Workshop for NFF Nanoimprint System NFF MA6 NFF MA6 Nanoimprint Nanoimprint Upgrade Upgrade
Workshop for NFF Nanoimprint System
NFF MA6 Nanoimprint NFF MA6 Nanoimprint Upgrade Upgrade
OutlineOutline
Nanoimprint Lithography (NIL)Nanoimprint Lithography (NIL) Upgrade PartsUpgrade Parts
Workshop for NFF Nanoimprint System
Nanoimprint Lithography (NIL)
Versatile, cost effective, flexible and high throughput (parallel) method for fabrication of down to 10 nm structures even over large areas (wafers)
Applications in:
•Semiconductor memory•Micro and nano fluidics •Optical devices e.g. LEDs and lasers •Life science, e.g. lab-on-a-chip systems, bio sensors•Radio frequency components•Renewable energy•Security (holography, tags, etc.)•Nanotechnology
Workshop for NFF Nanoimprint System
Residual imprint polymer under stamp protrusionremoved by ‘descum’ process
Imprinted pattern transferred into substrate bydry etching
Nanoimprint processNanoimprint process
The stamp is pressed into a soft thermoplastic, thermosetting or UV-curable polymer ona substrate combined with heating or UV radiation
A stamp is fabricated by electron beam lithography(EBL) and dry etching
Stamp
Substrate Polymer
The polymer is cured and the stamp releasefrom substrate
Workshop for NFF Nanoimprint System
Upgrade Parts IncludeUpgrade Parts Include
StampStamp Stamp HolderStamp Holder Substrate HolderSubstrate Holder Stamping controlStamping control
Workshop for NFF Nanoimprint System
StampStamp
BBare Quartz Plate Patterned Stampare Quartz Plate Patterned Stamp
Workshop for NFF Nanoimprint System
Stamp HolderStamp Holder
Workshop for NFF Nanoimprint System
Substrate HolderSubstrate Holder
Workshop for NFF Nanoimprint System
Stamping ControlStamping ControlWith Firmware upgradeWith Firmware upgrade
Workshop for NFF Nanoimprint System
StampStamp
Stamp Plate DimensionStamp Plate Dimension Stamp PatternStamp Pattern Anti- sticking LayerAnti- sticking Layer Stamp HandlingStamp Handling
Workshop for NFF Nanoimprint System
Stamp Plate DimensionStamp Plate Dimension
Square Quartz Plate 65mm x 65mm x 6.35 mm thick A Square Shape Mesa ~ 25 um height at the center Probably 3 E-beam Alignment marks will be set nearly at the corners (will further discuss)
6.35 mm
65mm
65mm
Mesa
~ 25 um
6.35 mm
Mesa
Workshop for NFF Nanoimprint System
Stamp Pattern
All pattern should be inside the Mesa area
Standard Mesa size in NFF: 10 mm square
Mesa can change to another size but it will take longer time to fabricate, more chance to jammed with the substrate and extra charge for new mesa mask
Large patterned area also cause flatness problem of stamp
To avoid drawing at boundary or a large enclosed pattern, especially near at the edges of Mesa. Because it will block the excess imprint resist flow
Workshop for NFF Nanoimprint System
Beware of the imprint resist thickness to the depth of stamp patternUnit cell
dot
LS
(Vto fill) of resist needed to fill completely this structure. For our design, Vto fill = Hm{LS + (L + S)S}, where Hm is the mould’s depth, L the dot’s size andS the spacing between each dot. Now the available volume of resist for this unit cell is Vresist = Hi (L + S)2, where Hi is the initial resist layer thickness.
Nanotechnology 17 (2006) 2701–2709S Landis et al
Workshop for NFF Nanoimprint System
Anti-sticking Layer
The Mesa is covered by an Anti-sticking layerThe Mesa is covered by an Anti-sticking layer
Anti-sticking layer is a very thin Fluorocarbon layerAnti-sticking layer is a very thin Fluorocarbon layer
AAnti-sticking layer (nti-sticking layer (>1>10 nm) for 0 nm) for easy easy stamp release from a thin impristamp release from a thin imprint resistnt resist
Don’t scratch the Anti-sticking layerDon’t scratch the Anti-sticking layer
If Anti-sticking layer gets damage, it will cause jammed stamp If Anti-sticking layer gets damage, it will cause jammed stamp during stamp releasing step or imprint resist stick onto the stamp during stamp releasing step or imprint resist stick onto the stamp surfacesurface
Workshop for NFF Nanoimprint System
Stamp handling
Cleaning the stamp by Acetone, IPA, thinner and DI Cleaning the stamp by Acetone, IPA, thinner and DI water water ONLYONLY. (No oxygen plasma, EKC or MS2001). (No oxygen plasma, EKC or MS2001)
Before put the stamp back into the packing box, please Before put the stamp back into the packing box, please make sure the box is dust freemake sure the box is dust free
Mesa side always face downward inside the packing box Mesa side always face downward inside the packing box and don’t make it face upward even in normal caseand don’t make it face upward even in normal case
Seal the packing box by aSeal the packing box by adhesivedhesive tape if it will not be tape if it will not be used for a period of timeused for a period of time
Don’t touch the Mesa surface with anything elseDon’t touch the Mesa surface with anything else.. Of course, don’t drop itOf course, don’t drop it
Workshop for NFF Nanoimprint System
Thank you for your attention!
Workshop for NFF Nanoimprint System