Welcome to the Nano Dimension Webinar on NaNoS

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Welcome to the Nano Dimension Webinar on NaNoS.

We will begin shortly!

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NaNoS Presentation Nasdaq: NNDM I November 2020

ADDITIVELY MANUFACTURED ELECTRONICS (AME)USING NaNoS SERVICES

I n t e l l i g e n t M a c h i n e s , P r o p r i e t a r y C o n d u c t i v e & D i e l e c t r i c I n k M a t e r i a l s

3D-PRECISION PRINTED

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• NANO DIMENSION

• THE MISSION

• HOW DOES IT WORK?

• NANOS℠

• TRADITIONAL PCB VS AME

• 3D-PRINTED H i -PEDs™

TA B L E O F C O N T E N T S

https://www.nano-di.com/


• Industry Leader: Additive Manufactured Electronics (AME)

• More than a dozen patents granted, and more than three dozen patent applications

• First-to-Market Advantage

• The ONLY technology that converts CAD files into functional devices in a single operation

• Approximately 60 Systems Worldwide

N A N O D I M E N S I O N



TRADITIONAL INTEGRATED CIRCUITS

(IC, Chips, CPU, ASICs)

TRADITIONAL PRINTED CIRCUIT BOARDS (PCB)

DragonFly LDM & Ink MaterialsDesign Proof of Concepts

Prototype & Early Fabrication of HiPEDs™(High Performance Electronic Devices)

AME TECHNOLOGY

V I S I O N : B R I D G I N G T H E G A P



Our DragonFly™ AME Machines (controlled by AI algorithms) produce electronic devices through simultaneous precision jetting of dielectric and conductive materials to fabricate, within hours:

3D High Performance Electronic Devices: Hi-PEDs™

We develop and produce proprietary complimentary inks as consumables in our AME machines. All are mission critical and economical for our customers.

Sensors, Antennas, Capacitators, Convertors for unique geometries and complex devices

O U R M I S S I O N



A L L O F T H I S …

… R E P L A C E D B Y T H I S !

D R A G O N F LY L D M : A D I G I TA L FA C T O R Y I N A B O X



T H E O B J E C T I S B U I L T U P , L A Y E R B Y L A Y E R , T H R O U G H F U L L S T A C K T H I C K N E S S :○ Conductive layers & Dielectric layers○ Drills and vias bottom up printed○ Soldermask & Annotation

H O W D O E S I T W O R K ?

T W O I N K J E T P R I N T H E A D S J E T B O T H M A T E R I A L S S I M U L T A N E O U S L Y :○ Both conductor traces & insulator substrate are printed○ Both materials are activated in real – time on-the-fly○ 100% fully additive process!

Just one manufacturing step: No need for etching, pressing, electroplating!

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Conductivity (Silver nano particles)(S/m) at 20 °C] *up to 50% bulk copper 15x106 – 30 x106 Printing & sintering conditions dependent

Max reflow solder temperature [°C] 165 Quick Chip TS391LT (138°C)/ KoKI TB48-M742 (138°C) Paste.

Tg (DMA, 10 Hz, tan delta) 162 IPC-TM-6502.4.25 (2.4.24.4)

Decomposition temp. (Td 5%) (TGA) 351 IPC-TM-650 2.4.24.6

Flexural strength(crosswise) N/mm2 106.4 IPC TM-650 2.4.4

Dielectric breakdown(thickness 0.6mm) KV 40.3 IPC-TM-650 2.5.6

Silver Nanoparticle Conductive Ink AgCite™

1092 Dielectric Ink UV Curable Acrylates Ink Dielectric

Constant (Dk) Tangentialloss (Df)

200MHz 2.80 0.000500MHz 2.81 0.0041GHz 2.81 0.0062GHz 2.80 0.0115GHz 2.78 0.01210GHz 2.76 0.01315GHz 2.75 0.01320GHz 2.78 0.012

I N K S : C O N D U C T I V E I N K ( C I ) A N D D I E L E C T R I C ( D I )



P R I N T E D C A P A C I T O R S○ High Accuracy Capacitors

Integrated in the board○ 50 layers

R A P I D P R O T O T Y P I N G I N H O U S E○ Months > days○ Dozens of layers, both sides

populated

R F A M P L I F I E R F O R S P A C E○ Light weight○ Integrated design○ < 1db gain difference

I N N O V A T I V E M E M S P A C K A G I N G○ Embed piezoelectric transducers○ Compact, lightweight and robust

packageD R A G O N F LY L D M

“Lights Out” Digital Manufacturing

N E W M A N U FA C T U R I N G P O S S I B I L I T I E S W I T H T H E D R A G O N F LY L D M

High-Performance Electronic Devices™ : Hi-PEDs™



N A N O D I M E N S I O N O F F E R I N G

A M E 3 D - P R E C I S I O N P R I N T I N G S Y S T E M SD R A G O N F L Y L D M

N a N o S℠ – 3 D FA B R I C AT I O N S E R V I C EF O R T H E P R O D U C T I O N O F H i - P E D s T M

○ System – Manufactured by Nano Dimension

○ Training and Support provided

○ Leasing and Sales Options

○ Enables Co-creating a Unique Design with our Team

○ Prototyping

○ Low Volume Production



NANOS: 3D FABRICATION SERVICES



N A N O S : 3 D FA B R I C AT I O N S E R V I C E S

WE PRINT THE PARTS YOU NEED

• Fabricate Complex Multilayered Devices

• Test various Designs

• Explore new Solutions for 3D-Applications

• Co-Design side by side with our experts



OUTSOURCE AND EXPLORE NEW COMPLEX 3D FABRICATION POSSIBILITIES

N A N O S : 3 D FA B R I C AT I O N S E R V I C E S

• Our Expert will Design with you the Application you need. Explore the possibilities

• We use STL and GERBER FILES. Any traditional Software Program is accepted

• We Print & Ship around the world. You will receive your order quick and easy at your doorstep



PCB vs AME



The vast majority of electronic circuits are now made using Printed Circuit Boards (PCBs). These are copper-clad fiberglass or epoxy boards that have the copper selectively etched away to leave conductive traces. Componentscan be mounted through drilled holes (left) or on the surfaces of the boards (right).

Through-Hole Electronics Surface Mount Electronics

T R A D I T I O N A L P C B s : M O U N T I N G C O M P O N E N T S



Traditional PCBs are a mature technology, and their limitations are well understood. High-end multilayer PCB manufacture is tricky and expensive, and prototypes are usually made externally and often off-shore. Traditional PCBs are both rigid and flat.

This imposes constraints on design that usually result in a traditional PCB being encapsulated in a housing typically made by injection molding thermoplastic

T R A D I T I O N A L P C B s : L A Y E R S



A D D I T I V E M A N U FA C T U R I N G O F 3 D E L E C T R O N I C S

High Performance Electronic Devices™: Hi-PEDs™


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3D-Pr inted Hi -PEDs™

Nano Dimension® Confidential and Proprietary

NASDAQ: NNDM I www.nano-di.com | © 2020 Nano Dimension. All rights reserved. 21

• LOW PASS FILTER (LPF)• VERTICALLY STACKED INTEGRATED CIRCUITS (ICS)• RF ANTENNAS & AMPLIFIERS UP TO 6GHZ• FUNCTIONAL CAPACITORS BY ADDITIVE MANUFACTURING• IN PCB PLANAR DC-DC UP CONVERTER TRANSFORMER• SIDE MOUNT/CONTACT AND INSERTED COMPONENTS• BUILT IN POWER TRANSFORMERS

Example of Hi-PEDs™ :

N A N O D I M E N S I O N : 3 D - P R I N T E D H i - P E D s ™



Emerging Technologies• Communication 5G/RF

• Heterogeneous Integrations

• Aerospace (i.e. micro-satelites)

• Defense

• Medical (i.e. in-vivo devices)

• Automotive Revolution

(electrical, autonomous)

Hi-PEDs™ Necessitate• Fast time-to-market

• IP safety in-house rapid prototyping and production

• Interactive development

• Device performance gains

• Control of fabrication facilities Defense & Homeland Security

Hi-PEDs™ (High-Mix-Low-Volume) are produced at high quantitates that are constructed from high mix of designs and low volume per variety. This necessitates prototyping and low cost of production for low volumes.

N A N O D I M E N S I O N : R E V E N U E D R I V E R S



Printed LP X-ray ofPrinted LP

LPF uses AME capacitors fabricated simultaneously inside the AME board together with strip lines.

The AME capacitor and the strip line can be placed on any layer or on different layers in the AME board With Commercial Capacitors

AME

-30dB

LPF with AME Capacitors filters the signal at least up to 20GHz. (less than -30db)

LPF with Commercial Capacitors stops filtering at 6GHz

E X A M P L E O F H i - P E D s ™ : L O W P A S S F I L T E R ( L P F )



E X A M P L E O F H i - P E D s ™ : C B N I I T




COMPACT

THIN

RELIABLE




Embedding flow sensors in sealed package

Dragonfly® for Packaging of Unconventional Silicon Dies

Flexibility and Compliance for a new paradigm in kinetic energy harvesting



E X A M P L E O F H i - P E D s ™ : H E N S O L D T

Realized Full 3D ACB structuresEXPLORE THE SPACE OF

3D-PRINTED STRUCTURES ELECTRONIC

• Completely new form factors

of designs

• “Full 3D-Wiring”

• 3D printed lumped elements

(capacitors, coils)

• Avoid Vias



Stacked ICs have a higher circuitry density than traditional PCBs by allowing ICs to be mounted and interconnected on top of each other.

E X A M P L E O F H i - P E D s ™ : V E R T I C A L L Y S T A C K E D I N T E G R A T E D C I R C U I T S ( I C S )



Our capability to print UHF & SHF RF signal transmission line and antennas. RF antennas & amplifier applications with up to 6GHz frequency.

NANO DIMENSION CAN DO IT

E X A M P L E O F H i - P E D s ™ : R F A N T E N N A S & A M P L I F I E R S U P T O 6 G H Z



• Produced simultaneously during the additive manufacturing of PCBs

• Reduce the total size of the PCB

• Freeing surface area for mounting other PCB components

Design Actual

E X A M P L E O F H i - P E D s ™ : F U N C T I O N A L C A P A C I T O R S B Y A D D I T I V E M A N U F A C T U R I N G



• The most common DC-DC Up Converters are units mounted on a PCB

• By producing the device as an integrated part of the PCB, surface area usage, assembly time, and other overhead costs are reduced.

E X A M P L E O F H i - P E D s ™ : I N P C B P L A N A R D C - D C U P C O N V E R T E R



• Enables the use of an area not common for PCB components

• Enables the creation of customized small PCBs that can be inserted into a socket

a) b)Figure 1 X-ray view of a) inserted, and b) side mounted components soldered to vertical contacts manufactured as part of the PCB additive manufacturing technology in the DragonFly LDMTM

E X A M P L E O F H i - P E D s ™ : S I D E M O U N T / C O N T A C T A N D I N S E R T E D C O M P O N E N T S



AC-AC Up Converter (x10)

Custom Coil DesignsFor Unique Applications

AC-AC Transformer with

ferrite core

E X A M P L E O F H i - P E D s ™ : B U I L T I N P O W E R T R A N S F O R M E R S



R O I : P R O T O T Y P I N G

D E S I G N E C A D P o C * & P R O T O T Y P I N G T E S T I N G T O O L I N G P R O D U C T I O N

D E S I G N E C A DP o C * & P R O T O -T Y P I N G

T E S T I N G T O O L I N G P R O D U C T I O N

W E E K S

D A Y S

○ Accelerate Product Development and reduce Time-To-Market (TTM)

○ In-House Rapid Prototyping with Nano Dimension AME Systems

Nano Dimension AME System

* P o C - P r o o f o f C o n c e p t



R O I : P R O D U C T I O N

D E S I G N E C A D P o C * & P R O T O T Y P I N G T E S T I N G T O O L I N G P R O D U C T I O N

D E S I G N E C A DP o C *

& P R O T O -T Y P I N G

T E S T I N G P R O D U C T I O N

M O N T H S

W E E K S

○ Eliminate need for tooling○ Consolidate Assembly Steps○ Low Mix / High Volume Production with



* P o C - P r o o f o f C o n c e p t



N A N O D I M E N S I O N ’ S 3 D FA B R I C AT I O N S E R V I C E S : N a N o S℠

• Nano Services (NaNoS℠) is an offering for customers who need to get their hands-on complex, multilayered high-performance electronics with a quick turnaround time.

• Provide services to customers around the globe with its fabrication labs in the US, Israel and Hong Kong.

• Guaranteed quick turnaround for complex Hi-PEDs™.


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H i - P E D s ™

H I G H P E R F O R M A N C E E L E C T R O N I C D E V I C E S

LOW PASS FILTER 3D MIDCOILS & INDUCTORS RF ANTENNAS

AME CIRCUIT WITH SIDE MOUNTED AND

INSERTED COMPONENTS

AME CIRCUIT WITH INTEGRATED

FUNCTIONAL CAPACITORS

VERTICALLY STACKED INTEGRATED CIRCUITS

IOT/WIFI ACCESS POINT

C O M P L E X M U L T I L A Y E R P C B ( 5 0 L A Y E R S )

AME Circuit with Capacitors

IOT Access Point

AME with Side Mounted

ComponentsVertically Stacked Integrated Circuits

RF Antenna3D MIDCoils & InductorsLow Pass Filter

Fast prototyping, hours vs weeks

Tens of layersin a 3mm board

Printed embedded components

Expand 3D scales

Filled Vias: No need for drilling

P R O D U C E C O M P L E X P C B A N D H i - P E D S ™



3D Printed Electronics Components (Capacitor, Inductor, Transformer,

Antenna)

Non Planar Shape and 3D Structural Elements (Cavities, Special Shapes)

RF&MW Embedded Components Converter and Chargers(DC, AC)

High Layer Count Circuits > 50

Multi Stacking ICs, Packages, Side Mount & Contacts,

Free Form of Vias

Electronics integration (MEMS, Sensors, Transistors, ICs, Opto, Piezo,

Chem-Electro, Magnetics, Motion)

Real 3D Embedded Electronics for Heterogenous Integration

AME Hi-PEDs™

beyond traditional manufacturing

A D D I T I V E M A N U FA C T U R I N G O F 3 D E L E C T R O N I C S


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Welcome to the Nano Dimension Webinar on NaNoS

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