Confidential UMC Automotive Solutions Teng Tang Yang Technical Manager Corporate Marketing May 2015
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Outline
• Market Trends And Requirements• UMC Automotive Solutions• Success and Summary
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The Strongest Growing Segment in IC Market
3Source: IC Insights
• Automotive IC market is forecast the strongest average annual revenue growth rate through 2018
10.8%
5.5%
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Megatrends in Automotive Technology
Smarter
Greener
• Driving Aids / Automated Driving• Smart Vehicle Access• Personal Media
• Driving Aids / Automated Driving• Smart Vehicle Access• Personal Media
• Fuel Efficiency• Car Electrification• Fuel Efficiency• Car Electrification
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Necessary Supports from Foundry
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LiabilityCapacity
ProductivityReliability
QualityLongevity
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Outline
• Market Trends and Responses• UMC Automotive Solutions• Success Stories and Summary
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UMC’s Role & Solutions in Auto Value Chain
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Specification Design Production
High temp. PDK (150C)
SPICE Model
Library
Memory
AEC Q-100 Platform
Grade-1, eFlash (4Q16)
Grade-0, BCD (4Q15)
Porting Service
Automotive Service
Package (ASP)
Turnkey Service
Screening (part of ASP)
Statistical Yield Limit
Statistical Bin Limit
Part Average Test
Dynamic V-Stress
Verification System
Confidential
UMC © 2014
UMC’s Role & Solutions in Auto Value Chain
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Specification Design Production
High temp. PDK (150C)
SPICE Model
Library
Memory
AEC Q-100 Platform
Grade-1, eFlash (4Q16)
Grade-0, BCD (4Q15)
Porting Service
Automotive Service
Package (ASP)
Turnkey Service
Screening (part of ASP)
Statistical Yield Limit
Statistical Bin Limit
Part Average Test
Dynamic V-Stress
Verification System
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UMC © 2014
High Temperature FDK for Auto IC Designs
9
Note:Tj: junction temp.Ta: ambient temp.
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Opportunities from Automotive Electrification
• Recommended CMOS processes: 55nm eFlash & 0.18um BCD
Electrical Train System Key IC Component
• Battery Management • Power Control• Charging System • Motor Control
• MCU• Battery Charger• Motor Driver• DC-DC Converter
Motor control
Battery Management
Power Control Charger
Charging Spot
Charging Spot
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M
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55nm eFlash1.2V/2.5V
1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16
Automotive SST eFlash Solution
Note:*: 1st lot qualification 11
+ SST Cust. Macro
T/O
SSTQual.*
AEC Q100 Grade-1 Qualification Temperature range: -40oC ~ 125oC (Ta)
I/O Lib.
Standard Cell Lib.
SP SRAM1PRF
DP SRAM2PRF
SiReport
SiReport
SiReport
SiReport
SiReport
SiReport
SiReport
SiReportVia ROM
SiReport
SiReport
IPDS
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0.18um BCD Value Propositions
Cost
Diversity
Integration
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• 5V~100V wide range support• Deep Trench Isolation• Thick Plated Copper ( 21um)
• 1.8V core (110Kgate/mm2)• eFuse/OTP/MTP• 175oC (Tj) Model/IPs
• Modular process• Competitive mask count• State of art RonArea
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0.18um BCD1.8V/5V/HV **
1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16
IP Portfolio for Value-added Integration
Note: *: Preliminary Tape-Out Kit**: HV operation voltage support up to 100V
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I/O Lib.I/O Lib.
SiReport
SiReport
T/OKitT/OKitStandard Cell Lib.Standard Cell Lib.
OTPOTP
eFuseeFuse
MTPMTP
SiReport
SiReport
T/OKitT/OKit
SiReport
SiReport
T/O*Kit
T/O*Kit
SiReport
SiReport
T/O*Kit
T/O*Kit
SiReport
SiReport
T/O*Kit
T/O*Kit
AEC Q100 Grade-0 Qualification Temperature range: -40oC ~ 150oC (Ta)
Confidential
UMC © 2014
UMC’s Role & Solutions in Auto Value Chain
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Specification Design Production
High temp. PDK (150C)
SPICE Model
Library
Memory
AEC Q-100 Platform
Grade-1, eFlash (4Q16)
Grade-0, BCD (4Q15)
Porting Service
Automotive Service
Package (ASP)
Turnkey Service
Screening (part of ASP)
Statistical Yield Limit
Statistical Bin Limit
Part Average Test
Dynamic V-Stress
Verification System
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Proven Porting Flow for IDM Customers
Gap Analysis FMEA Kick-off Meeting
Preparation
Stage - 1
Physical Matching Electrical Matching Cross Fab Verification
Validation
Stage - 2
BKM Process Wafer Level Qual. Product Level Qual.
Qualification
Stage - 3
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Success on Porting and JDP Projects
• Tremendous successes demonstrated on diversified technology nodes for emb-NVM and Power IC/Discrete products
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Automotive Production Goal: Zero Defect
• Prevention: avoid the creation of defective parts• Detection: avoid the outflow of defective parts
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Prevention DetectionZeroDefectPrevention DetectionZeroDefect
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UMC’s Automotive Service Package
Production Control
• Tighten SPC
• Preferred tools
• Defect scanning
• Tighten WAT
• AVI
• Q-Time Control
• Rescreen
• Rework
System Management
• Identification
• Data retention
• PCM
• 8D report
• MRB
• Early Alert
• Audit
Defective Part Screening
• SYL
• SBL
• PAT
• DVS
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Turnkey Service with Backend Ecosystem
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• Experienced geographic OSATs turnkey management for customersJ-Device Amkor STATSChipPAC
ChipBond UTAC Ardentec GT
ASE Amkor SPIL KYEC
SPIL ChipMore KLT UTAC
JCET / jcap NFME ASE Amkor
ASEArdentecPTI
BumpWLP CP Package FT
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UMC © 2014
Outline
• Market Trends and Responses• UMC Automotive Solutions• Success Stories and Summary
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UMC © 2014
Successful Automotive Partnership
• Advanced Logic• Application processors in ADAS for US auto manufacturers
• BCD• Adopted by major European automakers
• Grade-0 for chassis control• PMICs for major Japanese/Korean automotive OEMs.
• CIS• Adopted by key Korean and European suppliers
• For ADAS application • With good performance in low light condition
• Others: eFlash, eHV, MEMS,…21
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The growth of product TO coincides the market trend.
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Accelerating Automotive Tape-outs at UMC
~2X
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Summary
• Automotive market experiencing strongest growth compared to others sectors, requiring more foundry industry involvement.
• UMC commits to Automotive excellence with solutions that meet AEC guidelines/specification
• Automotive Service Package offered to reduce process variation and outliers for low DPPM goal
• Electrifying growth of automotive business at UMC• >100% growth on automotive product tape-outs since 2013• Looking forward to helping Japan Market benefit
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