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OPTICAL ALIGNMENTFaster, more accurate alignment for better polishing resultsOur patented ULTRACOLLIMATOR technology allows for fast accurate and repeatable parallel alignment of surfaces to the polisher. Since the collimator beam optically aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Alignment is constantly monitored during polishing. Transfer to-and-from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.
FEATURESIntuitive design & optimized ergonomics
ULTRAPOL Advance incorporates key improvements in the control of all polishing parameters, sample mounting, sample transfer, and calibration.
6124.1 Encapsulated Mount Fixture – Holds 0.5 inch to 1.5 inch diameter mounts
Planar polishing with extremely low edge-rounding
6150.1 Quick Release Vise for holding packages, large dice,
waveguides etc.
6145.1 Single Die Stub Cross-section holder
6178.1 Mounting Stand for SEM Stubs
6189.1 Hotplate Transfer Device
1503.1 Disc Holding Band
CROSS-SECTION HOLDERS
6170.1 Standard Mounting Plate - 1mm Alignment Hole (shown above) 6170.2 Standard Mounting Plate - 2mm Alignment Hole - also available
STANDARD MOUNTING PLATES
WORKHOLDERS
Optical Alignment Hole
POLISHING ACCESSORIES
Order Code Description3250.1
6183.UL
ULTRAPOL Advance Polishing System Includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 8” (200mm) Polishing plate, Z-height control with 1µm precision, Mechanical alignment indicator, 2 circle tilt control (+/- 2 degrees) Sample Rotation and sweep controls, Quick release interface mounting system, two sample mounting plates and start-up accessory kit. Sample Load Control – 0 to 3 kg. Solenoid Controlled Coolant System. Slurry Containment Tray.
ULTRACOLLIMATOR LASER ALIGNMENT UPGRADE Includes: Laser module, cross-hair generator, and 6.5 inch lcd monitor, with Video Out (ntsc). Includes optical flat and mount-ing bracket for ULTRAPOL Advance
6172.H 6172.F 6172.J
ULTRAPOL Advance offers the ‘best of both worlds’ for the production of flat and polished surfaces. The benefit of traditional optical ‘flat lapping’ systems is achieved with an adjustable-amplitude sweep control. The convenient sample handling of ‘off the lap’ systems is achieved with our ingenious ‘quick release’ interface, sample loading and alignment functions.
The patented ULTRACOLLIMATOR tech-nology works ‘in situ’ with the part being polished – providing constant live feedback of angular alignment. Our 2nd generation LASER ULTRACOLLIMATOR module al-lows for improved return-beam imaging, and up to 4 times the alignment precision.
ULTRAPOL End & Edge Polisher offers ultimate versa-tility for sample load control and producing wedge-angles for cross-sectioning and edge polishing applications. A range of workholders extends the application of the system.
The micropositioner head may be calibrated in two-circles to ensure the correct features and or finish thickness can be polished or revealed for analysis.
ULTRAPOL accepts polishing films, papers, pads and cloths to achieve the finest surfaces on most sample types, materials and chemistries.
Cross-section polishing with ultimate pressure control, workholding and angular versatility
ULTRAPOL End & Edge Polisher
Weight Kit (0 to 2000g)
Lock for Slippable Scale
Quick Release Interface
Coolant Nozzle with Valve
8” Polishing Plate with Ultra-Low
Run-Out
Precise 2-CircleGoniometric Movement
Digital Angle Dial (0.01 degrees Read-out) with Process-End Alarm
End Stop Fine Adjust
1µm Z-Position Adjustment
Sweep Oscillator (0 to 20 degrees)
Lock for Adjustable Position Micropositioner
Order Code Description
6390.1D
6390.1A
ULTRAPOL End & Edge Polishing System - Digital Includes polishing unit with timer, tachometer, solenoid coolant system, speed control and process-end indicator. Micropositioner head includes, advanced angular control, low inertial mass loading system with auxiliary weight kit, oscilla-tion control, 1 micron Z-control and ‘Quick Release’ workhold-er mounting system. Digital Angle Dial with 0.01 degree read-out and process-end alarm. Configured for 100-220/240V.
ULTRAPOL End & Edge Polishing System - Analog Specifications as 6390.1D but supplied with 0.1 degree analog angle readout and without process-end alarm.
Manual polishing tools remain important to the lab needing good delayering and/or cross-sectioning results on a very tight budget. ULTRA TEC is proud to be associated with the polishing experts at Accelerated Analysis, and to offer their manual tools for use with our ULTRAPOL Basic polisher.
ULTRAPOL Fiber Lensing Machine offers the ability to produce accurate end profiles on bare optical fibers. Full angular control is achieved with the integral micropositioner, allowing various sculpted end shapes (shown below) in a wide range of included angles.
Order Code Description
1209.1
UPF101
UPF201
ULTRAPOL Basic Polisher – Configured for 100- 220/240V operation. 0-500 RPM. Includes 8 inch (200mm) polishing system with speed control and solenoid-controlled coolant system
Manual Cross Section Fixture includes 5 aluminum and 5 stainless steel sample mounts
Manual Parallel Polish Fixture includes alignment mirror and 3 parallel polish sample mounts.
End Polishing Converter Large Included Angle Small Included Angle
Order Code Description6380.1A
6380.1D
ULTRAPOL Fiber Lensing Machine - AnalogIncludes: ULTRAPOL Base unit with 5” o.d lapping plate, Fiber Lensing Micropostitioner, with feed-through spindle. Analog Angle Dial with 0.1 degree readout. Produces sculpted ends on optical fibers – examples: cone tips, chisel / screwdriver tips, bevels. Power: 110 V / 60Hz and 220 to 240V, 50 HzULTRAPOL Fiber Lensing Machine - Digital Specification as 6380.1A but supplied with digital angle dial with 0.01 degree readout and process-end alarm.
ICis is a modular microscope offering up to 3 standard imaging modes, often required by professionals in electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thick-ness measurements of backside thinned and polished samples; it is also invaluable for fast imaging and archiving of samples being parallel pol-ished or de-processed.
Backside Imaging Topside & X-Section Imaging High Res Imaging
Measures Remaining Silicon Thickness
Si Thickness Here
Order Code Description
6425.1-IR
6465.16410.IR6462.16410.1
ICis NIR Microscope MICROSCOPE with optimized tube, Motorized ‘Z Direction’ Focus Block Bench-top Stand, X-Y Table, large enough to accept standard ASAP-1 sample holder plates, NIR optimized un-cooled Inspection Camera, Desktop computer, running Windows 7, mouse, keyboard, 19” min monitor, ICis Custom Software that provides image capture, optimization, annotation, silion thickness measurement, and archival functions, Power Cord, Sample holder plate
50x Objective lens Visible /NIR (WD = 18.3mm / NA = 0.45)100x Objective lens, plan, optimized for NIR2.5X Objective Lens for Visible / UV100x Objective lens plan for Visible / UV
6426.UV UV Imaging UV Illumination Pod with filter and UV Source controller – Upgrade
6427.VIS Visible Light Camera Color Mega-pixel Camera, USB, with software – Upgrade
6428.XY Motorized X-Y Table Motorized X-Y Table for Main ICis unit, with nano-step controller – allows mouse control of X, Y and Z directions - Upgrade
ULTRA TEC is proud to operate a continuous product improvement program. Product specifications and appearance are subject to modifications without prior notification.
Crystalwax Cement – Standard mounting wax for wafer and die applications. Soluble in acetoneLoctite 460™ is a fast curing, ultra-high bond adhesive for semi-permanent mounting of samples for TEM / Pre-FIB thinning and similar applications. Soluble in acetone
2307.1
2311.1
JET SET Cold Mounting Epoxy Kit (2 part)
Micro-Soap, for micro-organic critical cleaning of sam-ples. Diluted in warm water
Cements, Encapsulants & Cleaning Fluid
Order Code ApplicationDescription2239.1 Standard anodized flat lapping plate, used with films papers and pads
Final polishing of many materials, with colloidal suspensions Replacement Poly facing – adhesive-backed
Rubber-based pad, with durometer control to achieve a PC polish on fiber-optic connectors. It is placed onto 2239.1 Disc, and then covered with a lapping film.
Polyurethane-based low-nap cloth for delayering IC’s and final polishing optical and fiber-optic components – adhesive-backed
Sintered Diamond Lap 42 micron, 360 mesh – for fast removal of mate-rials such as glass
Red, nylon-based cloth, for achieving final surfaces for SEM & TEM Analysis – adhesive-backed
15 micron, 1200 mesh – precursor to finishing with films and cloths