UGM 5DX v8.50 preview and User Contributed tools€¦ · Page 2 Agenda 1. Software release 8.50 preview 2. User Contributed Tools • Build Operator Menu Demo • codeNexus – Defect

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Material Created By:

Jeremy Pemberton-Pigott

• Technical Marketing Engineer for AXI (Singapore)

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Agenda

1. Software release 8.50 preview

2. User Contributed Tools

• Build Operator Menu Demo

• codeNexus – Defect Reporter Demo

3. Q & A

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Agilent Medalist 5DXv8.50 Software Release

Preview

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8.5 Software Release

• Release Content

– Algorithm Enhancements

• Connector Joint Type

– Modifications for very heavily shaded components by using gray level analysis.

• Chip Joint Type

– T-Shirt Cap updates to reduce false failures.

• FET (Field Effect Transistor) Joint Type

– Allows testing of FET type components for Open / Insufficient / Voiding.

– Uses a special Voiding algorithm that compares a learned image vs. the currently inspected joint. This is superior to the Paste – Voiding algorithm.

– Defect Enhancements

• Critical / high priority defects as well as some minor new enhancements.

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8.5 Software Release

• Targeted Release Date: August – September 2008

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Connector SPC Algorithm Enhancements

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Connector SPC Algorithm Enhancements

• Based on the standard Connector joint type.

• Special features in the SPC algorithm allow for the inspection of heavily shaded solder joints, where other methods would normally fail. It is based on gray level analysis instead of just solder thicknesses to allow analysis of joints that may not even be visible by the naked eye (without image enhancement).

• Sample application: Ventura connectors.

– The 5DX is currently the only automated test system in world, that can detect opens on the bridged-ground pins, for this connector. ICT and AOI are unable to detect opens on the bridged-ground pins in the Ventura connectors, due to pin access limitations.

• The enhanced Connector joint type is specifically designed to test for Open / Insufficient solder joints on these heavily shaded types of components.

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Sample Ventura Connector (female)

Large amount of metal in the connector causes

shading issues for x-ray

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Ventura Connector Pins and PCB

Replaceable wafer

Bridged

Ground Pins

Signal

Pin

Damaged

Pins

SignalPins

Bridged Ground Pins

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Sample Ventura Connector Defect Image

• Image is heavily shaded.

• Maximum camera brightness and integrations are used.

• Special averaging technique used to further reduce noise.

• The algorithm’s special features

allow accurate measurement of

the resultant image for insufficient

and open defects.

Fail O

pen

Fail O

pen

Fail S

hort

Pass S

hort

2 Bridged-Ground Rows

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Good Solder Joint vs. Bad Open Solder Joint Comparison

Good Solder Joints:

- Heel, toe, and side fillets well defined.

- Consistent fillet length.

Suspect Solder Joints:

- Heel, toe, and side fillets not well defined.

- Inconsistent fillet length.

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Good Solder Joint vs. Bad Cold Solder Joint

BadGood

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Good Solder Joint Profile

Profile of a good solder joint includes the following:

- Well defined heel / toe fillets.

- Consistent fillet length.

- Steep heel and toe fillet slopes.

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Open Solder Joint Profile

Profile of an open solder joint includes the following:

- No heel / toe fillets, raised center.

- Inconsistent fillet length.

- Shallow heel and toe fillet slopes.

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Chip Enhancements for T-Shirt Capacitors

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Side Fillets of Chip T-Shirt Capacitors

Adds capability for discrete devices with solder fillets on the sides of the pin not just on the end of the pin.

Enhancements to the Chip joint type provide detection of:

- Side fillet insufficients

- Side fillet opens

- Misalignments

- Partially lifted bodies

- Lower false calls than previous releasesSide fillets with solder

Side fillets with solder

Body of package

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New Chip Open Test

Uses Maximum Pad Thickness Delta

• Creates a ratio of pad 1 thickness over pad 2 thickness.

• Joints are failed when they exceed this ratio:

Pad 1 test = (Pad 1 / Pad 2) * 100

Pad 2 test = (Pad 2 / Pad 1) * 100

• Note

– This test will run on either T-Shirt Cap or on normal Cap packages.

– For T-Shirt Cap packages, the average thickness is taken from the T-Shirt search regions

– For normal packages, the average thickness is taken from the pad 1

and pad 2 regions of interest.

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Side Fillets

Enabling the Side Fillet testing

• Turns on new regions of interest that generate a profile across a joint.

Pad Region Width

• Controls the width of the region of interest.

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IdealAcceptable

Reject

Sample T-Shirt Caps

• Cap is between the BGA pins

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Sample T-Shirt Caps

OpenInsufficient

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The New FET Joint Type

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Why a new joint type?

• We required a new family of algorithms to improve the detection of defects in non-standard joint shapes.

• Some example defect conditions:

– Insufficient solder and no solder

– Un-reflowed solder or cold solder

– Excessive voiding in the solder joint

• Sample applications: PolarPAKTM and DirectFETTM devices.

– The FET joint type can be used on any FET type device but it is not restricted to only these devices and can also be used to analyze many other oddly shaped joints.

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Sample PolarPAK™ FET device

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Sample FET Layout

Drain

Land Pattern layout- Single large pad for source pin

Gate

Source

Drain

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FET Overview – The SPC Algorithm

Along Pad Profile

Measures changes in slopes along the region:

– Generates a 2nd derivative profile (which identifies a change in slopes).

– Changes are summed.

– Finds Opens / Insufficient.

• Gap Along Measurements

• Activates 2 search regions which identifies & measures ‘gaps’ in the solder.

• Gap Across Measurements

• Same as along, but used for going across the joint.

• Span Size

• Number of pixels to smooth the joint profiles with. Eliminates noise from the

joint profile to allow for more accurate insufficients testing.

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FET Overview – SPC Algorithm

Gap Across

Gap Along

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Sample FET DefectsFirst Device Type

Insufficient solder on Source / Drain / Gate pins

Large Gap

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Sample FET DefectsSecond Device Type

Insufficient solder on Drain / Gate pins

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Sample Insufficient Defects (both types of devices)

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FET Overview – Voiding Algorithm

The Voiding algorithm uses a special technique of comparing a known, previously learned, good image to the actual joint.

The previously learned image is called an ‘Expected Image’.

By analyzing the differences, between the images, the voids in the joint can be found – no matter what shape the joint is.

You do have to take some care not to learn too many voids or

defects into the ‘Expected Image’.

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FET Voiding – Expected Image Analysis

How it works?

• The FET Voiding algorithm learns a set of images which are used to create an overall ‘Expected Image’ that does not contain any voids.

1. The region of each joint that contains solder is identified.

2. Within the soldered region, each pixel is compared to it’s corresponding pixel in the ‘Expected Image’.

3. Pixels that fall into a void will have a lower gray level value than the current

‘Expected Image’.

4. A minimum area of pixels is required to count the area as being a void.

5. The pixels in each area that are identified as being a void are counted and

compared to the total number of pixels within the soldered region.

6. The total percentage of voiding is then used to pass or fail the joint.

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How Expected Image Works (visually)?

Expected Image Pin 1

Component 1

Pin 1

Component 2

Pin 1

Component 3

Pin 1

Expected Image Pin 2

Component 1

Pin 2

Component 2

Pin 2

Component 3

Pin 2

Set 1 Set 2

+

+

+

+

+ +

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How Expected Image Works (visually)?

Calculated voids are marked in light blue(small voids omitted)

Pin to be analyzed

for voiding

The

‘Expected Image’−

> Threshold?

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Sample FET Voiding

In the next slides we will get a representative ‘step by step’approach to how the machine looks for the voids and calculates

the voiding area of only the ‘Region of Interest’.

Total Un-Masked

Area of the ‘Expected Image’:

48,413 pixels

After processing:Voided Area (Un-Masked): 1,341 pixelsVoided Area (Un-Masked): 2.76%

Joint image to be analyzed

Mask created by setting a threshold using the

‘Expected Image’

Total Pad Area: 86,072 pixelsThis is how the CAD is setup

Total Un-Masked

Area of the ‘Expected Image’:

48,413 pixels

After processing:Voided Area (Un-Masked): 26,074 pixelsVoided Area (Un-Masked): 53.86%

Joint image to be analyzed

Mask created by setting a threshold using the

‘Expected Image’

Total Pad Area: 86,072 pixelsThis is how the CAD is setup

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Sample FET Voiding

Expected learned image

of the soldered region.Void identification made from the

comparison to the expected image.

Areas excluded

(masked) from voiding

the analysis

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Sample FET Voiding

Expected learned image

of the soldered region.Void identification made from the

comparison to the expected image.

Areas excluded from

voiding analysis

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Defect Fixes

– Issues reported by customers from v8.30 – v8.42 are being incorporated

into v8.50.

– Our focus is on customer reported critical and high priority defects.

There are over 35 fixes to the new release of software.

– Fixes and enhancements have just completed beta testing in Asia and the Americas. Final fixes are being implemented and tested before going out for release worldwide.

TD3

Slide 39

TD3 For the comment "list of fixes not available today" - I would replace this with our focus is on Customer Reported Critical/High defects. There are some defects already fixed and waiting on the 8.5 branch. George David should be able to give you this list, however it is really small, so it may not be worth mentioning here.Terri Devlin, 11/29/2007

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Defect Fixes

Short list of fixes:

• Test Link:

• Changing the family of a part resets all components’ test status

• 5DX / TDW:

• Excess algorithm added to the PressFitConnector joint type

• Short threshold “Test region” is not displaying the correct information when first displayed

• Review Measurements “Default Configuration” function is incorrect

• 5DX:

• AutoUI compile menu is limited to 500 programs

• Alignment does not fail all the time for a bad alignment point

• Duplicate barcodes not checked across multiple boards on a single panel

• Manual board alignment on multi-board panel allows wrong alignment points

• Review Defects BGA pin # mismatch between the review defect image and list

• Panel with x-out board last has no res/log file saved/sent to the ITF server

• SMEMA outputs incorrectly set in Automatic Review mode

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Defect Fixes

Short list of fixes continued:

• 5DX

• Software hangs when aborting manual alignment

• Review Defects shows the wrong slice

• Software reloads previous program during align & map

• Topside Reference Point from wrong panel is used

• Align and Map mis-focused images: Surface Map Alignment Views not working

• Aligning on two-row devices or single caps or resistors fails to work

• Automatic Reporter re-sends all of the test results to the ITF server upon logging into Windows

• 5DX Crashes:

• serialNumberListSelectionChanged error

• loadPanelAsynchronously error

• setSingleFamilyAllAlgorithms error

• setAlignmentTimeInMilliSeconds error

• getTopSideMeasuredZHeightNanoMeters error

• getBottomSideMeasuredZHeightNanoMeters error

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End of 8.50 Preview

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Questions?

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User Contributed Disclaimer

• Since this software is user contributed software it may be outdated or unmaintained in future releases.

• You may use it at your own risk.

• We are not responsible for any damages incurred from the use of this software.

• This software is offered as a free service to our customers.

• We take no responsibility for the infringement of any proprietary rights or of any export or security restrictions caused by the distribution or of the items contained in it.

• In addition, we may not have reviewed or modified these items and do not make any claims as to the suitability or fitness of this software for any purpose.

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Build Operator Menu Demo

• Multiple menu & user configuration control for the 5DX AutoUI

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BLDOPMNU DOS Command

The “Build Operator Menu” software replaces and extends the functionality found in the BLDOPMNU DOS command.

BLDOPMNU DOS Program

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Build Operator MenuFeatures

• Same features as the BLDOPMNU DOS command for enabling / disabling menu items in a single menu setup (default mode).

• Extends this functionality to allow for different menu items to be configured (enabled / disabled) by the group that a user belongs to.

• Security features like password protection for each user as well as generating security logs. Security logs track program startup, shutdown, user login/out, and wrong password entry attempts.

• Ability to run from a single network share directory and setup different users on different 5DXs or run in different configuration modes.

• Ability to set different ‘S’ user passwords while locking the ‘S’ user out from the Auto UI. This ensures that there is an audit trail for the ‘S’ user, if configured.

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Build Operator Menu2 Modes of Operation

• Single User Menu Mode

– Runs in tandem with the 5DX Auto UI interface.

– Does not change any system settings.

– Users can optionally log into the Build Operator Menu software for tracking purposes, user name is automatically entered into the Auto UI.

• Multiple User Menu Mode

– Runs in tandem with the 5DX Auto UI interface.

– Changes the system settings so that all users must log into the Auto UI through the Build Operator Menu interface.

– Allows the disabling of different menu items for different users depending on the group that they belong to.

– Optionally locks out the ‘S’ user if it is added to the ‘SUPERVISOR’group.

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Build Operator MenuHow It Works – Log in

Screen shot of the 5DX Auto UI interface and the Build Operator Menu about to enter a user name into Auto UI.

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Build Operator MenuHow It Works – Log in

Screen shot of the 5DX Auto UI interface and the Build Operator Menu after entering a user name into Auto UI.

1

2

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Build Operator MenuHow It Works – Log out

Log out of the 5DX before trying to log out of the Build Operator Menu software.

1

2

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Build Operator MenuMultiple User Menu Mode – Configure Users and Menus

• Double click a group or user to configure a group’s menu access in the AutoUI.

• The F2 key will enable / disable the menu item.

Groups and users.

Configured menu items

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Build Operator Menu InterfaceFile Menu Items – Multiple User Menu Mode

Enable ‘Single User Menu’ mode features

Set Administrator password for access to the

system’s configuration screen

View the security audit log file

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End of Build Operator Menu Demo

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What is the codeNexus – Defect Reporter?

A ‘User Contributed’ tool for the 5DX that replaces functionality found in:

• Defect Reporter (DOS based)

• Some Review Measurements graphing (DOS based)

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What does the codeNexus – Defect Reporter do?

It is a graphical user interface of the DOS Defect Reporter.

It provides some basic graphing / exporting functionality:

• Different graph types for the test results

• A ‘Defects Only’ view of the test results for production tuning

• Measurement filtering and graphing

• Exporting filtered defect / measurement data to CSV

• Basic chart printing, zooming, and copying functions

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What does the interface look like?

Select a result file from the list to view the results

Choose any result folderSwitch viewing mode

Details of the selected result file

Results List View

Optionally: Select any results file from

the graph to view the test results

Auto. refresh test results Remotely monitor results on a 5DXResults Plot View

Grouping by the selected attribute

Export Defects to CSV

Switch viewing mode

Defect Results List View

Load a graph of the data

Defect Results Plot View

Chart failures grouped by

‘Joint Type - Subtype’

(#) of failures in

‘Joint Type - Subtype’

Measurement filters to filter any measurement

Plot multiple slices at once

Measurements Filtering / Charting View

Export filtered data to CSV

Defective joints always

show up no matter

which measurement

filter is selected

Show all or only defective measurements

Menu for Copy / Print / Save Picture

Zoom In / Out

Mean+/- 1σ

+/- 3σ

Passing Range

UtilizationTest result chart for selected program name

Click the program name to view test result chart data for it

Machine ‘Operation Summary Report’

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End of codeNexus – Defect Reporter Demo

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FAQ on User Contributed Software

What does it cost to buy?

• Nothing.

What versions of 5DX software does it work on?

• All versions from v7.xx to v8.xx

What versions of Microsoft Windows does it work on?

• All versions of Windows NT to Windows XP

– Provided .NET 2.0 can be installed on it

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EUP (E-mail Update Program)

Please subscribe to the Agilent E-mail Update Program to receive the latest notices of

software updates / articles / application notes and other monthly technical content.

To subscribe by e-mail or RSS simply go to:

• www.agilent.com/find/axi and click on one of subscription links

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Questions?