WBS 6.2.5 Stave Assembly Gabriella Sciolla L3 Subsystem Manager Brandeis U.S. ATLAS HL-LHC Upgrade DOE Independent Project / CD-3a Review Brookhaven National Laboratory Upton, New York July 9-11, 2019
WBS 6.2.5Stave Assembly
Gabriella Sciolla
L3 Subsystem Manager
Brandeis
U.S. ATLAS HL-LHC UpgradeDOE Independent Project / CD-3a Review
Brookhaven National LaboratoryUpton, New York July 9-11, 2019
Outline
• Deliverable Overview
• Technical Progress and Plans Progress since CD-1
Remaining work for CD-2
ES&H
Quality Assurance and Control
• Cost and Schedule CD-3a Needs
• Risk Main Deliverable Risks
External Dependencies
• Closing Remarks
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 2
Stave Assembly Deliverables
Stave assembly is the last step in the production of the ITk Strip staves before the detectors are shipped to CERN
In production, 196/206 staves will be assembled at BNL FY21-24 50% of the ATLAS barrel strip detector
Receive and re-test components Stave cores from Yale
Modules from BNL/LBNL/SCIPP
End of Stave card from DESY
Stave assembly Positioning and gluing of modules on cores with 50 μm precision
Wire bonding
Staves testing Both mechanical and electrical testing
Shipping to CERN Staves received + tested before releasing them to international ATLAS
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 5
From the WBS dictionary
WBS number: 6.2.5 WBS Title: Strips Tracker Stave Assembly
WBS Dictionary Definition:
WBS 6.2.5 refers to the loading of assembled modules (6.2.4) onto the stave cores (6.2.1) for the barrel part of the ITk silicon strip tracker as well as to the final mechanical measurement and electrical testing of the loaded staves.
The ITk barrel detector consists of 392 staves configured in 4 readout layers. Each stave carries a total of 28 modules, 14 modules on each side. The US will deliver 196 working staves to the ATLAS tracker. All the assembled and tested modules built in the U.S., which correspond to 50% of all barrel modules, will be shipped to BNL where they will be mounted on stave cores. Also affixed to the stave will be an End-of-Stave (EOS) card supplied by a non-US institution. The module mounting process will use a custom-programmed XYZ stage to place and survey each module on the stave core. Once all modules are placed and glued, they will be wire bonded and put through an electrical test and final burn-in process. Quality assurance and testing will be provided at all stages.
Brookhaven has the primary responsibility to provide technical resources, space, and supplies.Brandeis University manages the stave assembly and provides most of the labor associated with programming the XYZ stage and testing the loaded staves. Harvard University and University of Pennsylvania participate in various tasks related to the stave assembly, in particular DAQ and testing.
6
US Organization at L4
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 7
6.02 ITk StripsL2M: C. Haber (LBNL)
Deputy: G. Sciolla (Brandeis)
6.02.01 Stave CoreL3M: J. Ashenfelter (Yale)
6.02.04 ModulesL3M: G. van Nieuwenhuizen
(BNL)
6.02.01.01 Cores LBNL
IC: C. Haber (LBNL)
6.02.03 HybridsL3M: A. Ciocio (LBNL)
6.02.02 Readout Electronics
L3M: E.Thomson (Penn)
6.02.05 Stave Assembly
L3M: G. Sciolla (Brandeis)
6.02.01.05 Cores YaleIC: J. Ashenfelter (Yale)
6.02.01.06 Cores Iowa
IC: S. Prell (Iowa St)
6.02.02.01 DCS/LV/HV
IC: D. Lynn (BNL)
6.02.02.02 Power BrdIC: J. Joseph (LBNL)
6.02.02.03 ABC*,HCC*,AMAC
IC: J. Kroll (Penn)
6.02.03.01 Hbrd BNLIC: A. Tricoli (BNL)
6.02.03.02 Hbrd LBNLIC: A. Ciocio (LBNL)
6.02.03.04 HbrdUCSC
IC: A. Affolder (UCSC)
6.02.04.01 Mdls BNLIC: G. van Nieuwenhuizen
(BNL)
6.02.04.02 Mdls LBNLIC: A. Ciocio (LBNL)
6.02.04.04 MdlsUCSC
IC: A. Affolder (UCSC)
6.02.05.01 Stave BNLIC: D. Lynn (BNL)
6.02.05.03 Stave Penn
IC: M. Newcomer (Penn)
6.02.05.08 Stave Harvard
IC: M. Morii (Harvard)
6.02.05.09 Stave Brandeis
IC: G. Sciolla (Brandeis)
6.02.02.04 ABC*,HCC*
IC: A. Grillo (UCSC)
6.02.02.05 DC-DCIC: J. Ashenfelter (Yale)
6.02.01.10 Cores Mass
IC: C. DallaPiccola(U.Mass)
6.02.04.07 Test Duke IC: M. Kruse (Duke)
6.02.04.10 Test Mass IC: C. DallaPiccola
(U.Mass)
Many in this community have collaborated since mid-1990’s. The 11 institutions are now tightly linked since formalizing these specific roles and responsibilities beginning in 2015.
6.02.04.11 Test IowaIC: U.Mallik
(U.Iowa)
CQ.3
Experience of the Team
Institute Members Past Experience Relevant to this Deliverable
BNL D. Lynn ITk strips since 2008; Former local support activity coordinator; HV Mux leader; General strips R&D
Gerrit van Nieuwenhuizen
WA98 Silicon Drift Detectors, PHOBOS Silicon Detector, STAR Intermediate Silicon Tracker, ATLAS ITk since 2015
P. Kuczewki, Senior Electronics Tech, STAR Silicon Vertex Tracker, ITk Strips, HV-Mux
R. Burns Senior Mechanical Tech, ITk strips since 2010, stave core R&D
C. Musso Electronics tech, wirebonding, 3D detector wirebonding and testing
Brandeis G. Sciolla BaBar Drift Chamber; Directional Dark Matter Detectors R&D; ATLAS Muon System; ATLAS ITk since 2017
A. Duskin Mechanical engineer with >20 years of experience in ATLAS; Designed alignment for ATLAS Forward MDTs; LZ; ATLAS ITk since 2018
Harvard M. Morii Electronics for Kaon experiment at KEK; OPAL calorimeter; BaBar Drift Chamber; LUX; ATLAS Muon; ITk since 2017
S. Sansone Manager of Harvard Physics Dep. machine shop; ATLAS MDT; LSST
Penn Engineering team
Designed ITk chips!
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 8
Stave Assembly Overview
XYZ stage used for mounting,
gluing, and surveying modules
Stave mounted in assembly frame fixed to granite table.
System of computers/monitors
for real time feedback
Mounting bridge
Automated glue dispenser
Camera
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 9
Stave Testing Overview (2)
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 10
Temporary testing station
Example of testing code
Pelican case used for shipping
Stave Assembly Project at a glance
• TM prototype: 1 full stave (FY17-2018)
• Electrical prototype: 1 stave with 3 electrical modules (FY18)
• Pre-production 1 (FY18-19) 2 x SS 13-modules electrical staves
ABC130 chipset, 13-module bus tape design
• Pre-production 2 (FY19) 2 x LS 28-modules electrical staves
New: *chipset and 14-module bus tape design
• Pre-production 3 (FY20) 9 x 28-module electrical staves, LS+SS
o Final electronics and stave cores
o Opportunity to finalize system and ramp up for production
• Production (Apr 2021-Jul 2024) Starting in April 2021
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 13
2018 Director's Review
CD1
2019 Director's Review
Huge amount of progress since CD1!
We are on track to meet Project’s goals
CQ.1
2019 CD3a
Technical progress since CD1:
Electrical Prototype -- “Stavelet”
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 14
• Spring 2018: Completed assembly of first electrical prototype 3 electrical modules on a 13-module core
First read out using ITSDAQ
First measurements of noise, gain, etc.
Technical progress since CD1:
PP1-Stave1
• Assembly completed in Sep 2018 Loaded with 12/13 electrical modules
ABC-130 chips, first EoS card from DESY
• Deployed new volumetric glue dispenser ≈ 2 min, down from ≈ 8min
• Read out and electrically tested Results of noise, gain, etc. measurements according to specs
• Metrology results according to specs
• Shipped to RAL for first system testG. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 15
New glue dispenser
PP1-Stave1
Technical progress since 2018 DR:
PP1-stave2
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 16
• PP1-stave 2 completed in May 2018
Loaded with 13/13 electrical modules (130 chipset)
• Deployed new Brandeis bridge to mount modules
Successfully tested parallel module mounting and glue dispending 2 modules/syringe
• First modules successfully read out and tested
• Will be used at BNL to perfect testing procedures
PP1-Stave2New Brandeis bridges
Remaining Work for CD-2
• Pre-production 2 2 x LS 28-modules electrical staves
o New: *chipset and 14-module bus tape design
Stave 1 – IMPORTANT as it is the basis for Local Support FDR o June-July : prep work for new stave core, assembly frame, LS sensors, bridges, EoS
o Aug: assemble and test side A
o Sep-Oct: assemble and test side B
– NB: first time slave EoS will be used!
o Nov: prepare for FDR
o Dec 2019: Local Support FDR
Stave 2 – Goal: improve assembly and testing procedures o Nov: assemble and test side A
o Dec: assemble and test side B
• Pre-production 3 (FY20) Preparation for PP3 will start early 2020 and by CD2 PP3 will be in full
swing… RAMP UP ETC.
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 17
Demonstration of assembly methods and
completion of fully functional detector
component with ~ final components
ATLAS Reviews for Stave Assembly
Technical reviews at CERN include
Preliminary Design Reviewo Passed in Oct 2018
o Topics reviewed: stave/petal cores, the mounting of modules/EOS, and the electrical/thermal/mechanical evaluations of the loaded staves/petals
Final Design Reviewo Schedules in ~ December 2019
o Review will be based on assembly and testing of PP2-Stave 1 (US deliverable)
Production Readiness Reviewo Expected date: Late 2020
o Once passed, production can start!
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 18
CQ.7
ES&H for Stave Assembly
• Safety is of the highest priority within the Project Work at each institute adheres strictly to its ES&H policies
The BNL ES&H Liaison (L. Stiegler) provides oversight and advice
Institute contacts act as interfaces between their institute and BNL
• Hazards in Stave Assembly are pretty low risk Robotic machinery (XYZ stage); mitigation: interlocks, barrier, ES&H training
Glues; mitigation: gloves and eye protection, ES&H training
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 19
CQ.6
Institute Institute ES&H Contact
BNL Achim Franz ([email protected])
Brandeis Andrew Finn ([email protected])
Harvard Tiffany Lee ([email protected])
Penn Kimi Bush ([email protected])
RLS Changes Since CD-1
• The RLS has been quite stable since CD1 With the exception of some shifting of tasks due mainly to availability of
parts (mainly ASICS)o In sync with the international ATLAS Schedule
Overall impact on schedule is minor o Recovered later start in production by decreasing the duration of batches
o Last stave delivered at CERN: Aug 2024 (CD1) July 2024
Overall change in budget is contained o +200k$ (after 2017 actuals are correctly taken into account)
• Budget changes described and approved in BCP-005 Total impact on this L3 system was +3% of the total L3 cost
• Main reasons for cost increase Need for additional cleanroom space at BNL during production
o ~50k$/year * 4 years + overhead
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 22
CQ.2
Cost Profile
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 23
FY17 FY18 FY19 FY20 FY21 FY22 FY23 FY24
BCWS
ENG 21,141 236,299 169,050 136,349 144,421 100,006 112,830 79,430
EQUIP 180,927 419,977 269,601 158,207 162,958 167,849 172,882
MAT 2,124 49,038 64,427 352,828 396,957 210,566
STU 2,128 356
TECH 189,723 153,357 132,302 145,646 358,272 550,009 562,614 402,945
TRAVD 8,050 12,212 9,448 11,566 7,119
TRAVF 5,783
0
200,000
400,000
600,000
800,000
1,000,000
1,200,000
1,400,000Total Cost by Resource Category
FTE by resource category
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 24
In Stave Assy: Labor is 50% On-Project and 50% Scientific Labor
• Scientific labor mainly students/postdocs/faculty from Universities
• In principle vulnerable to funding of University Research Grants
• We are hopeful that DOE will continue and reward the University’s
substantial contribution to the success of the project
FY17 FY18 FY19 FY20 FY21 FY22 FY23 FY24 FY25
Y-FTE
ENG 0.23 2.44 1.22 0.90 1.47 1.27 1.49 1.00
SCI 1.32 2.49 1.54 1.66 2.61 3.11 3.50 2.55 0.20
STU 0.06 0.01
TECH 0.93 0.81 0.67 0.71 1.68 2.54 2.52 1.75
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
Axi
s Ti
tle
FTE by Resource Category
Strips Schedule – Stave Assembly
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 25
We are here
Critical Path? No Stave Assembly is not on the Critical Path until the very end of the project
In production, schedule driven by hybrids/modules production
Milestones
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 26
CERN key dates:
Due at CERN: Oct 1, 2024
Float: 62 days (3 calendar months): gained ~ 2 months of float
Aligned with International ATLAS Schedule
Lowering in the pit starts on 4/1/2025
Milestone Date in P6
End of pre-production 2 1/23/20
End of pre-production 3 3/29/21
10% of staves delivered at CERN 1/4/22
50% of staves delivered at CERN 1/6/23
100% of staves delivered at CERN 7/2/24
Long Lead Procurements
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 28
WBS Activity ID Activity Name Date Trigger By Review Date Days After
Material
(AYk$)
6.02.01 Stave Core
LBNL SC200510M Material Payment for Co-Cure Batch 1 of 12 Facings (Remainder are Shipped to UK)9/8/2020 PRR 6/18/2020 82 48
SC200720M Material Payment for Co-Cure Batch 4 of 25 Facings (Remainder are Shipped to UK)12/21/2020 PRR 6/18/2020 186 51
Yale
SC200474M Material Payment for Ordering Production Bus Tapes (FY19) 8/19/2020 PRR 6/18/2020 62 33
SC200475M PMT: Material Payment for Ordering Production Bus Tapes (FY20) 8/20/2020 PRR 6/18/2020 63 445
SC500890M Material Payment for Assembly Line & Tooling Procurement and Fabrication-Second Assembly Line11/11/2019 FDR 10/18/2019 24 76
SC501204M PMT: Material Payment for Order, Receive, Inspect Batch of Honeycomb (Ultracor)2/6/2020 FDR 10/18/2019 111 163
SC501210M Material Payment for Order, Receive, Inspect Batch of Foam Blocks-Single Source (ALLCOMB)2/21/2020 FDR 10/18/2019 126 54
6.02.02 Readout Electronics
BNL RE140420M Material for QC Testing Setup 1/17/2020 FDR 9/13/2019 126 61
RE140450M Material for QC Testing 5/11/2020 FDR 9/13/2019 241 5
RE140470M Material for Packaging Devices for Irradiation 6/9/2020 FDR 9/13/2019 270 5
RE140530M Material for Post-Irradiation Testing 10/13/2020 FDR 9/13/2019 396 3
LBNL
RE261330M Material for Production PCB Order Part 1 1000 8/28/2020 PRR 8/27/2020 1 13
RE261332M Material for Production PCB Order Part 2 5000 8/31/2020 PRR 8/27/2020 4 25
RE261350M Material for Production Passive Components Order 8/28/2020 PRR 8/27/2020 1 68
RE261370M Material for Production Shield Box Order 8/28/2020 PRR 8/27/2020 1 128
RE261373M Material for Production PCB Order Part 3 5000 9/1/2020 PRR 8/27/2020 5 25
RE261374M Material for Production PCB Order Part 4 4000 9/2/2020 PRR 8/27/2020 6 13
RE261380M Material for Passive and Active Test Board Order 9/30/2020 PRR 8/27/2020 34 77
RE261420M PMT: Material Payment for Load Boards Production 2/19/2021 PRR 8/27/2020 176 800
RE261425M Material for Load Production Active and Passive Test Boards 11/16/2020 PRR 8/27/2020 81 10
RE261430M PMT: Material for Production Test System 12/31/2020 PRR 8/27/2020 126 196
Yale 0
RE530450M Material Payment for Coils 11/29/2019 FDR 9/13/2019 77 109
6.02.03 Hybrid Assembly
LBNL HA24200M PMT: Common Items (Wire, Jigs, Fixtures) Plus Some Lab Equipment (Vacuum Pumps, Chiller)9/11/2019 FDR 9/13/2019 -2 172
HA260038M Material Payment for Hybrid Panels 11/7/2019 FDR 9/13/2019 55 47
HA260298M Material Payment for Hybrid Panels 11/5/2020 PRR 8/27/2020 70 98
6.02.04 Module Assembly
BNL MA162420M Material Payment in Preparation for Production 3/15/2021 PRR 8/27/2020 200 17
LBNL MA25350M Material Payment in Preparation for Production 3/15/2021 PRR 8/27/2020 200 16
UCSC MA45350M Material Payment in Preparation for Production 3/15/2021 PRR 8/27/2020 200 23
6.02.05 Stave Assembly
BNL SA190004M PMT: Payment for Glue Dispenser Consumables for Production Year Periods 1 - 46/30/2020 FDR 10/22/2019 252 149
6.02.07 US Contributions to CERN Procurements-BNL
BNL RE140400M PMT: Material Payment for Fabrication Order of All HV MUX Devices 1/17/2020 FDR 9/13/2019 126 895
RE261405M PMT: Material Payment for Production BPOL12V from CERN 6/2/2020 FDR 9/13/2019 263 210
RE310390M PMT: Material Payment for Production by CERN 6/18/2020 PRR 6/18/2020 0 853
RE321030M PMT: Material Payment for Chip Production Order 7/8/2020 PRR 6/18/2020 20 473
Grand Total 5,360
Long Lead Procurements Drill Down
• One long lead procurement for SA: glue dispenser disposable parts
• From BoE:
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 29
NB: direct cost
Why is it needed?
• We have been using this glue dispenser for about 1 year It took some work to optimize, but eventually obtained very
satisfactory performanceo Gluing time went from ~ 10 min/module to ~ 2 minutes per module
• Our only worry is that over the years the manufacturer may stop producing the disposable parts Getting a new glue dispenser and re-optimizing gluing procedure
would generate substantial delays (and unnecessary costs)
• Simple solution Buy all disposable parts before production starts instead of diluting
the purchase over the years
Not a huge item: 122k$ (direct)
• Local support FDR will review the assembly procedure: December 2019
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 30
CQ.5
Risk Overview for Stave Assembly
G. Sciolla, ITK Stave Assembly US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 34
Risk Description: Risk 6.2.5.2
US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 35
WBS 6.2.5 Type Threat Risk ID RD-06-02-05-002
Status Active
Expires 3/18/2024
Title Underestimation of yield of staves
SummaryThe assumption on the yield for loaded staves (95%) may be too optimistic. Additional loaded staves may be lost due to mechanical failure (e.g.: the cooling pipes break) or electrical failure (e.g.: staves are unreliable, noisy, or have bad data transmission performance).
Owner Carl Haber
Probability Pre 10% Post 3%
Cost Lo $200K Hi $2,000K
Schedule Lo 0.5 Hi 2.0
Tech Impact 0(N)
Post Mitg Prob 1(VL)
Impact Score Cost 3(H) Sched 1(L) Rank=70
MitigationRe-test all components (modules and cores) before starting the assembly; carefully follow the procedure and apply a stringent Q&A during the stave assembly. Thorough testing of the staves needs to be performed as soon as production is completed or at completion of each side.
ResponseIf a problem is discovered after the stave is fully loaded, the stave will be tested thoroughly to understand the
origin of the failure. If the problem is found to be in the stave core, the entire stave may be lost. In this case, the cost will be substantial
CommentsAveraged over the entire project cost ($40M) for 200 staves, the cost/stave is $0.2M. The high side cost is assuming
10 lost staves in addition to the assumed yield
Phase Effected Pre-production/Production
G. Sciolla, ITK Stave Assembly
External Dependencies
• Stave Assembly schedule is tightly linked to:
Availability of parts
o Mainly modules and stave cores (internal dependencies) Main constraint
o EoS cards from DESY (external dependencies)
International ATLAS schedule (external dependencies)
o Minor constraint
• External dependencies are contained
Availability of EoS cards
o Slow start in preproduction
o Production: we expect all EoS to be delivered within the first 2 months
Review dates (PDR, FDR, PRR)
o More complex dependencies than you’d think because these are joined
reviews with stave cores and petals (both cores and assembly)
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 36
CQ.4
Closing Remarks
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 37
1. Stave Assembly has made substantial progress since CD1 Completed electrical stave and PP1 (2 half staves)
Starting PP2 now; will start PP3 in 2020
On target to start production in 2021: will build 50% of Strips Barrel staves (196) in FY21-24
2. RLS is in good shape and the risk register is up-to-date
Float is 3 calendar months
3. Strong team with good complementarity between BNL and Universities
BNL provides mostly technical manpower and infrastructure
Universities provide mainly physicists for s/w development and stave testing
4. Dependencies mainly internal (modules, cores)
External dependency on EoS resolved at the very beginning of production
5. One long lead procurement (glue dispenser disposable parts) will eliminate risks
6. ES&H: no major danger in Stave Assembly, but all procedures are in place
7. Before CD2: successful completion of PP2-stave 1 28-module LS stave with star chipset
Bio Sketch of L3 Manager
Gabriella Sciolla, Professor of Physics, Brandeis University
• Member of ATLAS since 2011
• ITK responsibilities
US ATLAS Level-2 Strips Tracker Upgrade Construction deputy manager
L3 manager for stave electrical assembly (5.2.5)
Group heavily involved on stave assembly at BNL
• Other ATLAS roles
Muon Combined Performance Convener (2014-2016)
US Physics Advisor (2013-present)
• Selected committee activity:
HEPAP, Fermilab PAC, SNOLab Board of Directors, SNOLab Science and Technical Review Committee, CPAD
• Previous experiments: DELPHI, BaBar, DMTPC
G. Sciolla , ITK Strips – Stave Assembly CD1 Review, July 10-12, 2018, BNL 39
Risk Register (Stave Assembly)
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 40
CQ.2
From DocDB 196-v21
Risk Register (2)
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 41
Risk Register (3)
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 42
Risk Description: Risk 6.2.5.1
US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 43
WBS 6.2.5 Type Threat Risk ID RD-06-02-05-001
Status Active
Expires 3/18/2024
Title Problem with adhesive used to glue modules to stave.
SummaryModules are attached with SE4445, a removable thermal silicone. This has been used extensively in the past. We could run into a problem with the use of this adhesive in large-scale production.
Owner Carl Haber
Probability Pre 20% Post 10%
Cost Lo $48k Hi $192K
Schedule Lo 1 Hi 4
Tech Impact 0(N)
Post Mitg Prob 3(L)
Impact Score Cost 2(M) Sched 2(M) Rank=60
MitigationCareful QA on each batch of glue measuring the pull, peel, and shear strength to ensure that the specifications are met.
Response Get a new batch of glue and test again before using
CommentsIt takes a substantial amount of time to get a new batch. Max cost impact is due to 2 months of delay in the stave assembly schedule.
Phase Effected Pre-production/Production
G. Sciolla, ITK Stave Assembly
Risk Description: Risk 6.2.5.3
US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 44
WBS 6.2.5 Type Threat Risk ID RD-06-02-05-003
Status Active
Expires 3/18/2024Title Stave does not meet electrical specification due to bad modules
SummaryModules are tested before being mounted on the stave. None-the-less some staves may be found to be electrically unreliable or noisy due to defective modules or modules not properly wirebonded.
Owner Carl Haber
Probability Pre 10% Post 50%
Cost Lo $48k Hi $98K
Schedule Lo 1 Hi 2
Tech Impact 0(N)
Post Mitg Prob 1(VL)
Impact Score Cost 1(L) Sched 1(L) Rank=20
Mitigation
Re-test modules before mounting them on the staves; carefully follow the procedure and apply a stringent Q&A during the stave assembly. Thorough testing of the staves needs to be performed as soon as production is completed or at completion of each side.
Response
If a problem is discovered, the stave will be tested thoroughly to understand the origin of the failure. If the problem is in a single module or electronics component, the stave will be set aside and the component(s) will be replaced at the end of Production.
CommentsThe cost impact calculation takes into account the cost of the additional electronics components and of the manpower necessary to diagnose and fix the problem
Phase Effected Pre-production/Production
G. Sciolla, ITK Stave Assembly
Risk Description: Risk 6.2.5.4
US ATLAS HL-LHC DOE IPR/CD-3a, July 9-11, 2019, BNL 45
WBS 6.2.5 Type Threat Risk ID RD-06-02-05-004
Status Active
Expires 1/7/2021Title End of Stave (EOS) card is delayed Summary The EOS is a German deliverable. It could be delayed
Owner Carl Haber
Probability Pre 25% Post 5%
Cost Lo $10k Hi $20K
Schedule Lo 0 Hi 0
Tech Impact 2(M)
Post Mitg Prob 1(VL)
Impact Score Cost 1(L) Sched 1(L) Rank=20
MitigationWe will prepare a dummy version of the EOS which will allow us to test the stave electrically and then be replaced with the EOS when it arrives- extra PP3 version
Response The dummy versions will be installed and staves will be tested this way.
Comments
IT will take between $10k and $20k to build the dummy EoS. The impact to the schedule is negligible because the EoS cards will be all produced at the beginning of production. Even if they were late by a few months, we will be able to reabsorb the delay in the schedule.
Phase Effected Pre-production/Very beginning of Production
G. Sciolla, ITK Stave Assembly
Schedule for one Batch in Production
From BoE:
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 46
How long does it take to make a batch, what it takes too
Cost Estimate Type
G. Sciolla , ITK Strips – Stave Assembly Director's Review, May 14-16, 2019, BNL 47
27%
27%
46%
0%
6.02.05 Stave AssemblyESTIMATION TYPE
Existing PO, Work Complete
Extrapolating from Actuals
Analogy
Expert Opinion
• Labor estimates are from recent experience in ITk Strip prototype construction as well as past experience building the SCT ATLAS detector (mainly Analogy)
• Estimates for equipment and material comes from quotes, recent purchases, and past experience (mainly quotes Extrapolating from Actuals)
Equipment and materials: quotes
Labor: past experience