
XC9259B18E
PFM/PWMPWM
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
Rip
ple
Vol
tage
: Vr(m
V)
Output Current: IOUT (mA)
XC9259B33E
PFM/PWMPWM
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
VIN = 5.0VVIN = 3.7V
0
1020
3040
5060
7080
90100
0.1 1 10 100 1000
Rip
ple
Vol
tage
: Vr(m
V)
Output Current: IOUT (mA)
XC9259B18C
PFM/PWMPWM
01020
30405060708090
100
0.1 1 10 100 1000
Rip
ple
Vol
tage
: Vr(m
V)
Output Current: IOUT (mA)
XC9259B33C
PFM/PWMPWM
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
VIN = 5.0VVIN = 3.7V
L =LTF5022T-4R7N2R0(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
-
19/28
XC9259Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Output
Voltage vs. Ambient Temperature (5) UVLO Voltage vs. Ambient
Temperature
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
-50 -25 0 25 50 75 100 125
Out
putV
olta
ge: V
OU
T(V
)
Ambient Temperature: Ta (℃)
XC9259B18E
VIN = 3.7V
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
-50 -25 0 25 50 75 100 125
UV
LO V
olta
ge: U
VLO
(V)
Ambient Temperature: Ta (℃)
XC9259A08E
(6) Quiescent Current vs. Ambient Temperature
0102030405060708090
100
-50 -25 0 25 50 75 100 125
Qui
esce
nt C
urre
nt: I
q (μ
A)
Ambient Temperature: Ta (℃)
XC9259A08E
0102030405060708090
100
-50 -25 0 25 50 75 100 125
Qui
esce
nt C
urre
nt: I
q (μ
A)
Ambient Temperature: Ta (℃)
XC9259A08C
VIN = 5.0V, 3.7V, 2.5V
VIN = 5.0V, 3.7V, 2.5V
(7) Stand-by Current vs. Ambient Temperature (8) Oscillation
Frequency vs. Ambient Temperature
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0 200 400 600 800 1000
Osc
illatio
n Fr
eqen
cy: f
OSC
(MH
z)
Output Current: IOUT (mA)
XC9259B08E
VIN = 3.6V
VIN = 5.0V
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100 125
Sta
ndby
Cur
rent
: IST
B(μ
A)
Ambient Temperature: Ta (℃)
XC9259A08E
VIN = 3.0V
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
VIN = 5.0VVIN = 3.7V, 2.5V
-
20/28
XC9259 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Oscillation
Frequency vs. Ambient Temperature (Continued)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0 200 400 600 800 1000
Osc
illatio
n Fr
eqen
cy: f
OSC
(MH
z)
Output Current: IOUT (mA)
XC9259B18E
VIN = 5.0V
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0 200 400 600 800 1000
Osc
illat
ion
Freq
ency
: fO
SC(M
Hz)
Output Current: IOUT (mA)
XC9259B33E
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
VIN = 4.2V
VIN = 5.5V,5.0VVIN = 3.6VVIN = 3.0V
L = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL =
10μF×2(GRM155R61A106M)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 200 400 600 800 1000
Osc
illat
ion
Freq
ency
: fO
SC (M
Hz)
Output Current: IOUT (mA)
XC9259A08C
L = LTF5022T-4R7N2R0-LC(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
VIN = 3.6V
VIN = 3.0V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 200 400 600 800 1000
Osc
illat
ion
Freq
ency
: fO
SC(M
Hz)
Output Current: IOUT (mA)
XC9259A18C
L = LTF5022T-4R7N2R0-LC(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
VIN = 5.0V
VIN = 3.0V,3.6V,5.0V
(9) Pch Driver ON Resistance vs. Ambient Temperature
100
150
200
250
300
350
400
450
500
-50 -25 0 25 50 75 100 125
Lx S
W P
ch O
N R
esis
tanc
e: R
LxH
(mΩ
)
Ambient Temperature: Ta (℃)
XC9259A08E
VIN = 3.7VVIN = 2.5V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 200 400 600 800 1000
Osc
illat
ion
Freq
ency
: fO
SC(M
Hz)
Output Current: IOUT (mA)
XC9259A33C
VIN = 5.0V,5.5V
VIN = 4.2V
L = LTF5022T-4R7N2R0-LC(4.7μH)CIN = 10μF(GRM155R61A106M) CL =
10μF(GRM155R61A106M)
VIN = 5.0V
-
21/28
XC9259Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Nch Driver
ON Resistance vs. Ambient Temperature (11) LxSW ”L” Leakage Current
vs. Ambient Temperature
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
-50 -25 0 25 50 75 100 125
LxS
W”L”
Leak
age
Cur
rent
: ILx
L(μ
A)
Ambient Temperature : Ta (℃)
XC9259A08E
50
100
150
200
250
300
350
-50 -25 0 25 50 75 100 125
Lx S
W N
ch O
N R
esis
tanc
e: R
LxL
(mΩ
)
Ambient Temperature: Ta (℃)
XC92659A08E
VIN = 5.0VVIN = 3.7VVIN = 2.5V
VIN = 5.5V
(12) LxSW ”H” Leakage Current vs. Ambient Temperature (13) CE
”H” Voltage vs. Ambient Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50 -25 0 25 50 75 100 125
CE”H”
Vol
tage
VC
EH(V
)
Ambient Temperature: Ta (℃)
XC9259A08E
0.0
1.02.03.0
4.05.06.0
7.08.09.0
10.0
-50 -25 0 25 50 75 100 125
LxS
W”H”
Leak
age
Cur
rent
: ILx
H(μ
A)
Ambient Temperature : Ta (℃)
XC9259A08E
VIN = 5.5V VIN = 5.0VVIN = 3.7VVIN = 2.5V
(14) CE”L” Voltage vs. Ambient Temperature (15) Soft-Start Time
vs. Ambient Temperature
050
100150200250300350400450500
-50 -25 0 25 50 75 100 125
Sof
t-Sta
rt Ti
me:
t SS
(us)
Ambient Temperature: Ta (℃)
XC9259B08E
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50 -25 0 25 50 75 100 125
CE”L”
Vol
tage
VC
EL(V
)
Ambient Temperature: Ta (℃)
XC9259A08E
VIN = 5.0VVIN = 3.7VVIN = 2.7V
VIN = 5.0V
-
22/28
XC9259 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (16) Current
Limit vs. Ambient Temperature (17) CL Discharge Resistance vs.
Ambient Temperature
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100 125
CL
Dis
char
ge R
esis
tanc
e: R
DC
HG
(Ω)
Ambient Temperature: Ta (℃)
XC9259B08E
1000
1200
1400
1600
1800
2000
2200
2400
-50 -25 0 25 50 75 100 125
Cur
rent
Lim
it: I L
IM(m
A)
Ambient Temperature : Ta (℃)
XC9259A08E
VIN = 5.0V VIN = 3.7V VIN = 5.0VVIN = 3.0V
(18) Short Protection Threshold vs. Ambient Temperature
0
100
200
300
400
500
-50 -25 0 25 50 75 100 125
Shor
t Pro
tect
ion
Thre
shol
d V
SHO
RT
(mV
)
Ambient Temperature: Ta (℃)
XC9259B08E
VIN = 5.0V, 3.7V, 2.5V
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XC9259Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) Load
Transient Response
IOUT : 600mA
VOUT : 50mV/divVOUT : 50mV/div
20μs/div20μs/div
IOUT : 10mA
IOUT : 600mA
IOUT : 10mA
XC9259A12E (PWM Control)VIN = 5.0V VOUT = 1.2V fOSC = 6.0MHz
IOUT = 10mA ⇒ 600mAL = GLCLKR4701A(0.47μH)CIN =
10μF(GRM155R61A106M) CL = 10μF×2(GRM155R61A106M)
XC9259B12E (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 1.2V
fOSC = 6.0MHz IOUT = 10mA ⇒ 600mAL = GLCLKR4701A(0.47μH)CIN =
10μF(GRM155R61A106M) CL = 10μF×2(GRM155R61A106M)
VOUT : 50mV/div
50μs/div
VOUT : 50mV/div
50μs/div
IOUT : 600mAIOUT : 10mA
IOUT : 600mAIOUT : 10mA
XC9259A18E (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 1.8V
fOSC = 6.0MHz IOUT = 10mA ⇒
600mAL = GLCLKR4701A(0.47μH)CIN = 10μF(GRM155R61A106M) CL
= 10μF(GRM155R61A106M)
XC9259A18E (PWM Control)VIN = 5.0V VOUT = 1.8V fOSC = 6.0MHz
IOUT = 10mA ⇒ 600mAL = GLCLKR4701A(0.47μH)CIN =
10μF(GRM155R61A106M) CL = 10μF×2(GRM155R61A106M)
XC9259A33E (PWM Control)VIN = 5.0V VOUT = 3.3V fOSC = 6.0MHz
IOUT = 10mA ⇒ 600mAL = GLCLKR4701A(0.47μH)CIN =
10μF(GRM155R61A106M) CL = 10μF×2(GRM155R61A106M)
XC9259A33E (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 3.3V
fOSC = 6.0MHz IOUT = 10mA ⇒ 600mAL = GLCLKR4701A(0.47μH)CIN =
10μF(GRM155R61A106M) CL = 10μF×2(GRM155R61A106M)
IOUT : 600mAIOUT : 10mA
VOUT : 50mV/div
50μs/div
IOUT : 10mA
VOUT : 50mV/div
50μs/div
IOUT : 600mA
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XC9259 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) Load
Transient Response
VOUT : 100mV/div
50μs/div
VOUT : 100mV/div
50μs/div
IOUT : 600mAIOUT : 10mA
IOUT : 600mA
IOUT : 10mA
XC9259A12C (PWM Control)VIN = 5.0V VOUT = 1.2V fOSC = 1.2MHz
IOUT = 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN =
10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
XC9259A12C (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 1.2V
fOSC = 1.2MHz IOUT = 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN
= 10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
VOUT : 100mV/div
50μs/div
VOUT : 100mV/div
50μs/div
IOUT : 600mAIOUT : 10mA
IOUT : 600mAIOUT : 10mA
XC9259A18C PWM Control)VIN = 5.0V VOUT = 1.8V fOSC = 1.2MHz IOUT
= 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN =
10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
XC9259A18C (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 1.8V
fOSC = 1.2MHz IOUT = 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN
= 10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
VOUT : 200mV/div
50μs/div
IOUT : 600mAIOUT : 10mA
VOUT : 200mV/div
50μs/div
IOUT : 600mAIOUT : 10mA
XC9259A33C (PWM/PFM Automatic Control)VIN = 5.0V VOUT = 3.3V
fOSC = 1.2MHz IOUT = 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN
= 10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
XC9259A33C (PWM Control)VIN = 5.0V VOUT = 3.3V fOSC = 1.2MHz
IOUT = 10mA ⇒ 600mAL = LTF5022T-4R7N2R0-LC(4.7μH)CIN =
10μF(GRM155R61A106M) CL = 10μF(GRM155R61A106M)
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XC9259Series
■PACKAGING INFORMATION ●LGA-8B01 (unit:mm)
●LGA-8B01 Reference Pattern Layout (unit: mm) ●LGA-8B01
Reference Metal Mask Design (unit: mm)
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XC9259 Series
■PACKAGING INFORMATION (Continued) ● LGA-8B01 Power Dissipation
Power dissipation data for the LGA-8B01 is shown in this page. The
value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following
condition. 1. Measurement Condition
Condition: Mount on a board Ambient: Natural convection
Soldering: Lead (Pb) free Board: Dimensions 40mm×40mm (1600mm2
in one side)
1st Layer: Approx. 50% connect to lead 1/4/5/8 2nd Layer:
Approx. 50% connect to lead 1/4/5/8 3rd Layer: Approx. 50% connect
to lead 1/4/5/8 4th Layer: Approx. 50% connect to lead 1/4/5/8
The copper area is divided into four block, one block is 12.5%
of total. Each terminal connects one copper block in the front and
one in the back.
Material: Glass Epoxy (FR-4) Thickness: 1.6mm
Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient
Temperature (105℃)
Board Mount (Tjmax=125℃)
Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal
Resistance (℃/W)
25 1000 100.00
105 200
Pd-Ta特性グラフ
0
200
400
600
800
1000
1200
25 45 65 85 105 125
周囲温度Ta(℃)
許容損失Pd(mW)
Evaluation Board (Unit: mm)
2.54
1.4
40.0
40.0
2.5
28.9
28.9
Pd vs. Ta
Ambient Temperature: Ta (℃)
Pow
er D
issi
patio
n: P
d (m
W)
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27/28
XC9259Series
■MARKING RULE
Example (MARK ②,③)
OSCILLATION FREQUENCY
MARK XC9259*33*** XC9259*2C*** XC9259*1L*** ② ③ ② ③ ② ③
1.2MHz T 3 R C P L
6.0MHz Y 3 X C V L
④⑤ represents production lot number 01~09, 0A~0Z, 11~9Z, A1~A9,
AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded) * No character inversion used.
① represents products series MARK PRODUCT SERIES
E XC9259A*****-G F XC9259B*****-G
② represents integer and oscillation frequency of the output
voltage
OUTPUT VOLTAGE
(V)
MARK
fOSC=1.2MlHz (XC9259***C**-G)
fOSC=6.0MlHz (XC9259***E**-G)
0.x N U 1.x P V 2.x R X 3.x T Y
③ represents decimal number of the output voltage
VOUT(V) MARK PRODUCT SERIES
X.00 0 XC9259**0***-G X.05 A XC9259**A***-G X.10 1
XC9259**1***-G X.15 B XC9259**B***-G X.20 2 XC9259**2***-G X.25 C
XC9259**C***-G X.30 3 XC9259**3***-G X.35 D XC9259**D***-G X.40 4
XC9259**4***-G X.45 E XC9259**E***-G X.50 5 XC9259**5***-G X.55 F
XC9259**F***-G X.60 6 XC9259**6***-G X.65 H XC9259**H***-G X.70 7
XC9259**7***-G X.75 K XC9259**K***-G X.80 8 XC9259**8***-G X.85 L
XC9259**L***-G X.90 9 XC9259**9***-G X.95 M XC9259**M***-G
④⑤
②③
①1
2
3
6
5
4
LGA-8B01
-
28/28
XC9259 Series
1. The products and product specifications contained herein are
subject to change without
notice to improve performance characteristics. Consult us, or
our representatives
before use, to confirm that the information in this datasheet is
up to date.
2. We assume no responsibility for any infringement of patents,
patent rights, or other
rights arising from the use of any information and circuitry in
this datasheet.
3. Please ensure suitable shipping controls (including fail-safe
designs and aging
protection) are in force for equipment employing products listed
in this datasheet.
4. The products in this datasheet are not developed, designed,
or approved for use with
such equipment whose failure of malfunction can be reasonably
expected to directly
endanger the life of, or cause significant injury to, the
user.
(e.g. Atomic energy; aerospace; transport; combustion and
associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the
specified ranges.
Should you wish to use the products under conditions exceeding
the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to
abnormal use.
7. All rights reserved. No part of this datasheet may be copied
or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.