Www.ele.kth.se/~axel9/4/20151 International Master of Science Program in System-on-Chip (SoC) Design at KTH SoC Masters Axel Jantsch Royal Institute of.

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International Master of Science Program in System-on-Chip (SoC) Design at KTH

SoC Masters

Axel Jantsch

Royal Institute of Technology

Electronic System Design Laboratory

Email:[email protected]

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Background

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The challenge

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The challenge: example In year 2005 our students are launching a design project for I-Phone with the

following properties:– Single chip phone, PDA, TV, mini-DVD recorder, GPS, and medical monitoring device

inttegrated to a compact handheld device– On-chip RF (Bluetooth, GSM+, W-CDMA and local 4th generation wideband), optical I/F

to home theater system– Clock internally at 2.8 GHz, externally 820 MHz, 300 MHz JTAG– 135 million gates, 256Mb embedded RAM (of which 144 Mb used by 3-D engine mainly

for textures)– Single 1.5 V battery (AAA), 1 month standby, 4 hour DVD, 24 h web, 2 day phone– Full user and location awareness, build-in software agents for user adaptation and network

adaptation (cognitive radio)– 4 Terabit all-electronic harddisk

What are the open issues?– System noise budgets (even for digital parts)– System interference of its own analog and RF functionality; deep submicron effects– Specification and design of functionality and performance characteristics– Verfication

Globalisation of the product design and industrial activities with multi-cultural and geographically distributed teams

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System-on-Chip int. M.Sc. program: SoC Masters

System on Chip

Embedded systems & software

Deep submicrondigital circuits

RF and mixed signal

SoC and interconnectcentric architectures

System modelingand validation

Reusability and intellectual

property

Testability andfault tolerance

Digital system engineeringand System-on-Package

ASIC design

Methodologyand CAD tools

www.ele.kth.se/SoC/

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Three Lines of Courses

Group A: Design of heterogeneous SoC architectures containing custom hardware, digital signal processors (DSP), microprocessors, and embedded software.

Group B: Physical integration and implementation of heterogeneous blocks such as hardware, analog interfaces while optimizing power consumption, performance, cost, and noise.

Group C: SoC design methodology issues such as specification and validation, integrating the separate design flows for tightly coupled hardware and software development and supporting CAD tools.

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Courses Course Credit units Quarter Hardware modeling (C) 4 1 Embedded systems (A) 5 1 Digital circuit design (B) 5 1-2 Digital hardware organization (A) 4 2 Design of fault-tolerant systems (A) 4 2 SoC Architectures (A) 4 2 Digital systems engineering (B) 5 3 Design documentation & IPR issues (C) 4 3 Anatomy of CAD tools for electronic

design automation (C) 5 3

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Courses

System modeling (C) 5 3 Electronic system packaging (B) 5 4 Radio electronics (B) 5 4 Low power analog & mixed signal IC´s (B) 5 4 System ASIC design (A) 5 4 Special topics in SoC (C) 4 4 Master's thesis (2nd year) (A-B-C) 20 1-2