Wafer/Panel Level Package Flowability and Warpage Project Call for Sign-up Webinar Project Chair: Renn Chan Ooi, Intel Corporation Tanja Braun, Fraunhofer IZM iNEMI Staff: Haley Fu Session 2: Thursday, March 15, 2018 China Time: 9:00-10:00 pm US EDT: 9:00-10:00 pm Recording (available for up to 6 months after webinar): https://inemi.webex.com/inemi/lsr.php?RCID=a8301aeda03c4712a2bd62bd9324b29d
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Wafer/Panel Level Package Flowability and Warpage Project
Call for Sign-up WebinarProject Chair:
Renn Chan Ooi, Intel Corporation
Tanja Braun, Fraunhofer IZM
iNEMI Staff: Haley Fu
Session 2:
Thursday, March 15, 2018
China Time: 9:00-10:00 pm
US EDT: 9:00-10:00 pm
Recording (available for up to 6 months after webinar):https://inemi.webex.com/inemi/lsr.php?RCID=a8301aeda03c4712a2bd62bd9324b29d
– Identify risk of flying dies from molding pressure.
– Understand material behavior of selected candidates.
– Identify working window and the cliff of failure.
– Explore opportunities from process parameters to
mitigate flow issues.
– Challenges of the KOZ at wafer/panel peripherals and
the impact to flow and warpage.
• Sheet lamination:– Challenges of the KOZ at wafer/panel peripherals and
the impact to flow and warpage.
– Issue of die displacement.
– Understand material behavior of selected candidates,
identify working window and the cliff of failure.
– Explore opportunities from process parameters to
mitigate flow issues.
KOZ
Scope 2 - Warpage: Focus and Strategy
• Simulation & Experimental Approach:
– Understand warpage related material property from material candidates.
– Prelim warpage simulation to identify feasible range of sample dimensions.
– Conduct actual molding for model validation and process understanding.
– Failure analysis (cross section) of mold material behavior.
– Final simulation DOEs for warpage optimization from process and material aspect.
• Chemical Shrinkage:
– Methodology in measuring mold material chemical shrinkage.
– Capability of incorporating it in warpage modeling – explore readiness of simulation software.
– The need for benchmark material with minimum or almost zero chemical shrinkage.
Project Scope: Is/Is Not Analysis
This Project IS: This Project IS NOT:
To conduct mold material property measurements.
To conduct solder joint reliability.
To conduct mold flow and warpage simulation to understand key modulating factors.
To evaluate RDL processes before/aftermold.
To conduct molding experiments on test vehicles based on simulation results.
To develop specific standard(s).
To evaluate flowability of mold process through inspection of void, flow marks, etc.
Biased towards specific suppliers, geographies or market segment.
To evaluate warpage of mold process through measurement tools.
Work Plan – Step 1
Step 1 – Material characterization and preliminary simulation
• Task 1: Process & TV finalize and source dummy die, panel, and other collaterals for project
– Mold first up until de-bonding on metal carrier.
– Wafer size >300mm and panel size of 400x400~600x600mm2.
– Dummy die size of 10x10mm with 200-300um silicon thickness.
– Mold thickness range from 00 to 500um.
– Die to die spacing 1/4 ~1x die size.
– Silicon die selection: pure silicon, dummy die with bump, etc.
• Task 2: Mold compound selection
– Up to 3 or more mold materials to be studied.
• Task 3: Molding material characterization for flowability and warpage simulation
– Curing kinetics (Kamal’s model).
– Rheokinetics (Macosko model).
– TMA, DMA, modulus, Poisson’s ratio measurements, etc., for warpage.
• Task 4: Chemical shrinkage measurement
– Comparison of chemical shrinkage measurements methodology.
– Application into curing and warpage simulation (e.g., PVTc models, etc.).
• Task 5: Conduct preliminary flow simulation to gain further insight
– Preliminary flow simulation to call out potential flow related risks and aide decision in finalizing/update test vehicle attributes.
• Task 6: Conduct preliminary warpage simulation with additional focus on chemical shrinkage
– Preliminary warpage simulation to call out potential CTE mismatch and chemical shrinkage related risks and aide decision in finalizing/update test vehicle attributes.
Ack: Moldex3D
Work Plan – Step 2
Step 2 – Molding experiments
• Task 7: Conduct molding of selected test vehicles
– Assemble finalized test vehicle and conduct selected molding process.
• Task 8: Conduct flowability inspection of test vehicles