VINCELL LT 5.0 boxed PCT - recab.comrecab.com/images/stories/virtuemart/product/gf_vincelllt_50_boxed_res... · VINCELL LT 5.0 boxed TECHNICAL SPECIFICATION Garz Fricke GmbH Tempowerkring

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Online support on www.garz-fricke.com

VINCELL LT 5.0 boxed PCTARM Cortex-A8 panel mount HMI

5.0openVG openGL

xyz

(eBus) AudioRS-232 SPI / I2C

512+

512+

Cortex

i.MX53A8

Ethernet

USB 2.0RS-485

CAN

micro SD

3 8 3 9

Mic

ro S

D/S

DH

C

LAN Pwr/eBus USB-OTGUSB-HostRS232/RS485/CANSpeaker

Mic

ro S

D/S

DH

C

LAN Pwr/eBus USB-OTGUSB-HostRS232/RS485/CANSpeaker

Mic

ro S

D/S

DH

C

LAN Pwr/eBus USB-OTGUSB-HostRS232/RS485/CANSpeaker

Mic

ro S

D/S

DH

C

LAN Pwr/eBus USB-OTGUSB-HostRS232/RS485/CANSpeaker

Display and Touch boxed boxed PCTSize [mm] 5.0" (125.9)Orientation 6 o‘clockColors [bit] 24 (16.7 M colors)Backlight Unit LEDTouch Technology 4-wire

analog resistiveProjected capacitive

Width x Height [px] 800 x 480Luminance [cd/m²] 600* 500*Active Area [mm] 108.0 x 64.8

HousingMetal Parts 1.4016 high quality steel, 0,8 mmFront Frame Light metall

Décor 180µ polyester film, anti-glare coating

black Heat strengthened safety glass

Protection Class IP66 Device DimensionsW x H x D [mm] 149.0 x 100.2 x 29.7Weight [g] 290

Power SupplySupply [V DC] Nom. 12 ~ 24, max. 9 ~ 30Consumption [W] Typ. 6.0

Typical Environmental ConditionsStorage Temp. [°C] -20 to +70Operating Temp.[°C] 0 to +60Humidity [%RH] 5 to 90

*Luminance of the resistiv version applies to the entire device. For the capacitive version to the device without touch (with capacitive touch approx. 85%)

VINCELL LT 5.0 boxedTECHNICAL SPECIFICATION

Garz & Fricke GmbH Tempowerkring 2, 21079 Hamburg, GermanyPhone +49 40 791 899 30 · [email protected] · www.garz-fricke.com

Freescale CPUClass Freescale ARM® Cortex™- A8 i.MX537Type/Clock 800 MHzFeatures NEON™ for SIMD media acceleration and

VFP operations; 32 KB for instruction and data caches; Unified 256 KB L2 Cache Multi-format HD 1080p video decoder and HD 720p video encoder hardware engine

HW Accelerators OpenGL® ES 2.0, OpenVG™ 1.1RTC Depending on ambient temperature

Standard time´s deviation: +/- 30 ppm at 25°C

Memory

NAND FlashStandard 512 MByte SLC Maximum Up to 2GByte SLC

RAMStandard 512 MByte DDR3-RAMMaximum Up to 2GByte

SRAM 512 KB SRAM (Option)Micro SD Card Slot 4 bit SDIO/SD/SDHC (max. 32GB)

Operating SystemsSupported OS Windows® Embedded Compact 7, Linux,

Android™ 2.3.3/4.2.2Communication InterfacesNetwork 10/100 MBit/s Ethernet

Serial

1 x RS-232 (RX/TX/CTS/RTS) 1x RS-485 (Half duplex) MDB 1x MDB (Master) instead of

RS-232 or 1x MDB (Slave) instead of RS-232 (Option)

eBus 1x eBus (MDB n/a) (Option)

SynchronousSerial Interfaces

SPI (10 MBit/s) up to 12 chip selects; I²C Matrix keypad up to 8 x 8

High-Speed USB 2.0 1x 480 Mbit/s Host (Type A), 1x 480 Mbit/s OTG (Type Micro-AB)

CAN Fieldbus 1x CAN (ISO/DIS 11898)Speaker output 1x speaker (connector), 1.5 W RMS (8Ω)

Micro SD/SDHC

SPI/Keypad

LAN

Pwr/e

Bus

USB-

OTG

USB-

Ho

stRS

232/

RS48

5/C

ANSp

ea

ker

Micro SD/SDHC

SPI/Keypad

LANPw

r/eBus

USB-OTG

USB-Ho

stRS232/RS485/C

ANSp

ea

ker