1 Workshop on Reliability and DfX Engineering for System-in-Package Technologies May 29, 2008 Pallanza, Lago Maggiore, Italy Reliability and Test Challenges around C2W and W2W SiP assemblies N. Marenco 1 , W. Reinert 1 , S. Warnat 1 , P. Lange 1 , G. Allegato 2 , T. Ungaretti 2 , G. Hillmann 3 , G. Bock 3 , W. Gal 4 , S. Guadagnuolo 5 , A. Conte 5 , K. Friedel 6 , K. Malecki 6 , T. Falat 6 1) Fraunhofer Institute for Silicon Technology (ISIT) - Fraunhoferstrasse 1, 25524 Itzehoe, Germany 2) ST Microelectronics - Via C. Olivetti 2, 20041 Agrate Brianza, Italy 3) Datacon Technology Innstrasse 16 6240 Radfeld Austria Reliability and DfX Engineering for SiP Technologies Pallanza (Italy) 29 May 2008 Reliability and Test Challenges around C2W and W2W SiP assemblies [email protected]1 3) Datacon Technology - Innstrasse 16, 6240 Radfeld, Austria 4) FICO BV - Ratio 6, 6921 RW Duiven, The Netherlands 5) SAES getters - Viale Italia 77, 20020 Lainate (MI), Italy 6) Wroclaw University of Technology - Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland Today's MEMS packages for Automotive Inertial Measurement Units ("IMU") Sensor Dynamics Gyroscope with Reliability and DfX Engineering for SiP Technologies Pallanza (Italy) 29 May 2008 Reliability and Test Challenges around C2W and W2W SiP assemblies [email protected]2 failsafe-logic (SD750) open cavity plastic package SO24
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Workshop on Reliability and DfX Engineering for System-in-Package TechnologiesMay 29, 2008 Pallanza, Lago Maggiore, Italy
Reliability and Test Challenges around C2W and W2W SiP assemblies
N. Marenco 1, W. Reinert 1, S. Warnat 1, P. Lange 1,, , , g ,G. Allegato 2, T. Ungaretti 2, G. Hillmann 3, G. Bock 3,
W. Gal 4, S. Guadagnuolo 5, A. Conte 5, K. Friedel 6, K. Malecki 6, T. Falat 6
1) Fraunhofer Institute for Silicon Technology (ISIT) - Fraunhoferstrasse 1, 25524 Itzehoe, Germany2) ST Microelectronics - Via C. Olivetti 2, 20041 Agrate Brianza, Italy 3) Datacon Technology Innstrasse 16 6240 Radfeld Austria
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
STMicroelectronics e.g. 3-axis Accelerometer (LIS302) LGA 14 pin, 3 x 5 x 0,9 mm³
other LGA down to 3x3 mm²only a few products still in QFN28/44, 7x7x1,8mm³
STMicroelectronics
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CSP, WLP, SiP, ... Chip-Scale Package:Package size is determined by the die, not by the contact grid. Mostly small dies with low contact number:
High connectivity requires expensive board technologyIncreasing die size leads to larger CTE mismatch (use underfill)Smaller solder balls increase shear force
Wafer-Level Package:Packaging technology takes advantage of wafer-given batch processing. Main motivations are:
Stacking of geometrically matching dies to increase integration scaleEncapsulation of sensitive MEMS structures in clean environment Handling aspects for processing of thin wafers (e.g. via formation)
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
Von Mises – Stress: ~ 1 GPa at 400°C Risk of passivation cracking
due to thermomechanical loads(process or thermal ageing cycles)
Hermetic bonding
One by one or all at once?W2W::o) Fast throughput: Only batch processes involved:o\ Handling of two valuable, fully processed 8" wafers:o( Yield loss by combining bad devices with good ones!:o( Yield loss by combining bad devices with good ones!
TSV or contact window opening are mandatory (wafer thinning?) Thin wafer handling: Temperature conflict with temporary carrier bondingPreference not yet clear: Front-to-Front or Front-to-Back concept?
C2W::o( Risky handling (transport, particles):o) Advantage of yield control: Only good devices are combined!
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
One by one: MEMS placement in a Die BonderAutomated die bonding generates particles !
Installation in a cleanroom cellUse of filtered air flowHandling concept and operator instructionHandling concept and operator instruction Basic machine constructionAvoid getter activation / saturation (ASIC on heated chuck)
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
C2W: Au-Sn Bonding Liquid formation is necessary for topography adaptation: Bonding at ~300°CInterdiffusion in Au-Sn eutectic formation: Risk of Ti plating base deterioration
Prefixation bump
Test pad matrix lateral offset
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
E. Ohmura; F. Fukuyo; K. Fukumitsu; H. Morita: "Internal modified-layer formation mechanisms into silicon with nanosecond laser"Journal of Achievements in Materials and Manufacturing EngineeringJAMME 2006, vol.17, issue 1-2, pp. 381, 15 March 2006
22 scans / 690 µm wafer
Stealth laser dicing
Mahoh dicing with unoptimized MEMS design
Poly-SiPoly-Si transmission OK for bulk transforming.BUT: Insufficient weakening for singulation step!
Si (1,0,0) Bulk transformation to poly-Si
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies
Transfer molding: Long-distance fill of narrow gap• 6" wafer mold under construction (8" targeted)• Working conditions: 130...170°C / 3...12 MPa• Specific material and process optimizations to avoid premature curingp p p p g• "Dynamic Temperature Control" 2) allows to minimize warpage
Reliability and DfX Engineering for SiP TechnologiesPallanza (Italy) 29 May 2008
Reliability and Test Challenges around C2W and W2W SiP assemblies