Certified ISO 9001:2000 & ISO TS 16949 9 th International IEEE CPMT Symposium on High Density Design, Packaging and Microsystem Integration (HDP’07) 26 th -28 th June 2007 Shanghai, China Wafer Level Packaging & Bumping – A view from a European Service Provider Thomas Oppert VP Marketing & Sales [email protected]
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Certified ISO 9001:2000 & ISO TS 16949
9th International IEEE CPMT Symposium on High Density Design,Packaging and Microsystem Integration (HDP’07)
26th-28th June 2007Shanghai, China
Wafer Level Packaging & Bumping– A view from a European Service Provider
• Overview on Semiconductor Markets– 1970 to 2010– Applications and usage/implementation of eless NiAu
• ENIG UBM – History & Now– The early days of eless NiAu– Licenses & worldwide wafer bumping capacity– Pac Tech and eless NiAu now– Equipment for eless NiAu
• Soldering– Paste Printing– Single Ball Placement– Gang (Micro) Ball Placement
• Summary
Content
Certified ISO 9001:2000 & ISO TS 16949
Overview on Overview on Semiconductor MarketsSemiconductor Markets
Certified ISO 9001:2000 & ISO TS 16949
Evolution Semiconductor Market 1970 - 2010
Military/ Aerospace
Government
Enterprise
Internet
Consumer/Wireless
Source: SIA
Certified ISO 9001:2000 & ISO TS 16949
Semiconductor Market 2006
PC/ Computer 43,70%
Cell Phone/ mobil 17,00%
Wired Comm 7,00%
Industrial/ Military 7,30%
Automotive 8,70%Consummer
17,20%
Certified ISO 9001:2000 & ISO TS 16949
Products using electroless Ni/Au
• …First for products under very high price pressure (RFID)
• Meanwhile wide range of applications- ASIC (Sensors)- LCD Drivers- PowerMOS (Automotive)- Protection devices (Passives) CSP‘s, WLCSP‘s- Memories and memory modules- Consumer electronics- Mobile Phone- Medical (Ear phone)
Certified ISO 9001:2000 & ISO TS 16949
Worldwide use of Pac Tech eless Ni & solder printing
Mobile Phone; 40,00%
MOSFET; 20,00%
RFID; 20,00%
Memory; 5,00%
LCD Driver/ ASIC; 5,00%
Medical; 10,00%
Certified ISO 9001:2000 & ISO TS 16949
Electroless Electroless NiAuNiAuHistory & NowHistory & Now
Certified ISO 9001:2000 & ISO TS 16949
A Crazy Idea?• Technically impossible• Wrong concept• Not reliable• No infrastructure• Economically not feasible• hard to control dangerous / critical• Will be never accepted by customer
Electroless Ni/Au for Semiconductor Devices
Sounds familiar?
19901990
Certified ISO 9001:2000 & ISO TS 16949
A Crazy Idea?• Technically impossible• Wrong concept• Not reliable• No infrastructure• Economically not feasible• hard to control dangerous / critical• Will be never accepted by customer
Remember:
18861886
Certified ISO 9001:2000 & ISO TS 16949
History of electroless Ni/Au @ Pac Tech
• Basic studies & publications in 1985• First active electroless bumped wafer in 1989• Formation of Pac Tech in 1995• Further developments of the eless Ni UBM• Pilot production line in 1997• Start of customer qualification & production in 1998
2007…Pac Tech Wafer Bumping facilities in Germany, USA, Japan, Malaysia
Electroless Ni/Pd/Au Bumping on Al Electroless Ni/Pd/Au Bumping on Al
Certified ISO 9001:2000 & ISO TS 16949
Flip Chip Modules for contactless Smart Cards
Interconnection: Electroless NiAu with ACF
Certified ISO 9001:2000 & ISO TS 16949
Pacline 300 - A50
10 Plating Systems in the Field
300 mm
Certified ISO 9001:2000 & ISO TS 16949
- Capability for parallel processing of 3 carriers with 50 wafers 8“ or 3 carrierswith 26 wafers 12”- UPH: max. 150 Wafers 8"/hour or max. 78 wafers 12”/hour (5µm Ni/Au UBM)- Thick Au ability for wire bonding reliability- Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set- Central Computer Control Unit (CCCU)- PLC with Profi Bus system- Additional security tanks for each module and pump system- Design will be adapted to customer’s facility- SECS GEM Interfacing- The system fulfils the fire safety standard FM 4910
Stencil Solder Printing Process FlowStencil Solder Printing Process FlowSnPb37, LeadSnPb37, Lead--free: free: SnAgCuSnAgCu
Certified ISO 9001:2000 & ISO TS 16949
Applications for mobile phone
GSM Phone: Battery ControlWafer: Si-Ge Technology
Protection Devices
Certified ISO 9001:2000 & ISO TS 16949
Solder Printing on 300mm Wafer
• 740.000 I/O per Wafer• 680 I/O per Chip• 225µm pitch• 100µm pad size• 70µm solder ball height
Certified ISO 9001:2000 & ISO TS 16949
Solder Ball PlacementSolder Ball Placement&&
Laser ReflowLaser Reflow
Certified ISO 9001:2000 & ISO TS 16949
Laser Soldering SB2-Jet
Certified ISO 9001:2000 & ISO TS 16949
SB2 – Equipment
SB²-Jet LF
Semiautomatic SB²-SM
Automatic SB²-Jet
300 mmESD version of SB²-JetFor HGA & HSA Assembly
SB²-Jet LF with R2R Machines sold > 200 pcs
Certified ISO 9001:2000 & ISO TS 16949
SB2-Jet Advantages
• No tooling• Solder ball diameters from 80(60)µm - 760µm• Solder alloys: SnPb, SnAg, SnAgCu, AuSn• No flux• No mechanical stress/contact• No thermal stress• No additional reflow• No cleaning of flux residues• Fine pitch applications (110µm/100µm)
Certified ISO 9001:2000 & ISO TS 16949
SB2-Applications
• Wafer Bumping• BGA/ CSP Bumping• Wafer Level CSP Bumping• Rework/ Repair• Optoelectronic Packaging• SAW, BAW• MEMS & 3-D Packaging• Hard Disk Drive (HGA, HSA)• Camera Modules
Certified ISO 9001:2000 & ISO TS 16949
A
B
C
3D – AssemblyDesign Considerations
Certified ISO 9001:2000 & ISO TS 16949
Source: Seagate
Fluxless 3D-Ball Placement & Laser Reflow on FlexSuspension for HDD (HGA)
Certified ISO 9001:2000 & ISO TS 16949 Dateiname.ppt
Silicon stator(non-moving, attached to suspension)
Silicon rotor(moving, holds magnet and slider
Magnet/ buttom keeper
Narrow beam flexure(connects rotor to stator)
Read / write transducer
Electrical connections to read / write sliderElectrical connections to drive coil
Suspension
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Fluxless 3D-Ball Placement & Laser Reflow on FlexSuspension for HDD (HGA)
Certified ISO 9001:2000 & ISO TS 16949
Gang (Micro) Ball Placement
Certified ISO 9001:2000 & ISO TS 16949
Automatic Gang Ball Placer for Micro Ball Placement 1/2
• Cassette to Cassette robot handling f. wafer up to 12“
• Integrated rework capability• 100% yield
• 2x optical inspection• 1st after ball transfer• 2nd after repair
• min ball size 100µm• pre- fluxing by printing/spraying• UPH 5min/Wafer (8“)