This project has received funding from the European Union’s Seventh Framework Programme for research, technological development and demonstration under grant agreement no 318240. PhoxTroT - 4th Symposium on Optical Interconnect in Data Centers, ECOC 2016, Düsseldorf, Germany, 18. September 2016 WELCOME 4th Optical Interconnect in Data Centers EU-Symposium Tolga Tekin , Fraunhofer IZM / TU Berlin, Germany Richard Pitwon , Seagate, United Kingdom Nikos Pleros , AUTH, Greece Emmanouel Varvarigos , CTI ‘Diophantus’, Greece Dimitris Apostolopoulos , ICCS / NTUA, Greece
30
Embed
WELCOME 4th Optical Interconnect in Data Centers EU-Symposium · PhoxTroT Vision Keywords: Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
This project has received funding from the European Union’s Seventh Framework Programme for research, technological development and demonstration under grant agreement no 318240.
PhoxTroT - 4th Symposium on Optical Interconnect in Data Centers, ECOC 2016, Düsseldorf, Germany, 18. September 2016
WELCOME 4th Optical Interconnect in Data Centers EU-Symposium
Tolga Tekin, Fraunhofer IZM / TU Berlin, Germany
Richard Pitwon, Seagate, United Kingdom
Nikos Pleros , AUTH, Greece
Emmanouel Varvarigos , CTI ‘Diophantus’, Greece
Dimitris Apostolopoulos , ICCS / NTUA, Greece
2
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Thanks to
ECOC 2016 General Chairs Ronald Freund, Fraunhofer Heinrich Hertz Institute, Berlin Matthias Berger, Alcatel-Lucent, Nürnberg
ECOC 2016 Technical Program Chairs Peter Krummrich, Technische Universität Dortmund Christian Schaeffer, Helmut Schmidt Universität
ECOC 2016 Local Organis ing Committee Volker Schanz, VDE ITG, Frankfurt Hatice Altintas, VDE Conference Services, Frankfurt
for their kind support!
3
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
4th Optical Interconnect in Data Centers EU-Symposium
09:10 WELCOME by PhoxTroT
09:30 - 11:10 Session 1: THE END-USER PERSPECTIVE
11:30 - 13:30 Session 2: BRINGING TECHNOLOGY TO MARKET - I
14:30 - 16:30 Session 3: BRINGING TECHNOLOGY TO MARKET - II
16:50 - 18:30 Session 4: WHAT COMES NEXT?
4
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Revolutionizing the Data Centers and HPCs - Optical Interconnects
5
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
PhoxTroT - A Large-Scale Integrating Project
PhoxTroT is a large-scale European research effort focusing on
high-performance,
low-energy,
low-cost,
small-size
optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems:
on-board,
board-to-board and
rack-to-rack.
6
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
PhoxTroT brings together the major European industrial and research players in the field.
Fraunhofer IZM (DE)
Fraunhofer HHI (DE)
Vertilas GmbH (DE)
Seagate (UK)
ams AG (AT)
TTM Technologies (HK)
AMO GmbH (DE)
ICCS/NTUA (EL)
DAS Photonics SL (ES)
Phoenix BV (NL)
CERTH (EL)
Compass EOS Ltd (IL)
Bright Photonics BV (NL)
CTI (EL)
CNRS-UB (FR)
CNRS-LPN (FR)
KIT (DE)
SDU (DK)
UPVLC (ES)
IMEC (BE)
TE Connectivity (NL)
AUTH (EL)
Mellanox (IL)
PhoxTroT - Consortium
7
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
PhoxTroT‘s Mission
To streamline the synergistic evolution of the entire technology portfolio towards cost‐ and energy‐efficient Tb/s‐scale chip‐to‐chip, board‐to‐board and rack‐to‐rack level device development. PhoxTroT aims to generate the necessary energy and cost‐efficiency factors through breakthrough component level advances and through mastering the different technology platform design- and process-level requirements into a coherent methodology for optochip, optical PCB and Active Optical Cable fabrication.
8
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
PhoxTroT’s Holistic Approach
PhoxTroT tackles optical interconnects in a holistic way, synergizing the different technology platforms in order to deploy the optimal "mix & match" technology and tailor this to each interconnect layer.
Plasmonics
Si Photonics
III-V CMOS
electronics
Glass
PICs
Transceivers
Switches & Routers
PCBs
Interfaces
Polymers
Glass
Si Photonics
CMOS electronics
9
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
PhoxTroT’s Ecosystem
10
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Architecture
Architectural studies for on-board, board-to-board, and system-level hierarchies, based on specifications of the building-blocks developed in PhoxTroT.
Development of Automatic Topology Design tool to aid architecture design.
Layouts of interconnection network topologies on OPCBs.
Calculations of required area, worst case losses.
Executed 3 HPC applications on HellasGrid cluster. Traffic monitored and analyzed.
Collected traffic patterns of HPC and Data Centers applications (literature review).
To Backplane
Backplane
Waveguides
AOC
Backplane slot
Board
System
Processor chip
Router
CTI, CERTH
11
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Mask Generator
Designer
Design Kit
Foundry
Circuit Simulator Physical Simulations
Design Kits for Optical Interconnects PHOENIX, BP
12
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
90-deg bends
Splitters Over crossings
Straight lines Cascaded
bends Straight lines
Multi-Mode Optical/Electrical PCB Development
Multimode polymer waveguide process compatible with panel-scale HLC PCBs developed and demonstrated – TTM
Process for single-layer polymer WG PCBs supporting 300x350mm form factor on rigid MLB PCBs established. Scaling to dual-optical layer construction on going
Multimode O/E PCB test bed (4L+1Opt) with multiple passive components completed.– SEA, CEOS, TTM
Optical mid-board interface by 90° MLA (micro lenses) for chip-to-board I/O and board-edge connectors for WG-to-MMF
Demonstrator 1 (16L+ 1Opt w/ CMOS) CEOS, TTM
Multimode PCB @ 16” 20”Panel Product form factor test bed
Coupling interface verification
Demonstrator 1
TTM, CEOS, SEA
13
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Single-Mode Optical PCB Development
SM optical PCB process flow
Laser dicing & optical cut-outs
Two step ion-exchange process
Thin film mask on glass
PCB embedding
Propagation loss = 0.1dB/cm
SM chip-to-board coupling interface
IZM
14
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
Electronic VCSEL Driver and TIA Circuits Development
IMEC
40Gb/s NRZ VCSEL driver
Optimized for Vertilas’ single-mode VCSELs
Clockless feedforward equalizer
40Gb/s NRZ Transimpedance Amplifier
Compatible with HHI’s photodiodes
Gain control and limiting output
15
Ph
oxT
roT -
4th
Sym
po
siu
m o
n O
pti
cal In
terc
on
nect
in
Data
Cen
ters
VCSEL Development VERTILAS
Short-cavity VCSELs with 1550 nm wavelength developed and manufactured
Optical output power up to 4mW (20°C) and >1.5 mW (80°C)
Modulation bandwidth up to 14 GHz (20°C) and >10 GHz (80°C)