anel Jean-Charles LLR / IN2P3 nel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Technical status of the W-Si Technical status of the W-Si project project CALICE : CALICE : CA CA lorimeter for the lorimeter for the LI LI near near C C ollider ollider with with E E lectrons lectrons A calorimeter optimized for the Energy Flow A calorimeter optimized for the Energy Flow measurement of multi-jets final state at the measurement of multi-jets final state at the Future Linear Collider running at a center- Future Linear Collider running at a center- of-mass energy between 90 GeV to 1 TeV. of-mass energy between 90 GeV to 1 TeV. Electromagnetic Calorimeter Electromagnetic Calorimeter Hadronic Calorimeter Hadronic Calorimeter http://polywww.in2p3.fr/flc/ calice.html
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Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003 NIKHEF 1-4 April 2003 Technical status of the W-Si project CALICE : CAlorimeter for the LInear Collider.
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Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Technical status of the W-Si Technical status of the W-Si project project CALICE : CALICE : CACAlorimeter for the lorimeter for the LILInear near CCollider with ollider with
EElectronslectrons A calorimeter optimized for the Energy Flow A calorimeter optimized for the Energy Flow measurement of multi-jets final state at the Future measurement of multi-jets final state at the Future Linear Collider running at a center-of-mass energy Linear Collider running at a center-of-mass energy between 90 GeV to 1 TeV.between 90 GeV to 1 TeV.
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
General view of the General view of the calorimetercalorimeter Tracker : TPCTracker : TPC
ECAL : Sandwich Wplate & Si WaferECAL : Sandwich Wplate & Si WaferHCAL : DHCAL or AHCALHCAL : DHCAL or AHCALCoil : 4 T (2 Coil : 4 T (2 ))
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
ECAL concept : ECAL concept :
- A A fine granularity calorimeter with large number of segmentationfine granularity calorimeter with large number of segmentation is is proposed as the best solution for the energy flow, lepton identification, proposed as the best solution for the energy flow, lepton identification, photon reconstruction with good precision on energy and direction.photon reconstruction with good precision on energy and direction.
- On the other side, the coil thickness is bigger than usual due to the 4 On the other side, the coil thickness is bigger than usual due to the 4 Tesla field needed to maintain the machine background close to the Tesla field needed to maintain the machine background close to the beam pipe. beam pipe. Therefore , the ECAL has to be very compact. (1,30 m for Therefore , the ECAL has to be very compact. (1,30 m for ECAL and HCAL)ECAL and HCAL)
- Such a calorimeter could be made of Such a calorimeter could be made of Tungsten-Silicon sandwichTungsten-Silicon sandwich..- With pad of 1x1 cm and 40 layers : With pad of 1x1 cm and 40 layers : A TRACKER CALORIMETERA TRACKER CALORIMETER . .
- It gives a clean picture of all energy flow objects in all type of eventsIt gives a clean picture of all energy flow objects in all type of events- Simulation using GEANT4 lead to think of an energy resolution on Simulation using GEANT4 lead to think of an energy resolution on
electron/photon in the region of Delta E /E = 11% / sqrt(E) electron/photon in the region of Delta E /E = 11% / sqrt(E)
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
• Preamp 1 gain (1.5pF)• Low noise (2200e-)• Shaper Mono gainunipolar• track & hold Unipolar
Pin-Pincompatibility
AmpOPA
OPA
MUX out Gain=1
MUX out Gain=10
1 channel
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
New FLC_PHY2
• Peaking time is 200ns on both gain•High-gain shapers can be shut down by switching off their biases•Two different output for low gain and high gainInterface compatibility with the read out is keptNew interface not written at this point
Linearity simulationTransient simulation
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
DAQ :DAQ : VME (use and modify CMS board for Si VME (use and modify CMS board for Si
tracker)tracker)
21 January 2003 Paul Dauncey - UK Electronics 1
FED layoutIdeally, keep everything to the right, redo everything to the left
• Restrictsreadout board to same I/O and inter-FPGA paths as FED
• No major problems seen so far
Need of 6 boards for physic prototypeNeed of 6 boards for physic prototypeNeed of 6 boards for physic prototypeNeed of 6 boards for physic prototype
Talk from Paul Dauncey : DAQ for the CALICE beam test
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Cosmic test bench: general Cosmic test bench: general viewview
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
2 XY planes : 16 in X et 16 in Y (40x40 cm2 XY planes : 16 in X et 16 in Y (40x40 cm22))
(Chip evaluation board and small DAQ are (Chip evaluation board and small DAQ are ready)ready)
Passive component on the wafer Passive component on the wafer (Capacitance Ok and resistance still in progress)(Capacitance Ok and resistance still in progress)
Amorphous silicon … (works of Amorphous silicon … (works of Pierre Jarron at Cern)Pierre Jarron at Cern)
……
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Other ECAL R&D Other ECAL R&D
Thermal studiesThermal studies
Pad
Silicon wafer
PCB
Aluminium
Cooling tube Cooling tubeVFE chip1.3 mm
1.0 mm
0.5 mm
Thermal contact
gluing for electrical contact
AC coupling elements ?
power linecommand linesignal out
Pad
Silicon wafer
PCB
Aluminium
Cooling tube Cooling tubeVFE chip1.3 mm
1.0 mm
0.5 mm
Thermal contact
gluing for electrical contact
AC coupling elements ?
power linecommand linesignal out
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Other ECAL R&D Other ECAL R&D
Thermal studiesThermal studies
In the case of 40 layers and In the case of 40 layers and considering a power considering a power dissipated of about 5 mW/cmdissipated of about 5 mW/cm22 the temperature at the the temperature at the middle of structure would be middle of structure would be about about 280 °C280 °C
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Other ECAL R&D Other ECAL R&D
Thermal studiesThermal studies
PCB 1mm thick(with wafers)
Heat points(VFE chip)
Cooling channel
Radiator aluminium plate
Structure type H
Thermal sensors
Externalconnections
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
(Chip evaluation board and small DAQ are (Chip evaluation board and small DAQ are ready)ready)
Passive component on the wafer Passive component on the wafer (Capacitance Ok and resistance still in progress)(Capacitance Ok and resistance still in progress)
Amorphous silicon … (works of Amorphous silicon … (works of Pierre Jarron at Cern)Pierre Jarron at Cern)
……
Vanel Jean-Charles LLR / IN2P3Vanel Jean-Charles LLR / IN2P3 NIKHEF 1-4 April 2003NIKHEF 1-4 April 2003
Physic prototype : Physic prototype : who who ??
Mechanic : Mechanic : – W plates : RussianW plates : Russian– ECAL Structure : ECAL Structure : LLRLLR– Infrastructure of beam test : Infrastructure of beam test : LPC Clermont-ferrand ? LPC Clermont-ferrand ? and and ??– beam Hodoscope : beam Hodoscope : ??